CN108816301A - Micro-fluidic chip and its packaging method, micro-fluidic chip encapsulation encapsulation accessory - Google Patents
Micro-fluidic chip and its packaging method, micro-fluidic chip encapsulation encapsulation accessory Download PDFInfo
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Abstract
本发明公开了一种微流控芯片及其封装方法、微流控芯片封装用封装配件,该微流控芯片用于高通量分析,该微流控芯片包括:芯片本体,和设置于芯片本体背部的加强筋。该加强筋包括边缘加强筋和/或内部加强筋,其中,边缘加强筋呈环形且沿芯片本体的边缘设置,芯片本体的边缘包围内部加强筋。上述微流控芯片通过在芯片本体的背部设置加强筋,加强了整个微流控芯片的强度,在封装时芯片本体有朝向正面弯曲的应力,加强筋能够抵抗芯片本体弯曲变形的受力,减小了芯片本体在封装时的弯曲变形,提高了芯片本体在封装后的平整度,即提高了整个微流控芯片的平整度,特别是面积较大的微流控芯片,则为微流控芯片能够与多孔板配套仪器适配提供了前提。
The invention discloses a microfluidic chip, a packaging method thereof, and packaging accessories for microfluidic chip packaging. The microfluidic chip is used for high-throughput analysis. The microfluidic chip includes: a chip body, and a chip body Rib on the back of the body. The ribs include edge ribs and/or inner ribs, wherein the edge ribs are annular and arranged along the edge of the chip body, and the edge of the chip body surrounds the inner ribs. The above-mentioned microfluidic chip strengthens the strength of the entire microfluidic chip by providing reinforcing ribs on the back of the chip body. When the chip body is packaged, there is stress to bend toward the front, and the ribs can resist the force of the chip body bending deformation, reducing The bending deformation of the chip body during packaging is reduced, and the flatness of the chip body after packaging is improved, that is, the flatness of the entire microfluidic chip is improved, especially for a microfluidic chip with a larger area, it is a microfluidic The chip can be adapted to the supporting instrument of the multi-well plate to provide the premise.
Description
技术领域technical field
本发明涉及微流控技术领域,更具体地说,涉及一种微流控芯片及其封装方法、微流控芯片封装用封装配件。The invention relates to the field of microfluidic technology, and more specifically, to a microfluidic chip, a packaging method thereof, and a packaging accessory for microfluidic chip packaging.
背景技术Background technique
目前,在高通量分析领域,如细胞培养、免疫ELISA反应、核酸扩增等,广泛使用的反应载体或耗材为多孔板,如96孔板和384孔板。围绕着多孔板有一系列的配套仪器,例如孔板离心机、排枪移液器、PCR仪、酶标仪等。这些仪器和多孔板的配合在高通量分析领域发挥了重要作用,但是目前的多孔板的液体自动化操作还需要移液工作站等大型仪器来操作,仪器昂贵,在很多场合使用也不灵活、不方便。At present, in the field of high-throughput analysis, such as cell culture, immune ELISA reaction, nucleic acid amplification, etc., widely used reaction carriers or consumables are multi-well plates, such as 96-well plates and 384-well plates. There are a series of supporting instruments around the multi-well plate, such as a well-plate centrifuge, a row gun pipette, a PCR instrument, a microplate reader, etc. The cooperation of these instruments and multi-well plates has played an important role in the field of high-throughput analysis. However, the current automatic liquid operation of multi-well plates still requires large-scale instruments such as liquid transfer workstations to operate. convenient.
微流控技术是一种通过微管道及微结构在外界硬件的辅助下控制流体完成各种生物和化学反应的一种技术,在高通量、低试剂消耗量分析方面具有优势。此外,微流控技术在流体操控上具有优势,因此有望解决现有基于多孔板的高通量分析的不足。然而利用微流控芯片解决现有多孔板的不足的同时,也遇到一些难题。例如,微流控芯片与现有基于多孔板的高通量分析仪器如何兼容。用户习惯了用排枪移液器来加样,用PCR仪、酶标仪等进行生物反应和检测。若微流孔芯片不能适配这些设备,则可能还需要购置微流控芯片专用的设备以及熟悉相关的使用技巧,带来成本的提高和使用的不便。Microfluidic technology is a technology that controls fluids to complete various biological and chemical reactions through micropipes and microstructures with the assistance of external hardware. It has advantages in high-throughput and low reagent consumption analysis. In addition, microfluidic technology has advantages in fluid manipulation, so it is expected to solve the shortcomings of existing high-throughput analysis based on multi-well plates. However, while using the microfluidic chip to solve the shortcomings of the existing multi-well plate, it also encounters some difficulties. For example, how microfluidic chips are compatible with existing multi-well plate-based high-throughput analytical instruments. Users are accustomed to adding samples with a gun pipette, and using PCR instruments, microplate readers, etc. for biological reactions and detection. If the microfluidic chip cannot be adapted to these devices, it may be necessary to purchase special equipment for the microfluidic chip and be familiar with the relevant usage skills, which will increase the cost and inconvenience the use.
因此,如何设计和加工与现有多孔板配套仪器适配的、且用于高通量分析的微流控芯片成为一个重要需求。然而,微流控芯片为了导热和光学检测良好且试剂消耗量较低,一般需要厚度较薄,由于多孔板的面积较大,则微流控芯片与之适配必然面积也较大。Therefore, how to design and process a microfluidic chip that is compatible with existing multi-well plate supporting instruments and used for high-throughput analysis has become an important requirement. However, microfluidic chips generally need to be thinner in order to conduct heat and optical detection well and consume less reagents. Since the area of the porous plate is larger, the microfluidic chip must have a larger area to fit it.
在封装时,会使微流控芯片的正面受热,由于微流控芯片通常为高分子聚合物,高分子聚合物受热之后再冷却会发生收缩,导致微流控芯片有朝向正面弯曲的应力,导致微流控芯片在封装后的平整度较差,影响封装质量。微流控芯片的面积越大,封装对微流控芯片平整度的影响越大。因此,如何提高大面积的微流控芯片的平整度,以为微流控芯片能够与多孔板配套仪器适配提供前提,是一个需要解决的重要问题。During packaging, the front of the microfluidic chip will be heated. Since the microfluidic chip is usually a polymer, the polymer will shrink after being heated and then cooled, causing the microfluidic chip to bend towards the front. As a result, the flatness of the microfluidic chip after packaging is poor, which affects the packaging quality. The larger the area of the microfluidic chip, the greater the impact of packaging on the flatness of the microfluidic chip. Therefore, how to improve the flatness of a large-area microfluidic chip to provide a prerequisite for the microfluidic chip to be compatible with the supporting instruments of the multi-well plate is an important problem that needs to be solved.
发明内容Contents of the invention
本发明的目的是提供一种微流控芯片,用于高通量分析,以提高微流控芯片的平整度,从而为微流控芯片能够与多孔板配套仪器适配提供前提。本发明的另一目的是提供一种微流控芯片封装用封装配件、一种微流控芯片的封装方法。The purpose of the present invention is to provide a microfluidic chip for high-throughput analysis to improve the flatness of the microfluidic chip, thereby providing a premise for the microfluidic chip to be adapted to the supporting equipment of the porous plate. Another object of the present invention is to provide a packaging accessory for packaging a microfluidic chip and a packaging method for a microfluidic chip.
为了实现上述目的,本发明提供如下技术方案:In order to achieve the above object, the present invention provides the following technical solutions:
一种微流控芯片,用于高通量分析,包括:芯片本体,和设置于所述芯片本体背部的加强筋。A microfluidic chip for high-throughput analysis, comprising: a chip body, and ribs arranged on the back of the chip body.
优选地,所述加强筋包括边缘加强筋和/或内部加强筋,其中,所述边缘加强筋呈环形且沿所述芯片本体的边缘设置,所述芯片本体的边缘包围所述内部加强筋。Preferably, the ribs include edge ribs and/or inner ribs, wherein the edge ribs are ring-shaped and arranged along the edge of the chip body, and the edge of the chip body surrounds the inner ribs.
