CN108878687B - Display panel and electronic equipment - Google Patents
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- CN108878687B CN108878687B CN201810718696.XA CN201810718696A CN108878687B CN 108878687 B CN108878687 B CN 108878687B CN 201810718696 A CN201810718696 A CN 201810718696A CN 108878687 B CN108878687 B CN 108878687B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a display panel and electronic equipment, wherein a color resistance stacking structure is arranged in a non-display area of the display panel, so that the film thickness of a color film substrate in the non-display area is improved, the thickness of a glue layer is reduced, the stress at the edge of the non-display area is larger during bending, the position of a neutral surface of the non-display area is improved, an inorganic layer for packaging in the non-display area is indirectly close to the position of the neutral surface of the non-display area, the risk of bending and breaking of the inorganic layer in the non-display area is greatly reduced, and the display effect of the display panel is improved. This electronic equipment reduces non-display area inorganic encapsulation layer and has the cracked risk of buckling through adopting this display panel, has solved steam and oxygen and has got into the display area and influence display panel's display effect's problem from fracture department, also very big improvement its display effect.
Description
Technical Field
The present invention relates to the field of flexible display technologies, and in particular, to a display panel and an electronic device.
Background
Organic Light-Emitting diodes (OLEDs), also known as Organic electroluminescent displays and Organic Light-Emitting semiconductors, have the advantages of self-luminescence, wide viewing angle, high contrast, low power consumption, fast response speed, and the like, and are widely used in the display fields of mobile phones, digital video cameras, DVD players, notebook computers, televisions, and the like.
Compared with a conventional Liquid Crystal Display (LCD), the OLED Display panel can realize flexible Display, so that a highly portable and bendable Display technology becomes a significant breakthrough in the field.
Based on the bendable display panel, the inorganic layer used for packaging in the non-display area is at a risk of bending and breaking due to the fact that the inorganic layer is far away from the neutral surface of the non-display area, so that water vapor and oxygen enter the display area from the breaking position, and the display effect of the display panel is affected.
Disclosure of Invention
In order to solve the above problems, the present invention provides a display panel and an electronic device, where the display panel solves the problems in the prior art, and greatly reduces the risk of bending and breaking of an inorganic layer in a non-display area.
In order to achieve the purpose, the invention provides the following technical scheme:
a display panel divided into a display area and a non-display area surrounding the display area;
the display panel includes:
a substrate base plate;
the array layer, the light-emitting functional layer, the packaging layer and the color film substrate are positioned on the substrate base plate and sequentially arranged along the direction far away from the substrate base plate;
the color film substrate comprises:
a color film substrate;
the color film substrate is divided into a display area and a display area, the display area is divided into a shading area and a light-transmitting area, the shading area covers the shading area, and the color resistors cover the light-transmitting area;
setting a color resistance stacking structure in the non-display area;
the color resistance stacking structure comprises the light shielding layer and at least one color resistance layer which are stacked, or at least two color resistances layers which are stacked and have different colors.
The invention also provides electronic equipment comprising the display panel.
As can be seen from the above description, in the display panel provided by the invention, the color resistance stacked structure is arranged in the non-display area, so that the film thickness of the color film substrate in the non-display area is increased, the stress at the edge of the non-display area is larger during bending, the position of the neutral surface of the non-display area is increased, the inorganic layer for encapsulation in the non-display area is indirectly close to the position of the neutral surface, the risk of bending and breaking of the inorganic layer in the non-display area is greatly reduced, and the display effect of the display panel is indirectly improved.
In addition, the color resistor stacking structure is manufactured by adopting materials and processes for manufacturing the color resistor and the shading layer in the manufacturing process, other processes are not needed, and the manufacturing process is simple.
