CN108800032B - Lamp assembly for a headlamp - Google Patents
Lamp assembly for a headlamp Download PDFInfo
- Publication number
- CN108800032B CN108800032B CN201810391108.6A CN201810391108A CN108800032B CN 108800032 B CN108800032 B CN 108800032B CN 201810391108 A CN201810391108 A CN 201810391108A CN 108800032 B CN108800032 B CN 108800032B
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- CN
- China
- Prior art keywords
- heat sink
- light source
- circuit board
- printed circuit
- lamp assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
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- 239000008393 encapsulating agent Substances 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
- B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
- F21S41/192—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
- F21S41/24—Light guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
- F21S43/195—Details of lamp holders, terminals or connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/235—Light guides
- F21S43/236—Light guides characterised by the shape of the light guide
- F21S43/237—Light guides characterised by the shape of the light guide rod-shaped
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/235—Light guides
- F21S43/242—Light guides characterised by the emission area
- F21S43/243—Light guides characterised by the emission area emitting light from one or more of its extremities
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/235—Light guides
- F21S43/247—Light guides with a single light source being coupled into the light guide
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/20—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by refractors, transparent cover plates, light guides or filters
- F21S43/27—Attachment thereof
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q2400/00—Special features or arrangements of exterior signal lamps for vehicles
- B60Q2400/30—Daytime running lights [DRL], e.g. circuits or arrangements therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Lighting Device Outwards From Vehicle And Optical Signal (AREA)
Abstract
A lamp assembly for mounting in a headlamp includes a heat sink having a printed circuit board landing area for receiving a printed circuit board and a light source landing area for receiving at least one light source. The lamp assembly further includes a light guide and a bracket for removably mounting on the heat sink. The holder is adapted to engage and secure the light guide in a predetermined position on a heat sink in which the at least one light source and the printed circuit board are not sealed.
Description
Technical Field
The present invention relates to motor vehicle headlamps, and more particularly, to a lamp assembly located in a headlamp.
Background
In the field of motor vehicle lighting, LEDs may be used in conjunction with light pipes to provide motor vehicle lighting functions. In the past, LEDs were mounted directly onto a Printed Circuit Board (PCB), which in turn was mounted onto a heat sink, requiring the heat sink to dissipate the heat generated by the printed circuit board and the LEDs mounted on the printed circuit board. The light pipe is typically positioned with its input face in operative relationship with the LEDs.
Then, the radiator is mounted on the outside of the headlamp and on the housing on the motor vehicle. This requires that the heat sink be sealed or that the heat sink be sealed to the housing. Therefore, an encapsulant must be provided to seal the heat sink and the components mounted on the heat sink, including the printed circuit board and the LEDs. Since the LEDs are mounted directly on the printed circuit board, which in turn is mounted on a heat sink, a relatively large heat sink is required to dissipate the heat of both components.
It is not uncommon for prior art designs to require a heat sink to be mounted to the housing and then the light pipe to be installed at some later point in time. The installation of the light pipe into the heat sink is often blind and can easily result in misalignment or misregistration of the light pipe entrance face with respect to the LEDs.
Accordingly, there is a need for systems, assemblies, and methods that overcome one or more of the above-referenced problems or other problems in the prior art.
Disclosure of Invention
It is therefore a primary object of the present invention to provide a lamp assembly that does not require a heat sink seal.
It is another object of the present invention to provide an assembly in which at least one or more LEDs can be mounted on a heat sink that is separate from the printed circuit board, thereby enabling a reduction in the size of the heat sink.
It is a further object of the invention to provide a lamp assembly in which the light pipe may be mounted to a heat sink prior to the assembly being installed into the light pipe.
It is another object of the present invention to improve the thermal conduction efficiency and heat dissipation of the printed circuit board and the at least one or more LEDs.
It is another object of the present invention to provide a lamp assembly that can be located directly in the head lamp, thereby eliminating the need for a seal.
It is another object of the present invention to provide a heat sink that is machined, folded or stamped with at least one or more protective devices for protecting components mounted on the heat sink.
It is a further object of the present invention to provide a system and assembly that helps reduce the cost of the lamp assembly.
It is another object of the present invention to provide a modular system and assembly that is adapted to accurately mount components, such as circuit boards, LEDs and/or light pipes, to a heat sink to register the components in predetermined positions on the heat sink.
In one aspect, one embodiment of the invention includes a lamp assembly for mounting in a headlamp that includes a heat sink having a landing area for receiving a printed circuit board and a landing area for receiving at least one light source, a light guide, and a bracket for removably mounting on the heat sink, the bracket adapted to engage and secure the light guide in a predetermined position on the heat sink.