优选地,当所述加强筋包括内部加强筋时,所述微流控芯片的反应孔与所述内部加强筋在所述芯片本体的正面上的投影无重叠部分。Preferably, when the ribs include internal ribs, there is no overlap between the reaction wells of the microfluidic chip and the projection of the internal ribs on the front surface of the chip body.
优选地,当所述加强筋包括边缘加强筋和内部加强筋时,所述边缘加强筋的高度高于所述内部加强筋的高度。Preferably, when the ribs include edge ribs and inner ribs, the height of the edge ribs is higher than that of the inner ribs.
优选地,所述内部加强筋的高度为1mm-3mm,所述内部加强筋的宽度为0.5mm-2mm。Preferably, the height of the internal reinforcing rib is 1mm-3mm, and the width of the internal reinforcing rib is 0.5mm-2mm.
优选地,所述加强筋包括内部加强筋,所述内部加强筋包括交叉设置的第一内部加强筋和第二内部加强筋。Preferably, the reinforcing ribs include internal reinforcing ribs, and the internal reinforcing ribs include first internal reinforcing ribs and second internal reinforcing ribs arranged crosswise.
优选地,所述加强筋包括内部加强筋,所述内部加强筋呈条形,且沿所述芯片本体的长度方向或宽度方向设置。Preferably, the reinforcing ribs include internal reinforcing ribs, and the internal reinforcing ribs are strip-shaped and arranged along the length direction or width direction of the chip body.
优选地,所述加强筋包括边缘加强筋,所述芯片本体的背部设有凸起,所述凸起与所述边缘加强筋平齐,所述芯片本体的正面开设有加样孔,且所述加样孔分布在所述凸起上。Preferably, the ribs include edge ribs, the back of the chip body is provided with a protrusion, and the protrusions are flush with the edge ribs, the front of the chip body is provided with a sample hole, and the The sample injection holes are distributed on the protrusions.
优选地,所述芯片本体的正面开设有凹槽和主流路,所述凹槽陷于所述凸起内,所述主流路与所述加样孔连通的一端位于所述凹槽内。Preferably, the front surface of the chip body is provided with a groove and a main channel, the groove is sunk in the protrusion, and the end of the main channel communicating with the sample injection hole is located in the groove.
优选地,所述主流路包括:与所述加样孔连通的第一分配段,通过连接流路与所述反应孔连通的第二分配段,连通所述第一分配段和所述第二分配段的第三分配段;其中,所述第一分配段的横截面积大于所述第三分配段的横截面积。Preferably, the main flow path includes: a first distribution section communicated with the sample injection hole, a second distribution section communicated with the reaction well through a connecting flow path, and communicated with the first distribution section and the second A third distribution section of the distribution sections; wherein the cross-sectional area of the first distribution section is greater than the cross-sectional area of the third distribution section.
优选地,所述微流控芯片设有用于与多孔板配套仪器定位的定位结构。Preferably, the microfluidic chip is provided with a positioning structure for the positioning of an instrument matched with the porous plate.
优选地,所述微流控芯片的加样孔的间距为4.5±0.2mm,或所述加样孔的间距为9±0.2mm;Preferably, the spacing between the sample loading holes of the microfluidic chip is 4.5±0.2mm, or the spacing between the sample loading holes is 9±0.2mm;
所述微流控芯片呈矩形,所述微流控芯片的反应孔以矩阵的形式分布;The microfluidic chip is rectangular, and the reaction holes of the microfluidic chip are distributed in the form of a matrix;
所述反应孔以16×24的形式等间距分布,所述反应孔的行间距为4.3mm-4.7mm,所述反应孔的列间距为4.3mm-4.7mm;The reaction wells are equally spaced in the form of 16×24, the row spacing of the reaction wells is 4.3mm-4.7mm, and the column spacing of the reaction wells is 4.3mm-4.7mm;
或,所述反应孔以8×12的形式等间距分布,所述反应孔的行间距为8.8mm-9.2mm,所述反应孔的列间距为8.8mm-9.2mm;Or, the reaction wells are equally spaced in the form of 8×12, the row spacing of the reaction wells is 8.8mm-9.2mm, and the column spacing of the reaction wells is 8.8mm-9.2mm;
或,所述反应孔以8×24的形式等间距分布,所述反应孔的行间距为8.8mm-9.2mm,所述反应孔的列间距为4.3mm-4.7mm;Or, the reaction wells are equally spaced in the form of 8×24, the row spacing of the reaction wells is 8.8mm-9.2mm, and the column spacing of the reaction wells is 4.3mm-4.7mm;
或,所述反应孔以16×12的形式等间距分布,所述反应孔的行间距为4.3mm-4.7mm,所述反应孔的列间距为8.8mm-9.2mm。Or, the reaction wells are equally spaced in the form of 16×12, the row spacing of the reaction wells is 4.3mm-4.7mm, and the column spacing of the reaction wells is 8.8mm-9.2mm.
优选地,所述微流控芯片还包括设置于所述芯片本体的排气结构,所述排气结构包括:排气通道,以及与排气通道连通的排气孔。Preferably, the microfluidic chip further includes an exhaust structure disposed on the chip body, and the exhaust structure includes: an exhaust channel, and an exhaust hole communicating with the exhaust channel.
优选地,所述微流控芯片的加样孔的入口段为渐扩段,且所述入口段自所述加样孔的底端至所述加样孔的入口端渐扩。Preferably, the inlet section of the sample injection hole of the microfluidic chip is a gradually expanding section, and the inlet section gradually expands from the bottom end of the sample injection hole to the inlet end of the sample injection hole.
本发明提供的微流控芯片,通过在芯片本体的背部设置加强筋,加强了整个微流控芯片的结构强度,在微流控芯片封装时,芯片本体有朝向正面弯曲的应力,加强筋能够抵抗芯片本体弯曲变形的受力,减小了芯片本体在封装时的弯曲变形,有效提高了芯片本体在封装后的平整度,即提高了整个微流控芯片的平整度,特别是面积较大的微流控芯片,则为微流控芯片能够与多孔板配套仪器适配提供了前提。The microfluidic chip provided by the present invention strengthens the structural strength of the entire microfluidic chip by arranging reinforcing ribs on the back of the chip body. When the microfluidic chip is packaged, the chip body has the stress of bending toward the front, and the ribs can Resist the force of the bending deformation of the chip body, reduce the bending deformation of the chip body during packaging, and effectively improve the flatness of the chip body after packaging, that is, improve the flatness of the entire microfluidic chip, especially if the area is large The microfluidic chip provides a prerequisite for the microfluidic chip to be adapted to the multi-well plate supporting equipment.
基于上述提供的微流控芯片,本发明实施例还提供了一种微流控芯片封装用封装配件,该微流控芯片封装用封装配件包括为弹性件的支撑体,所述支撑体设置有能够与所述芯片本体的背部完全贴合的支撑结构,所述支撑结构包括:能够与所述加强筋配合的配合结构。Based on the microfluidic chip provided above, an embodiment of the present invention also provides a packaging accessory for microfluidic chip packaging, the packaging accessory for microfluidic chip packaging includes a support body that is an elastic member, and the support body is provided with A supporting structure capable of being fully attached to the back of the chip body, the supporting structure comprising: a matching structure capable of matching with the reinforcing rib.
优选地,所述加强筋包括边缘加强筋,所述边缘加强筋呈环形且沿所述芯片本体的边缘设置;所述芯片本体的背部设有凸起,所述凸起与所述边缘加强筋平齐,所述芯片本体的正面开设有加样孔,且所述加样孔分布在所述凸起上;Preferably, the ribs include edge ribs, the edge ribs are ring-shaped and arranged along the edge of the chip body; the back of the chip body is provided with a protrusion, and the protrusions and the edge ribs flush, the front of the chip body is provided with sample holes, and the sample holes are distributed on the protrusions;
所述配合结构包括:与所述内部加强筋配合的让位凹槽,与所述边缘加强筋配合的第一台阶结构,与所述凸起配合的第二台阶结构。The matching structure includes: a relief groove cooperating with the internal reinforcing rib, a first step structure cooperating with the edge reinforcing rib, and a second step structure cooperating with the protrusion.
