CN109286700A - A kind of mobile phone backboard and mobile phone - Google Patents
A kind of mobile phone backboard and mobile phone Download PDFInfo
- Publication number
- CN109286700A CN109286700A CN201810812613.3A CN201810812613A CN109286700A CN 109286700 A CN109286700 A CN 109286700A CN 201810812613 A CN201810812613 A CN 201810812613A CN 109286700 A CN109286700 A CN 109286700A
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- CN
- China
- Prior art keywords
- mobile phone
- backboard
- heat
- radiating subassembly
- dissipating pipe
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
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- 150000001336 alkenes Chemical class 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 206010037660 Pyrexia Diseases 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 description 18
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- 239000004952 Polyamide Substances 0.000 description 1
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
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- 238000013021 overheating Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses a kind of mobile phone backboard and mobile phones.The mobile phone backboard includes: radiating subassembly, is located inside the backboard, and the radiating subassembly is heat-dissipating pipe.Mobile phone backboard provided in an embodiment of the present invention; by the way that radiating subassembly is arranged in cell phone back intralamellar part; utilize the heat-dissipating pipe in radiating subassembly; make mobile phone backboard on the basis of having protection cell-phone function; the heat generated when can also be by operating handset is distributed by heat-dissipating pipe; the temperature of mobile phone is effectively reduced, to prevent battery of mobile phone fever from generating risk out of control, guarantees the normal use of mobile phone.
Description
Technical field
The present embodiments relate to technical field of mobile phones more particularly to a kind of mobile phone backboards and mobile phone.
Background technique
As the function of mobile phone is gradually improved, it has been no longer limited to communication function, and mobile phone has various work, joy
Happy application function, to meet work and the entertainment requirements of people, mobile phone is as essential intelligence in people's daily life, work
One of the energy tool more and more important role of performer.
With the development of science and technology, the function of mobile phone is more and more perfect, the processing capacity of cell phone processor is also increasingly stronger, with
And come be that cell-phone heating amount is also quite large, although mobile phone itself is equipped with radiator, pass through the heat dissipation material for adding thermal conductivity high
Material is in contact with cell phone mainboard, is spread apart hot localised points by thermo-contact conduction.But dissipating for anticipation is often not achieved in this method
Thermal effect, especially when mobile phone charges and plays big game or viewing HD video, the calorific value of mobile phone reaches maximum, in hand
When machine calorific value maximum, it is easy that thermal runaway occurs because cell-phone heating amount is too big, leads to the hardware that crashes or burn, to drop
The low service life of mobile phone；Moreover, the calorific value of interior of mobile phone can be transmitted to the shell of mobile phone, so that user uses with hand
When mobile phone, situations such as scalding one's hand, to reduce the experience that user uses mobile phone.
Summary of the invention
The present invention provides a kind of mobile phone backboard and mobile phone is effectively reduced the temperature of mobile phone, keeps away to promote mobile phone radiating efficiency
Exempt from battery of mobile phone and thermal runaway occurs.
In a first aspect, the embodiment of the invention provides a kind of mobile phone backboards, comprising:
Radiating subassembly is located inside the backboard, and the radiating subassembly is heat-dissipating pipe.
Optionally, the backboard outer surface is provided with the first solar cell module, first solar cell module
Including thin-film solar cells and the connecting terminal being connect with battery of mobile phone circuit, the connecting terminal and the film sun
The positive and negative anodes electrical connection of energy battery.
Optionally, the backboard includes the first backboard and the second backboard being oppositely arranged, and the radiating subassembly is located at described
Between first backboard and second backboard.
Optionally, the radiating subassembly includes multiple heat-dissipating pipes, the side at the both ends of the multiple heat-dissipating pipe and the backboard
Edge flushes, the multiple heat-dissipating pipe both ends open.
Optionally, the radiating subassembly is the reticular structure being connected to by multiple heat-dissipating pipes.
Optionally, the heat-dissipating pipe both ends seal, and heat eliminating medium is filled in the heat-dissipating pipe, and the heat eliminating medium is
Water.
Optionally, the material of the heat-dissipating pipe is at least one of copper, aluminium, silver, gold, graphene, graphite.
