CN109565930A - Circuit board and supercomputer equipment - Google Patents
Circuit board and supercomputer equipment Download PDFInfo
- Publication number
- CN109565930A CN109565930A CN201880002442.6A CN201880002442A CN109565930A CN 109565930 A CN109565930 A CN 109565930A CN 201880002442 A CN201880002442 A CN 201880002442A CN 109565930 A CN109565930 A CN 109565930A
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- China
- Prior art keywords
- circuit board
- heat
- groove
- conducting piece
- card
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本申请提供了一种电路板以及超算设备，其中，该电路板包括电路板本体，电路板本体的表面上设置有至少一个凹槽；至少一个凹槽中设置有至少一个导热件；每一个导热件的下表面与导热件所对应的凹槽的底面贴合。通过在电路板本体的表面上开设凹槽，在凹槽中设置一个或多个导热件，进而在电路板本体的内部的热量可以通过导热件散发出去，增强电路板的散热效果；并且将导热件的底面与凹槽的底面进行贴合，进一步增大导热件与电路板本体的接触面积，进而将电路板在工作过程产生的热量传递到外界，提升电路板的散热能力；进而，保证电路板和电路板上的元器件不被高温所损伤，保障电路板和电路板上的元器件的正常工作。
The application provides a circuit board and a supercomputing device, wherein the circuit board includes a circuit board body, and at least one groove is provided on the surface of the circuit board body; at least one heat-conducting member is provided in the at least one groove; each The lower surface of the heat-conducting member is fitted with the bottom surface of the groove corresponding to the heat-conducting member. By opening grooves on the surface of the circuit board body, and arranging one or more heat-conducting parts in the grooves, the heat inside the circuit board body can be dissipated through the heat-conducting parts to enhance the heat dissipation effect of the circuit board; The bottom surface of the component is attached to the bottom surface of the groove, which further increases the contact area between the thermally conductive component and the circuit board body, and then transfers the heat generated by the circuit board during the working process to the outside world to improve the heat dissipation capacity of the circuit board; further, ensure the circuit board. The components on the board and the circuit board are not damaged by high temperature, and the normal operation of the circuit board and the components on the circuit board is guaranteed.
Description
Technical field
This application involves circuit board technology field more particularly to a kind of circuit board and supercomputer equipment.
Background technique
Printed circuit board (Printed Circuit Board, abbreviation PCB) is applied in all kinds of electronic devices, printing electricity
Road plate is important electronic component, and various components can be arranged on a printed circuit board.Wherein, printed circuit board can be referred to as
For circuit board.Circuit board can generate heat in the process of work, and the temperature of circuit board can be made higher, and higher temperature can be broken
Component in the structure and circuit board of bad circuit board leads to the component cisco unity malfunction on circuit board and circuit board, from
And it needs to carry out radiating treatment to circuit board.Multiple cooling fins can be set on circuit boards, by cooling fin to circuit board into
Row heat dissipation.
In the prior art, when cooling fin is set on circuit boards, tin cream can be coated on circuit boards, and dissipating
The bottom of backing coats tin cream, so that cooling fin be fixedly installed on circuit boards by tin cream；Alternatively, will be radiated by screw
Piece is screwed on circuit board.
But the inventors of the present application found that the contact area of cooling fin and circuit board is still not big enough, lead to circuit board
Heat dissipation effect it is bad.
Summary of the invention
The application provides a kind of circuit board and supercomputer equipment, is typically only capable to band in a manner of existing heat dissipation for circuit board to solve
Walk the least a portion of heat in circuit board, the unsatisfactory problem of whole heat dissipation effect.
In a first aspect, the application provides a kind of circuit board, comprising:
Circuit board body is provided at least one groove on the surface of the circuit board body；
At least one heat-conducting piece is provided at least one described groove；
The bottom surface of groove corresponding to the lower surface of each of at least one heat-conducting piece heat-conducting piece and heat-conducting piece
Fitting.
Further, the heat-conducting piece is heat-conducting metal.
Further, the heat-conducting metal includes one of copper, aluminium, silver, tin, gold, iron, aluminium alloy or a variety of.
Further, the heat-conducting piece is thermally conductive nonmetallic.
Further, described thermally conductive nonmetallic for graphene.
Further, it is provided in each of at least one described groove groove at least one described heat-conducting piece
One or more heat-conducting pieces.
Further, each of each of at least one described groove groove and at least one heat-conducting piece
Heat-conducting piece is one-to-one.
Further, each described groove is spirally connected with heat-conducting piece corresponding to each described groove；
Alternatively, each described groove carried out with heat-conducting piece corresponding to each described groove it is be bonded.
Further, each described groove is engaged with heat-conducting piece corresponding to each described groove.
Further, it is provided with the first clamping portion on each described groove, it is each corresponding to each described groove
The second clamping portion is provided on a heat-conducting piece, first clamping portion and second clamping portion are clamped.
Further, the number of first clamping portion on each described groove is one, first clamping portion
On be provided at least one first card and portion, be provided on each heat-conducting piece corresponding to each described groove and described the
At least one matched second card of one card and portion and portion.
Further, first card and portion are recess, and second card and portion are convex；
Alternatively, first card and portion are convex, second card and portion are recess.
Further, at least one described first card on each described first clamping portion and portion are arranged in the groove
Top edge；
The edge of the top surface of the heat-conducting piece is arranged at least one described second card and portion.
Further, the top of at least one first card and portion and the groove on each described first clamping portion
Portion is located at same level, at least one described second card and portion and the top surface of the heat-conducting piece are located at same level.