优选地,所述支撑体包括相连第一支撑分体和第二支撑分体,所述让位凹槽和所述第一台阶结构设置于所述第一支撑分体;Preferably, the support body includes a connected first support split body and a second support split body, and the relief groove and the first step structure are arranged on the first support split body;
所述第二支撑分体的顶面低于所述第一支撑分体的顶面,且所述第二支撑分体和所述第一支撑分体配合形成所述第二台阶结构;The top surface of the second support split body is lower than the top surface of the first support split body, and the second support split body and the first support split body cooperate to form the second stepped structure;
其中,所述第一支撑分体和所述第二支撑分体之间具有间隙。Wherein, there is a gap between the first supporting body and the second supporting body.
基于上述提供的微流控芯片和微流控芯片封装用封装配件,本发明还提供了一种微流控芯片的封装方法,微流控芯片的封装方法包括步骤:Based on the microfluidic chip and the packaging accessories for microfluidic chip packaging provided above, the present invention also provides a packaging method for the microfluidic chip. The packaging method for the microfluidic chip includes the steps of:
加工第一基体和第二基体,所述第一基体的正面设置反应孔,所述第一基体的背部设置有加强筋;Processing the first substrate and the second substrate, the front of the first substrate is provided with reaction holes, and the back of the first substrate is provided with reinforcing ribs;
向所述反应孔内加入反应所需的材料;Adding materials required for the reaction into the reaction well;
将所述第一基体放置在封装配件上,所述第一基体的背部与所述封装配件贴合;placing the first substrate on the packaging component, and bonding the back of the first substrate to the packaging component;
将第二基体放置在第一基体的正面上,封装所述第一基体和所述第二基体;placing a second substrate on the front side of the first substrate, encapsulating the first substrate and the second substrate;
其中,所述封装配件为上述任一项所述的微流控芯片封装用封装配件,所述第一基体和所述第二基体均为弹性件。Wherein, the packaging accessory is the packaging accessory for microfluidic chip packaging described in any one of the above, and both the first base and the second base are elastic members.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.
图1为本发明实施例提供的微流控芯片的背部示意图;Figure 1 is a schematic diagram of the back of the microfluidic chip provided by the embodiment of the present invention;
图2为图1中微流控芯片的正面示意图;FIG. 2 is a schematic front view of the microfluidic chip in FIG. 1;
图3为图2的局部放大图;Figure 3 is a partially enlarged view of Figure 2;
图4为本发明实施例提供的微流控芯片中流路的局部放大图;Fig. 4 is a partial enlarged view of the flow path in the microfluidic chip provided by the embodiment of the present invention;
图5为本发明实施例提供的微流控芯片的透视图的局部图;5 is a partial view of a perspective view of a microfluidic chip provided by an embodiment of the present invention;
图6为本发明实施例提供的微流控芯片中加样时的示意图;Fig. 6 is a schematic diagram of sample loading in the microfluidic chip provided by the embodiment of the present invention;
图7为本发明实施例提供的微流控芯片封装用封装配件的结构示意图。Fig. 7 is a schematic structural diagram of a packaging accessory for microfluidic chip packaging provided by an embodiment of the present invention.
具体实施方式Detailed ways
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本发明实施例提供的微流控芯片用于高通量分析,该微流控芯片包括芯片本体。The microfluidic chip provided by the embodiment of the present invention is used for high-throughput analysis, and the microfluidic chip includes a chip body.
为了保持微流控芯片较好的导热特性和较好的光学透过性,芯片本体的厚度设置较薄,优先选择芯片本体的厚度为0.5mm-3mm。为了提高较大面积的微流控芯片在封装后的平整度,本发明提供的微流控芯片中,芯片本体的背部设置有加强筋,如图1所示。In order to maintain good thermal conductivity and good optical transparency of the microfluidic chip, the thickness of the chip body is set to be thin, and the thickness of the chip body is preferably selected to be 0.5mm-3mm. In order to improve the flatness of a large-area microfluidic chip after packaging, in the microfluidic chip provided by the present invention, a reinforcing rib is provided on the back of the chip body, as shown in FIG. 1 .
需要说明的是,芯片本体的背部,是指芯片本体中与加样孔7的加样端位于同侧的部分。芯片本体的背面,是指芯片本体中与加样孔7的加样端位于同侧的面;芯片本体的正面与芯片本体的背面相对。It should be noted that the back of the chip body refers to the part of the chip body on the same side as the sample injection end of the sample injection hole 7 . The back of the chip body refers to the surface of the chip body on the same side as the sample loading end of the sample injection hole 7; the front of the chip body is opposite to the back of the chip body.
上述微流控芯片,通过在芯片本体的背部设置加强筋,加强了整个微流控芯片的结构强度。在采用热压封接、激光焊接、超声焊接等封装方式封装时,采用高分子聚合物制作的芯片本体受热之后再冷却会发生收缩,导致芯片本体有朝向正面弯曲的应力,加强筋能够抵抗芯片本体弯曲变形的受力,减小了芯片本体在封装时的弯曲变形,有效提高了芯片本体在封装后的平整度,即提高了整个微流控芯片的平整度,特别是面积较大的微流控芯片,则为微流控芯片能够与多孔板配套仪器适配提供了前提。For the above microfluidic chip, the structural strength of the entire microfluidic chip is enhanced by providing reinforcing ribs on the back of the chip body. When packaged by thermocompression sealing, laser welding, ultrasonic welding and other packaging methods, the chip body made of high molecular polymer will shrink after being heated and then cooled, causing the chip body to have the stress of bending toward the front, and the ribs can resist the chip. The bending deformation of the main body reduces the bending deformation of the chip body during packaging, effectively improves the flatness of the chip body after packaging, that is, improves the flatness of the entire microfluidic chip, especially the microfluidic chip with a large area. The fluidic chip provides the premise for the microfluidic chip to be adapted to the multi-well plate supporting instrument.
可以理解的是,多孔板配套仪器包括排枪等加样设备以及PCR仪、酶标仪等反应检测设备。多孔板配套仪器的具体类型,根据实际需要进行选择,本发明实施例对此不做限定。It can be understood that the supporting equipment for the multi-well plate includes sample loading equipment such as a row gun, and reaction detection equipment such as a PCR instrument and a microplate reader. The specific type of the supporting instrument for the porous plate is selected according to actual needs, which is not limited in the embodiment of the present invention.
对于加强筋的位置、形状以及数目,根据实际需要进行设计。优选地,上述加强筋包括边缘加强筋4,该边缘加强筋4呈环形且沿芯片本体的边缘设置。For the location, shape and number of ribs, design according to actual needs. Preferably, the above-mentioned reinforcing ribs include edge reinforcing ribs 4 , which are ring-shaped and arranged along the edge of the chip body.
在实际应用过程中,也可选择上述加强筋包括内部加强筋,上述芯片本体的边缘包围内部加强筋。当加强筋包括边缘加强筋4时,边缘加强筋4位于内部加强筋的外围,即内部加强筋位于边缘加强筋4的内部。In a practical application process, the above-mentioned reinforcing ribs can also be selected to include internal reinforcing ribs, and the edge of the above-mentioned chip body surrounds the internal reinforcing ribs. When the ribs include edge ribs 4 , the edge ribs 4 are located on the periphery of the inner ribs, that is, the inner ribs are located inside the edge ribs 4 .