Optionally, the cross section of the heat-dissipating pipe is round or star.
Optionally, the thin-film solar cells is copper-indium-galliun-selenium film solar cell, cadmium telluride diaphragm solar electricity
Any one in pond, organic thin film solar cell and non-crystalline silicon thin-film solar cell.
Second aspect, the embodiment of the invention also provides a kind of mobile phones, including the cell phone back as described in first aspect is any
Plate.
A kind of mobile phone backboard and mobile phone provided in an embodiment of the present invention, by the way that radiating subassembly is arranged in cell phone back intralamellar part,
Using the heat-dissipating pipe in radiating subassembly, make mobile phone backboard on the basis of having protection cell-phone function, it can also be by operating handset
When the heat that generates distributed by heat-dissipating pipe, the temperature of mobile phone is effectively reduced, to prevent battery of mobile phone fever from generating mistake
The risk of control guarantees the normal use of mobile phone, the service life of extending cell phone.
Detailed description of the invention
In order to more clearly illustrate the technical scheme of the exemplary embodiment of the present invention, below to required in description embodiment
The attached drawing to be used does a simple introduction.Obviously, the attached drawing introduced is present invention a part of the embodiment to be described
Attached drawing, rather than whole attached drawings without creative efforts, may be used also for those of ordinary skill in the art
To obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of mobile phone backboard provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram of the section structure of mobile phone backboard shown in FIG. 1；
Fig. 3 is the schematic diagram of the section structure of another mobile phone backboard provided in an embodiment of the present invention；
Fig. 4 is the schematic elevation view of mobile phone backboard shown in FIG. 1；
Fig. 5 is the schematic elevation view of another mobile phone backboard provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of another mobile phone backboard provided in an embodiment of the present invention；
Fig. 7 is the schematic diagram of the section structure of another mobile phone backboard provided in an embodiment of the present invention；
Fig. 8 is a kind of structural schematic diagram of mobile phone provided in an embodiment of the present invention.
Wherein, 10- radiating subassembly, 101- heat-dissipating pipe, the first backboard of 11-, the second backboard of 12-, the first solar battery of 13-
Component, 131- thin-film solar cells, 132- connecting terminal, 20- mobile phone backboard.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.It is wherein same or similar from beginning to end
Label indicates same or similar element or element with the same or similar functions.Upper and lower described in specific embodiment,
It is left and right etc. to be merely for convenience of understanding carried out description, it is not considered as the restriction in specific orientation.
The embodiment of the invention provides a kind of mobile phone backboard, which includes the heat dissipation group inside the backboard
Part, and radiating subassembly is heat-dissipating pipe.It, can be with opponent by the heat-dissipating pipe inside backboard after the mobile phone fit on mobile phone backboard
The heat generated in machine operational process is absorbed and is conducted, and then distributes heat, guarantees the temperature of mobile phone operational process
Degree is stablized, and will not generate the phenomenon that overheating due to radiating not in time.
It is core of the invention thought above, following will be combined with the drawings in the embodiments of the present invention, to the embodiment of the present invention
In technical solution be clearly and completely described.Based on the embodiments of the present invention, those of ordinary skill in the art are not having
Under the premise of making creative work, every other embodiment obtained be shall fall within the protection scope of the present invention.
Fig. 1 is a kind of structural schematic diagram of mobile phone backboard provided in an embodiment of the present invention, and Fig. 2 is cell phone back shown in FIG. 1
The diagrammatic cross-section of plate, with reference to Fig. 1 and Fig. 2, which includes radiating subassembly 10, and backboard is arranged in radiating subassembly 10
Inside, radiating subassembly 10 are heat-dissipating pipe 101.Wherein, the position of radiating subassembly 10 should correspond to battery of mobile phone or circuit board setting,
Guarantee that radiating subassembly 10 is covered in the battery of mobile phone or the sites of heat generation of circuit board, to promote to radiate.