This electronic equipment reduces non-display area inorganic encapsulation layer and has the cracked risk of buckling through adopting this display panel, has solved steam and oxygen and has got into the display area and influence display panel's display effect's problem from fracture department, also very big improvement its display effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 along the cutting line AA';
fig. 3 is a schematic cross-sectional view of the color filter substrate along the AA' cutting line in fig. 1;
fig. 4 is another schematic cross-sectional view of the color filter substrate along the AA' cutting line in fig. 1;
fig. 5 is a schematic cross-sectional view of the color filter substrate along the AA' cutting line in fig. 1;
fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of another display panel according to an embodiment of the present invention;
fig. 8 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, including a bending region;
fig. 9 is another schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, including a bending region;
fig. 10 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, which includes a bending region;
fig. 11 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, which includes a bending region;
fig. 12 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, which includes a bending region;
fig. 13 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, which includes a bending region;
fig. 14 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, which includes a bending region;
FIG. 15 is another schematic cross-sectional view of the display panel of FIG. 1 along the cutting line AA';
fig. 16 is a schematic cross-sectional view of the color filter substrate along the AA' cutting line in fig. 1.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, where the display panel is divided into a display area 11 and a non-display area 12 surrounding the display area 11, and the non-display area 12 is generally a frame area of the display panel.
Specifically, the display area 11 includes a plurality of pixel units, and each pixel unit includes: an anode layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and a cathode layer disposed on a TFT (thin film Transistor) control layer, each pixel unit for emitting light of a different color.
Referring to fig. 2, fig. 2 is a schematic cross-sectional view of the display panel of fig. 1 along the cutting line AA', the display panel including: a base substrate 21; the array layer 22, the light-emitting functional layer 23, the encapsulation layer 24 and the color film substrate 25 are located on the base substrate 21 and sequentially arranged along a direction away from the base substrate 21.
Specifically, the array layer 22 includes, but is not limited to, a buffer layer, the light-emitting function layer 23 includes, but is not limited to, a plurality of thin film transistors 26, a passivation layer 233, a planarization layer 234, and a pixel definition layer 235, wherein the thin film transistors 26 include an active layer 261, a gate electrode 262, a source electrode 263, and a drain electrode 264, the light-emitting function layer 23 further includes a gate insulating layer 231 disposed between the active layer 261 and the gate electrode 262, and an interlayer insulating layer 232 disposed between the gate electrode 262 and the source electrode 263 and the drain electrode 264, the passivation layer 233 is disposed on a side of the source electrode 263 and the drain electrode 264 facing away from the interlayer insulating layer 232, the planarization layer 234 is disposed on a side of the passivation layer 233 facing away from the interlayer insulating layer 232, the pixel definition layer 235 is disposed on a side of the planarization layer 234 facing away from the substrate 21, it should be noted that, the source electrode 263 and the drain electrode 264 are located at the same layer.
It should be noted that the pixel defining layer 235 has a multi-layer structure in fig. 2, which is not described in detail herein, and only one thin film transistor is illustrated in fig. 2 as an example.
The encapsulation layer 24 includes a first inorganic encapsulation layer 241, an organic encapsulation layer 242, and a second inorganic encapsulation layer 243 sequentially disposed on the pixel defining layer 235, and the encapsulation layer 24 is a Thin Film Encapsulation (TFE).
Optionally, the substrate 21 is made of a flexible insulating material, and has properties of being stretchable, bendable, or bendable, and the material includes, but is not limited to, a polyimide material (abbreviated as PI), a polycarbonate material (abbreviated as PC), a polyethylene terephthalate material (abbreviated as PET), and the like.
Optionally, the buffer layer includes but is not limited to an inorganic material layer or an organic material layer, where the material of the inorganic material layer includes but is not limited to silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, or aluminum nitride, and the material of the organic material layer includes but is not limited to acrylic or PI, and in the embodiment of the present invention, the buffer layer is exemplified by the organic material layer.
Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the color filter substrate along the AA' cutting line in fig. 1, where the color filter substrate 25 includes: a color film substrate 31; the color filter substrate 25 is divided into a light shielding area and a light transmitting area in the display area 11, the light shielding area is covered by the light shielding layer 31, and the light transmitting area is covered by the color filter 32. It should be noted that the arrangement of the color resists with different colors in the light-transmitting area is not limited in the present invention.