当上述加强筋包括内部加强筋时,优先选择上述微流控芯片的反应孔11与内部加强筋在芯片本体的正面上的投影无重叠部分,有效避免了内部加强筋的存在对反应孔11的传热和光学检测产生不利影响。When the above-mentioned reinforcing ribs include internal reinforcing ribs, the projection of the reaction well 11 of the above-mentioned microfluidic chip and the projection of the internal reinforcing ribs on the front of the chip body has no overlap, effectively avoiding the impact of the presence of internal reinforcing ribs on the reaction well 11. Heat transfer and optical detection are adversely affected.
当然,在保证反应孔11的传热和能够正常光学检测的前提下,也可选择反应孔11与内部加强筋在芯片本体的正面上的投影具有重叠部,该重叠部应该尽可能的小。Of course, on the premise of ensuring the heat transfer of the reaction well 11 and normal optical detection, the projection of the reaction well 11 and the internal rib on the front surface of the chip body may also choose to have an overlapping portion, and the overlapping portion should be as small as possible.
上述内部加强筋在保证维持微流控芯片的平面平整度时,应尽量避免微流控芯片在注塑的时在内部加强筋处发生缩水。为了达到上述目的,选择内部加强件为较窄较高的结构。优选地,内部加强筋的高度为1mm-3mm,内部加强筋的宽度为0.5mm-2mm。When the above-mentioned internal ribs ensure the flatness of the plane of the microfluidic chip, the shrinkage of the microfluidic chip at the internal ribs during injection molding should be avoided as much as possible. In order to achieve the above purpose, the inner reinforcement is chosen as a narrower and taller structure. Preferably, the height of the internal reinforcing rib is 1mm-3mm, and the width of the internal reinforcing rib is 0.5mm-2mm.
对于内部加强筋的具体结构,亦根据实际需要进行设计,例如,为了有效提高强度,上述内部加强筋包括交叉设置的第一内部加强筋5和第二内部加强筋6。第一内部加强筋5可为一个,也可为两个以上;第二内部加强筋6可为一个,也可为两个以上。The specific structure of the internal reinforcing ribs is also designed according to actual needs. For example, in order to effectively improve the strength, the internal reinforcing ribs include first internal reinforcing ribs 5 and second internal reinforcing ribs 6 arranged crosswise. The first internal reinforcing rib 5 may be one, or more than two; the second internal reinforcing rib 6 may be one, or more than two.
上述内部加强筋呈条形。进一步地,上述内部加强筋沿芯片本体的长度方向或宽度方向设置。此时,若内部加强筋包括交叉设置的第一内部加强筋5和第二内部加强筋6,则优先选择第一内部加强筋5沿芯片本体的长度方向设置,第二内部加强筋6沿芯片本体的宽度方向设置。可以理解的是,此时,芯片本体呈矩形。The above-mentioned internal reinforcing ribs are strip-shaped. Further, the above-mentioned internal reinforcing ribs are arranged along the length direction or the width direction of the chip body. At this time, if the internal reinforcing ribs include the first internal reinforcing ribs 5 and the second internal reinforcing ribs 6 arranged crosswise, the first internal reinforcing ribs 5 are preferably arranged along the length direction of the chip body, and the second internal reinforcing ribs 6 are arranged along the length direction of the chip body. The width direction setting of the main body. It can be understood that, at this time, the chip body is rectangular.
当然,也可选择上述内部加强筋为其他形状,沿其他方向设置,并不局限于上述实施例。Certainly, the above-mentioned internal reinforcing ribs may also be selected to be in other shapes and arranged along other directions, and are not limited to the above-mentioned embodiments.
当上述加强筋包括边缘加强筋4时,该边缘加强筋4可直接用于微流控芯片的夹持,所以选择边缘加强筋4的高度较高,优选边缘加强筋4的高度为4mm-8mm。进一步地,当上述加强筋包括边缘加强筋4和内部加强筋时,边缘加强筋4的高度高于内部加强筋的高度。When the above-mentioned ribs include edge ribs 4, the edge ribs 4 can be directly used for the clamping of the microfluidic chip, so the height of the edge ribs 4 is selected to be higher, preferably the height of the edge ribs 4 is 4mm-8mm . Further, when the above-mentioned reinforcing ribs include edge reinforcing ribs 4 and internal reinforcing ribs, the height of the edge reinforcing ribs 4 is higher than that of the internal reinforcing ribs.
上述加强筋包括边缘加强筋4时,上述芯片本体的背部设有凸起8,凸起8与边缘加强筋4平齐,芯片本体设有加样孔7,且加样孔7分布在凸起8上,如图1所示。这样,增大了芯片本体背部的支撑面,便于放置微流控芯片。When the above-mentioned reinforcing ribs include edge reinforcing ribs 4, the back of the above-mentioned chip body is provided with a protrusion 8, and the protrusion 8 is flush with the edge reinforcing ribs 4, and the chip body is provided with a sampling hole 7, and the sampling holes 7 are distributed on the protrusion. 8, as shown in Figure 1. In this way, the supporting surface on the back of the chip body is enlarged, which is convenient for placing the microfluidic chip.
为了进一步优化上述技术方案,如图2和图3所示,上述芯片本体的正面开设有凹槽14和主流路13,凹槽14陷于凸起8内,主流路13与加样孔7连通的一端位于凹槽14内;加样孔7的正端面与芯片本体的正面平齐。In order to further optimize the above technical solution, as shown in Figure 2 and Figure 3, the front of the above-mentioned chip body is provided with a groove 14 and a main channel 13, the groove 14 is sunk in the protrusion 8, and the main channel 13 communicates with the sample injection hole 7 One end is located in the groove 14; the positive end surface of the sample injection hole 7 is flush with the front surface of the chip body.
可以理解的是,加样孔7的正端面,是指加样孔7中与芯片本体的正面位于同侧的端面。主流路13的正端面也与芯片本体的正面平齐。主流路13的正端面,是指主流路13中与芯片本体的正面位于同侧的端面。It can be understood that the positive end surface of the sample loading hole 7 refers to the end surface of the sample loading hole 7 on the same side as the front surface of the chip body. The positive end surface of the main channel 13 is also flush with the front surface of the chip body. The positive end surface of the main channel 13 refers to the end surface of the main channel 13 on the same side as the front surface of the chip body.
上述结构从三方面有利于微流控芯片的平整度和封装:The above structure is beneficial to the flatness and packaging of the microfluidic chip from three aspects:
1)避免由于凸起8为实心结构而导致注塑时芯片本体于该处表面的不平整,不利于微流控芯片的封装;1) Avoid the unevenness of the surface of the chip body during injection molding due to the solid structure of the protrusion 8, which is not conducive to the packaging of the microfluidic chip;
2)减少了芯片本体于该凹槽处的正面面积,由于越大的平面越难实现不困住气泡的密封,这样,便于密封,从而便于封装;2) The front area of the chip body at the groove is reduced, because the larger the plane, the more difficult it is to realize the sealing without trapping air bubbles, so that it is easy to seal and thus easy to package;
3)凹槽14使得只有靠近加样孔7的区域、以及主流路13与加样孔7连通的部分的区域在芯片本体的正面的平面内,芯片本体在热封或焊接时只有靠近主流路13和加样孔7附近的区域和热源接触,有利于这些区域被更牢靠的热封或焊接。特别是该处位于芯片本体的边沿,相比于芯片中心区域散热更快,凹槽14的存在会让加样孔7、以及主流路13与加样孔7连通的部分的区域和芯片本体外周被空气隔离开,能有效地降低因周围散热导致的芯片本体不同封装效果的差异。3) The groove 14 makes only the area close to the sample injection hole 7 and the area where the main flow channel 13 communicates with the sample injection hole 7 in the plane of the front of the chip body, and the chip body is only close to the main flow channel during heat sealing or welding. 13 and the area near the sample injection hole 7 are in contact with the heat source, which is conducive to more reliable heat sealing or welding of these areas. Especially this place is located on the edge of the chip body. Compared with the central area of the chip, the heat dissipation is faster. The existence of the groove 14 will make the sample hole 7, the area of the part where the main channel 13 communicates with the sample hole 7 and the periphery of the chip body Isolation by air can effectively reduce the difference in package effects of different chip bodies caused by surrounding heat dissipation.