Further, first card and portion and second card and portion correspond.
Further, at least one cooling fin is provided in the circuit board body；
Each of at least one cooling fin cooling fin includes egative film and at least one radiating fin, it is described at least
Each of one radiating fin radiating fin is connect with the egative film, and the surface of the egative film and the circuit board body connects
It connects.
Further, interconnecting piece is provided on each described cooling fin, interconnecting piece includes the first plate and the second plate, described
It is in predetermined angle between first plate and second plate；
At least one described radiating fin is fixed at the upper surface of the interconnecting piece, and the egative film is fixed at institute
State the lower surface of interconnecting piece.
Further, the height of radiating fin adjacent at least one described radiating fin is identical or different.
Second aspect, the application provide a kind of supercomputer equipment, including at least one is as described in claim any one of 1-18
Circuit board.
Further, parallel with one another between each circuit board in the supercomputer equipment.
Further, be provided with sliding slot on the cabinet of the supercomputer equipment, the sliding slot be used for in the supercomputer equipment
Each circuit board be slidably connected.
In above various aspects, by being provided at least one groove on the surface of circuit board body；At least one
At least one heat-conducting piece is provided in groove；It pastes the bottom surface of groove corresponding to the lower surface of each heat-conducting piece and heat-conducting piece
It closes.By opening up groove on the surface of circuit board body, one or more heat-conducting pieces are set in a groove, and then in circuit board
The heat of the inside of ontology can be distributed by heat-conducting piece, enhance the heat dissipation effect of circuit board；And by the bottom of heat-conducting piece
Face is bonded with the bottom surface of groove, further increases the contact area of heat-conducting piece and circuit board body, and then circuit board is existed
The heat transfer that the course of work generates promotes the heat-sinking capability of circuit board to the external world；In turn, guarantee on circuit board and circuit board
Component is not damaged by high temperature, and ensures the normal work of circuit board and the component on circuit board.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those skilled in the art without any creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram one of circuit board provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram one of heat-conducting piece provided by the embodiments of the present application；
Fig. 3 is a kind of structural schematic diagram two of circuit board provided by the embodiments of the present application；
Fig. 4 is a kind of structural schematic diagram three of circuit board provided by the embodiments of the present application；
Fig. 5 is the structural schematic diagram one of another circuit board provided by the embodiments of the present application；
Fig. 6 is the structural schematic diagram two of another circuit board provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram one of cooling fin provided by the embodiments of the present application；
Fig. 8 is the structural schematic diagram two of cooling fin provided by the embodiments of the present application；
Fig. 9 is the structural schematic diagram three of cooling fin provided by the embodiments of the present application；
Figure 10 is the structural schematic diagram four of cooling fin provided by the embodiments of the present application；
Figure 11 is the structural schematic diagram one of another circuit board provided by the embodiments of the present application；
Figure 12 is the structural schematic diagram two of another circuit board provided by the embodiments of the present application；
Figure 13 is the structural schematic diagram three of another circuit board provided by the embodiments of the present application；
Figure 14 is the structural schematic diagram two of heat-conducting piece provided by the embodiments of the present application；
Figure 15 is the structural schematic diagram three of heat-conducting piece provided by the embodiments of the present application；
Figure 16 is the structural schematic diagram of supercomputer equipment provided by the embodiments of the present application.
Appended drawing reference:
| 1- circuit board body | 2- groove | 3- heat-conducting piece |
| 4- cooling fin | 5- egative film | 6- radiating fin |
| 7- interconnecting piece | The card of 8- first and portion | The card of 9- second and portion |
| 161- circuit board |
Specific embodiment
The embodiment of the present application is applied in circuit board.It should be noted that the scheme when the embodiment of the present application is applied to now
Circuit board or the future may appear circuit board when, the title of each structure may change, but this has no effect on this Shen
Please example scheme implementation.
It should be pointed out that noun involved in the embodiment of the present application or term can be referred to mutually, repeat no more.
In the prior art, when cooling fin is set on circuit boards, tin cream can be coated on circuit boards, and dissipating
The bottom of backing coats tin cream, so that cooling fin be fixedly installed on circuit boards by tin cream；Alternatively, passing through screw or screw
Deng cooling fin is screwed on circuit board.But the mode of the above facility cooling fin, so that the contact surface of cooling fin and circuit board
Product is smaller, and cooling fin cannot well take away the heat of circuit board, cause the heat dissipation effect of circuit board bad.
Circuit board and supercomputer equipment provided by the present application, it is intended to solve the technical problem as above of the prior art.
How the technical solution of the application and the technical solution of the application are solved with specifically embodiment below above-mentioned
Technical problem is described in detail.These specific embodiments can be combined with each other below, for the same or similar concept
Or process may repeat no more in certain embodiments.Below in conjunction with attached drawing, embodiments herein is described.
Fig. 1 is a kind of structural schematic diagram one of circuit board provided by the embodiments of the present application, and Fig. 2 provides for the embodiment of the present application
Heat-conducting piece structural schematic diagram one, as depicted in figs. 1 and 2, which includes: circuit board body 1, circuit board body 1
At least one groove 2 is provided on surface；At least one heat-conducting piece 3 is provided at least one groove 2；At least one heat-conducting piece
The lower surface of each of 3 heat-conducting pieces 3 is bonded with the bottom surface of groove 2 corresponding to heat-conducting piece 3.
Optionally, heat-conducting piece 3 is heat-conducting metal.Preferably, heat-conducting metal includes copper, aluminium, silver, tin, gold, iron, aluminium alloy
One of or it is a variety of.
