CN108774488A - Organic silicon pressure sensitive adhesive and preparation method thereof, structure of composite membrane, vibrating diaphragm and sound-producing device - Google Patents
Organic silicon pressure sensitive adhesive and preparation method thereof, structure of composite membrane, vibrating diaphragm and sound-producing device Download PDFInfo
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- CN108774488A CN108774488A CN201810695211.XA CN201810695211A CN108774488A CN 108774488 A CN108774488 A CN 108774488A CN 201810695211 A CN201810695211 A CN 201810695211A CN 108774488 A CN108774488 A CN 108774488A
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- sensitive adhesive
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- colloid
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention provide the preparation method of organic silicon pressure sensitive adhesive and organic silicon pressure sensitive adhesive a kind of, the structure of composite membrane using the organic silicon pressure sensitive adhesive, the vibrating diaphragm using the structure of composite membrane and application vibrating diaphragm sound-producing device.By weight, the making raw material of the organic silicon pressure sensitive adhesive includes：5~55 parts of 20~80 parts of organic siliconresin, 0.1~5 part of catalyst, 30~90 parts of organic solvent and organic silicon rubber.The present invention has preferable high temperature resistance using the vibrating diaphragm of the organic silicon pressure sensitive adhesive so that the vibrating diaphragm is not in polarization phenomena in vibration, so that the sound-producing device using the vibrating diaphragm has preferable sound quality and audition stability.
Description
Technical field
The present invention relates to sound-producing device technical field more particularly to a kind of organic silicon pressure sensitive adhesive, the organic silicon are pressure-sensitive
The preparation method of glue, the structure of composite membrane using the organic silicon pressure sensitive adhesive, the vibrating diaphragm using the structure of composite membrane and application should
The sound-producing device of vibrating diaphragm.
Background technology
Vibrating diaphragm is the core component of sound-producing device.Acrylics pressure sensitive adhesive has preferable damping capacity, in order to make to shake
There is film preferable damping capacity, generally use acrylics pressure sensitive adhesive to make the damping glue-line of vibrating diaphragm.However, due to third
Olefin(e) acid lipid pressure sensitive adhesive contains ester group isopolarity group, causes the high temperature resistance of the damping glue-line poor, increases in input voltage
Added-time, the rigidity and damping capacity of the damping glue-line decline, and cause vibrating diaphragm to be polarized in vibration processes, and then lead to sounding
The sound quality and audition stability of device are poor.
Invention content
In view of the above problems, the present invention provides a kind of organic silicon pressure sensitive adhesives, it is intended to make pressure-sensitive using the organic silicon
The vibrating diaphragm of glue has preferable high temperature resistance so that and the vibrating diaphragm is not in polarization phenomena in vibration, so that using
The sound-producing device of the vibrating diaphragm has preferable sound quality and audition stability.
In order to solve the above technical problems, by weight, the making raw material of organic silicon pressure sensitive adhesive provided by the invention includes：
20~80 parts of organic siliconresin；
0.1~5 part of catalyst；
5~55 parts of organic silicon rubber；And
30~90 parts of organic solvent.
Further, the organic siliconresin includes M chain links and Q chain links, which isThe Q chain links areThe quantity ratio of the M chain links and Q chain links is 1:0.6~0.9, wherein R1For methyl, hydrogen-based or vinyl, m
Ranging from 15~20.
Further, the structural formula of the organic silicon rubber isWherein,
R2For methyl, vinyl or phenyl, ranging from the 5000~10000 of n.
Further, the mass ratio of the organic siliconresin and organic silicon rubber is ranging from：1:1~15:1.
Further, by weight, the raw material further includes 0~5 part of crosslinking agent, which is containing hydrogen silicone oil, organic
Peroxide or alkoxy silane；And/or
By weight, the raw material further includes 0~5 part of reaction suppressor, which is alkynol compound, nitrogenous
Compound and at least one of vinyl compound；And/or
The organic solvent is at least one in benzene, toluene, ethyl acetate, dimethylbenzene, N-Methyl pyrrolidone and butanone
Kind；And/or
The catalyst is the organic complex or organo-tin compound of platinum.
