CN108803003A - A kind of endoscope lens module - Google Patents

Abstract

The present invention relates to an endoscope lens module, which includes a transmission cable, a circuit substrate, CMOS, a module casing, and an objective lens assembly. The front end of the transmission cable is connected to the circuit substrate, and the CMOS is welded on the On the circuit substrate, the imaging aspect ratio of the CMOS internal chip is 16:9 unit aspect ratio; the objective lens assembly is arranged in front of the CMOS, and the objective lens assembly includes an objective lens holder and a A conventional objective lens and a magnifying objective lens, the imaging planes of the conventional objective lens and the magnifying objective lens are on the same plane, the center of the imaging plane of the two is on the transverse centerline of the CMOS, the imaging area of the magnifying objective lens is in the same plane as the The width sides of the CMOS are tangent, the diameter of the imaging area of the magnifying objective lens is 5.5-6 units, and the diameter of the imaging area of the conventional objective lens is 9.5-10.5 units. The invention can realize the function of image enlargement without changing the design of the operating handle.

Description

A kind of endoscope lens module

technical field

The invention relates to the technical field of endoscopes, in particular to an endoscope lens module.

Background technique

Schematic diagram of the installation structure of the commonly used 16:9 endoscopic lens, including transmission cable, image sensor chip (CMOS), circuit substrate, module housing, objective lens holder and objective lens, among which the circuit substrate at one end of the transmission cable, The other end of the circuit substrate is connected to the CMOS. The size of the CMOS is 16:9 aspect ratio. The other end of the CMOS corresponds to an objective lens holder. The objective lens in the objective lens holder is generally located in the center of the lens holder, and the CMOS is in the objective lens The projection of the imaged area is inscribed in the latter. In this way, the viewing area of the circular objective lens is limited to a long profiling viewing angle of 16:9 in the CMOS chip, and most of the imaging area will be wasted.

Electronic endoscopes (taking electronic gastrointestinal endoscopes as an example) must use lenses with wide angle (120-145°) and long depth of field (3-100mm) due to actual observation needs, and the image magnification is always about 40 times (19-inch monitor device). Even if a high-resolution image sensor is used, the magnification effect is not obvious due to its own optical limitations. As shown in Figure 1, the 16:9 conventional image actually has a large part of the area that is not displayed (the underlined area).

The Japanese company mounts the zoom lens on the imaging sensor, which is consistent with conventional imaging in normal use. If you need to check the details of the lesion, you can pull the mechanical structure on the objective lens by operating the structure of the hand wheel, and change the distance between the lenses to achieve close-up magnification observation. The magnification is about 130 times, which can greatly improve the inspection accuracy and is very convenient. But this structure has obvious disadvantages, 1) zoom objective lens has complicated mechanical structure, and diameter is very thick, and endoscope also must be done thick, has a strong impact on patient's comfort level of use. 2) Due to the complex mechanical structure, it is easy for dust to enter when assembling the objective lens, and the movement between the lenses is also easy to generate garbage. 3) When designing the endoscope, it is necessary to increase the transmission structure from the operating handle to the objective lens, and a set of operating handles needs to be redesigned, which requires huge manpower and material resources.

Contents of the invention

The purpose of the present invention is to improve the above-mentioned situation and provide an endoscope lens module

The technical solution adopted in the present invention: an endoscope lens module, including a transmission cable, a circuit substrate, a CMOS, a module housing, and an objective lens assembly, the front end of the transmission cable is connected to the circuit substrate, and the CMOS Welded on the circuit substrate, the CMOS internal chip imaging aspect ratio is 16:9 unit aspect ratio; the objective lens assembly is arranged in front of the CMOS, and the objective lens assembly includes an objective lens holder and a wear-through Assuming its internal conventional objective lens and magnifying objective lens, the imaging planes of the conventional objective lens and the magnifying objective lens are on the same plane, and the center of the imaging plane circle of the two is on the transverse center line of the CMOS, and the imaging plane of the magnifying objective lens The area is tangent to the width side of the CMOS, the diameter of the imaging area of the magnifying objective lens is 5.5-6 units, and the diameter of the imaging area of the conventional objective lens is 9.5-10.5 units.

The beneficial effects of the invention are: the same CMOS can simultaneously realize the functions of conventional observation and magnified observation, and image magnification can be realized without using a focusing objective lens. There is also no need to change the operating handle design.