上述凹槽14可为一个,也可为两个以上。为了简化生产,上述凹槽14为一个,且呈条形。The above-mentioned groove 14 may be one, or more than two. In order to simplify the production, the above-mentioned groove 14 is one and is in the shape of a strip.
如图3和图4所示,上述微流控芯片中,主流路13连通加样孔7和反应孔11。上述主流路13包括:与加样孔7连通的第一分配段131,通过连接流路12与反应孔11连通的第二分配段132,连通第一分配段131和第二分配段132的第三分配段133。需要说明的是,上述第二分配段132与反应孔11一一对应。As shown in FIG. 3 and FIG. 4 , in the above-mentioned microfluidic chip, the main channel 13 communicates with the sample injection hole 7 and the reaction hole 11 . The above-mentioned main channel 13 includes: a first distribution section 131 communicated with the sample injection hole 7, a second distribution section 132 communicated with the reaction hole 11 through the connecting flow channel 12, and a second distribution section 132 communicated with the first distribution section 131 and the second distribution section 132. Three allocation segments 133 . It should be noted that, the second distribution section 132 corresponds to the reaction holes 11 one by one.
优选地,上述第一分配段131的横截面积大于第三分配段133的横截面积。该结构带来的两个优点:Preferably, the cross-sectional area of the first distribution section 131 is larger than the cross-sectional area of the third distribution section 133 . This structure brings two advantages:
1)第一分配段131直接连接加样孔7,而加样孔7位于凸起8的内部,则第一分配段131会跨过凸起8的边沿,如图3所示,在热封或超声焊接时,凸起8的边沿部分因有较厚的凸起8的边沿直接支撑而受力较大,导致芯片本体受热变形时在该处的变形较大,若第一分配段131较细则有可能直接变形堵死。因此,第一分配段131较粗能避免该问题;1) The first distribution section 131 is directly connected to the sample injection hole 7, and the sample injection hole 7 is located inside the protrusion 8, then the first distribution section 131 will cross the edge of the protrusion 8, as shown in Figure 3, after heat sealing Or during ultrasonic welding, the edge portion of the protrusion 8 is under a greater force due to the direct support of the thicker edge of the protrusion 8, resulting in a larger deformation of the chip body when it is heated and deformed. If the first distribution section 131 is relatively large The rules may be directly deformed and blocked. Therefore, the thicker first distribution section 131 can avoid this problem;
2)第一分配段131直接与加样口7连接,其较大的横截面带来较大的容纳体积,而该处容纳的液体或空气均不参与后续往反应孔11的分配,因而该处容纳的液体或空气能起到缓冲作用,能降低对加样量的准确性和加样手法的要求。2) The first distribution section 131 is directly connected to the sample injection port 7, and its larger cross-section brings a larger storage volume, and the liquid or air contained there does not participate in the subsequent distribution to the reaction well 11, so the The liquid or air contained in it can act as a buffer, which can reduce the requirements on the accuracy of the sample volume and the method of sample addition.
上述连接流路12经过热封变形会局部或全部堵塞连接流路12,为了便于实现对其的堵塞,上述连接流路12具有较小的深宽比,优选地,连接流路12的深宽比为0.01-0.50。The above-mentioned connecting flow path 12 will partially or completely block the connecting flow path 12 after being heat-sealed and deformed. In order to facilitate its blockage, the above-mentioned connecting flow path 12 has a smaller aspect ratio. The ratio is 0.01-0.50.
为了便于微流控芯片与多孔板配套仪器配套,上述微流控芯片设有用于与多孔板配套仪器定位的定位结构3。可以理解的是,上述多孔板配套仪器或与多孔板配套仪器适配的配件上也具有与该定位结构3定位配合的结构,以保证定位。In order to facilitate the matching of the microfluidic chip with the supporting instruments of the porous plate, the microfluidic chip is provided with a positioning structure 3 for positioning with the supporting instruments of the porous plate. It can be understood that the above-mentioned perforated plate matching instrument or accessories adapted to the perforated plate supporting instrument also have a structure for positioning and cooperating with the positioning structure 3 to ensure positioning.
需要说明的是,上述定位结构3还可用于微流控芯片变形的矫正。It should be noted that the above positioning structure 3 can also be used to correct the deformation of the microfluidic chip.
上述定位结构3可为定位孔、定位柱、定位槽等。若定位结构3为定位柱,那么芯片本体采用膜热封时,用于热封的膜需要让开定位柱,对膜的结构和定位有要求。为了方便芯片本体的封装,优先选择上述定位结构3为定位孔。此时,芯片本体无凸出部,即无凸出部挡着膜,可以直接将膜贴上热封即可。The above-mentioned positioning structure 3 may be a positioning hole, a positioning column, a positioning groove, and the like. If the positioning structure 3 is a positioning column, then when the chip body is heat-sealed with a film, the film used for heat sealing needs to get out of the positioning column, which requires the structure and positioning of the film. In order to facilitate the packaging of the chip body, the above-mentioned positioning structure 3 is preferably selected as the positioning hole. At this time, the chip body has no protrusions, that is, no protrusions block the film, and the film can be directly pasted and heat-sealed.
对于定位结构3的数目,根据实际需要进行选择。为了提高定位效果,优先选择上述定位结构3至少为两个。进一步地,上述定位结构3为四个,两个定位结构3位于微流控芯片的一端,另外两个定位结构3位于微流控芯片的另一端。The number of positioning structures 3 is selected according to actual needs. In order to improve the positioning effect, it is preferable to select at least two positioning structures 3 above. Further, there are four positioning structures 3, two positioning structures 3 are located at one end of the microfluidic chip, and the other two positioning structures 3 are located at the other end of the microfluidic chip.
优选地,上述加样孔7的间距为4.5±0.2mm或9±0.2mm。这样,方便了微流控芯片与多孔板常用的排枪移液器等配套,从而方便了对微流控芯片进行操作。Preferably, the distance between the sample injection holes 7 is 4.5±0.2mm or 9±0.2mm. In this way, it is convenient for the microfluidic chip to be matched with the commonly used row gun and pipette for the porous plate, thereby facilitating the operation of the microfluidic chip.
为了便于微流控芯片与多孔板配套仪器配套,上述微流控芯片呈矩形,微流控芯片的反应孔11以矩阵的形式分布。可以理解的是,反应孔11分布在芯片本体上。上述微流控芯片呈矩形,可在微流控芯片的顶角处设置圆角或者倒角结构。In order to facilitate the matching of the microfluidic chip with the supporting instruments of the porous plate, the above-mentioned microfluidic chip is rectangular, and the reaction wells 11 of the microfluidic chip are distributed in the form of a matrix. It can be understood that the reaction wells 11 are distributed on the chip body. The above-mentioned microfluidic chip is in the shape of a rectangle, and rounded or chamfered structures can be arranged at the top corners of the microfluidic chip.
对于上述微流控芯片的长度和宽度,根据实际多孔板的尺寸进行选择。例如,微流控芯片的长约127.76mm,宽约85.48mm,与标准96或384孔板相同。本发明实施例对此不做额外限定。The length and width of the aforementioned microfluidic chip are selected according to the size of the actual porous plate. For example, the microfluidic chip is about 127.76mm long and 85.48mm wide, which is the same as a standard 96 or 384-well plate. This embodiment of the present invention makes no additional limitation.
上述微流控芯片的反应孔11与多孔板上的反应孔分布一致,以保证与多孔板配套仪器配套。The reaction wells 11 of the above-mentioned microfluidic chip are distributed in the same way as the reaction wells on the porous plate, so as to ensure matching with the supporting instruments of the porous plate.
