CN109166826B - Display panel and display device with same - Google Patents

Abstract

The display panel related to the present invention comprises: an array substrate (1); a plurality of light-emitting units (2) arranged on the surface of the array substrate; a pixel defining layer (3) having a plurality of openings for accommodating the light-emitting units; a plurality of support columns (4) ), located on the pixel-defining layer and corresponding to the pixel-defining layer; and a buffer layer (5), the buffer layer is close to the support column and is arranged in the same layer as the support column, and the height of the buffer layer is higher than The height of the support column. In the display panel and the display device having the same, the buffer layer is reasonably arranged around the support column, so as to avoid damage to the support column caused by the inability to disperse the impact stress of external force, and at the same time to avoid damage to the functional devices including the nearby light-emitting units, By enhancing the shock resistance and shock resistance of the display panel, it can ultimately prevent the occurrence of dark spots, bright spots, color spots and other undesirable phenomena in the display area, which will affect the product quality of the display screen.

Description

Display panel and display device having the same

technical field

The invention belongs to the technical field of display screens, and in particular relates to a display panel and a display device having the same.

Background technique

OLED display equipment has gradually matured in technology after several generations of improvement, and has been favored by more and more manufacturers, and has been gradually adopted in a variety of electronic products. Compared with screens made of LCD and other materials, OLED screens have obvious advantages such as thinness and flexibility. On the other hand, the market also puts forward higher requirements for the structural strength and anti-collision performance of OLED series products. When the OLED display screen is hit by a heavy object, the support column is often damaged because the stress concentration cannot be dispersed, and even the relevant components under the support column of the display panel are damaged, which eventually leads to dark spots, bright spots, color spots and other undesirable phenomena in the display area. .

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide a display panel and a display device with such a display panel which can enhance the impact strength of the screen body, aiming at the deficiencies of the anti-damage performance of traditional products.

A display panel, comprising:

array substrate;

a plurality of light-emitting units arranged on the surface of the array substrate;

a pixel-defining layer having a plurality of openings for accommodating the light-emitting units;

a plurality of support pillars located on the pixel defining layer and corresponding to the pixel defining layer;

and a buffer layer, the buffer layer is close to the support column and is disposed on the same layer as the support column, and the height of the buffer layer is higher than the height of the support column.

In one embodiment, the buffer layer has a first end face close to the array substrate and a second end face away from the array substrate, and the cross-sectional area of the first end face is not greater than the cross-sectional area of the second end face. cross-sectional area.

In one embodiment, the cross-sectional area of the first end face is smaller than the cross-sectional area of the second end face.

In one embodiment, the buffer layer is in an inverted trapezoid shape in the extending direction of the support column.

In one embodiment, the buffer layer is disposed in direct contact with the sidewall of the support column.

In one embodiment, the buffer layer material is selected from any one of pressure-sensitive adhesive or UV adhesive.

In one of the embodiments, an encapsulation structure is further included, and the encapsulation structure includes a glass encapsulation.

In one embodiment, the buffer layer is 1 to 6 microns higher than the support pillars.

In one embodiment, the buffer layer is arranged around the support column.

Correspondingly, the present invention also provides a display device including the display panel described in any one of the foregoing.

In the display panel and the display device having the same, the buffer layer is reasonably arranged around the support column to avoid damage to the support column caused by the inability to disperse the impact stress of external force, and at the same time to avoid damage to the functional devices including the nearby light-emitting units, By enhancing the shock resistance and shock resistance of the display panel, it can ultimately prevent the occurrence of dark spots, bright spots, color spots and other undesirable phenomena in the display area, which will affect the product quality of the display screen.

Description of drawings

FIG. 1 is a schematic cross-sectional view of an embodiment of a display panel of the present invention;

FIG. 2 is a schematic longitudinal cross-sectional view of an embodiment of a display panel of the present invention;

FIG. 3 is a schematic longitudinal cross-sectional view of another embodiment of the display panel of the present invention.