In another aspect, another embodiment of the invention includes a headlamp including a headlamp housing, a primary light source for performing a primary lighting function, a lamp assembly for performing a secondary lighting function, the lamp assembly being mounted in the headlamp housing, and a lens and seal for mounting on the headlamp housing, the lamp assembly including a heat sink having a printed circuit board landing area for receiving a printed circuit board and a light source landing area for receiving at least one light source, a light guide, and a bracket for removably mounting on the heat sink, the bracket adapted to engage and secure the light guide in a predetermined position.
The invention, including all embodiments shown and described herein, may be used alone or with and/or in combination with one or more features covered by one or more of the following:
-a lamp assembly, wherein the at least one light source comprises at least one LED mounted directly to a light source landing zone.
-a lamp assembly, wherein the light guide comprises a protrusion, the heat sink comprising at least one aperture adapted to receive the protrusion and position the input face of the light guide in opposing relation to the at least one light source.
-a lamp assembly, wherein the heat sink comprises at least one wall.
A lamp assembly, wherein the heat sink is of unitary or monolithic construction and is machined or folded to include a plurality of walls for protecting the printed circuit board, the at least one light source and the electrical connections therebetween.
-a lamp assembly, wherein the plurality of walls comprises a first wall having at least one first wall aperture and a substantially opposite second wall having at least one second wall aperture, the bracket comprises at least one first resilient arm and at least one second resilient arm, each of the at least one first resilient arm and the at least one second resilient arm having a detent, the detents of the at least one first resilient arm being adapted to be received in the at least one first wall aperture and the detents of the at least one second resilient arm being adapted to be received in the at least one second resilient arm so as to secure or lock the bracket to the heat sink.
-a lamp assembly, wherein the heat sink comprises at least one registration post, the printed circuit board comprises an aperture having a size and shape that is substantially complementary to the size and shape of the at least one registration post such that when the printed circuit board is mounted on the heat sink, the printed circuit board is automatically registered with respect to the at least one light source on the light source landing zone.
-a lamp assembly, wherein the lamp assembly is mounted in a sealed headlamp.
-a lamp assembly, wherein the lamp assembly performs at least one of a primary lighting function or a secondary lighting function.
-a lamp assembly, wherein the auxiliary lighting function is a daytime running lamp function.
-a lamp assembly, wherein at least two LEDs are used in conjunction with the light guide, one for Daytime Running Lamps (DRL) and one for turn indicator lamps.
Lamp assemblies, where the LEDs for daytime running lamps can be dimmed to obtain a stop lamp or a position lamp.
-a headlamp, wherein the at least one light source comprises at least one LED mounted directly to the light source landing zone.
-a headlamp, wherein the light guide comprises a protrusion, and the heat sink comprises at least one aperture adapted to receive the protrusion and to position the input face of the light guide in an opposing relationship to the at least one light source.
-a headlamp, wherein the heat sink comprises at least one wall for protecting the printed circuit board, the at least one light source and the electrical connection between the two.
A headlamp, wherein the heat sink is a monolithic or monolithic structure and is machined or folded to comprise a plurality of walls for protecting the printed circuit board, the at least one light source and the electrical connections between the two.
-a headlamp, wherein the plurality of walls comprises a first wall having at least one first wall hole and a substantially opposite second wall having at least one second wall hole, the bracket comprises at least one first resilient arm and at least one second resilient arm, each of the at least one first resilient arm and the at least one second resilient arm having a detent, the detents of the at least one first resilient arm being adapted to be received in the at least one first wall hole and the detents of the at least one second resilient arm being adapted to be received in the at least one second wall to secure or lock the bracket to the heat sink.
-a headlamp, wherein the heat sink comprises at least one registration post, the printed circuit board comprises an aperture having a size and shape that is substantially complementary to the size and shape of the at least one registration post such that when the printed circuit board is mounted on the heat sink, the printed circuit board is automatically registered with respect to the at least one light source on the light source landing zone.
-a headlamp, wherein the primary lighting function is a low-beam or high-beam headlamp function and the auxiliary lighting function is a daytime running lamp function.
A headlamp, wherein the lamp assembly performs an auxiliary lighting function.
-a lamp assembly, wherein the at least one light source and the printed circuit board are unsealed with respect to the environment and are sealed with respect to the environment after the lamp assembly is mounted in the headlamp
These and other objects and advantages of the present invention will become apparent from the following description, the accompanying drawings and the appended claims.