例如,上述微流控芯片的反应孔11与96多孔板上的反应孔分布一致,或上述微流控芯片的反应孔11与384多孔板上的反应孔分布一致。具体地,反应孔11以16×24的形式等间距分布,反应孔11的行间距为4.3mm-4.7mm,反应孔11的列间距为4.3mm-4.7mm;或,反应孔11以8×12的形式等间距分布,反应孔11的行间距为8.8mm-9.2mm,反应孔11的列间距为8.8mm-9.2mm;或,反应孔11以8×24的形式等间距分布,反应孔11的行间距为8.8mm-9.2mm,反应孔11的列间距为4.3mm-4.7mm;或,反应孔11以16×12的形式等间距分布,反应孔11的行间距为4.3mm-4.7mm,反应孔11的列间距为8.8mm-9.2mm。For example, the distribution of the reaction wells 11 of the above-mentioned microfluidic chip is consistent with that of the 96-well plate, or the distribution of the reaction wells 11 of the above-mentioned microfluidic chip is consistent with that of the 384-well plate. Specifically, the reaction wells 11 are equally spaced in the form of 16×24, the row spacing of the reaction wells 11 is 4.3mm-4.7mm, and the column spacing of the reaction wells 11 is 4.3mm-4.7mm; or, the reaction wells 11 are arranged at 8×24 12 are equally spaced, the row spacing of the reaction wells 11 is 8.8mm-9.2mm, and the column spacing of the reaction wells 11 is 8.8mm-9.2mm; or, the reaction wells 11 are equally spaced in the form of 8×24, and the reaction wells The row spacing of 11 is 8.8mm-9.2mm, and the column spacing of reaction wells 11 is 4.3mm-4.7mm; or, the reaction wells 11 are equally spaced in the form of 16×12, and the row spacing of reaction wells 11 is 4.3mm-4.7mm mm, the column spacing of the reaction wells 11 is 8.8mm-9.2mm.
以上反应孔11的尺寸适配标准96多孔板或384多孔板的配套仪器,如实时荧光PCR仪或酶标仪。The size of the above reaction wells 11 is adapted to the supporting instruments of standard 96-well plate or 384-well plate, such as real-time fluorescent PCR instrument or microplate reader.
当然,也可选择上述反应孔11以其他距离进行分布,只要保证上述微流控芯片的反应孔11与多孔板上的反应孔分布一致即可。Of course, the distribution of the reaction wells 11 at other distances can also be selected, as long as the distribution of the reaction wells 11 of the microfluidic chip is consistent with the distribution of the reaction wells on the porous plate.
当芯片本体在封装过程中,由于芯片本体的面积较大,则较易产生气泡。为了排出气泡或者避免产生气泡,上述微流控芯片还包括排气结构2,如图2所示,该排气结构2包括:排气通道,以及与排气通道连通的排气孔。可以理解的是,排气孔贯穿芯片本体,以保证排气。When the chip body is in the packaging process, due to the larger area of the chip body, air bubbles are more likely to be generated. In order to discharge air bubbles or avoid generation of air bubbles, the above-mentioned microfluidic chip further includes an exhaust structure 2, as shown in FIG. 2 , the exhaust structure 2 includes: an exhaust channel, and an exhaust hole communicating with the exhaust channel. It can be understood that the exhaust hole runs through the chip body to ensure exhaust.
优选地,上述排气通道设置在所述芯片本体的边缘;排气孔为多个,且均匀分布于排气通道。Preferably, the above-mentioned exhaust channel is arranged on the edge of the chip body; there are multiple exhaust holes, which are evenly distributed in the exhaust channel.
进一步地,上述芯片本体呈矩形,排气通道为两个,一个排气通道沿芯片本体的宽度方向设置,另一个排气通道沿芯片本体的长度方向设置。Further, the above-mentioned chip body has a rectangular shape, and there are two exhaust channels, one exhaust channel is arranged along the width direction of the chip body, and the other exhaust channel is arranged along the length direction of the chip body.
当然,也可选择排气结构2以其他形状和结构进行设计,并不局限于此。Certainly, the exhaust structure 2 may also be designed in other shapes and structures, and is not limited thereto.
如图5和图6所示,上述微流控芯片的加样孔7的入口段为渐扩段,且入口段自加样孔7的底端至加样孔7的加样端渐扩。As shown in FIG. 5 and FIG. 6 , the inlet section of the sampling hole 7 of the above-mentioned microfluidic chip is a gradually expanding section, and the inlet section gradually expands from the bottom end of the sampling hole 7 to the sampling end of the sampling hole 7 .
上述加样孔7的结构,移液吸头插入加样孔7时,加样孔7的入口段的底部能够卡住移液吸头,且能够保证移液吸头的端头不接触到第二基体,实现了移液吸头与加样孔7紧密接触,保证了加样的过程中液体不会泄露;同时,加样孔7的入口段便于移液吸头的插入定位,还能容纳完成进样拔出移液吸头时溢出的少量液体,从而避免了样本的污染。With the structure of the above-mentioned sample hole 7, when the pipette tip is inserted into the sample hole 7, the bottom of the inlet section of the sample hole 7 can block the pipette tip, and can ensure that the end of the pipette tip does not touch the first The two bases realize the close contact between the pipette tip and the sample hole 7, ensuring that the liquid will not leak during the sample addition; at the same time, the inlet section of the sample hole 7 is convenient for the insertion and positioning of the pipette tip, and can also accommodate A small amount of liquid spilled when the pipette tip is pulled out after the injection is completed, thereby avoiding contamination of the sample.
上述芯片主体包括:封装相连的第一基体1和第二基体。具体地,第二基体盖设于第一基体1且与第一基体1密封连接。需要说明的是,图中未显示第二基体。当然,也可选择上述芯片本体由至少三层基体组成,并不局限于两层基体,即第一基体1和第二基体。反应孔11、与反应孔11连通的流路均设置于第一基体1,第一基体1的强度较低,优先选择加强筋设置在第一基体1。对于加强筋的具体位置,根据实际需要进行选择。为了避免加强筋影响微流控芯片的反应孔11和流路,优先选择加强筋设置在第一基体1的背部,即第一基体1远离第二基体的一侧。The above-mentioned chip main body includes: a first substrate 1 and a second substrate that are packaged and connected. Specifically, the second base body is covered on the first base body 1 and sealed with the first base body 1 . It should be noted that the second substrate is not shown in the figure. Of course, the above-mentioned chip body can also be selected to be composed of at least three layers of substrates, and is not limited to two layers of substrates, ie, the first substrate 1 and the second substrate. The reaction holes 11 and the flow paths connected to the reaction holes 11 are all set on the first base body 1 . The strength of the first base body 1 is relatively low, and it is preferable to choose reinforcing ribs to be set on the first base body 1 . For the specific position of the rib, choose according to actual needs. In order to prevent the ribs from affecting the reaction holes 11 and flow paths of the microfluidic chip, the ribs are preferably arranged on the back of the first base 1 , that is, the side of the first base 1 away from the second base.
因热压封接、激光焊接、超声焊接等封装方式都会让第一基体1的正面受热,而高分子聚合物受热之后冷却会发生收缩,从而导致第一基体1有朝向正面弯曲的应力,此时在第一基体1的背部的加强筋刚好可以起到抵抗第一基体1弯曲变形的受力,从而提高了第一基体1在封装后的平整度,进而提高了整个芯片本体在封装后的平整度,即提高了微流控芯片的平整度。Due to thermal compression sealing, laser welding, ultrasonic welding and other packaging methods, the front side of the first base 1 will be heated, and the high molecular polymer will shrink after being heated, which will cause the first base 1 to bend toward the front side. At the same time, the ribs on the back of the first base body 1 can just resist the bending and deformation of the first base body 1, thereby improving the flatness of the first base body 1 after packaging, and further improving the stability of the entire chip body after packaging. Flatness, that is, the flatness of the microfluidic chip is improved.
上述芯片本体可为上述第一基体1,也可选择上述芯片本体包括相连的第一基体1和第二基体。The above-mentioned chip body may be the above-mentioned first base body 1 , or the above-mentioned chip body may optionally include a connected first base body 1 and a second base body.