Alternatively, optional, heat-conducting piece 3 is thermally conductive nonmetallic.Preferably, thermally conductive nonmetallic for graphene.
Optionally, be provided in each of at least one groove 2 groove 2 at least one heat-conducting piece 3 one or
Multiple heat-conducting pieces 3；Alternatively, each of at least one groove 2 groove 2 is thermally conductive with each of at least one heat-conducting piece 3
Part 3 is one-to-one.
Optionally, each groove 2 is spirally connected with heat-conducting piece 3 corresponding to each groove 2；Alternatively, each is recessed
Slot 2 carries out be bonded with heat-conducting piece 3 corresponding to each groove 2；Alternatively, corresponding to each groove 2 and each groove 2
Heat-conducting piece 3 is engaged.
Illustratively, circuit board is made of a circuit board body 1.
The shape of circuit board body 1 can be rectangle or be square or be it is trapezoidal or be other rule
Shape or be other irregular shapes；For the shape of circuit board body 1, the application is with no restrictions.
For the material of circuit board body 1, the application is with no restrictions.
Circuit board body 1 can be single sided board or dual platen or multi-layer board, and the application is with no restrictions.
N number of groove 2 is opened up on the surface of circuit board body 1, N is the positive integer more than or equal to 1.For example, in electricity
One or more grooves 2 are opened up on the upper surface of road plate ontology 1；Alternatively, opened up on the lower surface of circuit board body 1 one or
Multiple grooves 2；Alternatively, opening up one or more grooves 2 on the upper surface of circuit board body 1, also, in circuit board body 1
Lower surface on open up one or more grooves 2.
Groove 2 needs not interfering with the work of circuit board body 1 itself, and groove 2 needs not interfering with circuit board sheet
The work of each component on body 1.
For each position of the groove 2 on the surface of circuit board body 1, the application is with no restrictions.For each
Size, shape and the area of groove 2, the application is with no restrictions.For the depth of each groove 2, the application is with no restrictions.Together
The size of heat-conducting piece 3 in one groove 2, area, material, can be identical or different.
M heat-conducting piece 3 is set in N number of groove 2, and M is the positive integer more than or equal to 1；Heat-conducting piece 3 can produce circuit board
Raw heat is taken away；Also, in order to enable heat-conducting piece 3 is preferably thermally conductive, by the lower surface of each heat-conducting piece 3 and heat-conducting piece 3
The bottom surface of corresponding groove 2 is bonded.Illustratively, one or more is arranged in each of N number of groove 2 groove 2
A heat-conducting piece 3；Alternatively, one or more heat-conducting pieces 3 are arranged in the R groove 2 in N number of groove 2, R be more than or equal to 1 and
Integer less than N, also, heat-conducting piece 3 can be not provided in the remaining N-R groove 2 in N number of groove 2.
Each heat-conducting piece 3 in each groove 2 can fill completely corresponding groove 2；Alternatively, each in each groove 2
Heat-conducting piece 3 can be not filled with completely corresponding groove 2.
For example, Fig. 3 is a kind of structural schematic diagram two of circuit board provided by the embodiments of the present application, as shown in figure 3,
N number of groove 2 is opened up on the surface of circuit board body 1, and one or more heat-conducting pieces 3 are provided in each groove 2, wherein
The number of heat-conducting piece 3 in different grooves 2 can be identical or different.For example, as indicated at 3, N number of groove 2 includes first
2, second grooves 2 of groove and third groove 2 are provided with a heat-conducting piece 3, in second groove 2 in first groove 2
In be provided with two heat-conducting pieces 3, provided with a heat-conducting piece 3 in third groove 2.
Again for example, Fig. 4 is a kind of structural schematic diagram three of circuit board provided by the embodiments of the present application, as shown in figure 4,
N number of groove 2 is opened up on the surface of circuit board body 1, in each groove 2 be provided with a heat-conducting piece 3, groove 2 with lead
It is one-to-one between warmware 3.
In the present embodiment, heat-conducting piece 3 can be heat-conducting metal；It preferably, may include following in the material of heat-conducting metal
It is one or more: copper, aluminium, silver, tin, gold, iron, aluminium alloy are not limited in any way this.Alternatively, heat-conducting piece 3 is thermally conductive non-gold
Belong to, for example, it is thermally conductive it is nonmetallic may include below one or more: in thermally conductive nonmetallic material include resin, ceramics, stone
Ink, graphene, water etc. are not limited in any way this.In the present embodiment, the material of different heat-conducting pieces 3 is identical or different.It lifts
For example, M heat-conducting piece 3 is provided in N number of groove 2 of circuit board body 1, M heat-conducting piece 3 can all be heat-conducting metal；
Alternatively, M heat-conducting piece 3 can all be thermally conductive nonmetallic；Alternatively, the S heat-conducting piece 3 in M heat-conducting piece 3 is heat-conducting metal,
In, S is the positive integer more than or equal to 1 and less than M, remaining N-S heat-conducting piece 3 is thermally conductive nonmetallic.
It further, can will be in groove 2 and groove 2 in order to enable the setting that can consolidate of heat-conducting piece 3 is in groove 2
Heat-conducting piece 3 be fixedly connected.Wherein, the mode being fixedly connected can use following at least one: be spirally connected, be cementing, bonding,
Engaging.