Detailed ways

The display screen in the traditional technology is prone to display failure problems, such as dark spots, bright spots, color spots and other undesirable phenomena in the display area of the display screen. The inventor's research found that the root cause of this problem is that the display The shock absorption and buffering effect of the screen is not good. When a heavy object hits the display screen, the stress on the display screen is difficult to release, which will cause the display screen to break or the components inside the display screen to be damaged. The display panel is the main functional area of the display panel. Improving the shock resistance and impact resistance of the display panel can effectively improve the display failure problem of the display panel.

To solve the above problems, the inventors add a buffer layer between the pixel defining layer and the encapsulation structure. Specifically, a buffer layer close to the support column is disposed on the pixel defining layer, and the height of the buffer layer is higher than or equal to the height of the support column. That is to say, the buffer layer is close to the support pillar and is disposed on the same layer as the support pillar, that is, both are disposed on the pixel defining layer. The height of the buffer layer is higher than or equal to the height of the support column, and the buffer layer is used to support the package structure to avoid damage to the support column caused by the inability to disperse the impact stress of external force.

In order to make the above objects, features and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

FIG. 1 is a schematic cross-sectional view of an embodiment of a display panel of the present invention; FIG. 2 is a schematic longitudinal cross-sectional view of an embodiment of the display panel of the present invention.

As shown in FIG. 2 , the display panel of this embodiment includes an array substrate 1; a pixel defining layer 3 is located on the surface of the array substrate 1 and has a number of pits for accommodating the light-emitting units 2; a number of light-emitting units 2 are accommodated in corresponding A number of support pillars 4 are located on the pixel defining layer 3; a buffer layer 5, the buffer layer 5 is close to the support pillar 4 and is arranged in the same layer as the support pillar 4, and the height of the buffer layer 5 is higher than the height of the support pillar 4 ; Also includes a package structure 6, which is arranged on the array substrate 1.

The array substrate 1 can be a TFT (Thin Film Transistor) substrate, the surface of which is further provided with a planarization layer. The pixel defining layer 3 is provided on the surface of the planarization layer. The light-emitting unit 2 is a light-emitting pixel and is formed by vapor deposition of a light-emitting material. The pits on the pixel defining layer 3, also called pixel accommodating cavities, are used for accommodating light-emitting pixels. The shape of the pixel accommodating cavity may be a prism, a cube, a rectangular parallelepiped, etc., which is not limited. The pixel-defining layer 3 is used to isolate pixels and prevent cross-color between adjacent light-emitting pixels. The support columns 4 are distributed between the adjacent light emitting units 2 for supporting the package structure 6 .

The encapsulation structure 6 is used to encapsulate the plurality of light emitting units 2 and the pixel defining layer 3 on the array substrate 1 to prevent water and oxygen molecules in the air from entering the light emitting unit and destroying the light emitting unit 2 . The package structure 6 may be a glass cover plate package, that is, a seal is formed between the cover plate and the array substrate 1 through a sealing material, and this type of package is also commonly referred to as a hard screen package. In addition, the encapsulation structure 6 can also be a thin-film encapsulation structure, that is, the light-emitting unit is sealed by means of alternately arranged organic thin-film and inorganic thin-film structures, which is called flexible screen encapsulation. In the figure, the package structure 6 is a glass cover package as an example for description.

The support column 4 is used to support the package structure 6 . When the screen body is impacted by external force, the instantaneous external force is first transmitted to the support column 4, and the support column 4 is often damaged due to stress concentration that cannot be dispersed, resulting in cracks or debris on the display panel, causing black spots and color spots on the screen. . Therefore, the inventors set the buffer layer 5 around the support column 4, and the height of the buffer layer 5 is higher than the height of the support column 4, so that the buffer layer 5 can support the package structure 6, and can avoid the impact stress caused by external force that cannot be dispersed. The supporting column 4 is damaged, and at the same time, damage to the functional devices including the nearby light-emitting unit is avoided. The above settings, by enhancing the shock resistance and shock resistance of the display panel, ultimately prevent the occurrence of dark spots, bright spots, color spots and other undesirable phenomena in the display area, which affect the product quality of the display screen.

