CN1089543C - 磁性预浸片及其制造方法和使用该预浸片的印刷电路板 - Google Patents
磁性预浸片及其制造方法和使用该预浸片的印刷电路板 Download PDFInfo
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Abstract
为了改善噪声特性优异的印刷电路板的噪声特性,作为构成印刷电路板的预浸片,使用使由软磁粉末和热固化树脂组成的磁性涂料浸渍到玻璃布中而构成的磁性预浸片。软磁粉末最好实质上是扁平状的金属粉末。而且,热固化树脂的主要成分应是环氧树脂。
Description
本发明涉及印刷电路板,特别是涉及抑制因不需要的电磁波干扰产生的电磁波故障的印刷电路板。
众所周知,数字电子仪器由多个电子部件构成,这些电子部件分别是由多个逻辑元件构成的随机存取存储器(RAM)、只读存储器(ROM)、微处理器等,这些电子部件安装在信号线(布线导体)遍布的印刷电路板上。在近年来的数字电子仪器中,在期望使逻辑元件的运算速度迅速地高速化的同时,使装置的更加轻薄小型化。与此伴随的是电子部件在印刷电路板上的安装密度迅速提高。
但是,由于流过逻辑元件的信号伴随着电压、电流的急剧变化,所以电子部件也成为发生高频噪声的噪声发生源。此高频噪声与串扰噪声和阻抗失配引起的噪声相乘地相互作用,对于印刷电路板内的其它电子部件来说,既诱发误动作又使其它系统受到不利影响。而且,随着电子部件在印刷电路板上的高密度安装和电子部件的小型化,由于电子部件之间和信号线之间的静电结合增大,所以在数字电子仪器内容易发生电磁波干扰。
以往,在数字电子仪器中使用的一般的印刷电路板中,当流过逻辑元件和信号线的信号的工作频率是低频的情况下,从印刷电路板内部发生的电磁感应等的信号线之间的电磁耦合比较小,不成为问题。但是,流过逻辑元件和信号线的信号的工作频率成为高频时,信号线之间的电磁耦合增密,产生了上述的问题。
为此,提出了在印刷电路板本身上设置屏蔽层的构造的电磁波屏蔽电路板,利用这种电磁波屏蔽层,对在印刷电路板上发生的不需要的电磁波进行屏蔽。具体地讲,上述电磁波屏蔽电路板具有把屏蔽层夹于其间的2块电路板对置的构造。这里,屏蔽层由反射电磁波的导电材料构成。亦即,屏蔽层产生的电磁波屏蔽,其目的是通过反射在此入射的电磁波,从而使电磁波不向内部侵入。因此,在电磁波屏蔽电路板中,对于与装载成为噪声发生源的电子部件一侧的电路板面对置的电路板面,可以期望具有屏蔽效果,对于与装载成为噪声发生源的电子部件的一侧的同一电路板面,则产生因电磁波反射引起的不需要的辐射。结果,经常发生在噪声发生源侧的同一电路板面助长二次电磁耦合的问题。再有,在未接地的数字电子仪器中,由于屏蔽层起天线作用,所以发生来自屏蔽层的二次辐射噪声。
为了解决这种问题,本发明人已经在特开平8-46386号公报(以下称为已有技术)中,提供了一种印刷电路板,对电磁波屏蔽电路板的屏蔽效果无损害,对于电磁波的透过具有充分的屏蔽效果,对于电磁波的反射至少不会助长反射引起的电磁耦合。此已有技术公开的印刷电路板中,在单面或者两面具有布线导体的印刷电路板基材,具有导电支承体和在此导电支承体的两面设置的绝缘性软磁体层。此绝缘性软磁体层含有软磁粉末和有机粘结剂。而且,也可以在绝缘性软磁体层的至少一面设置有电介质层,此电介质层含有电介质粉末和有机粘结剂。或者,上述绝缘性软磁体层也可以含有软磁粉末、电介质粉末、和有机粘结剂。而且,上述软磁体粉末最好是扁平状和/或针状粉末。
但是,上述印刷电路板基材所用的导电性支承体和绝缘性软磁体的叠层体(电磁干扰抑制体层),例如按如下方式制造。采用刮刀法在75μm的聚酰亚胺薄膜两面用铜浆料成膜,获得导电性支承体。之后,利用刮刀法在此导电性支承体的两面涂敷软磁体浆料,形成绝缘性软磁体层,在85℃进行24小时的固化,获得印刷电路板。
以往,构成印刷电路板的预浸片由树脂和玻璃布构成。例如,已有的预浸片是使热固化树脂浸透到玻璃布中,通过干燥和半固化来制备。
但是,已有技术公开的印刷电路板,存在难以形成绝缘性软磁体层的问题。而且,已有的印刷电路板由于是仅由树脂和玻璃布构成,所以不能吸收辐射噪声。
因此,本发明的目的在于提供可以吸收辐射噪声的磁性预浸片。
本发明的另一目的在于提供上述磁性预浸片的制造方法。
本发明的又一目的在于提供采用上述磁性预浸片的印刷电路板。
为了实现上述目的,根据本发明的第一方案,提供一种磁性预浸片,是使由软磁粉末和热固化树脂组成的磁性涂料浸渍到玻璃布中而构成。在上述磁性预浸片中,软磁粉末最好实质上是扁平状的金属粉末。而且,热固化树脂的主要成分应该是环氧树脂。
根据本发明的第二方案,提供一种磁性预浸片的制造方法,其特征在于,将由软磁粉末和热固化树脂组成的磁性涂料浸渍到玻璃布中后,对其干燥,再固化成为半固化状态。在此制造方法中,最好使磁性涂料浸渍到玻璃布中之后,在玻璃布的面内方向做磁场取向处理。
根据本发明的第三方案,提供一种印刷电路板,是采用上述磁性预浸片的印刷电路板,具有由树脂和玻璃布构成的通常的预浸片,和在此通常的预浸片的至少一面侧通过布线图形层叠的至少一块磁性预浸片。
图1是表示本发明的一实施例的磁性预浸片的剖面图。
图2是分解展示采用图1所示磁性预浸片的印刷电路板的组合剖面图。
图3是图1所示磁性预浸片和图2所示的印刷电路板的制造工序图。
图4是表示已有技术的和本发明的印刷电路板的电场强度的频率特性的曲线图,(a)展示了已有的印刷电路板的电场强度的频率特性,(b)展示了本发明的印刷电路板的电场强度的频率特性。
以下,参照附图详细说明本发明。
