CN109545733A - A kind of wafer carrier and the manipulator for operating the wafer carrier - Google Patents
A kind of wafer carrier and the manipulator for operating the wafer carrier Download PDFInfo
- Publication number
- CN109545733A CN109545733A CN201710867571.9A CN201710867571A CN109545733A CN 109545733 A CN109545733 A CN 109545733A CN 201710867571 A CN201710867571 A CN 201710867571A CN 109545733 A CN109545733 A CN 109545733A
- Authority
- CN
- China
- Prior art keywords
- wafer carrier
- wafer
- carrier
- manipulator
- clamping part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
本发明提供一种晶圆载具及用于操作所述晶圆载具的机械手，该晶圆载具包括：用于夹持晶圆的载具环以及设置在所述载具环中的磁性部件，该机械手包括：上夹持部和下夹持部，在所述上夹持部和/或下夹持部上设置有电磁部件，所述电磁部件在通电时向外一侧的极性与所述晶圆载具上对应的所述磁性部件向外一侧的极性相反。该晶圆载具及用于操作所述晶圆载具的机械手可以更容易操作诸如450mm晶圆的重量较大的晶圆，并且不会污染晶圆。
The present invention provides a wafer carrier and a manipulator for operating the wafer carrier. The wafer carrier includes: a carrier ring for clamping wafers and a magnetic field disposed in the carrier ring The manipulator includes: an upper clamping part and a lower clamping part, an electromagnetic part is arranged on the upper clamping part and/or the lower clamping part, and the polarity of the electromagnetic part is outward when energized The polarity is opposite to that of the outer side of the corresponding magnetic component on the wafer carrier. The wafer carrier and the robot for handling the wafer carrier can more easily handle heavier wafers, such as 450mm wafers, without contaminating the wafers.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of wafer carrier and for operating the wafer
The manipulator of tool.
Background technique
With the development of semiconductor technology, had begun in advanced semiconductors manufacture at present using 450mm wafer, it can
To improve the production efficiency of semiconductor devices, the cost of manufacture of semiconductor devices is reduced.It is formed currently, being sliced at crystal bar (igot)
After wafer, wafer is installed on wafer carrier and is further installed in carrier box.However, 450mm wafer is very heavy, it is mechanical
Hand (robot) is difficult smoothly to operate wafer disengaging carrier box.Therefore, the loading side of wafer is needed to be improved during wafer processing
Method is more preferably to operate 450mm wafer.Figure 1A and Figure 1B shows a solution, as shown in FIG. 1A and 1B, in wafer carrier
Notch 11 is formed on 10, and forms corresponding holding section on manipulator 20, and specifically, manipulator 20 includes upper 21 He of clamping part
Lower clamping part 22, the holding section 23 matched with notch 11 is arranged in the lower surface of upper clamping part 21, and manipulator 20 passes through engaging
Portion 23 operates wafer carrier with the clamping of the engaging of notch 11 and upper clamping part 21 and lower clamping part 22, such as will load
There is the wafer carrier of wafer to be put into carrier box or take out from carrier box.
Although this wafer carrier and manipulator can overcome the problems, such as that 450mm wafer difficulty operates, notch 11 is easy
Particle is collected, and the cleaning of notch and manipulator is more difficult, therefore is easy to pollution wafer.
Manipulator it is therefore desirable to propose a kind of wafer carrier and for operating the wafer carrier, at least partly to solve
The certainly above problem.
Summary of the invention
A series of concept of reduced forms is introduced in Summary, this will in the detailed description section into
One step is described in detail.Summary of the invention is not meant to attempt to limit technical solution claimed
Key feature and essential features do not mean that the protection scope for attempting to determine technical solution claimed more.
In view of the deficiencies of the prior art, the present invention proposes a kind of wafer carrier and the machinery for operating the wafer carrier
Hand, can be easier to operate to the biggish wafer of weight of such as 450mm wafer, and will not pollute wafer.
