CN109021900A - A kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery - Google Patents
A kind of preparation method of single-component epoxy adhesive used for encapsulation of solar battery Download PDFInfo
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- CN109021900A CN109021900A CN201810705518.3A CN201810705518A CN109021900A CN 109021900 A CN109021900 A CN 109021900A CN 201810705518 A CN201810705518 A CN 201810705518A CN 109021900 A CN109021900 A CN 109021900A
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- HLWRJUZDZZVDCL-UHFFFAOYSA-N CC(C)(C1C=CC(Pc(cc2)ccc2OC)=CC1)ONC Chemical compound CC(C)(C1C=CC(Pc(cc2)ccc2OC)=CC1)ONC HLWRJUZDZZVDCL-UHFFFAOYSA-N 0.000 description 1
- 0 CC(C)(c1ccc(*c(cc2)ccc2OC)cc1)O* Chemical compound CC(C)(c1ccc(*c(cc2)ccc2OC)cc1)O* 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1477—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing nitrogen
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- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
一种太阳能电池封装用单组份环氧胶黏剂的制备方法，所述方法将环氧树脂与硅烷偶联剂机械搅匀，升温至70~90℃，加入催化剂，恒温反应2~4小时，得到有机硅改性环氧树脂，环氧树脂与硅烷偶联剂的质量之比为0.67~4.1︰1；2）20~30℃下将填料、交联剂、增塑剂加入到所得的有机硅改性环氧树脂中，搅拌分散30~150分钟，获得环氧胶黏剂。本发明采用硅烷偶联剂改性环氧树脂，制得的环氧胶黏剂可自交联固化，不需额外添加固化剂，可单组份灌装。所制备的有机硅改性环氧树脂胶黏剂，常温下能快速固化，粘结性能好，胶膜韧性、防水性均得到提高。制备方法操作简单、成本低，使用方便。
A method for preparing a single-component epoxy adhesive for solar cell encapsulation. In the method, the epoxy resin and the silane coupling agent are mechanically stirred, the temperature is raised to 70-90°C, a catalyst is added, and the reaction is carried out at a constant temperature for 2-4 hours. , to obtain silicone modified epoxy resin, the mass ratio of epoxy resin to silane coupling agent is 0.67~4.1︰1; 2) Add filler, crosslinking agent and plasticizer to the obtained Stir and disperse in silicone modified epoxy resin for 30-150 minutes to obtain epoxy adhesive. The invention adopts the silane coupling agent to modify the epoxy resin, and the prepared epoxy adhesive can be self-crosslinked and cured without adding additional curing agent, and can be filled with one component. The prepared silicone-modified epoxy resin adhesive can be quickly cured at room temperature, has good bonding performance, and the toughness and water resistance of the adhesive film are improved. The preparation method is simple in operation, low in cost and convenient in use.
Description
Technical Field
The invention relates to a preparation method of a single-component epoxy adhesive for packaging a solar cell, and belongs to the technical field of epoxy adhesives.
Background
As a solar cell for cleaning, sufficiency and sustainable development of new energy, rapid progress has been made in practical application in recent years, among which the application of a silicon wafer solar cell is particularly widespread. The adhesive used in the integrated use is extremely easy to corrode and damage due to exposure in the air, so that the photoelectric conversion efficiency of the solar cell is reduced. Therefore, in order to maintain the photoelectric conversion efficiency of the solar cell stable, a novel adhesive for encapsulation having good properties such as adhesion, transparency, weather resistance and the like is called. The publication No. CN107129764A discloses a preparation method of an adhesive for solar cell back plates, which adopts polyurethane obtained by polymerizing polyol and hexamethylene diisocyanate as a base material, and the adhesive is prepared by adding cellulose, chlorosulfonated polyethylene, polylactic acid, hydroxyl silicone oil, lecithin, triethanolamine, sodium metasilicate, alumina sol and the like, has good aging resistance and hydrolysis resistance, but the polyurethane adhesive is slow in curing at room temperature, and has certain toxicity of raw materials.