In the present embodiment, being fixedly connected with mode used by different heat-conducting pieces 3 can be identical or different.For example,
M heat-conducting piece 3, each of M heat-conducting piece 3 heat-conducting piece 3 and heat-conducting piece are provided in N number of groove 2 of circuit board body 1
Groove 2 corresponding to 3 is spirally connected；Alternatively, groove 2 corresponding to each of M heat-conducting piece 3 heat-conducting piece 3 and heat-conducting piece 3
Engaged；Alternatively, the S heat-conducting piece 3 in M heat-conducting piece 3 is spirally connected with groove 2 corresponding to heat-conducting piece 3, wherein S is
Positive integer more than or equal to 1 and less than M, remaining N-S heat-conducting piece 3 are engaged with groove 2 corresponding to heat-conducting piece 3；M
S heat-conducting piece 3 in a heat-conducting piece 3 is spirally connected with groove 2 corresponding to heat-conducting piece 3, wherein S is more than or equal to 1 and small
In the positive integer of M, remaining N-S heat-conducting piece 3 carries out cementing with groove 2 corresponding to heat-conducting piece 3.
The present embodiment, by being provided at least one groove 2 on the surface of circuit board body 1；In at least one groove 2
It is provided at least one heat-conducting piece 3；The lower surface of each heat-conducting piece 3 is bonded with the bottom surface of groove 2 corresponding to heat-conducting piece 3.
By opening up groove 2 on the surface of circuit board body 1, one or more heat-conducting pieces 3 are set in groove 2, and then in circuit
The heat of the inside of plate ontology 1 can be distributed by heat-conducting piece 3, enhance the heat dissipation effect of circuit board；And by heat-conducting piece 3
Bottom surface be bonded with the bottom surface of groove 2, further increase the contact area of heat-conducting piece 3 Yu circuit board body 1, and then will be electric
The heat transfer that road plate is generated in the course of work promotes the heat-sinking capability of circuit board to the external world；In turn, guarantee circuit board and circuit
Component on plate is not damaged by high temperature, and ensures the normal work of circuit board and the component on circuit board.
Fig. 5 is the structural schematic diagram one of another circuit board provided by the embodiments of the present application, and Fig. 6 mentions for the embodiment of the present application
The structural schematic diagram two of another circuit board supplied, as shown in Figure 5 and Figure 6, on the basis of embodiment shown in Fig. 1, circuit board
At least one cooling fin 4 is provided on ontology 1.
Each of at least one cooling fin 4 cooling fin 4 includes egative film 5 and at least one radiating fin 6, at least one
Each of radiating fin 6 radiating fin 6 is connect with egative film 5, and egative film 5 is connect with the surface of circuit board body 1.
Optionally, interconnecting piece 7 is provided on each cooling fin 4, interconnecting piece 7 includes the first plate and the second plate, the first plate
It is in predetermined angle between the second plate；At least one radiating fin 6 is fixed at the upper surface of interconnecting piece 7, and the fixation of egative film 5 is set
It sets in the lower surface of interconnecting piece 7.
Optionally, the height of radiating fin 6 adjacent at least one radiating fin 6 is identical or different.
Illustratively, on the basis of the above embodiments, one or more can also be arranged on the surface of circuit board body 1
A cooling fin 4.
For example, one or more cooling fins 4 are fixedly installed on the upper surface of circuit board body 1；Alternatively, in circuit
One or more cooling fins 4 are fixedly installed on the lower surface of plate ontology 1；Alternatively, fixation is set on the upper surface of circuit board body 1
One or more cooling fins 4 are set, also, one or more cooling fins 4 are fixedly installed on the lower surface of circuit board body 1；Or
On the surface of one or more heat-conducting pieces 3 in circuit board body 1, one or more cooling fins 4 are arranged in person.
For position of the cooling fin 4 in circuit board body 1, the application is with no restrictions.For cooling fin 4 in circuit board sheet
Arrangement mode on body 1, the application is with no restrictions.For the number of cooling fin 4, the application is with no restrictions.For cooling fin 4
Shapes and sizes, the application is with no restrictions.
Further, on one or more chips are provided on the lower surface of circuit board body 1, each chip and circuit
Plate ontology 1 is fixedly connected；For the ease of the heat dissipation of chip, cooling fin 4 can be set on each chip.
For the connection type of cooling fin 4 and chip, the application is with no restrictions.For chip under circuit board body 1
Position on surface, the application is with no restrictions.For arrangement mode of the chip in circuit board body 1, the application is with no restrictions.
For the number of chip, the application is with no restrictions.For the shapes and sizes of chip, the application is with no restrictions.
Further, Fig. 7 is the structural schematic diagram one of cooling fin provided by the embodiments of the present application, as shown in fig. 7, each
Cooling fin 4 is made of egative film 5 and at least one radiating fin 6, each radiating fin 6 is fixedly connected with egative film 5；Also, bottom
Piece 5 is fixedly connected with circuit board body 1, and then will be in the fixed setting to circuit board body 1 of cooling fin 4.
Also, the height of adjacent radiating fin 6 is identical or different in each radiating fin 6 in same cooling fin 4.Example
Such as, the height of each radiating fin 6 in same cooling fin 4 is all identical；Alternatively, each radiating fin 6 in same cooling fin 4
Height be all different；Alternatively, the height of the part radiating fin 6 in same cooling fin 4 is identical, remaining part dissipates
The height of hot fin 6 is different；Alternatively, for same cooling fin 4, from the radiating fin 6 of the centre of cooling fin 4 towards both sides
Radiating fin 6 direction, the height of radiating fin 6 is successively raised and lowered.For example, as shown in fig. 7, each in cooling fin 4
The height of radiating fin 6 is all identical；For example, Fig. 8 is the structural schematic diagram two of cooling fin provided by the embodiments of the present application, such as
Shown in Fig. 8, from the radiating fin 6 of the centre of cooling fin 4 towards the direction of the radiating fin 6 on both sides, the height of radiating fin 6 according to
Secondary raising.