上述微流控芯片中,反应孔11和加样孔7均为多个,加样孔7位于主流路13的两端,上述连接流路12与反应孔11位于第一基体1的同一表面,加样孔7贯穿第一基体1。主流路13的整体分布与反应孔11的分布平行,连接流路12与反应孔11一一对应。主流路13可为一个,也可为两个以上。上述反应孔11具有容腔,以容纳待检测的液体。反应孔11开设在第一基体1的一个侧面上,反应孔11为盲孔。In the above-mentioned microfluidic chip, there are multiple reaction holes 11 and sample injection holes 7, the sample injection holes 7 are located at both ends of the main channel 13, and the connecting channel 12 and the reaction well 11 are located on the same surface of the first substrate 1, The sample injection hole 7 runs through the first base body 1 . The overall distribution of the main channels 13 is parallel to the distribution of the reaction holes 11 , and the connecting flow channels 12 correspond to the reaction holes 11 one by one. The main flow path 13 may be one, or two or more. The above-mentioned reaction hole 11 has a cavity to accommodate the liquid to be detected. The reaction hole 11 is opened on one side of the first substrate 1, and the reaction hole 11 is a blind hole.
为了便于完成离心分配以及提高分配的均匀性,上述第二分配段132向连接流路12凸出。优选地,第二分配段132呈弧形或V型。进一步地,第二分配段132呈半圆形。可以理解的是,可在上述V型尖角处设置圆角,以便于离心分配当然,也可选择上述第二分配段132为其他形状,并不局限于上述结构。In order to facilitate centrifugal distribution and improve distribution uniformity, the above-mentioned second distribution section 132 protrudes toward the connecting flow path 12 . Preferably, the second distribution section 132 is arc-shaped or V-shaped. Further, the second distributing section 132 is semicircular. It can be understood that rounded corners can be provided at the above-mentioned V-shaped sharp corners to facilitate centrifugal distribution. Of course, the second distribution section 132 can also be selected to have other shapes, and is not limited to the above-mentioned structure.
进一步,为了便于样品更均匀的离心分配,上述第二分配段132的横截面积大于第三分配段133的横截面积。Further, in order to facilitate more uniform centrifugal distribution of samples, the cross-sectional area of the second distribution section 132 is larger than the cross-sectional area of the third distribution section 133 .
基于上述实施例提供的微流控芯片,本发明实施例还提供了一种微流控芯片封装用封装配件,如图7所示,该微流控芯片封装用封装配件包括为弹性件的支撑体,该支撑体设置有能够与第一基体1的背部完全贴合的支撑结构,该支撑结构包括:能够与第一基体1背部的加强筋配合的配合结构。Based on the microfluidic chip provided in the above embodiments, the embodiment of the present invention also provides a packaging accessory for microfluidic chip packaging. As shown in Figure 7, the packaging accessory for microfluidic chip packaging includes a support for elastic parts body, the support body is provided with a support structure that can be fully attached to the back of the first base body 1 , and the support structure includes: a matching structure that can cooperate with the ribs on the back of the first base body 1 .
上述支撑体的支撑结构能够与第一基体1的背部完全贴合,则实现了对第一基体1的支撑;由于支撑体为弹性件,封装配件与第一基体1结合后受压会变形,能自适应第一基体1的结构和形状,则使得第一基体1在有一定的弯曲和局部不平的情况也能较好地被封装。The support structure of the above-mentioned support body can be completely attached to the back of the first base body 1, thus realizing the support for the first base body 1; since the support body is an elastic member, the packaging accessories will be deformed after being combined with the first base body 1 under pressure. Being able to adapt to the structure and shape of the first base body 1 enables the first base body 1 to be better packaged even when there is a certain curvature and local unevenness.
若上述加强筋包括边缘加强筋4,边缘加强筋4呈环形且沿芯片本体的边缘设置,芯片本体的背部设有凸起8,凸起8与边缘加强筋4平齐,芯片本体的正面开设有加样孔7,且加样孔7分布在凸起8上,则上述配合结构包括:与内部加强筋配合的让位凹槽01,与边缘加强筋4配合的第一台阶结构02,与凸起8配合的第二台阶结构03。If the above-mentioned ribs include edge ribs 4, the edge ribs 4 are annular and arranged along the edge of the chip body, the back of the chip body is provided with a protrusion 8, the protrusion 8 is flush with the edge rib 4, and the front of the chip body is provided with There are sample injection holes 7, and the sample injection holes 7 are distributed on the protrusion 8, then the above-mentioned matching structure includes: a relief groove 01 that cooperates with the internal reinforcement rib, a first step structure 02 that cooperates with the edge reinforcement rib 4, and The second stepped structure 03 that the protrusion 8 cooperates with.
为了提高支撑体的弹性,以保证第一基体1在有一定的弯曲和局部不平的情况也能较好地被封装,上述支撑体包括相连第一支撑分体05和第二支撑分体06,让位凹槽01和第一台阶结构02设置于第一支撑分体05;第二支撑分体06的顶面低于第一支撑分体05的顶面,且第二支撑分体06和第一支撑分体05配合形成第二台阶结构03;其中,第一支撑分体05和第二支撑分体06之间具有间隙04。上述间隙04为狭窄且深度较大的缝隙。In order to improve the elasticity of the support body, so as to ensure that the first base body 1 can be better packaged in the case of certain curvature and local unevenness, the above support body includes a first support split body 05 connected to a second support split body 06, The relief groove 01 and the first step structure 02 are arranged on the first support split body 05; the top surface of the second support split body 06 is lower than the top surface of the first support split body 05, and the second support split body 06 and the second support split body 06 A supporting split body 05 cooperates to form a second stepped structure 03 ; wherein, there is a gap 04 between the first supporting split body 05 and the second supporting split body 06 . The gap 04 is narrow and deep.
通过设置上述间隙04,增大了第二台阶结构的运动自由度,提高了整个结构的弹性,使得整个结构能更好地与第一基体1进行适配。By setting the above-mentioned gap 04, the freedom of movement of the second stepped structure is increased, and the elasticity of the whole structure is improved, so that the whole structure can be better adapted to the first base body 1 .
上述封装配件优选为硅胶件、橡胶件等弹性塑料件,上述封装配件通过机加工或注塑的方式制成。The above-mentioned packaging accessories are preferably elastic plastic parts such as silicone parts and rubber parts, and the above-mentioned packaging accessories are made by machining or injection molding.
因封装配件为弹性塑料件,而弹性塑料件的导热性较差,在热压封接、激光焊接、超声焊接等会让微流控芯片受热的封装方式中,封装配件减少了微流控芯片的散热量,从而减少了封装时的能量消耗,即减少了对微流控芯片正面的加热程度,进而减小了因上述加热导致的微流控芯片的正面变形,有利于保证微流控芯片封装后的平整度。Because the packaging accessories are elastic plastic parts, and the thermal conductivity of elastic plastic parts is poor, in the packaging methods that will heat the microfluidic chip, such as thermocompression sealing, laser welding, and ultrasonic welding, the packaging accessories reduce the number of microfluidic chips. The amount of heat dissipation, thereby reducing the energy consumption during packaging, that is, reducing the degree of heating on the front of the microfluidic chip, thereby reducing the deformation of the front of the microfluidic chip caused by the above heating, which is conducive to ensuring that the microfluidic chip Flatness after encapsulation.