The epoxy resin adhesive is a material which takes aromatic, aliphatic and alicyclic groups as main chains and contains two or more than two epoxy groups, and has excellent adhesive property, thermal stability, electrical insulation and weather resistance in the field of packaging materials. The solar cell is packaged by using the epoxy resin adhesive, and the construction mode mostly adopts a glue pouring packaging mode, namely, enough liquid epoxy adhesive is filled in the gap of the cell fixed with the silicon wafer, and the packaging work is finished when the epoxy resin is completely cured.
The cured epoxy resin has high crosslinking degree, large internal stress, easy brittle fracture and poor impact resistance. Publication No. CN104004483B discloses an impact-resistant, high-toughness and high-temperature-resistant epoxy adhesive, which is formed by mixing a component A consisting of a bisphenol A epoxy base material, a toughening agent, a coupling agent and a filler and a component B consisting of polyamide resin synthesized by dimer fatty amine and polyamine, a modified fatty amine curing agent, ATBN, the coupling agent and the filler, and has higher Tg and better toughness and impact strength. Publication No. CN105199081A discloses a ring-opened alicyclic amine containing C ═ S bond as a curing agent for epoxy resin, and the epoxy adhesive introduced with urea bond has a lower crosslinking density than an aliphatic amine curing agent containing only amino group, and the epoxy adhesive has a reduced brittleness and an improved toughness. The Caojun introduces the synthesized branched silicone-containing multi-fatty amine into an epoxy resin crosslinking network, and the introduction of a flexible siloxane chain segment effectively improves the toughness, the impact resistance, the bonding strength and the heat-resistant and water-resistant properties of the epoxy resin (Caojun. preparation of the silicone-modified epoxy resin and performance research thereof [ D ] of Zhejiang university, 2017). The preparation cost of the epoxy adhesives is low, and the toughness of the adhesive film is improved, but in the preparation methods, the epoxy resin cannot be cured automatically, and a curing agent is required to be used as a second component to assist the epoxy resin to complete curing, which brings inconvenience to practical application. Therefore, the development of a one-component epoxy adhesive which is low in price, convenient to use and free of a curing agent is the key point of research of people.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a preparation method of a single-component epoxy adhesive for packaging a solar cell.
The technical scheme of the invention is as follows:
a preparation method of a single-component epoxy adhesive for packaging a solar cell comprises the following steps:
(1) mechanically stirring epoxy resin and a silane coupling agent uniformly, heating to 70-90 ℃, adding a catalyst, and reacting at constant temperature for 2-4 hours to obtain organic silicon modified epoxy resin, wherein the mass ratio of the epoxy resin to the silane coupling agent is 0.67-4.1: 1;
(2) and (2) adding a filler, a cross-linking agent and a plasticizer into the organic silicon modified epoxy resin obtained in the step (1) at the temperature of 20-30 ℃, and stirring and dispersing for 30-150 minutes to obtain the epoxy adhesive.
The epoxy resin in the step (1) is one of bisphenol A epoxy resin, bisphenol S epoxy resin and bisphenol F epoxy resin; the silane coupling agent is one of 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane and 3- (2-aminoethyl) aminopropylmethyldimethoxysilane; the catalyst is dibutyltin dilaurate, stannous octoate and monobutyl tin oxide, and the dosage of the catalyst is 0.5-5% of the mass of the epoxy resin; the structural formula of the organic silicon modified epoxy resin is as follows:
whereinn＝1～5，R1Is C (CH)3)2、CH2、SO2One of (1), R2Is (CH)2)3、H(CH2)2NH(CH2)3One of (1), R1＇、R2＇、R3' is OC2H5、OCH3、CH3One or more of them.