The shape of the buffer layer 5 is various, and is not limited by the embodiment of the present invention. The height of the buffer layer 5 is set to be able to play a supporting role. For example, the height of the buffer layer 5 may be higher than the height of the support column 4, then the buffer layer 5 will be stressed before the support column 4 and play a buffering role, directly buffering and buffering the light emitting unit 2 and its adjacent areas. Protective effects. Wherein, when the height of the buffer layer 5 is higher than the height of the support column 4, preferably, the height difference is 1 to 6 micrometers, and specifically, it may be 1 micrometer, 6 micrometers or 3 micrometers. Alternatively, if the height of the buffer layer 5 is set to be higher than the height of the support column 4, the buffer layer 5 and the support column 4 are stressed together and play a buffering role.

In one embodiment, the buffer layer 5 has a first end face close to the array substrate 1 and a second end face away from the array substrate 1 , and the cross-sectional area of the first end face is not greater than the cross-sectional area of the second end face. The first end surface is disposed on the pixel defining layer 3 , and the second end surface faces the package structure 6 and supports the package structure 6 . The above method maximizes the force-bearing area of the buffer layer 5, and the larger force-bearing area helps to relieve stress, increase the buffering effect, especially help to protect the support column 4 and the light-emitting unit 2, and reduce the impact on them. damage. Specifically, the cross-sectional area of the first end surface may be smaller than the cross-sectional area of the second end surface, that is, the cross-sectional area of the second end surface is larger, so that the area used to support the package structure 6 is larger. In other embodiments, the cross-sectional area of the first end face may also be equal to the cross-sectional area of the second end face.

In one of the embodiments, the buffer layer 5 is in an inverted trapezoid shape along the extending direction of the support column 4 (ie, the direction away from the pixel defining layer 5 ). That is, the support column 4 is a trapezoidal column with a narrow top and a wide bottom, which is located on the pixel defining layer 3 to support the structure of the display panel layer. The buffer layer 5 is correspondingly arranged according to the shape of the support column 4 . Specifically, as shown in FIG. 3 , the buffer layer 5 is in the shape of an inverted trapezoid, which matches the shape of the support column 4 , so that as many buffer layers 5 can be provided in a limited space as possible. The inverted trapezoidal buffer layer 5 has a stable structure, and changes gently from the proximal end to the distal end of the array substrate 1 , so that the stress distribution is relatively uniform. In other embodiments, the buffer layer 5 may have a rectangular shape or a regular trapezoid shape.

In order to facilitate the light-emitting effect of the light-emitting unit 2, between the light-emitting unit 2 and the support column 4, the buffer layer 5 is actually disposed on the array substrate 1 closer to the support column 4 to avoid affecting the normal operation of the light-emitting unit 2. It is beneficial for the light-emitting unit 2 to achieve a good light-emitting effect. In one embodiment, the aforementioned buffer layer 5 is arranged in direct contact with the sidewall of the support column 4 . Specifically, the buffer layer 5 can be adhered to the support column 4 , or can be closely abutted on the support column 4 . In this way, in addition to ensuring the light-emitting effect of the light-emitting unit 2, it can also ensure the effective contact between the buffer layer 5 and the support column 4, increase the possible contact area, improve the dispersion and digestion of stress, and reduce the impact caused by external force.

In one embodiment, the buffer layer 5 is arranged around the support column 4 . That is to say, the buffer layers 5 are correspondingly arranged around the support column 4 , which can buffer and decompose the stress in any direction. Specifically, the buffer layer 5 corresponding to each support column 4 is divided into four parts that are not connected to each other, and are respectively located at the periphery of the four sides of the column body corresponding to any support column 4 . In other embodiments, the buffer layer 5 is arranged around the support column 4 , the buffer layer 5 itself is annular, and the inner wall of the buffer layer 5 is arranged in direct contact with the side wall of the support column 4 . Of course, the arrangement of the buffer layer 5 is not limited to the above method, and it can be divided into two, three or other parts, as long as they are distributed around the support column 4 , it has the functions of decomposing and buffering the force on the support column 4 .