Radiating subassembly 10 is set to cell phone back intralamellar part and refers in 20 preparation process of mobile phone backboard, and radiating subassembly 10 is collected
At in mobile phone backboard 20, mobile phone backboard 20 can use on the one hand to protect radiating subassembly, prevent from for radiating subassembly 10 being arranged
In mobile phone 20 inner surface of backboard, radiating subassembly 10 generates the problems such as wearing and falling off, and on the other hand avoids radiating subassembly
10 position setting in 20 inner surface of mobile phone backboard, i.e., abutting mobile phone when, although can guarantee endothermic effect, heat dissipation still can be by
The problem of backboard hinders takes into account radiating subassembly 10 and absorbs mobile phone heat and distribute heat, reaches preferable thermally conductive scattered
Thermal effect.
Mobile phone backboard provided in an embodiment of the present invention utilizes heat dissipation group by the way that radiating subassembly is arranged in cell phone back intralamellar part
Heat-dissipating pipe in part makes mobile phone backboard on the basis of having protection cell-phone function, the heat generated when can also be by operating handset
Amount is distributed by heat-dissipating pipe, and the temperature of mobile phone is effectively reduced, to prevent battery of mobile phone fever from generating risk out of control, is protected
Demonstrate,prove the normal use of mobile phone.
The radiating subassembly for the form of tubes that radiates can increase surface area using tubular structure, guarantee the heat dissipation effect of radiating subassembly
Fruit, those skilled in the art can according to actual preparation process and heat dissipation effect, select diameter, the length of suitable heat-dissipating pipe with
And spacing, herein without limitation.The materials such as plastics, metal, glass, sapphire, zirconium oxide can be selected in cell phone back plate matter, for
The preparation of the mobile phone backboard of plastic material then mostly uses Shooting Technique to complete, and is then formed by modes such as spraying, printing, ink-jets
Design and color.And radiating subassembly is placed in the inside of mobile phone backboard during mobile phone backboard is made, for different materials,
Can be there are many technique, illustratively, plastic handset backboard will can dissipate simultaneously during through the preparation of the techniques such as injection molding
Hot component is placed in mold, realizes the integrated molding of mobile phone backboard.Integrally formed mobile phone backboard is wrapped in radiating subassembly, to scattered
There are certain influences for the heat sinking function of hot component.
With continued reference to Fig. 2, the present invention also provides a kind of mobile phone backboards, and optionally, backboard includes first be oppositely arranged
Backboard 11 and the second backboard 12, radiating subassembly 10 is between the first backboard 11 and the second backboard 12, i.e., heat-dissipating pipe 101 is arranged
Between the first backboard 11 and the second backboard 12.Mobile phone backboard provided in an embodiment of the present invention can also use the knot of double-layer back plate
Heat-dissipating pipe is placed in the gap between double-layer back plate by structure, increases the contact surface of heat-dissipating pipe and air, improves dissipating for radiating subassembly
Thermal effect.Optionally, the metal tubes such as copper, aluminium, silver, gold can be selected in heat-dissipating pipe, or good using the heating conductions such as graphene, graphite
Tubular structure made of good nonmetallic materials.Using the preferable feature of above-mentioned material heating conduction, mobile phone can be helped quick
Heat dissipation, reduces the temperature of mobile phone.
As shown in Fig. 2, heat-dissipating pipe 101 is round tube, in order to increase the heat dissipation performance of heat-dissipating pipe 101, the embodiment of the present invention
A kind of mobile phone backboard is additionally provided, Fig. 3 is the schematic diagram of the section structure of another mobile phone backboard provided in an embodiment of the present invention, ginseng
Fig. 3 is examined, the cross section of heat-dissipating pipe 101 is star.Using the big feature of star-like heat-dissipating pipe surface area, heat-dissipating pipe 101 can be increased
Heat dissipation performance, may further effectively cool down to mobile phone, in addition to star structure shown in Fig. 3, can also be other
Star structure with large surface area, herein with no restrictions.
Fig. 4 is the schematic elevation view of mobile phone backboard shown in FIG. 1, and with reference to Fig. 4, optionally, radiating subassembly includes multiple dissipates
Heat pipe, multiple heat-dissipating pipes 101 are arranged in parallel, and heat-dissipating pipe 101 is parallel with the short side of mobile phone backboard or long side.Wherein, cell phone back
The short side and long side of plate refer to the outside of cell phone back plate shape, and heat-dissipating pipe is parallel with short side or long side, can preferably cover
Mobile phone back guarantees effective endotherm area of radiating subassembly.