The filler in the step (2) is one or more of nano silicon dioxide, modified clay, light calcium carbonate, asbestos powder, carbon fiber and mica powder, and the mass of the filler is 10-100% of that of the organic silicon modified epoxy resin; the cross-linking agent is one of orthosilicate and titanate, and the mass of the cross-linking agent is 0.15-30% of that of the organic silicon modified epoxy resin; the plasticizer is one or more of diisooctyl sebacate, dioctyl adipate, dioctyl phthalate and dibutyl phthalate, and the mass of the plasticizer is 5-45% of that of the organosilicon modified epoxy resin.
Compared with the prior art, the epoxy adhesive has the beneficial effects that the silane coupling agent is adopted to modify the epoxy resin, the prepared epoxy adhesive can be self-crosslinked and cured, no additional curing agent is required, and the epoxy adhesive can be filled in a single component. The prepared organic silicon modified epoxy resin adhesive can be quickly cured at normal temperature, has good adhesive property, and improves the toughness and the waterproofness of the adhesive film. The preparation method has the advantages of simple operation, low cost and convenient use.
Drawings
FIG. 1 is a block diagram of a process for preparing the epoxy adhesive of the present invention;
fig. 2 is a contact angle picture of an adhesive layer after the adhesive is coated in table 1, wherein a is a contact angle picture of formula 1, and the contact angle picture is 91.73 degrees; b is the contact angle diagram of formulation 2, 62.43 °; after the bisphenol A epoxy resin is modified by the silane coupling agent, the waterproof performance of the obtained epoxy adhesive is improved.
Detailed Description
The invention is further illustrated by the following examples:
example 1
2.9194 g of bisphenol A epoxy resin and 3.4346 g of (3-aminopropyl) triethoxysilane are mechanically stirred uniformly, the temperature is raised to 70 ℃, 0.1460 g of dibutyltin dilaurate are added, and the reaction is carried out for 2 hours at constant temperature, so as to obtain the organic silicon modified epoxy resin.
Adding 0.50 g of nano silicon dioxide, 1.50 g of light calcium carbonate, 1.95 g of tetraethyl orthosilicate and 0.325 g of diisooctyl sebacate into the organosilicon modified epoxy resin at 25 ℃, and stirring and dispersing for 60 minutes to obtain the epoxy adhesive.
Table 1 shows the formulation of the epoxy resin adhesive of this example, wherein formulation 1 corresponds to example 1, the binder of the formulation is a silicone modified epoxy resin, and the binder of formulation 2 is an epoxy resin.
As shown in fig. 2, a is the contact angle plot for formulation 1, the contact angle is 91.73 °; b is the contact angle graph of formulation 2, the contact angle is 62.43 °; as can be seen from fig. 2, after the bisphenol a epoxy resin is modified by the silane coupling agent, the waterproof performance of the obtained epoxy adhesive is improved.
Table 1 formula of epoxy resin adhesive table
Example 2
4.6360 g of bisphenol A epoxy resin and 2.3180 g of 3- (2-aminoethyl) aminopropyltriethoxysilane are mechanically stirred uniformly, the temperature is raised to 90 ℃, 0.0460 g of stannous octoate are added, and the reaction is carried out for 2 hours at constant temperature, so as to obtain the organic silicon modified epoxy resin.
Adding 3.50 g of nano silicon dioxide, 3.50 g of asbestos powder, 0.0105 g of tetrabutyl titanate and 1.4 g of dioctyl phthalate into the organic silicon modified epoxy resin at 30 ℃, and stirring and dispersing for 30 minutes to obtain the epoxy adhesive.
Example 3
4.8200 g of bisphenol S epoxy resin and 1.1560 g of 3-aminopropyl methyl diethoxy silane are mechanically stirred uniformly, the temperature is increased to 80 ℃, 0.0240 g of monobutyl tin oxide is added, and the reaction is carried out for 4 hours at constant temperature, thus obtaining the organic silicon modified epoxy resin.
And adding 0.30 g of carbon fiber, 0.30 g of modified clay, 0.60 g of tetramethyl orthosilicate and 2.70 g of dibutyl phthalate into the organic silicon modified epoxy resin at the temperature of 20 ℃, and stirring and dispersing for 150 minutes to obtain the epoxy adhesive.