基于上述实施例提供的微流控芯片封装用封装配件,本发明实施例还提供了一种微流控芯片的封装方法,微流控芯片的封装方法包括步骤:Based on the packaging accessories for microfluidic chip packaging provided in the above embodiments, the embodiment of the present invention also provides a packaging method for a microfluidic chip. The packaging method for a microfluidic chip includes the steps of:
1)加工基体:1) Processing substrate:
具体地,加工第一基体1和第二基体,第一基体1的正面设置反应孔11,第一基体1的背部设置有加强筋。第一基体1和第二基体均为弹性件。第一基体1的材料为高分子聚合物。上述高分子聚合物为聚甲基丙烯酸甲酯、聚碳酸酯、或聚丙烯等。上述第一基体1通过注塑、激光雕刻或机械加工而成。第二基体为与第一基体1相同的基材,或第二基体为与第一基体1匹配的热封膜。为了便于检测,上述第一基体1和/或第二基体为透光基体。Specifically, the first substrate 1 and the second substrate are processed, the first substrate 1 is provided with reaction holes 11 on the front, and the back of the first substrate 1 is provided with reinforcing ribs. Both the first base body 1 and the second base body are elastic parts. The material of the first base 1 is high molecular polymer. The high molecular polymer mentioned above is polymethyl methacrylate, polycarbonate, or polypropylene. The above-mentioned first base body 1 is formed by injection molding, laser engraving or mechanical processing. The second base is the same substrate as the first base 1 , or the second base is a heat-sealing film matching the first base 1 . For the convenience of detection, the above-mentioned first base body 1 and/or the second base body is a light-transmitting base body.
2)点样:2) Spotting:
向反应孔11内加入反应所需的材料。通过移液工作站、排枪移液器、各种接触式点样或喷点设备向反应孔11内加入反应所需的生物材料,例如用于PCR反应的引物、探针、酶等,待其中的液体挥发或冻干固化到反应孔11中,完成点样。此外,反应孔11中也可以加入已经固化后的生物材料,例如生物试剂的冻干球等。Add the materials required for the reaction into the reaction well 11. Add biological materials required for the reaction, such as primers, probes, enzymes, etc. The liquid volatilizes or lyophilizes and solidifies into the reaction well 11 to complete sample application. In addition, solidified biological materials, such as freeze-dried balls of biological reagents, can also be added to the reaction well 11 .
3)封装:3) Package:
将第一基体1放置在封装配件上,第一基体1的背部与封装配件贴合;将第二基体放置在第一基体1的正面上,封装第一基体1和第二基体。上述封装配件为上述实施例所述的微流控芯片封装用封装配件。The first substrate 1 is placed on the packaging accessory, and the back of the first substrate 1 is bonded to the packaging accessory; the second substrate is placed on the front of the first substrate 1, and the first substrate 1 and the second substrate are packaged. The above-mentioned packaging accessories are the packaging accessories for microfluidic chip packaging described in the above-mentioned embodiments.
上述第一基体1和第二基体在常温下为弹性材料,在加热到一定温度后可变形且有弹性,这是很多高分子聚合物具有的特性。上述第一基体1和第二基体可通过热压封接、激光焊接、超声焊接、或胶封等现有技术封装贴合,实现密封连接。例如,上述第一基体1和第二基体中的一者为具有单面胶的基体。The above-mentioned first matrix 1 and the second matrix are elastic materials at room temperature, and can be deformed and elastic after being heated to a certain temperature, which is a characteristic of many polymers. The above-mentioned first base 1 and the second base can be packaged and bonded by existing technologies such as thermocompression sealing, laser welding, ultrasonic welding, or glue sealing, so as to realize hermetically sealed connection. For example, one of the above-mentioned first base 1 and the second base is a base with single-sided adhesive.
因第一基体1为凸凹不平的复杂结构,采用封装配件来辅助封装。第一基体1的背面面向封装配件与之结合。上述封装配件使得第一基体1在有一定的弯曲和局部不平的情况也能较好地被封装。Since the first substrate 1 has a complex uneven structure, packaging accessories are used to assist packaging. The back side of the first substrate 1 faces the packaging component and is combined therewith. The above-mentioned packaging components enable the first substrate 1 to be better packaged even when there is a certain curvature and local unevenness.
本发明实施例提供的微流控芯片的封装方法,通过封装配件对第一基体1和第二基体进行封装,使得第一基体1在有一定的弯曲和局部不平的情况也能较好地被封装,便于实现高效不泄露封装,提高了封装效果。The microfluidic chip packaging method provided by the embodiment of the present invention uses packaging accessories to package the first substrate 1 and the second substrate, so that the first substrate 1 can be better packaged even when there is a certain curvature and local unevenness. Encapsulation, it is convenient to realize high-efficiency non-leakage encapsulation, and improves the encapsulation effect.
此外,因封装配件为弹性塑料件,而弹性塑料件的导热性较差,在热压封接、激光焊接、超声焊接等会让微流控芯片受热的封装方式中,封装配件减少了微流控芯片的散热量,从而减少了封装时的能量消耗,即减少了对微流控芯片正面的加热程度,进而减小了因上述加热导致的微流控芯片的正面变形,有利于保证微流控芯片封装后的平整度。In addition, because the packaging accessories are elastic plastic parts, and the thermal conductivity of elastic plastic parts is poor, in the packaging methods that will heat the microfluidic chip, such as thermocompression sealing, laser welding, and ultrasonic welding, the packaging accessories reduce the microfluidic flow rate. Control the heat dissipation of the chip, thereby reducing the energy consumption during packaging, that is, reducing the heating degree of the front of the microfluidic chip, thereby reducing the deformation of the front of the microfluidic chip caused by the above heating, which is conducive to ensuring the microfluidic Control the flatness of the chip after packaging.
上述微流控芯片的使用方法包括步骤:The method for using the above-mentioned microfluidic chip includes steps:
1)注样:1) Sample injection:
将待检测的样品由加样孔7加入微流控芯片的主流路13中。The sample to be detected is injected into the main channel 13 of the microfluidic chip through the sample injection hole 7 .
2)密封加样口:2) Seal the sample port:
完成注样后,上述加样孔7可采用热封方式封闭或通过粘胶等方式封闭。After the sample injection is completed, the above-mentioned sample injection hole 7 can be sealed by means of heat sealing or glue.
3)离心分配样品:3) Centrifuge to distribute the sample:
将微流控芯片放置在离心装置上,将微流控芯片的主流路朝向离心中心而反应孔11远离离心中心的方向进行离心,样品由主流路13经过连接流路12进入反应孔11中。上述离心分配过程中,连接流路12处的离心力方向与连接流路12的轴向平行,或者连接流路12处的离心力方向与连接流路12的轴向之间的夹角为不大于80度。Place the microfluidic chip on the centrifuge device, centrifuge the main channel of the microfluidic chip toward the centrifugal center and the reaction well 11 is away from the centrifugal center, and the sample enters the reaction well 11 from the main channel 13 through the connecting channel 12 . During the above centrifugal distribution process, the direction of the centrifugal force at the connecting flow path 12 is parallel to the axial direction of the connecting flow path 12, or the angle between the direction of the centrifugal force at the connecting flow path 12 and the axial direction of the connecting flow path 12 is not greater than 80° Spend.
4)隔离反应孔:4) Isolate the reaction well:
对于离心完成分配的微流控芯片,将其放置在微流控芯片配套装置上,通过热压连接流路12的局部或全部,使得芯片局部变形而隔离,从而实现物理隔离每个反应孔11,有效提高了隔离可靠性,避免了交叉污染以及反应后的产物对环境的污染。For the microfluidic chip that has been distributed by centrifugation, it is placed on the supporting device of the microfluidic chip, and part or all of the flow path 12 is connected by heat and pressure, so that the chip is partially deformed and isolated, thereby achieving physical isolation of each reaction well 11 , effectively improving the isolation reliability, avoiding cross-contamination and environmental pollution by reaction products.
5)反应和检测:5) Reaction and detection:
完成隔离后的芯片通过与常规多孔板配套的仪器完成反应和检测,如实时荧光PCR仪、酶标仪等。After isolation, the chip is reacted and detected by an instrument matched with a conventional multi-well plate, such as a real-time fluorescent PCR instrument, a microplate reader, and the like.
对于上述多孔板配套的仪器的具体类型,根据实际需要进行选择,本发明实施例对配套仪器的类型不做限定。The specific type of the instrument matched with the above-mentioned porous plate can be selected according to the actual needs, and the embodiment of the present invention does not limit the type of the matched instrument.
对所公开的实施例的上述说明,使本领域技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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