Specifically, the light-transmitting regions correspond to the pixel units on the display substrate one to one, and the color of light emitted by the pixel units on the display substrate is deepened by setting the color resistors in the light-transmitting regions, for example, light emitted by one pixel unit is red light, and the red color resistors are set in the light-transmitting regions corresponding to the pixel units on the color film substrate, so that the red light emitted by the display panel can be darker by the red color resistors.
Optionally, in this embodiment, the color-resisting stacked structure 34 in the non-display area 12 is provided.
The color resistor stacking structure 34 includes the light-shielding layer 32 and at least one color resistor 33 stacked, or at least two color resistors 33 of different colors stacked.
Specifically, when forming color resists or light shielding layers of different colors on the color film substrate 31, the same technical process is adopted, and a required light shielding layer and/or a required color resist layer are/is sequentially formed in a direction perpendicular to the color film substrate 31 in the non-display area 12, so as to form a required color resist stacking structure.
It can be understood that the color resists of different colors are sequentially made of different materials at corresponding positions of the color film substrate 31, that is, although the color resists of different colors in the display area 11 are not overlapped, as shown in the figure, the color resists of different colors are located on the same plane parallel to the display panel in the display area 11, but actually the color resists of different colors are different film layers.
It can be understood that since the insulating layer in the array layer is mainly a film layer formed of an inorganic material, the inorganic material has a relatively high hardness. In the direction perpendicular to the display panel, the display region 11 includes more organic materials than non-display regions, such as the pixel defining layer 235, the planarization layer 234, and the organic encapsulation layer 242. Due to the existence of these film layers in the display region 11, the neutral plane in the display region 11 can be moved up compared to the non-display region, so that the neutral plane is close to or located in the inorganic insulating layer adjacent to the active layer of the thin film transistor in the array substrate, or can be adjusted by these organic layers, so that the neutral plane is close to or located in the inorganic encapsulating layer in the encapsulating layer, for example, an organic encapsulating layer 242 is disposed in the display region 11, the organic encapsulating layer 242 is formed by an inkjet printing process, and has a thickness of about 2um, which is thicker than that of other film layers, and the substrate 21 is also an organic material layer, such as PI material, and the substrate 21 is also thicker, and further, the neutral plane in the display region 11 can be increased by adjusting the organic encapsulating layer 242 and the substrate 21 in the display region 11, so that the neutral plane is close to or located in the light emitting device, The circuit elements in the array layer, the inorganic layer in the array layer of the display area 11 are not easy to crack. However, in the non-display region 12, firstly, the organic encapsulation layer 242 does not completely cover, secondly, the non-display region 12 is mainly formed by stacking a plurality of inorganic layers, for example, at least some of the barrier layer, the gate insulating layer, the interlayer insulating layer, and the inorganic encapsulation layer are stacked adjacent to each other in the non-display region, and the neutral plane in the non-display region 12 is located below the inorganic layers, and further, the inorganic layers in the non-display region 12 are easily broken during the bending process of the display panel along with the problem of large hardness of the inorganic layers.
In order to solve the problem that the inorganic layer in the non-display area is easy to break, the color resistance stacking structure 34 is arranged in the non-display area 12 to increase the thickness of the film layer above the inorganic layer in the non-display area 12, and obviously, the design can make the stress of the non-display area become large when the display panel is bent, so that the neutral surface of the non-display area 12 is located in the inorganic layer as much as possible, and the problem that the inorganic layer in the non-display area is broken when the display panel is bent is prevented.
Further, the color resistors comprise color resistors of n different colors, and the color resistor stacking structure comprises n stacked layers of color resistors of different colors.
Optionally, for example, the pixels of the display panel include a red sub-pixel, a blue sub-pixel, and a green sub-pixel, and the color resistances of the color film substrate correspond to the pixels one to one, where n is 3, that is, the color resistance includes a red color resistance, a blue color resistance, and a green color resistance.
Specifically, referring to fig. 4, fig. 4 is another schematic cross-sectional view of the color film substrate along an AA' cutting line in fig. 1, where the color film substrate 31 is located on the non-display area 12 of the display panel, and the stacked light-shielding layer and three color resists are disposed to form a color resist stacked structure 34.