In order to overcome the problems, such as that presently, there are one aspect of the present invention provides a kind of wafer carrier, comprising: for clamping wafer
Carrier ring and the magnetic part that is arranged in the carrier ring.
Optionally, at least two positions of the carrier ring are provided with the magnetic part.
Optionally, the magnetic part is set in the upside, downside or two sides of the carrier ring.
Optionally, the magnetic part there are two being set side by side in the upside of the carrier ring and/or downside.
Optionally, the polarity of the outside side of two magnetic parts is opposite.
Optionally, the surface of the magnetic part is flushed with the surface of the carrier ring
Another aspect of the present invention provide it is a kind of for operating the manipulator of above-mentioned wafer carrier, it is as described above for operating
Wafer carrier comprising: upper clamping part and lower clamping part are provided with electromagnetic part on the upper clamping part and/or lower clamping part
Part, the polarity magnetic part outside one corresponding on the wafer carrier of the electromagnetic component outside side when being powered
The polarity of side is opposite.
Optionally, the inside of the upper clamping part and/or lower clamping part is arranged in the electromagnetic component.
Optionally, the position and quantity of the position of the electromagnetic component and quantity and the magnetic part on the wafer carrier
It is corresponding.
Optionally, flexible material layer is covered on the inside of the lower clamping part.
Wafer carrier according to the present invention and manipulator for operating the wafer carrier, due to being set on wafer carrier
It is equipped with magnetic part, is correspondingly arranged on electromagnetic component in manipulator, therefore have nonmagnetic can be realized by controlling electromagnetic component
Clamping or release to wafer carrier, this operating method can smoothly operate such as 450mm wafer during wafer is processed
The biggish wafer of weight, and wafer will not be polluted because collecting particle due to being not provided with notch arrangement.
Detailed description of the invention
Following drawings of the invention is incorporated herein as part of the present invention for the purpose of understanding the present invention.Shown in the drawings of this hair
Bright embodiment and its description, principle used to explain the present invention.
In attached drawing:
Figure 1A shows a kind of schematic plan of wafer carrier for being mounted with wafer；
Figure 1B shows showing for wafer carrier described in Figure 1A and the manipulator for wafer carrier described in operation diagram 1A
Meaning property partial sectional view；
Fig. 2A shows the schematic plan of the wafer carrier for being mounted with wafer according to an embodiment of the present invention；
Fig. 2 B show wafer carrier described in Fig. 2A and according to an embodiment of the present invention for described in operation diagram 2A
Wafer carrier manipulator show in schematic partial sections.
Specific embodiment
In the following description, a large amount of concrete details are given so as to provide a more thorough understanding of the present invention.So
And it is obvious to the skilled person that the present invention may not need one or more of these details and be able to
Implement.In other examples, in order to avoid confusion with the present invention, for some technical characteristics well known in the art not into
Row description.
It should be understood that the present invention can be implemented in different forms, and should not be construed as being limited to propose here
Embodiment.On the contrary, provide these embodiments will make it is open thoroughly and completely, and will fully convey the scope of the invention to
Those skilled in the art.In the accompanying drawings, for clarity, the size and relative size in the area Ceng He may be exaggerated phase from beginning to end
Identical element is indicated with appended drawing reference.
It should be understood that when element or layer be referred to " ... on ", " with ... it is adjacent ", " being connected to " or " being coupled to " other members
When part or layer, can directly on other elements or layer, it is adjacent thereto, be connected or coupled to other elements or layer, or
There may be elements or layer between two parties.On the contrary, when element is referred to as " on directly existing ... ", " with ... direct neighbor ", " is directly connected to
To " or " being directly coupled to " other elements or when layer, then there is no elements or layer between two parties.Art can be used although should be understood that
Language first, second, third, etc. describes various component, assembly units, area, floor and/or part, these component, assembly units, area, floor and/or portion
Dividing should not be limited by these terms.These terms are used merely to distinguish a component, assembly unit, area, floor or part and another
Component, assembly unit, area, floor or part.Therefore, do not depart from present invention teach that under, first element discussed below, component, area,
Floor or part are represented by second element, component, area, floor or part.
