CN109580634A - A kind of confirmation method that diamond wire surface diamond is reunited - Google Patents
A kind of confirmation method that diamond wire surface diamond is reunited Download PDFInfo
- Publication number
- CN109580634A CN109580634A CN201811464512.8A CN201811464512A CN109580634A CN 109580634 A CN109580634 A CN 109580634A CN 201811464512 A CN201811464512 A CN 201811464512A CN 109580634 A CN109580634 A CN 109580634A
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- China
- Prior art keywords
- diamond
- wire surface
- diamond wire
- reunited
- microns
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 83
- 239000010432 diamond Substances 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000012790 confirmation Methods 0.000 title claims abstract description 12
- 230000002776 aggregation Effects 0.000 claims abstract description 21
- 238000005054 agglomeration Methods 0.000 claims abstract description 20
- 238000009825 accumulation Methods 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 230000002159 abnormal effect Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000691 measurement method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention provides the confirmation methods that a kind of diamond wire surface diamond is reunited comprising following steps: 1) the scattered error value K of the average diameter D and accumulation diameter accumulated by apparatus measures diamond wire surface diamond；If 2) D >=30 micron, directly judge that diamond agglomeration occurs for diamond wire surface；If 25 microns of 30 microns of < D <, 7 < K < 10 then directly judge that diamond agglomeration occurs for diamond wire surface；If 20 microns of D≤25 micron <, K >=10, then need to judge by scanning electron microscope that diamond agglomeration occurs for diamond wire surface.The confirmation method that above-mentioned diamond wire surface diamond is reunited can quickly, efficiently and accurately judge diamond wire surface with the presence or absence of diamond agglomeration.It not only reduces cutting process interrupt line and silicon chip surface stria and causes partially thin etc. abnormal risks of piece thickness；And improve production efficiency；It ensure that the cut quality of solar silicon wafers.
Description
Technical field
The invention belongs to the confirmation sides that solar silicon wafers cutting technique more particularly to a kind of diamond wire surface diamond are reunited
Method.
Background technique
Currently, the cutting line of mainstream is that hyperfine cutting steel wire does bus, diameter is about 55~65 microns, diamond
Molecule inlay on line, be made into diamond cutting secant.But bad coating can be generated in the electroplating process of diamond
The bulky grain of problem, such as the agglomeration traits of diamond particles, these aggregations and superposition change the diamond wire in cutting stage by
Power situation increases Micro Lub stress, relative to the equally distributed diamond wire of particle, improves cutting torque value.It increases and cuts
It cuts broken string and silicon chip surface stria in the process and causes partially thin etc. abnormal risks of piece thickness.
Therefore, how rapidly and accurately to determine that diamond wire surface whether there is diamond agglomeration is those skilled in the art
Member's problem in the urgent need to address.
Summary of the invention
The purpose of the present invention is to provide the confirmation methods that a kind of diamond wire surface diamond is reunited, to solve the prior art
In the problem of can not rapidly and accurately determining diamond wire surface with the presence or absence of diamond agglomeration.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of confirmation method that diamond wire surface diamond is reunited comprising following steps:
1) the scattered error value K of the average diameter D and accumulation diameter accumulated by apparatus measures diamond wire surface diamond；
2) judge whether diamond wire surface occurs diamond agglomeration according to the value of D in step 1) and K, specifically sentence
Disconnected standard are as follows: if D >=30 micron, directly judge that diamond agglomeration occurs for diamond wire surface, if 25 microns of < D < 30 are micro-
Rice；7 < K < 10 then directly judge that diamond agglomeration occurs for diamond wire surface.
Particularly, if 20 microns of D≤25 micron < in the step 2)；K >=10 then need to judge gold by scanning electron microscope
Diamond agglomeration occurs for rigid line surface.
Particularly, measured in the step 1) by scroll saw instrument diamond wire surface diamond accumulation average diameter D and
Accumulate the scattered error value K of diameter, specific measurement method are as follows: diamond wire after cleaning is fixed on Horizontal clamp, root under fixed multiplying power
The equivalent particle size diameter mean value D in 5 sections of screen visuals field is measured according to gray value, while calculating scattered error value K.