参照图1,本发明一实施例磁性预浸片10,通过使由软磁粉末121和热固化树脂122构成的磁性涂料12浸渍到玻璃布14中而构成。软磁粉末121最好实质上是扁平状的金属粉末。而且,热固化树脂122的主要成分应是环氧树脂。
作为热固化树脂122,除了环氧树脂之外,可列举出(聚)氨酯树脂、苯酚树脂、酰胺系树脂、酰亚胺系树脂等。作为软磁粉末121可列举出高频导磁率大的铁铝硅合金(该合金通称为Sendust(商标))、铁镍合金(坡莫合金)作为有代表性的材料。将软磁粉末121的细微粉末化的表面氧化后再使用。而且,软磁粉末121的长宽比应足够大(例如在5∶1以上)。由于软磁粉末121的形状实质上是扁平状,由此可以更有效地吸收、抑制不需要的辐射噪声。其原因在于,软磁粉末121的形状实质上是扁平状,如果将其在磁性预浸片中向面内方向取向配置,则出现形状各向异性,基于高频段的磁共振的复数导磁率增大。
作为上述磁性涂料12可以使用以下表1所示材料。
表1
| 扁平状软磁微粉末组成:Fe-Al-Si合金平均粒径:30μm长宽比:约10 | 90重量份 |
| 热固化树脂溴化环氧树脂邻甲酚酚醛清漆型环氧树脂双氰胺二甲苄胺 | 15重量份5重量份0.8重量份0.06重量份 |
| 溶剂MEK和DMK和甲基溶纤素 | 40重量份 |
图2中展示了采用图1所示的磁性预浸片10的印刷电路板20。图中所示的印刷电路板20的结构是,作为由树脂和玻璃布构成的通常的预浸片的内层材22,被一对磁性预浸片10从其两面通过铜箔24所夹持,用铜箔24覆盖磁性预浸片10的暴露表面。铜箔24例如厚约0.035mm,形成布线图形。内层材22和磁性预浸片10中设置图中未示出的通孔,通过此通孔使铜箔(布线图形)24相互形成电气连接。
以下参照图3说明磁性预浸片10和印刷电路板20的制造方法。
首先,如图3(a)所示,通过使卷筒状的玻璃布14通过装入磁性涂料12的槽30中,使玻璃布14浸渍上必要量的磁性涂料12。而且,玻璃布14浸渍磁性涂料12后,最好采用通过螺线管磁体中等手段(图中未示出)进行磁场取向处理。
接着,如图3(b)所示,通过使浸渍了磁性涂料12的玻璃布14通过温度均匀控制的干燥机40中,进行树脂反应。此干燥之后,如图3(c)所示,按必要的尺寸切断。切断后的产品称为树脂布50。由此制备磁性预浸片10(图1)。
接着,如图3(d)所示,把一定张数的树脂布50、内层材22(图2)和铜箔24组合,压盖不锈钢板(图中未示出)。这样,如图3(e)所示,采用多级压机60对压盖了不锈钢板的材料进行加压成型。由此制备印刷电路板20(图2)。
图4中展示了已有技术和本发明的印刷电路板的电场强度的频率特性(噪声频谱)。图4中,横轴是频率(Hz),纵轴是电场强度(10dB/div.)。而且,图4(a)展示了无磁性预浸片10的已有的印刷电路板的电场强度的频率特性,图4(b)展示了采用本发明的磁性预浸片10的印刷电路板20的电场强度的频率特性。作为印刷电路板已有技术和本发明均使用形成相同的布线图形的印刷电路板。
正如从图4所知,本发明的印刷电路板(图4(b)),与已有的印刷电路板(图4(a))比较,电场强度相对较低。亦即,可知本发明的印刷电路板可以降低放射噪声。
虽然以上以列举实施例的方式说明了本发明,但是本发明并不限于上述实施例,不言而喻在不脱离本发明要点的范围内可以做出各种变化。例如,软磁粉末和热固化树脂的材料当然并不限于实施例的范围。而且,构成印刷电路板的磁性预浸片的层叠张数也当然并不限于实施例的范围。
如上所述的本发明,通过使用在由软磁粉末和热固化树脂组成的磁性涂料中浸渍玻璃布而构成的磁性预浸片,获得噪声特性优异的印刷电路板。
Claims (6)
1.一种磁性预浸片,使由软磁粉末和热固化树脂组成的磁性涂料浸渍到玻璃布中而构成。
2.根据权利要求1的磁性预浸片,其特征在于,所述软磁粉末实质上是扁平状的金属粉末。
3.根据权利要求1的磁性预浸片,其特征在于,所述热固化树脂的主要成分是环氧树脂。
4.一种磁性预浸片的制造方法,其特征在于,使由软磁粉末和热固化树脂组成的磁性涂料浸渍到玻璃布中之后,使其干燥,再固化成为半固化状态。
5.根据权利要求4的磁性预浸片的制造方法,其特征在于,使所述磁性涂料浸渍所述玻璃布之后做磁场取向处理。
6.一种印刷电路板,采用权利要求1~3中任一项的磁性预浸片,具有由树脂和玻璃布构成的通常的预浸片,和在该通常的预浸片的至少一面通过布线图形层叠的至少一块所述磁性预浸片。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP235299/96 | 1996-09-05 | ||
| JP8235299A JPH1079593A (ja) | 1996-09-05 | 1996-09-05 | 磁性プリプレグとその製造方法及びそれを用いたプリント配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1199538A CN1199538A (zh) | 1998-11-18 |
| CN1089543C true CN1089543C (zh) | 2002-08-21 |
Family
ID=16984066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97191174A Expired - Fee Related CN1089543C (zh) | 1996-09-05 | 1997-09-04 | 磁性预浸片及其制造方法和使用该预浸片的印刷电路板 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6362434B1 (zh) |