Or, referring to fig. 5, fig. 5 is another schematic cross-sectional view of the color film substrate along the AA' cutting line in fig. 1, taking the display panel including pixels of three colors as an example, the color resists include three colors, in this embodiment, three stacked color resists of different colors are directly disposed in the non-display region to form a color resist stacked structure 34, and the color resists of three colors are stacked to shield the light emitted by each pixel of the display panel, thereby having the light shielding function.
It should be noted that, in the present invention, other material layers may also be present between the color filter stack structure 34 and the color filter substrate 31.
Optionally, the material of the color filter substrate 31 includes, but is not limited to, a colorless polyimide material.
As can be seen from the above description, in the display panel provided by the invention, the color resistance stacked structure is arranged in the non-display area, so that the film thickness of the color film substrate in the non-display area is increased, the stress at the edge of the non-display area is larger during bending, the position of the neutral surface of the non-display area is increased, the inorganic layer for encapsulation in the non-display area is indirectly close to the position of the neutral surface, the risk of bending and breaking of the inorganic layer in the non-display area is greatly reduced, and the display effect of the display panel is improved.
In addition, the color resistor stacking structure is manufactured by adopting materials and processes for manufacturing the color resistor and the shading layer in the manufacturing process, other processes are not needed, and the manufacturing process is simple.
Further, referring to fig. 6, fig. 6 is a schematic structural diagram of another display panel according to an embodiment of the present invention, where the display panel has at least one bending region 61, an extending direction of a bending axis 62 of the bending region 61 intersects with an extending direction of an edge of the display region 11, and the color-resist stacking structure 34 is disposed in the bending region 61.
Specifically, since the risk region of the inorganic layer breaking in the non-display region 12 is substantially in each bending region 61 in the entire display panel based on the bendable display panel, it is preferable to provide the color resist stacking structure 34 in the bending region 61, that is, the color resist stacking structure 34 in the bending region in the non-display region 12.
Further, the orthographic projection of the color-resistance stacked structure 34 on the plane of the display panel is a bar-shaped pattern extending along the frame of the display panel.
Alternatively, as shown in fig. 6, the orthographic projection of the color-resisting stacked structure 34 on the plane of the display panel is around the display area 11.
The color resistance stack structure 34 ensures that when the display panel is bent based on any bending axis, the color resistance stack structure can always improve the stress of the non-display area to prevent the problem of inorganic layer fracture in the non-display area.
It should be noted that, the bending axis in this embodiment is not a solid structure, but refers to the folding axis of the bending area, i.e. the axis for guiding the bending direction, or the path of the bending crease is consistent with the extending direction of the bending axis.
It should be noted that the color-resisting stacked structure 34 can also cover the whole non-display area 12.
Referring to fig. 7, fig. 7 is a schematic structural diagram of another display panel according to an embodiment of the present invention, and it should be noted that fig. 7 illustrates only one bending region. The same parts of this embodiment as those of the above embodiments will not be described again.
In contrast, the bending axis of the bending region intersects with two opposite sides of the display panel, and optionally, as shown in fig. 7, the bending axis 62 of the bending region 61 is perpendicular to two opposite sides of the display panel, and the bending region 61 includes two sub-bending regions 63.
In the same bending region, two sub-bending regions 63 are respectively located in the non-display regions 12 on two sides of the display region 11, and the color resistance stacking structure 34 is disposed in at least one sub-bending region 63.
Specifically, in the same bending region, each of the sub-bending regions 63 is provided with the color resistance stacking structure 34, so as to ensure that the stresses on the two sides of the display region 11 are kept the same as much as possible in the bending process of the display panel, thereby avoiding problems caused by different stresses, such as deviation of film layers in the display panel, and the like, and improving the bending capability of the display panel, so as to improve the portability of the display panel, and is particularly suitable for a foldable display panel.
Further, referring to fig. 8, fig. 8 is a schematic cross-sectional view of the color filter substrate along BB' cutting line in fig. 7, where in at least one direction parallel to the extending direction of the display panel frame and parallel to the substrate, the width of the color-resist stack structure 34 is equal to the width of the sub-bending region 63.
