Excellent properties such as high temperature resistant, corrosion-resistant, wear-resistant and high strength that metal-base composites has, high tenacity, be widely used in space flight, chemical industry, fields such as machinery, it combines high-temperature, the hardness of Plastic Deformation, toughness and stupalith, high-modulus, corrosion resistant advantage can be used under the working conditions of harshnesses such as high temperature, burn into wearing and tearing.But because complicated process of preparation and the high restriction of cost only are applied in limited field for a long time.With the development of reduction of toughener cost and composite material preparation process technology, the range of application of metal-base composites enlarges gradually.Space flight, the aviation field composite applications adopts continuous fibre enhanced height ratio strong metal based composites usually, excellent performance, but cost is higher and complex process, high temperature corrosion-resisting metal-base composites for industrial application, people are more interested to be that discontinuous toughener strengthens, toughness reinforcing matrix material, this is because discontinuous toughener cost is low on the one hand, it is simple that discontinuous on the other hand toughener strengthens metal-base composites preparation technology, can adopt extruding in addition, technology such as rolling is carried out secondary processing, in general, discontinuous toughener enhanced metal-base composites prepares with traditional powder metallurgical technique, be about to metallic matrix and toughener uniform mixing and prepare matrix material through the liquid phase sintering densification, ununiformity in the mixing process, toughener particle on the one hand will weaken, whisker combines with the interface of metallic matrix, influences the performance of coking property and material on the other hand.Crux problem in the therefore discontinuous toughener enhanced metal-base composites preparation, the one, the interface compatibility of toughener and matrix, another is the dispersing uniformity problem of ceramics reinforcing agent in metallic matrix.
The object of the present invention is to provide a kind of preparation method of non-continuous ceramics reinforcing agent enhanced metal-base composites, its metal-base composites of preparing has more good performance, and cost improves few.
The invention provides a kind of preparation method of metal-base composites, be applicable to discontinuous toughener enhanced metal-base composites, adopt powder metallurgy process, promptly pottery and the metal with metallic coating is mixed in proportion, and through high temperature sintering, obtains matrix material; Before the preparation metal-base composites, with prefabricated this metallic matrix coating in discontinuous toughener surface, coat-thickness is at 20~100 μ m, metal matrix material applicatory comprises Ni-Cr-Al-Ti, Fe-Ni-C, Ni-Ti alloy, Ni, Mo or Cu metal, toughener comprises TiC, WC, SiC, TiB
2Particle or whisker.For solving the compatibility problem between ceramic particle and matrix better, the metallic coating of good wettability is arranged all with toughener and metallic matrix simultaneously at toughener surface preparation one deck earlier before the prefabricated metal basal body coating layer.Toughener for conduction directly adopts electric plating method, prefabricated metal coating on toughener.For nonconducting toughener, at first form metallic membrane on the surface by electroless plating, form the film that needs with electrochemical plating then.This is another characteristics of the present invention to carry out pre-plating coating with electrochemical method on ceramic particle, whisker surface, chemical vapour deposition relatively, and physical gaseous phase deposition coating, electrochemical process has pollution-free and low cost, and the present invention has following several preferable selection:
1. metallic matrix is chosen as Ni-Cr-Al-Ti, Fe-Ni-C or Ni-Ti alloy, and toughener is chosen as TiC or WC plating Ni film, and the add-on of toughener accounts for 30~80% of cumulative volume.
2. metallic matrix is chosen as the Cu based composites, and toughener is chosen as SiC whisker, TiB
2, Mo particle plating Cu film, the toughener add-on accounts for 5~50% of cumulative volume.
3. metallic matrix is chosen as the Ni based composites, and toughener is chosen as SiC whisker plating Ni film, and the toughener add-on accounts for 30~70% of cumulative volume.
In a word, the present invention carries out precoated layer to solve the problem of interface compatibility and toughener dispersing uniformity with electrochemical method on ceramic particle, whisker surface, mechanical properties such as the density that obtains of metal-base composites such as coating enhancer enhanced Cu, Ni-Cr, intensity, hardness are all not high than equal volume fractional for the composite fortifier enhanced metal-base composites that has metallic coating that it obtained, and below by embodiment in detail the present invention are described in detail.
The preparation of embodiment 1 TiC-Ni-Cr-Ti-Al metal-base composites
1. the top coat of toughener TiC:
Adopt electrochemical method at TiC surface preplating Ni film
The sensitization of TiC particle surface and activating process:
1. sensitization: sensitization solvent:
SnCl
2·2H
2O 10~20(g)
Hcl 40~50ml (37% solution)
Water 1000ml
Room temperature 5~10 minutes
2. activation: activated solution
PdCl
2(Palladous chloride) 0.4~0.8 (g)
Hcl 10ml (30% solution)
Water 1000ml
Room temperature 5~10 minutes
3. Ni chemical plating solution:
Single nickel salt (NiSO
47H
2O) 20~25 grams per liters
Sodium hypophosphite (NaH
2Po
2H
2O) 15~20 grams per liters
Sodium-acetate NaC
2H
3O
210 grams per liters
Trisodium Citrate Na
3C
6H
3O
72H
2O 10 grams per liters
PH value 4.1~4.4
85~90 ℃ of temperature
Further adopt electro-plating method to prepare TiC/Ni film composite powder again after the TiC surface forms the Ni film: control Ni film thickness is at 20~100 μ m.