In one embodiment, the material of the buffer layer 5 is selected from any one of pressure-sensitive adhesive or UV adhesive. Pressure-sensitive adhesives are a class of adhesives that are sensitive to pressure, including natural rubber-based pressure-sensitive adhesives with low curing temperature, good viscosity and good temperature resistance, as well as silicone rubber and silicone resins. Contains silicone pressure-sensitive adhesive with strong anti-peeling properties. There are many forms of pressure-sensitive adhesives, which will not be listed one by one. Since pressure-sensitive adhesives generally have good adhesion properties, wetting properties and anti-peeling properties, they are very suitable as materials for the buffer layer 5 . And UV glue, also known as shadowless glue, UV curing glue, is a type of adhesive that must be cured by ultraviolet light. It can be used as an adhesive, and the corresponding UV lamp can be easily installed in the existing production line It can be used without major changes to the production line. The curing speed of UV glue can be completed in a few seconds to tens of seconds, which is conducive to automatic production lines and improves labor productivity. As a light-curable adhesive, UV adhesive is very convenient for bonding light-transmitting materials. When used as the material of the buffer layer 5, the ultraviolet rays can smoothly enter the buffer layer 5 through the outside of the display panel to complete the curing. After the display panel is impacted to generate pressure conduction, the pressure-sensitive adhesive or UV adhesive becomes soft and sticky to form an effective buffer. The material of the buffer layer 5 can also be an emulsion. The above-mentioned emulsion is a liquid preparation prepared by dissolving the raw material, an organic solvent and an emulsifier in a certain proportion to prepare a homogeneous phase. The emulsion may be a pressure sensitive latex, the raw material of which includes polyacrylate latex. The above-mentioned emulsion can also adopt other raw materials, such as sodium dodecylbenzene sulfonate or nonylphenol polyoxyethylene ether, etc. The prepared emulsion can also play a buffering effect on the received force.

When processing the display panel, the functional parts including the light-emitting unit 2 can be encapsulated by frit packaging (glass cover packaging), thin film packaging, etc., so that the functional parts are sealed and prevent the functional parts from generating external water and oxygen. reaction.

In one embodiment, frit packaging is adopted, and the packaging structure 6 includes a glass cover plate, and a glass frit sealing frame disposed on the periphery of the plurality of light emitting units 2 and bonding the array substrate 1 and the glass cover plate. The inventor found that the buffer layer 5 also brings about the phenomenon of thin film interference, that is, the contact between the buffer layer 5 and the top of the glass cover plate produces some bright and dark circles. gradually narrows as the distance increases. They are interference fringes formed by the mutual interference of light reflected on a spherical surface and a plane, and have a great impact on the display effect of the display panel. The inventors further studied and found that the reason for the above phenomenon is that the height of the buffer layer 5 is too high. Therefore, in this embodiment, the heights of the buffer layer 5 and the glass frit sealing frame are set to be the same or similar to prevent the occurrence of Newton's rings, that is, the phenomenon of thin film interference. Theoretically, it is the best case that the heights of the buffer layer 5 and the glass frit sealing frame are consistent. In actual production, there will be a certain difference in the heights of the two. For example, the height difference is acceptable within 1.08 microns.

In one of the embodiments, the packaging structure 5 adopts a thin film packaging structure. Display panels, especially organic light-emitting materials in OLED display panels, are particularly sensitive to water and oxygen. In order to meet the basic service life, there are usually very strict requirements on the permeability of water and oxygen, so the packaging of the panel is higher. requirements. Thin-film encapsulation can better meet the above requirements. For example, a water-oxygen barrier wall with a closed-loop structure is formed on the array substrate 1, and the encapsulation film covers the light-emitting unit 2, and the periphery of the encapsulation film is connected to the water-oxygen barrier wall. Seal fit. The thin film package uses one or several layers of vacuum-deposited films to block water and oxygen, but does not block the light exit or incident path, and does not affect the flexibility of the array substrate 1 .