Example 4
2.5768 g of bisphenol F epoxy resin and 3.8459 g of 3- (2-aminoethyl) aminopropyltriethoxysilane are mechanically stirred uniformly, the temperature is raised to 70 ℃, 0.0773 g of dibutyltin dilaurate is added, and the reaction is carried out for 3 hours at constant temperature, so as to obtain the organic silicon modified epoxy resin.
At 25 ℃, 1.25 g of mica powder, 2.0 g of light calcium carbonate, 1.3 g of tetraethyl orthosilicate, 0.05 g of dioctyl adipate and 0.60 g of dibutyl phthalate are added into the organosilicon modified epoxy resin, and the mixture is stirred and dispersed for 120 minutes to obtain the epoxy adhesive.
Example 5
4.4665 g of bisphenol F epoxy resin and 1.4888 g of 3- (2-aminoethyl) aminopropyl methyl dimethoxy silane are mechanically stirred uniformly, the temperature is increased to 80 ℃, 0.0447 g of stannous octoate are added, and the reaction is carried out for 3 hours at constant temperature, so as to obtain the organic silicon modified epoxy resin.
Adding 0.35 g of nano silicon dioxide, 0.25 g of modified clay, 0.06 g of tetrabutyl titanate, 0.80 g of diisooctyl sebacate and 1.00 g of dioctyl phthalate into the organic silicon modified epoxy resin at 30 ℃, and stirring and dispersing for 90 minutes to obtain the epoxy adhesive.
Example 6
3.4483 g of bisphenol S epoxy resin and 3.4483 g of 3-aminopropylmethyldiethoxysilane are mechanically stirred uniformly, the temperature is raised to 90 ℃, 0.1034 g of monobutyl tin oxide is added, and the reaction is carried out for 4 hours at constant temperature, thus obtaining the organic silicon modified epoxy resin.
Adding 1.50 g of nano silicon dioxide, 1.30 g of carbon fiber, 0.70 g of tetramethyl orthosilicate and 0.35 g of diisooctyl sebacate into the organic silicon modified epoxy resin at the temperature of 20 ℃, and stirring and dispersing for 60 minutes to obtain the epoxy adhesive.
Example 7
4.1379 g of bisphenol A epoxy resin and 1.6551 g of 3-aminopropyltriethoxysilane are mechanically stirred uniformly, the temperature is raised to 80 ℃, 0.2070 g of stannous octoate are added, and the reaction is carried out for 2 hours at constant temperature, so as to obtain the organic silicon modified epoxy resin.
2.5 g of nano silicon dioxide, 1.0 g of asbestos powder, 0.009 g of tetraethyl orthosilicate, 1.0 g of dioctyl adipate and 1.4 g of dibutyl phthalate are added into the organic silicon modified epoxy resin at the temperature of 20 ℃, and the mixture is stirred and dispersed for 60 minutes to obtain the epoxy adhesive.
Example 8
3.1863 g of bisphenol S epoxy resin and 3.1863 g of 3- (2-aminoethyl) aminopropyltriethoxysilane are mechanically stirred uniformly, the temperature is raised to 90 ℃, 0.1274 g of dibutyltin dilaurate are added, and the reaction is carried out for 4 hours at constant temperature, so as to obtain the organic silicon modified epoxy resin.
Adding 0.13 g of nano silicon dioxide, 0.065 g of mica powder, 0.975 g of tetrabutyl titanate and 0.325 g of dioctyl phthalate into the organic silicon modified epoxy resin at 30 ℃, and stirring and dispersing for 150 minutes to obtain the epoxy adhesive.
Claims (8)
1. A preparation method of a single-component epoxy adhesive for packaging a solar cell is characterized by comprising the following steps:
(1) mechanically stirring epoxy resin and a silane coupling agent uniformly, heating to 70-90 ℃, adding a catalyst, and reacting at constant temperature for 2-4 hours to obtain organic silicon modified epoxy resin, wherein the mass ratio of the epoxy resin to the silane coupling agent is 0.67-4.1: 1;
(2) and (2) adding a filler, a cross-linking agent and a plasticizer into the organic silicon modified epoxy resin obtained in the step (1) at the temperature of 20-30 ℃, and stirring and dispersing for 30-150 minutes to obtain the epoxy adhesive.