4. Ni electroplating bath solution
NiSO
47H
2O 250~300 grams per liters
NiCl
26H
2O 30~60 grams per liters
H
3BO
335~40 grams per liters
Sodium lauryl sulphate
C
12H
25SO
4Na 0.25~0.1 grams per liter
pH 3~4
45~60 ℃ of temperature
Current density 1~2.5A/dm
2
2. after obtaining TiC/Ni film composite powder, evenly at 980 ℃~1050 ℃ vacuum solid solution diffusions,, add a certain amount of activator (CrCl for strengthening the diffusibility of Cr with the Cr powder mixes
36H
2O, NH
4Cl, CrBr
36H
2O etc.) prepare TiC-NiCr composite powder with good interface structure, add Ti-Al through hot pressing, normal pressure burning method is prepared high performance TiC-NiCrTiAl matrix material, composition is: 50TiC, 26Ni, 22Cr, 1.5Ti, 0.5Al (volume parts) compared performance with the material that the end adds coating and is significantly improved.Performance relatively sees the following form.
| Performance materials | K
IC (MPam
1/2)
| O
f (MPa)
| H
v |
| Coating is arranged | 20 | 1500 | 2300 |
| No coating | 15 | 800 | 1900 |
Embodiment 2 SiC whisker Cu based composites
The SiC whisker is the same with the TiC particle to be non-conductor, could use the electrochemical method plated film behind the employing activating surface, thereby obtains the compound whisker of SiC/Cu film,
1. sensitizing:
SnCl
2·2H
2O 10~20(g)
HCl 40~60ml (37% aqueous solution)
Water 1000ml
Room temperature 5~10 minutes
2. reactivation process
PdCl
2 0.5~0.8(g)
Hcl 10ml (37% solution)
Water 1000ml
Room temperature 5~10 minutes
3. Electroless Cu Plating:
First part: CuSO
45H
2O 30~50 (g)
KNaC
4H
4O
6·4H
2O 160~180(g)
NaOH 50(g)
Water 1000 (g)
Second section: HCHO 200~300ml (37%)
Mix two portions solution, at room temperature electroless plating is 5~10 minutes
4. electroplate the Cu film
CuSO
4·5H
2O 150~250(8)
H
2SO
4 45~110(g)
20~50 ℃ of temperature
Current density 1~3A/dm
2
Obtain SiC whisker/compound whisker of Cu film, preparation SiC whisker/Cu matrix material, its performance is higher than uncoated matrix material, and (the SiC whisker of 5% volume parts) sees the following form.
| Performance materials | Void content (%) | Hardness (HB) | Ultimate compression strength (MPa) | Thermodiffusion (mm
2/s)
| Thermal conductivity W/m ℃ |
| Plated film | 2.78 | 218 | 625 | 21 | 60 |
| The end plated film | 20.00 | 193 | 525 | 4.9 | 12 |
The end plated film adopts direct mechanical to mix and obtains
Example 3 TiB
2/ Cu based composites
TiB
2Plating Cu membrane method is with the SiC/Cu composite material preparation process, and its matrix material with the mechanically mixing powdered preparation is compared performance and is improved: (TiB
2Account for 50%)
| Performance materials | Void content (%) | Hardness (HB) | Ultimate compression strength (MPa) | Thermodiffusion (mm
2/s)
| Thermal conductivity (W/m ℃) |
| Plated film | 1.2 | 208 | 643 | 56 | 180 |
| The end plated film | 5.18 | 143 | 462 | 48 | 150 |
The end plated film adopts direct mechanical to mix and obtains
The preparation of real side 4.Cu/Mo matrix material
Cu adopts the mode of Direct Electroplating to carry out in the plating of Mo surface:
CuSo
45H
2O is 150~250 (g)
H
2SO
4 45~110(g)
20~50 ℃ of temperature
Current density 1~3A/dm
2
Can obtain the Cu plated film of required thickness and the Cu/Mo matrix material of mechanically mixing, performance is compared as follows: (Mo accounts for 60%)
The metal coating layer material of the black powder of example 5 stones
The electroplated Ni of powdered graphite, metallic membrane technologies such as Cu are as follows:
C/Cu film: with the Cu/Mo electroplating technology;
The C/Ni membrane process:
NiSO
47H
2O 250~300 grams per liters
NiCl
26H
2O 30~60 grams per liters
H
3BO
335~40 grams per liters
Sodium lauryl sulphate 0.25~0.1 grams per liter
(C
12H
25SO
4Na)
PH value 3~4
Temperature: 45~60 ℃
Current density: 1~2.5A/dm
2
Graphite/the Cu, the Ni film composite powder material that obtain are applied to inhale ripple filtering layer material, can increase substantially wave-absorbing effect.
Add the resonance absorbing peak that graphite/Cu film powder improves the multilayer cartridge of impedance filtering layer, the frequency span of basic reflectivity is wideer approximately one times than individual layer cartridge.