Further, the both ends of multiple heat-dissipating pipes 101 are flushed with the edge of backboard.By the length that heat-dissipating pipe 101 is arranged
It is flushed with back plate edges, can guarantee that radiating subassembly 10 is at least completely covered mobile phone back on the edge extending direction,
Also can opponent's machine carry out large area heat absorption, improve the heat dissipation of battery of mobile phone or circuit board.
Heat dissipation can also be arranged in addition to above-mentioned heat-dissipating pipe is parallel with the short side of mobile phone backboard or long side in heat radiation assembly structure
At an angle, heat-dissipating pipe both ends flush the short side or long side of pipe and mobile phone backboard with back plate edges, so that radiating subassembly be made to exist
The area coverage of mobile phone back maximizes, and on the basis of guaranteeing radiating subassembly endothermic effect, utilizes inclination heat-dissipating pipe and backboard side
The biggish principle of the cut surface of edge, increases the bare area of heat-dissipating pipe, to increase heat dissipation effect.
Fig. 5 is the positive structure diagram of another mobile phone backboard provided in an embodiment of the present invention, with reference to Fig. 5, optionally,
For heat-dissipating pipe 101 in addition to being provided parallel to arrangement architecture, radiating subassembly may also be configured to the netted knot being connected to by multiple heat-dissipating pipes 101
On the one hand structure increases the quantity of heat-dissipating pipe 101, ensure that radiating subassembly to the heat absorption capacity of mobile phone；On the other hand setting heat dissipation
Pipe 101 is the structure of netted connection, can increase the heat-sinking capability of radiating subassembly.The netted knot being wherein made of heat-dissipating pipe 101
Heat-dissipating pipe in structure can be is parallel to backboard short side or long side as shown in Fig. 5, can also be with backboard short side and long side in certain
Angle, details are not described herein again.
In order to guarantee that heat-dissipating pipe has better heat dissipation performance, optionally, multiple heat-dissipating pipe both ends opens guarantee heat-dissipating pipe
In lead to and air circulation can be carried out, heat absorbed from battery of mobile phone or circuit board is effectively distributed with this.
In addition to this it is possible to which the sealing of heat-dissipating pipe both ends is arranged, and heat eliminating medium is filled in heat-dissipating pipe.Preferably, it dissipates
The biggish liquid of specific heat capacity may be selected in thermal medium, such as water utilizes the biggish spy of water specific heat capacity by filling water in heat-dissipating pipe
Point, when absorbing identical heat, the temperature rising of water is smaller, can increase the heat absorption capacity of radiating subassembly with this, be effectively reduced
The temperature of mobile phone.
To a certain extent can during arranging multiple heat-dissipating pipes in radiating subassembly using the structure of multiple heat-dissipating pipes
There is a problem of preparation process complexity, in order to avoid the problem that the arrangement of multiple heat-dissipating pipes is complicated, tortuous one can be directly used
Serpentine fin pipe, Fig. 6 is the structural schematic diagram of another mobile phone backboard provided in an embodiment of the present invention, with reference to Fig. 6, the mobile phone
It include radiating subassembly inside backboard, radiating subassembly is 101 structure of heat-dissipating pipe, and the heat-dissipating pipe 101 is the snakelike knot of tortuous one
Structure, when can concentrate to avoid mobile phone heat source position, corresponding heat-dissipating pipe temperature is excessively high, radiates not in time, and far from heat source position
Heat-dissipating pipe absorb heat unconspicuous problem, can be by the even heat of local absorption to dissipating using the serpentine fin pipe 101 of one
Everywhere in hot component, heat dissipation effect is improved, in addition, the contact area of serpentine fin pipe 101 and mobile phone back plate edges increases, namely
The exposed surface area of heat-dissipating pipe 101 can increase, and may further increase heat dissipation.