Spatial relation term for example " ... under ", " ... below ", " below ", " ... under ", " ... on ",
" above " etc., herein can for convenience description and being used describe an elements or features shown in figure with it is other
The relationship of elements or features.It should be understood that other than orientation shown in figure, spatial relation term intention further include using with
The different orientation of device in operation.For example, then, being described as " below other elements " if the device in attached drawing is overturn
Or " under it " or " under it " elements or features will be oriented in other elements or features "upper".Therefore, exemplary term
" ... below " and " ... under " it may include upper and lower two orientations.Device, which can be additionally orientated, (to be rotated by 90 ° or other takes
To) and spatial description language as used herein correspondingly explained.
The purpose of term as used herein is only that description specific embodiment and not as limitation of the invention.Make herein
Used time, " one " of singular, "one" and " described/should " be also intended to include plural form, unless the context clearly indicates separately
Outer mode.It is also to be understood that term " composition " and/or " comprising ", when being used in this specification, determines the feature, whole
The presence of number, step, operations, elements, and/or components, but be not excluded for one or more other features, integer, step, operation,
The presence or addition of component, assembly unit and/or group.Herein in use, term "and/or" includes any of related listed item and institute
There is combination.
In order to thoroughly understand the present invention, detailed structure and step will be proposed in following description, to illustrate this hair
The technical solution of bright proposition.Presently preferred embodiments of the present invention is described in detail as follows, however other than these detailed descriptions, the present invention
There can also be other embodiments.
To solve foregoing problems, the present invention proposes a kind of wafer carrier and the manipulator for operating the wafer carrier,
Below with reference to Fig. 2A and Fig. 2 B, the manipulator to wafer carrier according to the present invention and for operating the wafer carrier carries out detailed
It describes in detail bright.
As shown in Figure 2 A and 2 B, wafer carrier 200 disclosed in the present embodiment includes the carrier ring for clamping wafer W
201 and the magnetic part 202 that is arranged in the carrier ring 201.The structure annular in shape of carrier ring 201, for clamping wafer W.
Magnetic part 202 is the various parts with magnetic action, such as magnet etc..The sheet of carrier ring 201 is arranged in magnetic part 202
In vivo, and the surface of magnetic part 202 is flushed with the surface of carrier ring 201, thus make the smooth of 201 surface of carrier ring, so as to
In cleaning carrier ring 201.
Further, wafer carrier is preferably operated for the ease of manipulator, in the present embodiment, in carrier ring 201
At least two positions are provided with magnetic part 202.Illustratively, as shown in Figure 2 A, it (is defined herein in the upside of carrier ring 201
The outside side of wafer is the upside of carrier ring, and opposite side is downside) setting a pair of magnetic component 202, and illustratively,
The outside side of a pair of magnetic component 202 has opposite polarity, i.e. the outside side of a magnetic part is the pole N, another
The outside side of a magnetic part is the pole S.
It should be appreciated that the position of magnetic part 202 is not limited to position shown in Fig. 2A, such as can be in carrier ring 201
Magnetic part 202 is arranged in downside, or is respectively provided with magnetic part in two sides.Illustratively, as shown in Figure 2 B, in carrier ring 201
The upper side and lower side be provided with magnetic part 202, and the magnetic part 202 of upper layer and downside can be using shown in Fig. 2A
Arrangement, i.e., parallel arrangement, and the outside side of a pair of magnetic component 202 has opposite polarity.Certainly, magnetic part
202 polarity is also not necessarily limited to the example in the present embodiment, in other embodiments, the polarity of the outside side of magnetic part 202
Can be identical, for example, magnetic part 202 be all N extremely outward or be all S extremely outside, as long as accordingly adjustment manipulator on electromagnetic part
Part iron set-up mode.Herein, the outside side of so-called magnetic part 202 refers to magnetic part 202 towards external one
Side, it is opposite with the side being located inside carrier ring 201.