Alternatively, referring to fig. 9, fig. 9 is another schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, where the width of the color-resist stack structure 34 is greater than the width of the sub-bending region 63.
Specifically, since the risk area of inorganic layer fracture in the non-display area 12 is substantially in each bending area 61, in at least one direction parallel to the extending direction of the display panel frame and parallel to the substrate base plate, the width of the color-resistor stacking structure 34 is at least equal to the width of the sub-bending area 63, so as to reduce the risk of inorganic layer fracture in the sub-bending area 63 to the minimum, and if the width of the color-resistor stacking structure 34 is smaller than the width of the sub-bending area 63, it is obvious that the sub-bending area 63 not covered by the color-resistor stacking structure 34 still has the risk of inorganic layer fracture.
Alternatively, as shown in fig. 8 and 9, in at least one cross section perpendicular to the bending axis and the substrate base plate, the color-resistance stacking structure is symmetrical about the center of the bending region.
Specifically, since the range of the bending region 61 is only a range virtually defined based on the bending axis, the color-resist stacking structure 34 is symmetrically arranged about the center of the bending region 61 to ensure that the stress variation trends on both sides of the bending region are as consistent as possible based on the bending axis.
Further, referring to fig. 10, fig. 10 is another schematic cross-sectional view of the color filter substrate of fig. 7 along a BB' cutting line, which includes a bending region, and sequentially passes through a region 91 without a color-resist stacked structure, a buffer region 92, and a region (or a sub-bending region 63) with the color-resist stacked structure 34 in at least one second direction; wherein, a buffer color-resistance stacking structure 93 is arranged in the buffer area 92; in the first direction, the thickness of the buffer color-resistor stack structure 93 is smaller than the thickness of the color-resistor stack structure 34.
The first direction is perpendicular to the substrate base plate 21, the second direction is a direction pointing to the bending region 61 along the non-bending region, and the second direction is parallel to the extending direction of the frame of the display panel.
Specifically, since the color resistance stacking structure 34 is disposed in the bending region 61, the stress of the bending region 61 is increased, that is, the stress difference between the bending region 61 and the non-bending region is indirectly increased, and the stress difference inevitably affects the film structure and the trace structure in the non-display region 12.
Optionally, referring to fig. 11, fig. 11 is another schematic cross-sectional view of the color filter substrate along a BB' cutting line in fig. 7, and in the second direction, buffer color-resistor stack structures 93 may be disposed on both sides of the color-resistor stack structure 34.
It should be noted that the thicknesses of the two buffer color-resistor stacks 93 in the first direction may be different or the same, and the invention is not limited thereto.
It should be noted that there may be a gap between the buffer color-resistor stack structure 93 and the color-resistor stack structure 34, or it may be disposed in close proximity to the buffer color-resistor stack structure, and the invention is not limited thereto.
It should be noted that the width of the buffer color-resistor stack structure 93 in the second direction is not limited, and may be determined according to the frame condition of the specific display panel.
Further, in the first direction, the thickness of the buffer color-resistor stack structure 93 is smaller than the thickness of the color-resistor stack structure 34 by:
referring to fig. 12, fig. 12 is a schematic cross-sectional view of the color filter substrate of fig. 7 along a BB' cutting line, where in the first direction, the number of color-resist layers of the buffer color-resist stacked structure 93 is smaller than that of the color-resist stacked structure 34.
In the first case: as shown in fig. 12, the thicknesses of the color resists of each layer in the first direction are the same, and when the number of color resist layers of the buffer color resist stacked structure 93 is smaller than that of the color resist stacked structure 34, the thickness of the buffer color resist stacked structure 93 is always smaller than that of the color resist stacked structure 34 in the first direction.
In the second case: referring to fig. 13, fig. 13 is another schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, where the color resists of different colors have different thicknesses, and the color resist of the color resist stack structure 34 includes the color resist of the buffer color resist stack structure 93. That is, when the color resists of different colors have different thicknesses, since the number of color resists of the color resist stack structure 34 is greater than the number of color resists of the buffer color resist stack structure 93, it is obvious that the thickness of the color resist stack structure 34 is the thickness of the additional color resist layer added on the basis of the thickness of the buffer color resist stack structure 93.