2. The method for preparing the one-component epoxy adhesive for packaging the solar cell according to claim 1, wherein the epoxy resin is one of bisphenol A epoxy resin, bisphenol S epoxy resin and bisphenol F epoxy resin.
3. The method for preparing the one-component epoxy adhesive for packaging the solar cell as claimed in claim 1, wherein the silane coupling agent is one of 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltriethoxysilane, 3-aminopropylmethyldiethoxysilane and 3- (2-aminoethyl) aminopropylmethyldimethoxysilane.
4. The method for preparing the one-component epoxy adhesive for packaging the solar cell according to claim 1, wherein the catalyst is dibutyltin dilaurate, stannous octoate or monobutyl tin oxide; the dosage of the catalyst is 0.5-5% of the mass of the epoxy resin.
5. The preparation method of the one-component epoxy adhesive for packaging the solar cell according to claim 1, wherein the structural formula of the organosilicon modified epoxy resin is as follows:
wherein,
n＝1～5；R1is C (CH)3)2、CH2、SO2One of (1); r2Is (CH)2)3、H(CH2)2NH(CH2)3One of (1); r1＇、R2＇、R3' is OC2H5、OCH3、CH3One or more of them.
6. The method for preparing the one-component epoxy adhesive for packaging the solar cell according to claim 1, wherein the filler is one or more of nano silica, modified clay, light calcium carbonate, asbestos powder, carbon fiber and mica powder; the filler mass is 10-100% of the organosilicon modified epoxy resin mass.
7. The method for preparing the one-component epoxy adhesive for packaging the solar cell according to claim 1, wherein the cross-linking agent is one of orthosilicate and titanate; the mass of the cross-linking agent is 0.15-30% of that of the organic silicon modified epoxy resin.
8. The method for preparing the one-component epoxy adhesive for packaging the solar cell according to claim 1, wherein the plasticizer is one or more of diisooctyl sebacate, dioctyl adipate, dioctyl phthalate and dibutyl phthalate; the mass of the plasticizer is 5-45% of that of the organic silicon modified epoxy resin.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110791174A (en) * | 2019-11-12 | 2020-02-14 | 成都硅宝科技股份有限公司 | Polyurethane primer and preparation method thereof |
| CN110804369A (en) * | 2019-11-18 | 2020-02-18 | 安徽圣达生物药业有限公司 | Synthetic method of solvent-type organic silicon modified epoxy resin coating |
| CN112961636A (en) * | 2021-03-10 | 2021-06-15 | 安徽扬子地板股份有限公司 | Aging-resistant adhesive for wall decoration plate and preparation method thereof |
| CN113088228A (en) * | 2021-04-12 | 2021-07-09 | 江西省科学院应用化学研究所 | Preparation method of single-component organic silicon modified epoxy adhesive for solar cell packaging |
| CN115851195A (en) * | 2022-12-13 | 2023-03-28 | 东莞市佳迪新材料有限公司 | Elastic epoxy adhesive applied to encapsulation of new energy photovoltaic inductor and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281528A (en) * | 2004-03-30 | 2005-10-13 | Yokohama Rubber Co Ltd:The | Adhesive composition for optical material |
| JP2005281501A (en) * | 2004-03-30 | 2005-10-13 | Yokohama Rubber Co Ltd:The | Adhesive composition for optical material |
| CN1914291A (en) * | 2004-09-02 | 2007-02-14 | 横滨橡胶株式会社 | Adhesive composition for optical fiber |