The embodiment of the invention also provides a kind of mobile phone backboard, Fig. 7 is another cell phone back provided in an embodiment of the present invention
The sectional structure chart of plate, with reference to Fig. 7, which includes outside any radiating subassembly 10 as above, and backboard outer surface is set
It is equipped with the first solar cell module 13, the first solar cell module 13 includes thin-film solar cells 131 and and mobile phone
The connecting terminal 132 of battery circuit connection, connecting terminal 132 are electrically connected with the positive and negative anodes of thin-film solar cells 131.
After cell phone back board group is attached on mobile phone, mobile phone backboard not only can protect mobile phone, but also when mobile phone backboard connects
Electricity can be generated when receiving sunlit, and electricity is imported into mobile phone accumulation by the solar components on mobile phone backboard
Chi Zhong has achieved the purpose that store the continuation of the journey of electric energy extending cell phone；Amount of heat is generated when mobile phone receives solar energy irradiation simultaneously
When, can conduct heat to reach to cool down in the radiating subassembly of mobile phone backboard prevents the risk of battery of mobile phone thermal run away.Together
When radiating subassembly can also cool down to the thin-film solar cells of mobile phone backboard outer surface, by thin-film solar cells generate heat
Amount radiates.
Thin-film solar cells can be prepared in substrate flexible, form thin-film solar cells flexible, such as can incite somebody to action
Thin-film solar cells is formed in poly terephthalic acid class plastics (Polyethylene terephthalate, PET), polyamides
In the flexible substrates such as imines (Polyimide, PI), which is attached at mobile phone backboard outer surface,
It can be more bonded mobile phone backboard, while not will increase the hardness of cell phone back plate, it is ensured that mobile phone backboard can be normally assembled on mobile phone.
With reference to Fig. 4 and Fig. 5, the first solar cell module 13 includes distinguishing with the positive and negative anodes of thin-film solar cells 131
Two connecting terminals 132 of connection, with reference to Fig. 7, which runs through backboard and radiating subassembly, connecting terminal 132
One end connect with the positive and negative anodes of thin-film solar cells 131, the other end is then exposed to the inner surface of backboard, in mobile phone backboard
When being bonded with mobile phone, connecting terminal 132 can be in electrical contact with the battery circuit of mobile phone and realize connection, guarantee the first solar battery
Component 13 is charging mobile phone battery.
Connecting terminal 132 is exposed to mobile phone backboard inner surface, is easy to make connecting terminal 132 that electric leakage occur and lead to uneasiness
Entirely, therefore above-mentioned setting connecting terminal is removed, realizes that thin-film solar cells is the electrical connection charging of mobile phone accumulation pond, the present invention is real
It applies example and additionally provides a kind of wireless charging structure, i.e., wireless transmission coil is set on mobile phone backboard, and be arranged in mobile phone
The matching of wireless receiving coil, and the solar cell module of mobile phone backboard may also include rectification circuit in addition to wireless transmission coil
And inverter circuit, stable DC is exported using rectification circuit, then direct current is converted into high-frequency alternating current by inverter circuit,
Then the strong magnetic coupling of resonant mode for passing through wireless transmission coil and wireless receiving coil, forms on the wireless receiving coil of mobile phone
The alternating current of high frequency is then converted to direct current by the high-frequency rectification circuit of interior of mobile phone wireless charging circuit, is in mobile phone
Battery charging.Wireless charging circuit can be set along in cell phone back intralamellar part with wireless transmission coil, can be with heat dissipation
The different layer setting of component, is not specifically limited herein.
Optionally, compared to traditional crystal silicon solar energy battery, thin-film solar cells 131 has that quality is small, thickness
Very thin (several microns), it is flexible, manufacturing process is simple the advantages that, be suitble to be made on mobile phone backboard, currently have been carried out quotient
The thin film solar cell of industry mainly has cadmium telluride film solar cells, CIGS thin-film solar cell, non-crystalline silicon thin-film
Solar cell etc., therefore the thin-film solar cells on the mobile phone backboard can be selected as copper-indium-galliun-selenium film solar cell, tellurium
Cadmium thin-film solar cells, amorphous silicon thin-film solar cell etc., in addition to this it is possible to using organic thin film solar electricity
Pond, those skilled in the art can carry out selection setting according to the actual situation.