And it is possible to which a handle is arranged at the top of cooling fin 4, a radiating fin 6 of the handle and cooling fin 4 is solid
Fixed connection can also will be radiated so as to be snapped fit onto cooling fin 4 in circuit board body 1 by the handle by the handle
Piece 4 is taken off from circuit board body 1.
In the present embodiment, an interconnecting piece 7 can be provided on cooling fin 4, interconnecting piece 7 is by including the first plate and second
Plate is constituted, and is in predetermined angle between the first plate and the second plate, which can be in the range of 180 degree be to 90 degree；
Also, each radiating fin 6 is fixed at the upper surface of interconnecting piece 7, and egative film 5 is fixed at the lower surface of interconnecting piece 7.
For example, Fig. 9 is the structural schematic diagram three of cooling fin provided by the embodiments of the present application, as shown in figure 9, on cooling fin 4
It is provided with an interconnecting piece 7, also, the height of each radiating fin 6 in cooling fin 4 is all identical；Figure 10 is that the application is real
The structural schematic diagram four for applying the cooling fin of example offer is provided with an interconnecting piece 7 as shown in Figure 10 on cooling fin 4, and from dissipating
The radiating fin 6 of the centre of backing 4 towards both sides radiating fin 6 direction, the height of radiating fin 6 successively increases.
The present embodiment, by the way that one or more cooling fins 4 are arranged in circuit board body 1；Cooling fin 4 can be set in electricity
On the heat-conducting piece 3 of road plate ontology 1, alternatively, cooling fin 4 can be set at the other positions on the surface of circuit board body 1.In turn
By cooling fin 4, the heat for further generating circuit board in the course of work is more transmitted to the external world；Further mention
Rise the heat-sinking capability of circuit board.
Figure 11 is the structural schematic diagram one of another circuit board provided by the embodiments of the present application, as shown in figure 11, in Fig. 1 and
On the basis of embodiment illustrated in fig. 5, when groove 2 is engaged with heat-conducting piece 3 corresponding to groove 2, implement this implementation
The following scheme of example.
It is provided with the first clamping portion on each groove 2, is arranged on each heat-conducting piece 3 corresponding to each groove 2
There is the second clamping portion, the first clamping portion and the second clamping portion are clamped.
Optionally, the number of the first clamping portion on each groove 2 is one, is provided at least one on the first clamping portion
A first card and portion 8 are provided on each heat-conducting piece 3 corresponding to each groove 2 matched at least with the first card and portion 8
One second card and portion 9.
Optionally, the first card and portion 8 are recess, and the second card and portion 9 are convex；Alternatively, the first card and portion 8 are protrusion
Shape, the second card and portion 9 are recess.
Optionally, the side at the top of groove 2 is arranged at least one first card on each first clamping portion and portion 8
Edge；The edge of the top surface of heat-conducting piece 3 is arranged at least one second card and portion 9.
Optionally, at least one first card on each first clamping portion and portion 8 and the top of groove 2 are located at same water
Plane, at least one second card and portion 9 and the top surface of heat-conducting piece 3 are located at same level.
Optionally, the first card and portion 8 and the second card and portion 9 correspond.
Illustratively, in order to enable groove 2 and heat-conducting piece 3 carry out it is good engage, is provided on each groove 2
The second clamping portion is arranged on each heat-conducting piece 3 in one clamping portion；First clamping portion and the second clamping portion are mutually matched,
To which the first clamping portion can be clamped with the second clamping portion, and then heat-conducting piece 3 is engaged in groove 2.
Further, on each groove 2 be arranged first clamping portion, be provided on the first clamping portion one or
Multiple first cards and portion 8, also, setting and matched one or more second cards of the first card and portion 8 and portion 9 on heat-conducting piece 3.
For example, as shown in figure 11, one first card and portion 8 are provided in each groove 2；One groove 2 is right
A heat-conducting piece 3 is answered, then setting and the first card and portion 8 matched one or more second on the corresponding heat-conducting piece 3 of groove 2
Card and portion 9.Preferably, the first card and portion 8 and the second card and portion 9 are one-to-one.As shown in figure 11, the first card and portion 8 can
To be located on the bottom surface of groove 2.Wherein, first card and portion 8 can be recess, then second card and portion 9 be convex, can will
Second card and portion 9 are inserted into the first card and portion 8；In order to enable first card and portion 8 with second block and portion 9 connect it is more secured,
The first card can be set and portion 8 is elastic, and the first card and the diameter in portion 8 are greater than the diameter of the second card and portion 9.Alternatively,
First card and portion 8 can be convex, then the second card and portion 9 are recess, the first card and portion 8 can be inserted into the second card
In portion 9, in order to enable the first card and portion 8 block with second and portion 9 connect more secured, the first card and portion 8 can be set as bullet
Property, and the first card and the diameter in portion 8 block the diameter with portion 9 less than second.If first card and portion 8 can be convex,
Second card and portion 9 are recess, are inserted into multiple second cards in one first card and portion 8 and when portion 9, multiple second cards and
It can be interconnected between portion 9.