Drawings
FIG. 1 illustrates a view of a lamp assembly according to one embodiment positioned within a head lamp;
FIG. 2 shows an exploded view of the lamp assembly shown in FIG. 1;
FIG. 3 is a perspective view of a heat sink showing at least one or more LEDs mounted on an LED landing zone;
FIG. 4 is a perspective view similar to FIG. 3, showing a circuit board mounted in proximity to at least one or more LEDs;
FIG. 5 shows a perspective view of the lamp assembly in an assembled form;
FIG. 6 shows a plan view of the lamp assembly in assembled form;
FIG. 7 shows another perspective view of the lamp assembly in assembled form and showing the female connector protection device;
FIG. 8 shows a right side view of the lamp assembly;
FIG. 9 shows a side view of a lamp assembly; and
fig. 10 shows a left side view of the lamp assembly.
Detailed Description
Referring now to FIG. 1, a lamp assembly 10 is shown installed in a headlamp assembly 12 of a vehicle V. The head lamp assembly 12 includes a frame or housing 12a, a lens 12b, and a seal 12c, the seal 12c generally sealing the lamp assembly 10 within the head lamp assembly 12. The lamp assembly 10 includes a heat sink 14, the heat sink 14 being stamped from a single sheet of material (not shown) and configured as shown in the exploded view of fig. 2. The heat sink 14 is a unitary, unitary or monolithic structure and is machined or folded to include a first wall 14a, a second wall 14b (fig. 3) generally opposite the first wall 14a, a first end wall 14c and a second end wall 14d generally opposite the first end wall 14c, as shown in fig. 2. Note that the heat sink 14 includes a crescent or half moon shaped landing pad or landing zone 16 adapted to receive a light source 18, which light source 18 may include at least one or more Light Emitting Diodes (LEDs) 20. In the figure, at least one LED 20 is mounted on a landing pad or zone 16 using a conventional adhesive. It should be understood that the heat sink 14 may be coated or treated, such as by anodizing the heat sink 14, to facilitate heat transfer from the light source 18 to the heat sink 14. However, it is preferred that the landing pad or zone 16 does not have any coating in order to improve the adhesion of the at least one LED 20 to the landing pad or zone 16. In one embodiment, after anodizing the heat sink 14, the landing pads or areas 16 are laser ablated to facilitate adhering the at least one LED 20 to the heat sink.
The heat sink 14 includes a plurality of registration posts 24. The thermal paste 26 includes a plurality of walls 26a, the plurality of walls 26a defining a plurality of apertures 28, the plurality of apertures 28 receiving the posts 24 and registering the thermal paste 26 on a printed circuit board landing area (fig. 2) on the heat sink 14 and in operative relationship with the landing pad or area 16. It should be understood that the thermal paste 26 adheres the printed circuit board 30 to the heat sink 14 and also provides thermal conduction between the printed circuit board 30 and the heat sink 14. A Printed Circuit Board (PCB)30 is mounted to the printed circuit board landing area 27 by a thermally conductive paste 26. The printed circuit board 30 controls the operation of the light source 18 and the at least one LED 20. As shown, the printed circuit board 30 is mounted on the thermal paste 26. In this regard, as shown in fig. 2 and 5, note that printed circuit board 30 includes a plurality of holes 32, which holes 32 receive registration posts 24, which results in automatic registration of printed circuit board 30 relative to landing pad or zone 16.
As shown in fig. 4, the printed circuit board 30 includes a female connector 35 (fig. 4 and 8) coupled to a power source (not shown) of the vehicle V. The printed circuit board 30 also includes a plurality of vias or conductors 38 for coupling to the light sources 18. A plurality of electrical conductors 42 electrically couple the printed circuit board 30 to the light sources 18.
Returning to fig. 2, note that the lamp assembly 10 includes a light pipe 44 having a plurality of projections 46, the projections 46 being received in apertures 48 in the heat sink 14. In the depicted figures, the protrusions 46 of the light pipe 44 are frusto-conical in cross-section so that they are easily received in the apertures 48 and, when press-fit, the input face 50 of the light pipe 44 is automatically registered a predetermined distance relative to the light source 18.
As shown in fig. 2 and 5, the bracket 52 is mounted on the heat sink 14 and engages a surface or shoulder 56 of the light pipe 44 to retain it in a locked or fixed position in the lamp assembly 10. During assembly, the outlet face 44a (fig. 2, 5, 7 and 9) of the light pipe 44 is guided through the aperture 53 of the bracket 52. The bracket 52 includes a plurality of resilient arms 55 having ends, such as end 55a (fig. 6), that engage the shoulder 56 (fig. 2) and hold it in a locked position on the heat sink 14.