In order to operate above-mentioned wafer carrier, the present embodiment also discloses a kind of manipulator 300, and Fig. 2 B shows manipulator
300 Some illustrative sectional views.As shown in Figure 2 B, manipulator 300 disclosed in the present embodiment includes upper clamping part 301 and lower clamping
Portion 302, is provided with electromagnetic component 303 on the upper clamping part 301 and/or lower clamping part 302, and the electromagnetic component 303 exists
The polarity of the polarity of the outside side side outside with the magnetic part 202 corresponding on the wafer carrier 200 when energization
On the contrary.For example, when the polarity for stating the outside side of the corresponding magnetic part 202 on wafer carrier 200 is the pole N, then it is mechanical
Corresponding electromagnetic component outside side when being powered is the pole S on hand 300.When so-called correspondence refers to operation wafer carrier herein
The magnetic part and electromagnetic component of interaction between each other.The outside side of the electromagnetic component 303 refers to 303 court of electromagnetic component
It is opposite with the side being located inside upper clamping part 301 and/or lower clamping part 302 to external side.
It should be appreciated that the magnetic part 202 on the position of the electromagnetic component 303 and quantity and the wafer carrier 200
Position and quantity it is corresponding, and the electromagnetic component 303 can be according to the magnetic part 202 on the wafer carrier 200
Position the inside of the upper clamping part 301 and/or lower clamping part 302 is set.The so-called upper clamping part 301 herein
And/or the inside of lower clamping part 302 refers to the upper clamping part 301 and/or the side relative to each other of lower clamping part 302.
Further, for wafer processing device, wafer is smoothly operated, is covered in the inside of lower clamping part 302 soft
Property material layer 304.The flexible material layer can use various suitable materials, such as rubber etc..
The operating method of wafer carrier 200 and manipulator 300 disclosed in the present embodiment are as follows: when needing to clamp wafer carrier
When 200, then it is passed through electric current to the electromagnetic component 303 of manipulator 300, so that electromagnetic component 303 has magnetism, then manipulator
Upper clamping part 301 and lower clamping part 302 shift to wafer carrier 200 and close to each other, pass through electromagnetic component 303 and magnetic part
Clamping to wafer carrier 200 is realized in 202 interaction, (such as is put into after carrier box from load to operate wafer carrier 200
It is taken out in tool box).When needing to discharge wafer carrier 200, then the electric current for being passed through electromagnetic component 303 is disconnected, at this time electromagnetic component
303 no longer have magnetism, are separated from each other and wafer carrier 200 can be realized as long as controlling above clamping part 301 and lower clamping part 302
Release.
Manipulator according to the wafer carrier of the present embodiment and for operating the wafer carrier, due on wafer carrier
Be provided with magnetic part, be correspondingly arranged on electromagnetic component in manipulator, thus by control electromagnetic component have it is nonmagnetic can be real
Now to the clamping of wafer carrier or release, this operating method can smoothly operate such as 450mm crystalline substance during wafer is processed
The biggish wafer of round weight, and due to being not provided with notch arrangement wafer will not be polluted because collecting particle.