Again for example, as shown in figure 11, one first card and portion 8 are provided in each groove 2；One groove 2
Corresponded to multiple heat-conducting pieces 3, then on each the corresponding heat-conducting piece 3 of groove 2 setting with first card and 8 matched one, portion or
Multiple second cards and portion 9.First card and portion 8 can be recess, and the second card and portion 9 are convex；Alternatively, the first card and portion
8 can be convex, and the second card and portion 9 are recess.The first card can be set and portion 8 is elastic.
Again for example, Figure 12 is the structural schematic diagram two of another circuit board provided by the embodiments of the present application, such as Figure 12
It is shown, multiple first cards and portion 8 are provided in each groove 2；One groove 2 has corresponded to one or more heat-conducting pieces 3；Then
Setting and matched one or more second cards of the first card and portion 8 and portion 9 on the corresponding heat-conducting piece 3 of groove 2.Wherein, one
First card and portion 8 have corresponded to a heat-conducting piece 3；Alternatively, multiple first cards and portion 8 have corresponded to a heat-conducting piece 3；Alternatively, first
Card and portion 8 and the second card and portion 9 are one-to-one.As shown in figure 12, the first card and portion 8 can be located on the bottom surface of groove 2.
Likewise, the first card and portion 8 can be recess, then the second card and portion 9 are convex；Alternatively, the first card and portion 8 can be
Convex, then the second card and portion 9 are recess.The first card can be set and portion 8 is elastic.
Further, Figure 13 is the structural schematic diagram three of another circuit board provided by the embodiments of the present application, such as Figure 13 institute
Show, the first card and portion 8 can be arranged in the edge at the top of groove 2 corresponding to the first card and portion 8, also, second is blocked
The edge of the top surface of heat-conducting piece 3 is set with portion 9.The structure in the first card and portion 8 and two cards and portion, provides following several implementations
Mode.
The first embodiment: first card and portion 8 can be recess, second card and portion 9 be convex, then first card and
Portion 8 is recessed on the edge at the top of groove 2, extends the second card and portion 9 on the edge of the top surface of heat-conducting piece 3, in turn
Second card and portion 9 block and into the first cards and portion 8.At this point, first blocks the top position of the groove 2 corresponding with the top in portion 8
In same level.At this point, Figure 14 is the structural schematic diagram two of heat-conducting piece provided by the embodiments of the present application, as shown in figure 14, the
The top surface of the corresponding heat-conducting piece 3 in the top surface in two cards and portion 9 is located at same level；Alternatively, Figure 15 is the embodiment of the present application
The structural schematic diagram three of the heat-conducting piece of offer, as shown in figure 15, the top of the corresponding heat-conducting piece 3 in the bottom surface in the second card and portion 9
Face is located at same level.
The first embodiment: first card and portion 8 can be convex, second card and portion 9 be recess, then first card and
Portion 8 carries out protrusion on the edge at the top of groove 2, extends the second card and portion 9 on the edge of the top surface of heat-conducting piece 3, in turn
First card and portion 8 block and into the second cards and portion 9.At this point, first blocks the top position of the groove 2 corresponding with the bottom in portion 8
In same level.At this point it is possible to recessed portion is dug in the second card of the heat-conducting piece 3 shown in Figure 14 and portion 9, the second card and portion
The top surface of the corresponding heat-conducting piece 3 in 9 top surface is located at same level；Alternatively, the heat-conducting piece 3 shown in Figure 15 second card and
Recessed portion is dug in portion 9, the top surface of the second card heat-conducting piece 3 corresponding with the bottom surface in portion 9 is located at same level.
The present embodiment, it is each corresponding to each groove 2 by being provided with the first clamping portion on each groove 2
The second clamping portion is provided on a heat-conducting piece 3, the first clamping portion and the second clamping portion are clamped, so that heat-conducting piece 3 and groove 2
Good engaging is carried out, so that heat-conducting piece 3 is not easy to fall off from circuit board body 1, is beneficial to radiate to circuit board.
Embodiments herein additionally provides a kind of supercomputer equipment, as shown in figure 16, to provide in the embodiment of the present application
Supercomputer equipment structural schematic diagram.Specifically, as shown in Figure 16, in the supercomputer equipment include above-described embodiment in provide to
A few circuit board 161.
Optionally, parallel with one another between each circuit board 161 in supercomputer equipment.
Optionally, sliding slot is provided on the cabinet of supercomputer equipment, sliding slot is used for sliding with each circuit board 161 in supercomputer equipment
Dynamic connection.
Optionally, the cabinet two sides of supercomputer equipment are also provided with fan, the heat dissipation wind channel of fan can on circuit board 161
The heat dissipation cavity of radiator be consistent, so that quickly the heat that cabinet interior circuit board 161 generates is dispersed into outside cabinet, into
And provide the performance of supercomputer equipment.
Illustratively, one or more circuit boards 161 are set in supercomputer equipment, which uses above-mentioned implementation
The circuit board that example provides.The structure and function of circuit board 161 may refer to the introduction of above-described embodiment, repeat no more.
In the present embodiment, multiple circuit boards 161 can be subjected to parallel connection, then by the setting of circuit board 161 in parallel super
It calculates in equipment.In one embodiment, supercomputer equipment can be supercomputer server.
Circuit board 161 can choose the mode for being fixedly connected or being slidably connected with the connection type of supercomputer equipment.It is exemplary
Ground can be provided with one or more sliding slots on the cabinet of supercomputer equipment, and then circuit board 161 is arranged in sliding slot, is made
Obtaining circuit board 161 can slide on the chute.