The embodiment of the invention also provides a kind of mobile phone, Fig. 8 is that a kind of structure of mobile phone provided in an embodiment of the present invention is shown
It is intended to, with reference to Fig. 8, which includes any mobile phone backboard 20 of above-described embodiment.
A kind of mobile phone provided in an embodiment of the present invention utilizes heat dissipation group by the way that radiating subassembly is arranged in cell phone back intralamellar part
Heat-dissipating pipe in part makes mobile phone backboard on the basis of having protection cell-phone function, the heat generated when can also be by operating handset
Amount is distributed by heat-dissipating pipe, and the temperature of mobile phone is effectively reduced, to prevent battery of mobile phone fever from generating risk out of control, is protected
Demonstrate,prove the normal use of mobile phone.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of mobile phone backboard characterized by comprising
Radiating subassembly is located inside the backboard, and the radiating subassembly is heat-dissipating pipe.
2. mobile phone backboard according to claim 1, which is characterized in that the backboard outer surface is provided with the first solar-electricity
Pond component, first solar cell module include thin-film solar cells and the connection connecting with battery of mobile phone circuit touching
Point, the connecting terminal are electrically connected with the positive and negative anodes of the thin-film solar cells.
3. mobile phone backboard according to claim 1, which is characterized in that the backboard include the first backboard for being oppositely arranged and
Second backboard, the radiating subassembly is between first backboard and second backboard.
4. mobile phone backboard according to claim 1, which is characterized in that the radiating subassembly includes multiple heat-dissipating pipes, described
The both ends of multiple heat-dissipating pipes are flushed with the edge of the backboard, the multiple heat-dissipating pipe both ends open.
5. mobile phone backboard according to claim 1, which is characterized in that the radiating subassembly is connected to by multiple heat-dissipating pipes
Reticular structure.
6. mobile phone backboard according to claim 1, which is characterized in that the heat-dissipating pipe both ends seal, in the heat-dissipating pipe
Filled with heat eliminating medium, the heat eliminating medium is water.
7. mobile phone backboard according to claim 1, which is characterized in that the material of the heat-dissipating pipe is copper, aluminium, silver, gold, stone
At least one of black alkene, graphite.
8. mobile phone backboard according to claim 1, which is characterized in that the cross section of the heat-dissipating pipe is round or star.
9. mobile phone backboard according to claim 2, which is characterized in that the thin-film solar cells is CIGS thin-film
In solar battery, cadmium telluride diaphragm solar battery, organic thin film solar cell and non-crystalline silicon thin-film solar cell
Any one.
10. a kind of mobile phone, which is characterized in that including the mobile phone backboard as described in claim 1-9 is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810812613.3A CN109286700A (en) | 2018-07-23 | 2018-07-23 | A kind of mobile phone backboard and mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810812613.3A CN109286700A (en) | 2018-07-23 | 2018-07-23 | A kind of mobile phone backboard and mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109286700A true CN109286700A (en) | 2019-01-29 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810812613.3A Pending CN109286700A (en) | 2018-07-23 | 2018-07-23 | A kind of mobile phone backboard and mobile phone |
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| Country | Link |
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| CN (1) | CN109286700A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110601304A (en) * | 2019-09-25 | 2019-12-20 | 洪杭峰 | Wireless mobile phone charging device |