| EP (1) | EP0878984B1 (zh) |
| JP (1) | JPH1079593A (zh) |
| KR (1) | KR100451454B1 (zh) |
| CN (1) | CN1089543C (zh) |
| DE (1) | DE69731730T2 (zh) |
| TW (1) | TW346710B (zh) |
| WO (1) | WO1998010626A1 (zh) |
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| KR100533097B1 (ko) * | 2000-04-27 | 2005-12-02 | 티디케이가부시기가이샤 | 복합자성재료와 이것을 이용한 자성성형재료, 압분 자성분말성형재료, 자성도료, 복합 유전체재료와 이것을이용한 성형재료, 압분성형 분말재료, 도료, 프리프레그및 기판, 전자부품 |
| EP1347475A4 (en) * | 2000-12-28 | 2009-07-15 | Tdk Corp | LAMINATED PCB AND METHOD FOR PRODUCING AN ELECTRONIC PART AND LAMINATED ELECTRONIC PART |
| US20040020674A1 (en) * | 2002-06-14 | 2004-02-05 | Laird Technologies, Inc. | Composite EMI shield |
| US6764732B2 (en) * | 2002-07-11 | 2004-07-20 | Magna Paper Llc | Adhesive magnet receptive media |
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| US7449241B2 (en) * | 2003-08-04 | 2008-11-11 | General Electric Company | Organic coating compositions for aluminizing metal substrates, and related methods and articles |
| US7332024B2 (en) * | 2004-04-29 | 2008-02-19 | General Electric Company | Aluminizing composition and method for application within internal passages |
| KR20090090396A (ko) * | 2004-06-23 | 2009-08-25 | 히다치 가세고교 가부시끼가이샤 | 인쇄 배선판용 프리프레그, 금속박장 적층판 및 인쇄 배선판, 및 다층 인쇄 배선판의 제조 방법 |
| JP3972951B2 (ja) * | 2005-07-04 | 2007-09-05 | オムロン株式会社 | スイッチング電源、電源装置および電子機器 |
| US8058951B2 (en) * | 2005-09-30 | 2011-11-15 | Panasonic Corporation | Sheet-like composite electronic component and method for manufacturing same |
| JP4818852B2 (ja) * | 2006-08-31 | 2011-11-16 | ソニーケミカル&インフォメーションデバイス株式会社 | 磁性シートの製造方法及び磁性シート |
| JP5139750B2 (ja) * | 2006-11-22 | 2013-02-06 | Necトーキン株式会社 | 多層プリント配線基板 |
| JP4980322B2 (ja) * | 2008-09-17 | 2012-07-18 | アルプス電気株式会社 | 多層配線板およびその製造方法 |
| CN101604568B (zh) * | 2009-04-30 | 2012-09-05 | 兰州大学 | 一种磁场取向片状软磁复合材料及其制备方法 |
| GB201110233D0 (en) * | 2011-06-16 | 2011-08-03 | Williams Hybrid Power Ltd | Magnetically loaded composite rotors and tapes used in the production thereof |
| DE102011087263A1 (de) * | 2011-11-28 | 2013-05-29 | Lenze Drives Gmbh | Abschirmvorrichtung für elektrische Einheiten |
| GB2509753A (en) * | 2013-01-14 | 2014-07-16 | Bae Systems Plc | Ferrite Fibre Composites |
| JP6069070B2 (ja) * | 2013-03-28 | 2017-01-25 | 日東電工株式会社 | 軟磁性熱硬化性接着フィルム、磁性フィルム積層回路基板、および、位置検出装置 |
| KR20150007766A (ko) * | 2013-07-12 | 2015-01-21 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