Wherein, when multiple circuit board 161 are set in supercomputer equipment, each of multiple circuit boards 161 circuit
The structure of plate 161 can be identical or different.For example, S circuit board 161 is set in supercomputer equipment, and S is more than or equal to 2
Positive integer is provided with a groove on the circuit board 161 of the part in S circuit board 161, is arranged on remaining circuit board 161
Multiple grooves.
The present embodiment, by being provided at least one groove on the surface of circuit board body；It is set at least one groove
It is equipped at least one heat-conducting piece；The lower surface of each heat-conducting piece is bonded with the bottom surface of groove corresponding to heat-conducting piece.By
Groove is opened up on the surface of circuit board body, and one or more heat-conducting pieces are set in a groove, and then in circuit board body
The heat in portion can be distributed by heat-conducting piece, enhance the heat dissipation effect of circuit board 161；And by the bottom surface of heat-conducting piece with it is recessed
The bottom surface of slot is bonded, and further increases the contact area of heat-conducting piece and circuit board body, and then circuit board 161 is being worked
The heat transfer that process generates promotes the heat-sinking capability of circuit board 161 to the external world；In turn, guarantee circuit board 161 and circuit board
Component on 161 is not damaged by high temperature, and ensures the normal work of circuit board 161 and the component on circuit board 161.
When in the application, although term " first ", " second " etc. may be used in this application to describe respectively
Element, but these elements should not be limited by these terms.These terms are only used to by an element and another element region
It does not open.For example, in the case where not changing the meaning of description, first element can be called second element, and same, second
Element can be called first element, as long as " second yuan that " first element " occurred is unanimously renamed and occurred
Part " unanimously renames.First element and second element are all elements, but can not be identical element.
Word used herein is only used for description embodiment and is not used in limitation claim.Such as embodiment with
And used in the description of claim, unless context clearly illustrates, otherwise "one" (a) of singular, "one"
(an) and " described " (the) is intended to include equally plural form.Similarly, term "and/or" as used in this specification
Refer to comprising one or more associated any and all possible combinations listed.In addition, when being used for the application
When middle, term " includes " (comprise) and its modification " comprising " (comprises) and/or refer to including (comprising) etc. old
The presence of feature, entirety, step, operation, element and/or the component stated, but be not excluded for one or more other features,
Entirety, step, operation, element, component and/or these grouping presence or addition.
Above-mentioned technical description can refer to attached drawing, these attached drawings form a part of the application, and by description attached
The embodiment according to described embodiment is shown in figure.Although the description of these embodiments is enough in detail so that this field
Technical staff can be realized these embodiments, but these embodiments are non-limiting；Other implementations thus can be used
Example, and variation can also be made in the case where not departing from the range of described embodiment.For example, described in flow chart
Operation order be non-limiting, therefore in flow charts illustrate and according to flow chart description two or more behaviour
The sequence of work can be changed according to several embodiments.As another example, in several embodiments, it explains in flow charts
It releases and is optional or deletable according to one or more operations that flow chart describes.In addition, certain steps or
Function can be added in the disclosed embodiments or more than two sequence of steps are replaced.All these variations are considered
Included in the disclosed embodiments and claim.
In addition, using term to provide the thorough understanding of described embodiment in above-mentioned technical description.However, and being not required to
Will excessively detailed details to realize described embodiment.Therefore, the foregoing description of embodiment be in order to illustrate and describe and
It presents.The embodiment and example disclosed according to these embodiments presented in foregoing description is provided separately, with
Addition context simultaneously helps to understand described embodiment.Description above, which is not used in, accomplishes exhaustive or by described reality
Apply the precise forms that example is restricted to the application.According to the above instruction, it is several modification, selection be applicable in and variation be feasible.?
In some cases, processing step well known is not described in avoid described embodiment is unnecessarily influenced.
Specific embodiment is applied in the application, and the principle and implementation of this application are described, above embodiments
Explanation be merely used to help understand the present processes and its core concept；At the same time, for those skilled in the art,
According to the thought of the application, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Hold the limitation that should not be construed as to the application.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (21)
1. a kind of circuit board characterized by comprising
Circuit board body is provided at least one groove on the surface of the circuit board body；
At least one heat-conducting piece is provided at least one described groove；
The lower surface of each of at least one heat-conducting piece heat-conducting piece is bonded with the bottom surface of groove corresponding to heat-conducting piece.
2. circuit board according to claim 1, which is characterized in that the heat-conducting piece is heat-conducting metal.
3. circuit board according to claim 2, which is characterized in that the heat-conducting metal include copper, aluminium, silver, tin, gold, iron,
One of aluminium alloy is a variety of.
4. circuit board according to claim 1, which is characterized in that the heat-conducting piece is thermally conductive nonmetallic.
5. circuit board according to claim 4, which is characterized in that described thermally conductive nonmetallic for graphene.
6. circuit board according to claim 1, which is characterized in that set in each of at least one described groove groove
The one or more heat-conducting pieces being equipped at least one described heat-conducting piece.
7. circuit board according to claim 1, which is characterized in that each of at least one described groove groove and institute
It is one-to-one for stating each of at least one heat-conducting piece heat-conducting piece.
8. circuit board according to claim 1-7, which is characterized in that each described groove and it is described each
Heat-conducting piece corresponding to groove is spirally connected；
Alternatively, each described groove carried out with heat-conducting piece corresponding to each described groove it is be bonded.
9. circuit board according to claim 1-7, which is characterized in that each described groove and it is described each
Heat-conducting piece corresponding to groove is engaged.
10. circuit board according to claim 9, which is characterized in that it is provided with the first clamping portion on each described groove,
The second clamping portion, first clamping portion and described second are provided on each heat-conducting piece corresponding to each described groove
Clamping portion clamping.