After the lamp assembly 10 is assembled, the lamp assembly 10 is installed in a head lamp assembly 12, the head lamp assembly 12 being sealed from the weather and debris. Advantageously, a smaller heat sink 14 can be used since the light source 18 is mounted directly on the heat sink 14, rather than on the printed circuit board 30 as in the prior art. By reducing the overall size of the heat sink 14, the lamp assembly 10 is adapted to be mounted within the head lamp assembly 12, rather than on a housing (not shown) on which the head lamp assembly 12 is mounted. By doing so, the inventors have eliminated the need for a sealed heat sink as in the prior art. Note that the printed circuit board 30 and the at least one light source 20 are not sealed to the heat sink 14, as opposed to the prior art.
Another advantageous feature of the folded or processed heat sink 14 is that the heat sink 14 is adapted to include walls 14c and 14d that protect the printed circuit board 30 and the light source 18 and the electrical conductors 42. In the figures, the light source 18 and the at least one or more LEDs 20 comprise at least one LED, such as a high power LED, an organic light emitting diode, a laser diode, a filament, an arc lamp, or the like. It should be understood that the LED may emit white light, yellow light from a DRL/stop light, or amber light from a turn signal indicator light.
Other considerations
Advantageously, the lamp assembly 10 is particularly suited for use in a Daytime Running Light (DRL) environment.
The lamp assembly may have at least two LEDs cooperating with the light guide, one for Daytime Running Lights (DRLs) and one for turn indicator lights. In addition, the LED for daytime running lights may be dimmed to obtain a stop or position light
As previously described, the heat spreader 14 is coated or treated, such as by anodization, e.g., using a dark or black coating, in addition to the landing pad or zone 16 to promote heat transfer and dissipation. The landing pads or regions 16 are uncoated or coating is removed (e.g., by laser ablation) to enhance adhesion between the light source 18 and the heat sink 14.
By separating the mounting of the light source 18 from the printed circuit board 30 and providing the other features described herein, the lamp assembly 10 is dimensioned and dimensioned to be mounted directly inside the headlamp assembly 12, the headlamp assembly 12 itself being sealed, and thus the lamp assembly 10 does not require a heat sink housing, cover, seal, etc. of the type used in the prior art.
The present invention, including all embodiments shown and described herein, may be used alone or together and/or in combination with one or more features encompassed by one or more claims shown and described herein, including but not limited to features or steps set forth in one or more of the summary of the invention and the claims.
While the systems, devices and methods described herein constitute preferred embodiments of the invention, it is to be understood that the invention is not limited to such precise systems, devices and methods, and that changes may be made therein without departing from the scope of the invention as defined in the appended claims.
Claims (14)
1. A lamp assembly for mounting in a headlamp, the lamp assembly comprising:
a heat sink having a printed circuit board landing area for receiving a printed circuit board and a light source landing area for receiving at least one light source mounted directly to the light source landing area;
a light pipe; and
a holder for removably mounting on the heat sink, the holder being adapted to engage and secure the light guide in a predetermined position on the heat sink,
wherein the heat sink is a unitary or monolithic structure and is machined or folded to include a plurality of walls for protecting the printed circuit board, the at least one light source, and electrical connections between the printed circuit board and the at least one light source;
wherein the plurality of walls includes a first wall having at least one first wall aperture and a generally opposing second wall having at least one second wall aperture, the bracket includes at least one first resilient arm and at least one second resilient arm, each of the at least one first resilient arm and the at least one second resilient arm having a detent, the detent of the at least one first resilient arm adapted to be received in the at least one first wall aperture and the detent of the at least one second resilient arm adapted to be received in the at least one second wall aperture to secure or lock the bracket to the heat sink,
Wherein the lamp assembly is mounted in a sealed headlamp, an
Wherein the light pipe includes a protrusion and the heat sink includes at least one aperture adapted to receive the protrusion and position the input face of the light pipe in opposing relation to the at least one light source.
2. The lamp assembly of claim 1, wherein the at least one light source comprises at least one LED.
3. The lamp assembly of claim 1, wherein the heat sink comprises at least one wall.
4. The lamp assembly of claim 1, wherein the heat sink includes at least one registration post, the printed circuit board includes an aperture having a size and shape that is substantially complementary to the size and shape of the at least one registration post such that the printed circuit board is automatically registered with respect to the at least one light source on the light source landing zone when the printed circuit board is mounted on the heat sink.
5. The lamp assembly of claim 1, wherein the lamp assembly performs at least one of a primary lighting function or a secondary lighting function.