Beneficial effects of the present invention are the confirmation method energy that the diamond wire surface diamond is reunited compared with prior art
It is enough quickly, efficiently and accurately to judge diamond wire surface with the presence or absence of diamond agglomeration.Before being cut, there will be reunion
The diamond wire of problem is isolated, and is not only reduced cutting process interrupt line and silicon chip surface stria and is caused piece thickness partially thin etc.
Abnormal risk；And improve production efficiency；It ensure that the cut quality of solar silicon wafers.
Specific embodiment
Of the invention for ease of understanding, it is as follows that the present invention enumerates embodiment.Those skilled in the art are it will be clearly understood that the implementation
Example is only to aid in the understanding present invention, should not be regarded as a specific limitation of the invention.
In the present embodiment, a kind of confirmation method that diamond wire surface diamond is reunited comprising following steps:
1) the average diameter D of diamond wire surface diamond accumulation and the scattered error value K of accumulation diameter are measured by scroll saw instrument；
Specific measurement method are as follows: diamond wire after cleaning is fixed on Horizontal clamp, measures 5 sections according to gray value under fixed multiplying power
The equivalent particle size diameter mean value D in the screen visual field, while calculating scattered error value K；
2) judge whether diamond wire surface occurs diamond agglomeration according to the value of D in step 1) and K, specifically sentence
Disconnected standard are as follows:
If D >=30 micron, directly judge that diamond agglomeration occurs for diamond wire surface,
If 25 microns of 30 microns of < D <；7 < K < 10 then directly judge that diamond agglomeration occurs for diamond wire surface；
If 20 microns of D≤25 micron <；K >=10 then need to judge by scanning electron microscope that diamond occurs for diamond wire surface
Agglomeration.
The Applicant declares that the present invention is explained by the above embodiments detailed process equipment and process flow of the invention,
But the present invention is not limited to the above detailed process equipment and process flow, that is, it is above-mentioned detailed not mean that the present invention must rely on
Process equipment and process flow could be implemented.It should be clear to those skilled in the art, any improvement in the present invention,
Addition, selection of concrete mode of equivalence replacement and auxiliary element to each raw material of product of the present invention etc., all fall within of the invention
Within protection scope and the open scope.
Claims (3)
1. the confirmation method that a kind of diamond wire surface diamond is reunited, which is characterized in that itself the following steps are included:
1) the scattered error value K of the average diameter D and accumulation diameter accumulated by apparatus measures diamond wire surface diamond；
2) judge whether diamond wire surface occurs diamond agglomeration according to the value of D in step 1) and K, specific judgement mark
It is quasi- are as follows: if D >=30 micron, directly to judge that diamond agglomeration occurs for diamond wire surface, if 25 microns of 30 microns of < D <；7
< K < 10 then directly judges that diamond agglomeration occurs for diamond wire surface.
2. the confirmation method that diamond wire surface diamond as described in claim 1 is reunited, which is characterized in that in the step 2)
If 20 microns of D≤25 micron <；K >=10 then need to judge by scanning electron microscope that diamond agglomeration occurs for diamond wire surface.
3. the confirmation method that diamond wire surface diamond as claimed in claim 1 or 2 is reunited, which is characterized in that the step
1) the average diameter D of diamond wire surface diamond accumulation and the scattered error value K of accumulation diameter are measured in by scroll saw instrument, it is specific to survey
Amount method are as follows: diamond wire after cleaning is fixed on Horizontal clamp, 5 sections of screen views are measured according to gray value under fixed multiplying power
Wild equivalent particle size diameter mean value D, while calculating scattered error value K.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811464512.8A CN109580634A (en) | 2018-12-03 | 2018-12-03 | A kind of confirmation method that diamond wire surface diamond is reunited |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811464512.8A CN109580634A (en) | 2018-12-03 | 2018-12-03 | A kind of confirmation method that diamond wire surface diamond is reunited |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109580634A true CN109580634A (en) | 2019-04-05 |
Family
ID=65926653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811464512.8A Pending CN109580634A (en) | 2018-12-03 | 2018-12-03 | A kind of confirmation method that diamond wire surface diamond is reunited |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109580634A (en) |
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Application publication date: 20190405 |
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