Description of drawings

Briefly introduce the drawings involved in the description of the embodiments of the present invention, so as to provide a clearer and more complete description of the technical solutions in the embodiments of the present invention. The following drawings are only for some embodiments of the present invention and are not intended to limit In the present invention, on the premise of not performing other creative work, other drawings can obviously be obtained based on these drawings.

Fig. 1 is the imaging diagram of the CMOS of the endoscope lens module of prior art;

Fig. 2 is an exploded view of the endoscope lens module shown in the present invention;

Fig. 3 is the imaging diagram of the CMOS of the endoscope lens module shown in Fig. 2;

Figures 4a-4d are renderings on the display.

Detailed ways

Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. connected, or integrally connected. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "below" and "under" the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is less horizontal than the second feature.

As shown in Figures 2 to 3, an endoscope lens module includes a transmission cable 1, a circuit substrate 2, a CMOS 3, a module housing 4, and an objective lens assembly, and the front end of the transmission cable 1 is connected to the circuit substrate 2. The CMOS3 is welded on the circuit substrate 2, and the internal chip imaging aspect ratio of the CMOS3 is 16:9 unit aspect ratio; the objective lens assembly is arranged in front of the CMOS3, and the The objective lens assembly includes an objective lens mount 5 and a conventional objective lens 6 and a magnifying objective lens 7 penetrating the inside thereof, and the imaging planes of the conventional objective lens 6 and the magnifying objective lens 7 are on the same plane. The imaging plane centers of the two objective lenses are on the imaging lateral centerline of the CMOS3, while the imaging area of the enlarged objective lens 7 is tangent to the imaging width side of the CMOS3, and the imaging area diameter of the enlarged objective lens 7 is 5.5-5.5mm. 6 units, the diameter of the imaging area of the conventional objective lens 6 is 9.5-10.5 units.

During use, the conventional objective lens 6 is used for normal viewing angle observation. When a target is found, the direction or angle of the endoscope lens only needs to be adjusted in a small range, so that the magnifying objective lens 7 is directly facing the target area to obtain an enlarged image, and the magnifying objective lens 7 is set simultaneously. The diameter of the imaging area is 5.5-6 units, and the diameter of the imaging area of the conventional objective lens 6 is 9.5-10.5 units, so that a normal image and an enlarged image can be obtained at the same time without wasting more visual effects.

As shown in Figure 4a, it is the image reflected by the endoscope lens on the CMOS. The video segmentation line is the tangent of the viewing angle observed by the two objective lenses. At this time, the image cannot be used directly and needs to be divided into independent regular and enlarged images by software. , as shown in Figure 4b, the conventional image is an image with a radian edge cutting effect, or an octagonal image can be obtained through software. As shown in Figure 4c, the two images are re-spliced into one image according to actual needs and displayed on the monitor. As shown in Figure 4d, when observing the details of the lesion at close range, the image of the magnifying objective lens can also be electronically enlarged and the conventional image can be reduced to exchange positions for easy observation.

Further, the conventional objective lens 6 and the magnifying objective lens 7 are bonded to the objective lens holder 5 by glue.

Further, after the transmission cable 1 and the circuit substrate 2 are welded, the edges are fixed firmly by glue, and after the transmission cable 1 and the circuit substrate 2 are fixed firmly, they are then put into the module casing 4, and then glued firmly. Reinstall the objective lens assembly, correct the distance between the objective lens assembly and the sensor to meet the requirements of the best imaging effect, and then use glue to bond the objective lens assembly and the module housing 4 .

And the above are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention within.

Claims (2)

1. A kind of endoscope lens module, it is characterized in that, comprise transmission cable, circuit substrate, CMOS, module housing, objective lens assembly, the front end of described transmission cable connects described circuit substrate, and described CMOS welding On the circuit substrate, the CMOS internal chip imaging aspect ratio is 16:9 unit aspect ratio; the objective lens assembly is arranged in front of the CMOS, and the objective lens assembly includes an objective lens holder and a penetrating device. The conventional objective lens and the magnifying objective lens inside it, the imaging planes of the conventional objective lens and the magnifying objective lens are on the same plane, and the center of the imaging plane circle of the two is on the lateral center line of the CMOS, and the imaging area of the magnifying objective lens is Tangent to the width side of the CMOS, the diameter of the imaging area of the magnifying objective lens is 5.5-6 units, and the diameter of the imaging area of the conventional objective lens is 9.5-10.5 units. 2. A kind of endoscopic lens module according to claim 1, is characterized in that, described conventional objective lens and described magnifying objective lens are all bonded with described objective lens holder by glue.