The present invention has been explained by the above embodiments, but it is to be understood that, above-described embodiment is only intended to
The purpose of citing and explanation, is not intended to limit the invention to the scope of the described embodiments.Furthermore those skilled in the art
It is understood that the present invention is not limited to the above embodiments, introduction according to the present invention can also be made more kinds of member
Variants and modifications, all fall within the scope of the claimed invention for these variants and modifications.Protection scope of the present invention by
The appended claims and its equivalent scope are defined.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710867571.9A CN109545733A (en) | 2017-09-22 | 2017-09-22 | A kind of wafer carrier and the manipulator for operating the wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710867571.9A CN109545733A (en) | 2017-09-22 | 2017-09-22 | A kind of wafer carrier and the manipulator for operating the wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109545733A true CN109545733A (en) | 2019-03-29 |
Family
ID=65830653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710867571.9A Pending CN109545733A (en) | 2017-09-22 | 2017-09-22 | A kind of wafer carrier and the manipulator for operating the wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109545733A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128822A (en) * | 2019-12-10 | 2020-05-08 | 许正根 | Carrier for loading wafer and carrier clamping device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101148221A (en) * | 2007-09-03 | 2008-03-26 | 浙江大学 | Conveyor with drawer tray |
| CN101971318A (en) * | 2007-12-28 | 2011-02-09 | 朗姆研究公司 | Wafer carrier driving device and operating method thereof |
| CN203033437U (en) * | 2012-12-31 | 2013-07-03 | 杭州新峰恒富科技有限公司 | Electromagnet adsorption device |
| CN205950728U (en) * | 2016-08-17 | 2017-02-15 | 天津昊坤亿达金属制品有限公司 | Manipulator |
-
2017
- 2017-09-22 CN CN201710867571.9A patent/CN109545733A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101148221A (en) * | 2007-09-03 | 2008-03-26 | 浙江大学 | Conveyor with drawer tray |
| CN101971318A (en) * | 2007-12-28 | 2011-02-09 | 朗姆研究公司 | Wafer carrier driving device and operating method thereof |
| CN203033437U (en) * | 2012-12-31 | 2013-07-03 | 杭州新峰恒富科技有限公司 | Electromagnet adsorption device |
| CN205950728U (en) * | 2016-08-17 | 2017-02-15 | 天津昊坤亿达金属制品有限公司 | Manipulator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128822A (en) * | 2019-12-10 | 2020-05-08 | 许正根 | Carrier for loading wafer and carrier clamping device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107708886B (en) | Ferromagnetic plate spreading and gripping device | |
| CN104538345B (en) | A kind of pan device for clamping and rotating | |
| TWI668057B (en) | Semiconductor wafer cleaning equipment | |
| KR101545067B1 (en) | Port door positioning apparatus and associated methods | |
| CN106663516B (en) | Magneto-mechanical clamping device | |
| TW201351551A (en) | Wafer processing system for semiconductor process area and apparatus and method for transporting wafers between semiconductor devices | |
| TWI476856B (en) | Device for loading and unloading semiconductor substrate sheets | |
| JP2018510790A5 (en) | ||
| CN1543388A (en) | Electromagnetic clamping device and method for detecting and controlling the working state of the electromagnetic clamping device | |
| CN103137533B (en) | Electrostatic chuck robotic system | |
| JP2016539810A5 (en) | ||
| JP2003515941A (en) | Wafer transfer device | |
| JP2012528478A (en) | Device for particle-free handling of substrates | |
| CN109545733A (en) | A kind of wafer carrier and the manipulator for operating the wafer carrier | |
| CN112299010A (en) | A rigid-flexible switchable magnetic gripping device for robots | |
| CN106935537B (en) | Wafer cassette system and method of transporting semiconductor wafers | |
| Xiao et al. | Cytocompatible magnetostrictive microstructures for nano-and microparticle manipulation on linear strain response piezoelectrics | |
| US20100135764A1 (en) | Magnetically coupled thin-wafer handling system | |
| JP7488738B2 (en) | Vacuum lamination device and method for manufacturing laminate | |
| US20100028111A1 (en) | Variable-Size Load Port and Method for Operating the Same | |
| JP2007281203A (en) | Joining method and joining apparatus for joining two workpieces | |
| KR101448347B1 (en) | Mask alignment system using chuck plate | |
| CN116345956B (en) | Auxiliary fixture for magnetic levitation device and magnetic levitation equipment | |
| KR101584216B1 (en) | Electromagnetic Chuck having Adsorptive reinforcement structure | |
| KR101403766B1 (en) | Magnetic chucker for substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190329 |