6. The lamp assembly of claim 5, wherein the auxiliary lighting function is a daytime running light function.
7. The lamp assembly of claim 1, wherein the at least one light source and the printed circuit board are unsealed from an environment and sealed from the environment after the lamp assembly is installed in the head lamp.
8. A headlamp, comprising:
a headlamp housing;
a primary light source for performing a primary lighting function;
a lamp assembly for performing an auxiliary lighting function, the lamp assembly being mounted in the headlamp housing; and
a lens and a seal for mounting on the headlamp housing;
the lamp assembly includes:
a heat sink having a printed circuit board landing area for receiving a printed circuit board and a light source landing area for receiving at least one light source mounted directly to the light source landing area;
a light pipe; and
a holder for detachably mounting on the heat sink, the holder being adapted to engage and secure the light guide in a predetermined position,
wherein the light pipe includes a protrusion and the heat sink includes at least one aperture adapted to receive the protrusion and position the input face of the light pipe in opposing relation to the at least one light source.
9. The headlamp of claim 8, wherein the at least one light source comprises at least one LED.
10. The headlamp of claim 8, wherein the heat sink comprises at least one wall for protecting the printed circuit board, the at least one light source, and an electrical connection therebetween.
11. The headlamp of claim 8 wherein the heat sink is a unitary or monolithic structure and is machined or folded to include a plurality of walls for protecting the printed circuit board, the at least one light source, and electrical connections therebetween.
12. The headlamp of claim 11, wherein the plurality of walls includes a first wall having at least one first wall aperture and a generally opposing second wall having at least one second wall aperture, the bracket includes at least one first resilient arm and at least one second resilient arm, each of the at least one first resilient arm and the at least one second resilient arm having a detent, the detent of the at least one first resilient arm adapted to be received in the at least one first wall aperture and the detent of the at least one second resilient arm adapted to be received in the at least one second wall aperture to secure or lock the bracket to the heat sink.
13. The headlamp of claim 8, wherein the heat sink includes at least one registration post and the printed circuit board includes an aperture having a size and shape that is substantially complementary to the size and shape of the at least one registration post such that when the printed circuit board is mounted on the heat sink, the printed circuit board is automatically registered with respect to the at least one light source on the light source landing zone.
14. The headlamp of claim 8 wherein the primary lighting function is a low beam or high beam headlamp function and the auxiliary lighting function is a daytime running lamp function.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/498,839 | 2017-04-27 | ||
| US15/498,839 US10190745B2 (en) | 2017-04-27 | 2017-04-27 | Lamp assembly for use in a headlamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108800032A CN108800032A (en) | 2018-11-13 |
| CN108800032B true CN108800032B (en) | 2022-07-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810391108.6A Active CN108800032B (en) | 2017-04-27 | 2018-04-26 | Lamp assembly for a headlamp |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10190745B2 (en) |
| EP (1) | EP3396239B1 (en) |
| CN (1) | CN108800032B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11708968B2 (en) * | 2021-05-07 | 2023-07-25 | Lumileds Llc | Two-part heatsink for LED module |
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| US10180247B1 (en) * | 2017-07-03 | 2019-01-15 | Valeo North America, Inc. | Device and method for placement of light source on a heat sink |
| IT201800010248A1 (en) * | 2018-11-12 | 2020-05-12 | Automotive Lighting Italia Spa | LIGHTING DEVICE FOR VEHICLES WITH LIGHT GUIDES |
| EP3745017B1 (en) * | 2019-05-29 | 2024-12-04 | ZKW Group GmbH | Lighting device for a motor vehicle headlight |
| KR102872982B1 (en) * | 2020-08-25 | 2025-10-17 | 현대모비스 주식회사 | Light source module and lamp for vehicle having the same |
| CN117677795B (en) * | 2021-05-19 | 2026-01-06 | 亮锐有限责任公司 | Radiator with protruding pin and manufacturing method |
| FR3126475B1 (en) * | 2021-08-31 | 2024-01-05 | Valeo Vision | Light emitting module including a support for dissipating heat |
| CN220108548U (en) * | 2023-05-29 | 2023-11-28 | 市光法雷奥(佛山)汽车照明系统有限公司 | Radiator, lighting device and motor vehicle |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10190745B2 (en) | 2019-01-29 |
| EP3396239B1 (en) | 2023-04-26 |
| US20180313516A1 (en) | 2018-11-01 |
| EP3396239A1 (en) | 2018-10-31 |
| CN108800032A (en) | 2018-11-13 |
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