The present invention also provides a kind of preparation methods of organic silicon pressure sensitive adhesive, include the following steps：
By weight, 30~90 parts of 20~80 parts of organic siliconresin, 5~55 parts of organic silicon rubber and organic solvent are mixed,
Obtain mixture；
0.1~5 part of catalyst is provided, catalyst is added into mixture, has the mixture of catalyst to carry out addition
Heat treatment obtains colloid；And
The colloid is dried, organic silicon pressure sensitive adhesive is obtained.
Further, further comprising the steps of before drying the colloid after the acquisition colloid：
By weight, 0~5 part of crosslinking agent is provided；And
The crosslinking agent is added into the colloid.
It is further comprising the steps of before drying the colloid after the acquisition colloid：
By weight, 0~5 part of reaction suppressor is provided；And
The reaction suppressor is added into the colloid.
The present invention also provides a kind of structure of composite membrane, the structure of composite membrane includes two layers of the first base material layer and at least one
Layer pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer are located between two layers of the first base material layer, and the material of the pressure-sensitive adhesive layer is the pressure sensitive adhesive.
Further, the material of the first base material layer is polyether-ether-ketone, polyetherimide, polyphenylene oxide or poly- naphthalenedicarboxylic acid
Glycol ester；And/or
Ranging from 2~40 μm of the thickness of the first base material layer；And/or
Ranging from 2~40 μm of the thickness of the pressure-sensitive adhesive layer.
Further, the structure of composite membrane includes two layers of the first base material layer and two layers of pressure-sensitive adhesive layer, the composite membrane knot
Structure further includes one second substrate layer, which includes the first surface and second surface being oppositely arranged, wherein one is pressure-sensitive
Glue-line is located between the first surface of the second substrate layer and a first base material layer, and another pressure-sensitive adhesive layer is located in the second substrate layer
Second surface and another the first base material layer between.
Further, the material of second substrate layer is polyethylene terephthalate or non-woven fabrics；And/or
Ranging from 1~30 μm of the thickness of second substrate layer.
The present invention also provides a kind of vibrating diaphragm, the vibrating diaphragm has the structure of composite membrane.
The present invention also provides a kind of sound-producing device, the sound-producing device includes the vibrating diaphragm.
By weight, the making raw material of the organic silicon pressure sensitive adhesive of technical solution of the present invention includes：Organic siliconresin 20~
80 parts, 30~90 parts of organic solvent, 0.1~5 part of catalyst and 5~55 parts of organic silicon rubber, organic silicon rubber and organosilicon tree
Condensation reaction can occur between fat, also occur that cross-linking reaction, catalyst accelerate reaction speed between organic silicon rubber, to raw
At the organic silicon pressure sensitive adhesive of tridimensional network, which can make the organic silicon pressure sensitive adhesive have fine and close knot
Structure, so that organic silicon pressure sensitive adhesive has preferable high temperature resistance, and organic siliconresin has molecular weight greatly and modulus is big
The advantages of, organic siliconresin is set as 20~80 parts, so that organic silicon pressure sensitive adhesive also has preferable compactness, bonding
Property, organic silicon rubber is set as 5~55 parts, to improve film forming, caking property and the resilience of organic silicon pressure sensitive adhesive so that
Be not in polarization phenomena in vibration processes using the vibrating diaphragm of the organic silicon pressure sensitive adhesive, so that using the hair of the vibrating diaphragm
Acoustic device has preferable sound quality and audition stability.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the sectional view of structure of composite membrane first embodiment of the present invention.
Fig. 2 is the sectional view of structure of composite membrane second embodiment of the present invention.
Fig. 3 is the sectional view of one embodiment of vibrating diaphragm of the present invention.