In the third case: referring to fig. 14, fig. 14 is a schematic cross-sectional view of the color filter substrate along the BB' cut line in fig. 7, where the color filter includes a bending region, and the color filter includes: the color filter comprises a first color resistor and a second color resistor, wherein the thickness of the first color resistor is smaller than that of the second color resistor, and the thickness is the thickness in the first direction; at least a portion of the first color resists are located in the buffer color resist stack structure 93 and not in the color resist stack structure 34, and at least a portion of the second color resists are located in the color resist stack structure 34 and not in the buffer color resist stack structure 93. That is, in the case where there is a difference in the thicknesses of the first color resist and the second color resist, the thickness of the buffer color resist stack structure 93 is always ensured to be smaller than the thickness of the color resist stack structure 34.
Further, as shown in fig. 2, the display panel further includes: a first barrier layer 27 and a second barrier layer 28 disposed in the non-display area 12;
wherein the first barrier layer 27 surrounds the display region 11, the second barrier layer 28 surrounds the first barrier layer 27, and a gap exists between the first barrier layer 27 and the second barrier layer 28.
Specifically, the first barrier layer 27 may control an Encapsulation area in a Thin Film Encapsulation (TFE) process, and since the organic Encapsulation layer 242 in the TFE Encapsulation process is generally manufactured by an inkjet printing method, the first barrier layer 27 is required to define an area of the organic Encapsulation layer 242, and generally, the organic Encapsulation layer 242 is terminated to a side of the first barrier layer 27 opposite to the display region 11.
The second barrier layer 28 may prevent cracks generated by the fracture of the inorganic encapsulation layer in the non-display region from being spread toward the display region 12, and define the boundary of the first inorganic encapsulation layer 241 and the second inorganic encapsulation layer 243, the first inorganic encapsulation layer 241 and the second inorganic encapsulation layer 243 may generally cross the first barrier layer 27 to terminate at the second barrier layer 28, the first barrier layer 27 and the second barrier layer 28 may be generally formed of an organic stack, other organic film layers in the display region 11 may be reused, and the shape is not limited.
Further, referring to fig. 15, fig. 15 is another schematic cross-sectional view of the display panel of fig. 1 along the cutting line AA', and the color-resist stack structure 34 at least covers a side of the first barrier layer 27 opposite to the second barrier layer 28 from an edge of the non-display area away from the display area in at least one direction parallel to the bending axis.
In particular, the first barrier layer 27 and the second barrier layer 28 are relatively concentrated in stress at their locations, i.e., where the first and second barrier layers 27 and 28 are located, the thickness of the first and second inorganic encapsulation layers 241 and 243 is greater, and the organic encapsulating layer 242 is cut off to the side of the color-resisting stacked structure 34 opposite to the display area 11, so that only the inorganic encapsulating layer is left at the position of the first barrier layer 27 far away from the display area 11, and along with the problem of hard thickness of the inorganic layer, the stress at the position is relatively concentrated, and therefore cracks or fractures are easily generated, which is a dangerous area with fracture risk, therefore, the color-resist stack 34 covers at least the side of the first barrier layer 27 opposite to the second barrier layer 28, and the risk of breaking the first inorganic encapsulation layer 241 and the second inorganic encapsulation layer 243 in the non-display region 12 is greatly reduced.
Optionally, the color-resisting stacked structure 34 covers the area between the edge of the display panel and the first blocking layer 27, i.e. the color-resisting stacked structure 34 extends from the edge of the display panel to the display area and ends at the side of the first blocking layer 27 facing away from the display area 11. The organic packaging layer and the resistance stacking structures 34 are prevented from being overlapped, so that the neutral surface of the frame area of the display panel can be adjusted, the color resistance stacking structures 34 can be prevented from covering the area which does not need to adjust the neutral surface, excessive adjustment of the neutral surface of some areas is avoided, the position of the neutral surface of the area which needs to adjust the neutral surface of the frame area and the position of the area which does not need to adjust the neutral surface are consistent, and the uniformity of the bending performance of each area of the display panel is improved.