11. circuit board according to claim 10, which is characterized in that first clamping portion on each described groove
Number be one, at least one first card and portion are provided on first clamping portion, corresponding to each described groove
It is provided on each heat-conducting piece and at least one matched second card of first card and portion and portion.
12. circuit board according to claim 11, which is characterized in that it is described first card and portion be recess, described second
Card and portion are convex；
Alternatively, first card and portion are convex, second card and portion are recess.
13. circuit board according to claim 11 or 12, which is characterized in that described on each described first clamping portion
The edge at the top of the groove is arranged at least one first card and portion；
The edge of the top surface of the heat-conducting piece is arranged at least one described second card and portion.
14. circuit board according to claim 13, which is characterized in that on each described first clamping portion it is described at least
The top of one first card and portion and the groove is located at same level, it is described at least one second block and portion with it is described thermally conductive
The top surface of part is located at same level.
15. the described in any item circuit boards of 1-14 according to claim 1, which is characterized in that first card and portion and described the
Two cards and portion correspond.
16. -15 described in any item circuit boards according to claim 1, which is characterized in that be provided in the circuit board body to
A few cooling fin；
Each of at least one cooling fin cooling fin includes egative film and at least one radiating fin, it is described at least one
Each of radiating fin radiating fin is connect with the egative film, and the egative film is connect with the surface of the circuit board body.
17. circuit board according to claim 16, which is characterized in that it is provided with interconnecting piece on each described cooling fin,
Interconnecting piece includes the first plate and the second plate, is in predetermined angle between first plate and second plate；
At least one described radiating fin is fixed at the upper surface of the interconnecting piece, and the egative film is fixed at the company
The lower surface of socket part.
18. circuit board according to claim 16 or 17, which is characterized in that adjacent at least one described radiating fin
The height of radiating fin is identical or different.
19. a kind of supercomputer equipment, which is characterized in that including at least one such as the described in any item circuit boards of claim 1-18.
20. supercomputer equipment according to claim 19, which is characterized in that each circuit board in the supercomputer equipment it
Between it is parallel with one another.
21. supercomputer equipment described in 9 or 20 according to claim 1, which is characterized in that be provided on the cabinet of the supercomputer equipment
Sliding slot, the sliding slot with each circuit board in the supercomputer equipment for being slidably connected.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/113201 WO2020087411A1 (en) | 2018-10-31 | 2018-10-31 | Circuit board and supercomputing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109565930A true CN109565930A (en) | 2019-04-02 |
| CN109565930B CN109565930B (en) | 2022-03-08 |
Family
ID=65872570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880002442.6A Active CN109565930B (en) | 2018-10-31 | 2018-10-31 | Circuit boards and supercomputing equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109565930B (en) |
| WO (1) | WO2020087411A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023087587A1 (en) * | 2021-11-16 | 2023-05-25 | 中兴通讯股份有限公司 | Optional module heat dissipation apparatus and communication device |
| CN117395865A (en) * | 2023-12-12 | 2024-01-12 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
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| CN101291571A (en) * | 2007-04-20 | 2008-10-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Buried copper heat dissipation PCB structure |
| CN104776338A (en) * | 2015-04-24 | 2015-07-15 | 东莞市闻誉实业有限公司 | lighting device |
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
| CN205693973U (en) * | 2016-06-28 | 2016-11-16 | 广州市博声电子科技开发有限公司 | A kind of pcb board assembly |
| CN205864859U (en) * | 2016-07-11 | 2017-01-04 | 江门市奔力达电路有限公司 | A kind of PCB with radiator structure |
| CN207573703U (en) * | 2017-12-08 | 2018-07-03 | 东莞市德胜电路板有限公司 | A single-sided circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100819887B1 (en) * | 2005-11-25 | 2008-04-07 | 윤동구 | IC holder, system board and IC package for this. |
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2018
- 2018-10-31 CN CN201880002442.6A patent/CN109565930B/en active Active
- 2018-10-31 WO PCT/CN2018/113201 patent/WO2020087411A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101291571A (en) * | 2007-04-20 | 2008-10-22 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN204217201U (en) * | 2014-10-13 | 2015-03-18 | 东莞森玛仕格里菲电路有限公司 | Buried copper heat dissipation PCB structure |
| CN104776338A (en) * | 2015-04-24 | 2015-07-15 | 东莞市闻誉实业有限公司 | lighting device |
| CN105472869A (en) * | 2015-12-14 | 2016-04-06 | 深圳崇达多层线路板有限公司 | Printed circuit board with semi-embedded type embedded heat conductive block |
| CN205693973U (en) * | 2016-06-28 | 2016-11-16 | 广州市博声电子科技开发有限公司 | A kind of pcb board assembly |
| CN205864859U (en) * | 2016-07-11 | 2017-01-04 | 江门市奔力达电路有限公司 | A kind of PCB with radiator structure |
| CN207573703U (en) * | 2017-12-08 | 2018-07-03 | 东莞市德胜电路板有限公司 | A single-sided circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023087587A1 (en) * | 2021-11-16 | 2023-05-25 | 中兴通讯股份有限公司 | Optional module heat dissipation apparatus and communication device |
| CN117395865A (en) * | 2023-12-12 | 2024-01-12 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
| CN117395865B (en) * | 2023-12-12 | 2024-02-27 | 深圳市凌航达电子有限公司 | Stackable circuit board for sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020087411A1 (en) | 2020-05-07 |
| CN109565930B (en) | 2022-03-08 |
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