| JP2007191667A (en) * | 2006-01-23 | 2007-08-02 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| CN101838515A (en) * | 2004-09-02 | 2010-09-22 | 横滨橡胶株式会社 | Adhesive composition for optical fiber |
| CN102558500A (en) * | 2010-12-09 | 2012-07-11 | 中国科学院金属研究所 | Epoxy resin containing alkoxy silane functional groups and preparation method thereof |
| CN103990588A (en) * | 2014-05-07 | 2014-08-20 | 河海大学 | Long-acting protection multi-layer epoxy heavy-corrosion-prevention coating for sea steel structure and manufacturing method thereof |
| CN106715535A (en) * | 2014-09-25 | 2017-05-24 | 瀚森公司 | Silane functionalized compounds and compositions thereof |
| CN108140682A (en) * | 2015-09-29 | 2018-06-08 | 三井—杜邦聚合化学株式会社 | Multilayer sheet for solar cell encapsulation material, method for manufacturing multilayer sheet for solar cell encapsulation material, and solar cell module |
-
2018
- 2018-07-02 CN CN201810705518.3A patent/CN109021900A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005281528A (en) * | 2004-03-30 | 2005-10-13 | Yokohama Rubber Co Ltd:The | Adhesive composition for optical material |
| JP2005281501A (en) * | 2004-03-30 | 2005-10-13 | Yokohama Rubber Co Ltd:The | Adhesive composition for optical material |
| CN1914291A (en) * | 2004-09-02 | 2007-02-14 | 横滨橡胶株式会社 | Adhesive composition for optical fiber |
| CN101838515A (en) * | 2004-09-02 | 2010-09-22 | 横滨橡胶株式会社 | Adhesive composition for optical fiber |
| JP2007191667A (en) * | 2006-01-23 | 2007-08-02 | Yokohama Rubber Co Ltd:The | Adhesive composition |
| CN102558500A (en) * | 2010-12-09 | 2012-07-11 | 中国科学院金属研究所 | Epoxy resin containing alkoxy silane functional groups and preparation method thereof |
| CN103990588A (en) * | 2014-05-07 | 2014-08-20 | 河海大学 | Long-acting protection multi-layer epoxy heavy-corrosion-prevention coating for sea steel structure and manufacturing method thereof |
| CN106715535A (en) * | 2014-09-25 | 2017-05-24 | 瀚森公司 | Silane functionalized compounds and compositions thereof |
| CN108140682A (en) * | 2015-09-29 | 2018-06-08 | 三井—杜邦聚合化学株式会社 | Multilayer sheet for solar cell encapsulation material, method for manufacturing multilayer sheet for solar cell encapsulation material, and solar cell module |
Non-Patent Citations (2)
| Title |
|---|
| PAOLA CARDIANO: "Hydrophobic properties of new epoxy-silica hybrids", 《JOURNAL OF APPLIED POLYMER SCIENCE》 * |
| 沈春林 等: "《防水密封材料手册》", 30 June 2000, 中国建材工业出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110791174A (en) * | 2019-11-12 | 2020-02-14 | 成都硅宝科技股份有限公司 | Polyurethane primer and preparation method thereof |
| CN110791174B (en) * | 2019-11-12 | 2022-11-15 | 成都硅宝科技股份有限公司 | Polyurethane primer and preparation method thereof |
| CN110804369A (en) * | 2019-11-18 | 2020-02-18 | 安徽圣达生物药业有限公司 | Synthetic method of solvent-type organic silicon modified epoxy resin coating |
| CN112961636A (en) * | 2021-03-10 | 2021-06-15 | 安徽扬子地板股份有限公司 | Aging-resistant adhesive for wall decoration plate and preparation method thereof |
| CN113088228A (en) * | 2021-04-12 | 2021-07-09 | 江西省科学院应用化学研究所 | Preparation method of single-component organic silicon modified epoxy adhesive for solar cell packaging |
| CN115851195A (en) * | 2022-12-13 | 2023-03-28 | 东莞市佳迪新材料有限公司 | Elastic epoxy adhesive applied to encapsulation of new energy photovoltaic inductor and preparation method thereof |
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Application publication date: 20181218 |