Further, referring to fig. 16, fig. 16 is a schematic cross-sectional view of the color filter substrate along the AA' cutting line in fig. 1, where the display panel further includes:
and the adhesive layer 151 is positioned between the packaging layer and the color film substrate.
The thickness of the overlapping region of the glue layer 151 and the color resistance stack structure 34 is smaller than the thickness of the other regions of the glue layer 151, and the thickness is perpendicular to the display panel direction.
Optionally, the material of the glue layer 151 is optical glue.
Specifically, after the display substrate is subjected to planarization processing, the color film substrate and the display substrate are attached to each other through the adhesive layer 151, so as to form a required display panel structure.
As can be seen from the above description, in the display panel provided by the present invention, the color resistor stacking structure is disposed in the non-display area, so as to increase the thickness of the film layer of the color film substrate in the non-display area, reduce the thickness of the glue layer, increase the stress at the edge of the non-display area during bending, increase the position of the neutral surface of the non-display area, indirectly make the inorganic layer for encapsulation in the non-display area close to the position of the neutral surface thereof, and greatly reduce the risk of bending and breaking of the inorganic layer in the non-display area, so as to improve the display effect of the display panel.
Based on the display panel provided by the invention, the invention also provides electronic equipment which comprises the display panel.
Specifically, the electronic device includes, but is not limited to, a tablet, a mobile phone, and the like.
This electronic equipment reduces non-display area inorganic encapsulation layer and has the cracked risk of buckling through adopting this display panel, has solved steam and oxygen and has got into the display area and influence display panel's display effect's problem from fracture department, also very big improvement its display effect.
It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. A display panel is characterized in that the display panel is divided into a display area and a non-display area surrounding the display area;
the display panel includes:
a substrate base plate;
the array layer, the light-emitting functional layer, the packaging layer and the color film substrate are positioned on the substrate base plate and sequentially arranged along the direction far away from the substrate base plate;
the color film substrate comprises:
a color film substrate;
the color film substrate is divided into a display area and a display area, the display area is divided into a shading area and a light-transmitting area, the shading area covers the shading area, and the color resistors cover the light-transmitting area;
setting a color resistance stacking structure in the non-display area;
the color resistance stacking structure comprises the light shielding layer and at least one layer of color resistance which are stacked, or at least two layers of color resistance with different colors which are stacked;
the display panel is provided with at least one bending area, the extending direction of a bending shaft of the bending area is intersected with the extending direction of the edge of the display area, and the color resistance stacking structure is arranged in the bending area;
sequentially passing through an area without a color resistance stacking structure, a buffer area and an area with the color resistance stacking structure in at least one second direction;
wherein, a buffer color resistance stacking structure is arranged in the buffer area;
in a first direction, the thickness of the buffer color resistance stacking structure is smaller than that of the color resistance stacking structure;
the first direction is perpendicular to the substrate base plate, and the second direction is a direction pointing to the bending region along the non-bending region.
2. The display panel according to claim 1, wherein the color resists comprise n different color resists, and the color resist stack structure comprises n stacked layers of different color resists.
3. The display panel of claim 1, wherein the bending axis of the bending region intersects with two opposite sides of the display panel, and the bending region comprises two sub-bending regions;
in the same bending area, the two sub-bending areas are respectively positioned in the non-display areas on two sides of the display area, and the color resistance stacking structure is arranged in at least one sub-bending area.
4. The display panel of claim 3, wherein the width of the color-resisting stacked structure is equal to the width of the sub-bending region or greater than the width of the sub-bending region in at least one direction parallel to the extending direction of the bezel of the display panel and parallel to the substrate base plate.
5. The display panel of claim 1, wherein the color-resisting stack structure is symmetrical about a center of the bending region on at least one cross section perpendicular to the bending axis and the substrate base plate.
6. The display panel according to claim 1, wherein the second direction is parallel to an extending direction of the bezel of the display panel.