| CN114157820A (en) * | 2020-09-08 | 2022-03-08 | 江苏蔚联机械股份有限公司 | A TV heat dissipation structure |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120019929A (en) * | 2010-08-27 | 2012-03-07 | (주)템솔 | Heat radiating back sheet for photo voltaic module |
| CN202262194U (en) * | 2011-09-06 | 2012-05-30 | 惠州Tcl移动通信有限公司 | Heat dissipation structure of a mobile phone and its solar panel |
| CN203398852U (en) * | 2013-08-28 | 2014-01-15 | 高健 | Solar charging radiator for mobile phone |
| CN203675151U (en) * | 2013-12-17 | 2014-06-25 | 上海斐讯数据通信技术有限公司 | Cell phone with heat radiator |
| CN204482215U (en) * | 2015-04-15 | 2015-07-15 | 青岛海信移动通信技术股份有限公司 | A kind of mobile phone radiator structure |
| US20160028272A1 (en) * | 2014-07-24 | 2016-01-28 | Innovative Solar Industries Inc. | Housing having a solar panel and components capable of replenishing a mobile phone battery |
| CN205122119U (en) * | 2015-11-12 | 2016-03-30 | 福建新视觉光电科技有限公司 | Novel LED display screen is all spent to low -power consumption height |
| CN106450096A (en) * | 2016-12-15 | 2017-02-22 | 衡阳市鑫晟新能源有限公司 | Mobile phone heat dissipation aluminum shell lithium ion battery |
| US20170155746A1 (en) * | 2015-11-30 | 2017-06-01 | Samsung Electronics Co., Ltd. | Electronic device and method for manufacturing the same |
| KR20170098668A (en) * | 2016-02-22 | 2017-08-30 | 모건국 | Mobile phone cooling plate installation |
| CN107501844A (en) * | 2017-08-23 | 2017-12-22 | 重庆哈迪斯科技有限公司 | A kind of mobile phone heat abstractor and its manufacture method |
| CN207184129U (en) * | 2017-08-16 | 2018-04-03 | 东莞市巨通五金科技有限公司 | A kind of solar mobile bonnet of good heat dissipation effect |
| CN209201108U (en) * | 2018-07-23 | 2019-08-02 | 东汉太阳能无人机技术有限公司 | A kind of mobile phone backboard and mobile phone |
-
2018
- 2018-07-23 CN CN201810812613.3A patent/CN109286700A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120019929A (en) * | 2010-08-27 | 2012-03-07 | (주)템솔 | Heat radiating back sheet for photo voltaic module |
| CN202262194U (en) * | 2011-09-06 | 2012-05-30 | 惠州Tcl移动通信有限公司 | Heat dissipation structure of a mobile phone and its solar panel |
| CN203398852U (en) * | 2013-08-28 | 2014-01-15 | 高健 | Solar charging radiator for mobile phone |
| CN203675151U (en) * | 2013-12-17 | 2014-06-25 | 上海斐讯数据通信技术有限公司 | Cell phone with heat radiator |
| US20160028272A1 (en) * | 2014-07-24 | 2016-01-28 | Innovative Solar Industries Inc. | Housing having a solar panel and components capable of replenishing a mobile phone battery |
| CN204482215U (en) * | 2015-04-15 | 2015-07-15 | 青岛海信移动通信技术股份有限公司 | A kind of mobile phone radiator structure |
| CN205122119U (en) * | 2015-11-12 | 2016-03-30 | 福建新视觉光电科技有限公司 | Novel LED display screen is all spent to low -power consumption height |
| US20170155746A1 (en) * | 2015-11-30 | 2017-06-01 | Samsung Electronics Co., Ltd. | Electronic device and method for manufacturing the same |
| KR20170098668A (en) * | 2016-02-22 | 2017-08-30 | 모건국 | Mobile phone cooling plate installation |
| CN106450096A (en) * | 2016-12-15 | 2017-02-22 | 衡阳市鑫晟新能源有限公司 | Mobile phone heat dissipation aluminum shell lithium ion battery |
| CN207184129U (en) * | 2017-08-16 | 2018-04-03 | 东莞市巨通五金科技有限公司 | A kind of solar mobile bonnet of good heat dissipation effect |
| CN107501844A (en) * | 2017-08-23 | 2017-12-22 | 重庆哈迪斯科技有限公司 | A kind of mobile phone heat abstractor and its manufacture method |
| CN209201108U (en) * | 2018-07-23 | 2019-08-02 | 东汉太阳能无人机技术有限公司 | A kind of mobile phone backboard and mobile phone |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110601304A (en) * | 2019-09-25 | 2019-12-20 | 洪杭峰 | Wireless mobile phone charging device |
| CN110601304B (en) * | 2019-09-25 | 2024-03-15 | 洪杭峰 | Wireless mobile phone charging device |
| CN114157820A (en) * | 2020-09-08 | 2022-03-08 | 江苏蔚联机械股份有限公司 | A TV heat dissipation structure |
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