In one embodiment, the bottom of the buffer layer 5 is attached to the above-mentioned array substrate 1 , and the top of the buffer layer 5 is attached to the above-mentioned packaging structure 5 , so as to ensure the first and direct buffering effect. While the bottom of the buffer layer 5 is attached to the above-mentioned array substrate 1 , the top of the buffer layer 5 is attached to the above-mentioned package structure 5 , which also has a good buffering effect on the lateral stress on the package structure 5 .

In other embodiments, considering that there is generally an encapsulation area around the light-emitting display area of the display panel, and the encapsulation area can have a very good shock and shock resistance effect, the bottom of the buffer layer 5 is attached to the above-mentioned array substrate 1, and the buffer layer 5 There is a certain gap between the top of the package structure 5 and the above-mentioned package structure 5 . The bottom of the buffer layer 5 is attached to the above-mentioned array substrate 1 , which can buffer the positive impact force. There is a certain gap between the top of the buffer layer 5 and the above-mentioned encapsulation structure 5 , so that the encapsulation area in the non-light-emitting display area is preferentially subjected to force, and then the buffer layer 5 is subjected to force.

Correspondingly, the present invention also provides a display device including the display panel of the above-mentioned embodiments. The display device may be an electronic device such as a tablet computer and a mobile phone.

To sum up, in the display panel and the display device having the same of the present invention, the buffer layer is reasonably arranged around the support column, so as to avoid damage to the support column caused by the inability to disperse the impact stress of the external force, and at the same time to avoid damage to the nearby light-emitting units in the The functional devices inside the display panel can ultimately prevent black spots, bright spots, color spots and other undesirable phenomena in the display area by enhancing the impact resistance and shock resistance of the display panel, which affects the product quality of the display screen.

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (10)

1. A display panel, comprising:

an array substrate (1);

the light emitting units (2) are arranged on the surface of the array substrate;

a pixel defining layer (3) having a number of openings to accommodate the light emitting cells;

a plurality of support columns (4) which are positioned on the pixel limiting layer and are arranged corresponding to the pixel limiting layer;

the buffer layer (5) is close to the support column and arranged on the pixel definition layer at the same layer as the support column, and the height of the buffer layer is higher than that of the support column;

the light-emitting diode array substrate is characterized by further comprising an encapsulation structure (6), wherein the encapsulation structure (6) comprises a glass cover plate and is arranged on the periphery of the light-emitting units (2) and is bonded with the array substrate (1) and a glass material sealing frame of the glass cover plate, and the buffer layer (5) is consistent with the glass material sealing frame in height.

2. The display panel according to claim 1, wherein the buffer layer (5) has a first end surface close to the array substrate (1) and a second end surface far from the array substrate, and a cross-sectional area of the first end surface is not larger than a cross-sectional area of the second end surface.

3. The display panel according to claim 2, wherein a cross-sectional area of the first end face is smaller than a cross-sectional area of the second end face.

4. A display panel according to claim 3, wherein the buffer layer (5) has an inverted trapezoidal shape in the direction in which the support columns (4) extend.

5. The display panel according to claim 1, wherein the buffer layer (5) is disposed in direct contact with a sidewall of the support pillar (4).

6. The display panel according to claim 1, wherein the buffer layer (5) material is selected from any one of a pressure sensitive adhesive or a UV adhesive.

7. The display panel of claim 1, wherein the encapsulation structure comprises a glass encapsulation.

8. The display panel according to claim 7, wherein the buffer layer (5) is 1 to 6 microns higher than the support posts (4).

9. The display panel according to claim 1, wherein the buffer layer (5) is arranged around the support pillar (4).

10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.

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