7. The display panel according to claim 1, wherein in the first direction, the number of color resistance layers of the buffer color-resistance stack structure is smaller than the number of color resistance layers of the color-resistance stack structure;
and if the thicknesses of the color resistors of the layers in the first direction are the same or the thicknesses of the color resistors with different colors are different, the color resistors in the color resistor stacking structure comprise the color resistors of the buffer color resistor stacking structure.
8. The display panel according to claim 1, wherein the color resistance comprises: the color filter comprises a first color resistor and a second color resistor, wherein the thickness of the first color resistor is smaller than that of the second color resistor, and the thickness is the thickness in the first direction;
at least part of the first color resistor is located in the buffer color resistor stacking structure and not located in the color resistor stacking structure, and at least part of the second color resistor is located in the color resistor stacking structure and not located in the buffer color resistor stacking structure.
9. The display panel according to claim 1, characterized in that the display panel further comprises: a first barrier layer and a second barrier layer disposed in the non-display region;
wherein the first barrier layer surrounds the display area, the second barrier layer surrounds the first barrier layer, and a gap exists between the first barrier layer and the second barrier layer.
10. The display panel according to claim 9, wherein the color-resist stack structure covers at least a side of the first barrier layer opposite to the second barrier layer from an edge of the non-display area facing away from the display area in at least one direction parallel to the bending axis.
11. The display panel according to claim 1, characterized in that the display panel further comprises:
the adhesive layer is positioned between the packaging layer and the color film substrate;
the color resistance stacking structure is positioned on one side, facing the packaging layer, of the color film substrate, the thickness of an overlapped area of the glue layer and the color resistance stacking structure is smaller than the thickness of other areas of the glue layer, and the thickness is perpendicular to the display panel.
12. The display panel according to claim 11, wherein the material of the adhesive layer is an optical adhesive.
13. The display panel according to claim 1, wherein the color filter substrate is made of a colorless polyimide material.
14. An electronic device, comprising the display panel according to any one of claims 1 to 13.
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| US11903298B2 (en) | 2020-03-27 | 2024-02-13 | Boe Technology Group Co., Ltd. | Display panel and display device |
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| CN109830518B (en) * | 2019-02-28 | 2021-09-14 | 上海天马有机发光显示技术有限公司 | Display panel and display device |
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| CN112714890B (en) * | 2019-08-27 | 2023-11-24 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method thereof and display device |
| WO2021189482A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Display substrate and preparation method therefor, and display apparatus |
| CN115768178B (en) * | 2020-06-04 | 2025-12-02 | 武汉天马微电子有限公司 | An organic light-emitting display panel and display device |
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| CN113299706A (en) * | 2021-05-11 | 2021-08-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| GB2621091A (en) * | 2021-10-22 | 2024-01-31 | Boe Technology Group Co Ltd | Display panel and preparation method therefor, and display device |
| CN114284456B (en) * | 2021-12-29 | 2023-11-10 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
| CN114447077B (en) * | 2022-01-25 | 2025-07-08 | 深圳市华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
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| KR102227480B1 (en) * | 2014-09-12 | 2021-03-15 | 삼성디스플레이 주식회사 | Organic light-emitting display apparatus and method for manufacturing the same |
| CN104597656B (en) * | 2015-02-13 | 2018-04-06 | 深圳市华星光电技术有限公司 | Color membrane substrates, manufacture method and liquid crystal panel |
| KR102422103B1 (en) * | 2015-05-28 | 2022-07-18 | 엘지디스플레이 주식회사 | flexible organic light emitting diode display device |
| CN206431397U (en) * | 2017-02-09 | 2017-08-22 | 上海天马微电子有限公司 | Liquid crystal display panel and display device |
| CN107390402A (en) * | 2017-09-07 | 2017-11-24 | 京东方科技集团股份有限公司 | Mask plate, color membrane substrates and preparation method thereof, display panel, display device |
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| US11903298B2 (en) | 2020-03-27 | 2024-02-13 | Boe Technology Group Co., Ltd. | Display panel and display device |
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