| DE102014210013A1 (de) | 2014-05-26 | 2015-11-26 | Schaeffler Technologies AG & Co. KG | Magnetische Platine und Verfahren zu deren Herstellung |
| KR102475762B1 (ko) * | 2018-09-12 | 2022-12-07 | 컴포시큐어 엘엘씨 | 금속-도핑된 에폭시 수지 트랜잭션 카드 및 이를 제조하기 위한 프로세스 |
| KR20220008845A (ko) | 2019-05-15 | 2022-01-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 필름 특성들을 최적화하기 위한 자기 충전제들의 배향 |
| EP4092697A1 (en) | 2021-05-18 | 2022-11-23 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | A magnetic inlay with an adjustable inductance value for a component carrier, and manufacturing method |
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| JPH02120040A (ja) * | 1988-10-28 | 1990-05-08 | Hitachi Chem Co Ltd | 電波吸収用銅張積層板 |
| US5207841A (en) * | 1990-04-12 | 1993-05-04 | Tdk Corporation | Soft magnetic powder and magnetic shield composition |
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| JP3528257B2 (ja) * | 1994-07-29 | 2004-05-17 | Necトーキン株式会社 | プリント配線基板 |
| DE4441436A1 (de) * | 1994-11-23 | 1996-05-30 | Vdo Schindling | Trägersubstrat für elektronische Bauelemente oder Schaltungen, insbesondere für elektronische Geräte in Kraftfahrzeugen |
| JPH08186378A (ja) * | 1994-12-29 | 1996-07-16 | Cmk Corp | 磁性体を有する多層プリント配線板とその製造方法 |
-
1996
- 1996-09-05 JP JP8235299A patent/JPH1079593A/ja active Pending
-
1997
- 1997-09-04 DE DE69731730T patent/DE69731730T2/de not_active Expired - Lifetime
- 1997-09-04 EP EP97939168A patent/EP0878984B1/en not_active Expired - Lifetime
- 1997-09-04 KR KR10-1998-0703165A patent/KR100451454B1/ko not_active Expired - Fee Related
- 1997-09-04 CN CN97191174A patent/CN1089543C/zh not_active Expired - Fee Related
- 1997-09-04 WO PCT/JP1997/003101 patent/WO1998010626A1/ja not_active Ceased
- 1997-09-04 US US09/066,381 patent/US6362434B1/en not_active Expired - Lifetime
- 1997-09-05 TW TW086112814A patent/TW346710B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1199538A (zh) | 1998-11-18 |
| US6362434B1 (en) | 2002-03-26 |
| DE69731730D1 (de) | 2004-12-30 |
| EP0878984A4 (en) | 2000-08-16 |
| KR100451454B1 (ko) | 2004-12-17 |
| DE69731730T2 (de) | 2005-11-03 |
| KR20000064305A (ko) | 2000-11-06 |
| TW346710B (en) | 1998-12-01 |
| WO1998010626A1 (en) | 1998-03-12 |
| JPH1079593A (ja) | 1998-03-24 |
| EP0878984A1 (en) | 1998-11-18 |
| EP0878984B1 (en) | 2004-11-24 |
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