Drawing reference numeral explanation：
| Label | Title | Label | Title |
| 100 | Structure of composite membrane | 53 | Second surface |
| 10 | The first base material layer | 200 | Vibrating diaphragm |
| 30 | Pressure-sensitive adhesive layer | 21 | Ring portion |
| 50 | Second substrate layer | 23 | Top dome portion |
| 51 | First surface |
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained without creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining relative position relation, motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
It should also be noted that, when element is referred to as on " being fixed on " or " being set to " another element, it can be straight
It is connected on another element or may be simultaneously present centering elements.When an element is known as " connection " another element,
It can be directly connected to another element or may be simultaneously present centering elements.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and should not be understood as referring to
Show or imply its relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " are defined as a result,
Two " feature can explicitly or implicitly include at least one of the features.In addition, the technical solution between each embodiment can
To be combined with each other, but must can be implemented as basis with those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or cannot achieve when, will be understood that the combination of this technical solution is not present, also not the present invention claims protection model
Within enclosing.
By weight, the present invention provides a kind of making raw material of organic silicon pressure sensitive adhesive and includes：
20~80 parts of organic siliconresin；
0.1~5 part of catalyst；
5~55 parts of organic silicon rubber；And
30~90 parts of organic solvent.
Catalyst is the organic complex or organo-tin compound of platinum.
The main function of catalyst is to speed up reaction speed, the condensation that can be catalyzed between organic silicon rubber and organic siliconresin
Reaction.
A concentration of 1~100ul/L of the organic complex of platinum.The organic complex of platinum can be the molten of chloroplatinic acid polysiloxanes
At least one of liquid, chloroplatinic acid isopropanol complex and chloroplatinic acid diethyl phthalate complex compound.
Organic tin compound be selected from dibutyl tin dilaurate, tin dilaurate dioctyl tin, dibutyltin diacetate and
At least one of stannous octoate.
Organic solvent is at least one of benzene, toluene, ethyl acetate, dimethylbenzene, N-Methyl pyrrolidone and butanone.Have
Machine silicones and organic silicon rubber may be dissolved in the organic solvent, uniformly to mix.
By weight, the making raw material of the organic silicon pressure sensitive adhesive of technical solution of the present invention includes：Organic siliconresin 20~
80 parts, 30~90 parts of organic solvent, 0.1~5 part of catalyst and 5~55 parts of organic silicon rubber, organic silicon rubber and organosilicon tree
Condensation reaction can occur between fat, also occur that cross-linking reaction, catalyst accelerate reaction speed between organic silicon rubber, to raw
At the organic silicon pressure sensitive adhesive of tridimensional network, which can make the organic silicon pressure sensitive adhesive have fine and close knot
Structure, so that organic silicon pressure sensitive adhesive has preferable high temperature resistance, and organic siliconresin has molecular weight greatly and modulus is big
The advantages of, organic siliconresin is set as 20~80 parts, so that organic silicon pressure sensitive adhesive also has preferable compactness, bonding
Property, organic silicon rubber is set as 5~55 parts, to improve film forming, caking property and the resilience of organic silicon pressure sensitive adhesive so that
Be not in polarization phenomena in vibration processes using the vibrating diaphragm of the organic silicon pressure sensitive adhesive, so that using the hair of the vibrating diaphragm
Acoustic device has preferable sound quality and audition stability.
The organic silicon pressure sensitive adhesive of the present invention has higher damping and amortization, fissipation factor >=0.5.
It is sticky preferable that there is the organic silicon pressure sensitive adhesive of the present invention high temperature to hold, under 150 DEG C of test environment, when falling off
Between be more than 1 hour.
Organic siliconresin includes M chain links and Q chain links, which isThe Q chain links are
Wherein, R1For methyl, hydrogen-based or vinyl, ranging from the 15~20 of m.
The quantity of M chain links and Q chain links ratio is 1:0.6~0.9.
The compatibility to organic silicon rubber can be improved in the M chain links of organic siliconresin, and plays tackifying effect, and Q chain links, which have, to be mended
Use is pretended, the cohesive strength of organic silicon pressure sensitive adhesive obtained can be improved.It is organic when the small number of M chain links and Q chain links
The compatibility of silicones and organic silicon rubber is poor, and when the quantity of M chain links and Q chain links is bigger, organic silicon pressure obtained
The cohesive strength of quick glue is poor.The M chain links of technical solution of the present invention and the quantity ratio of Q chain links are set as 1:0.6~0.9, not only
It can make the organic siliconresin that there is preferable compatibility with organic silicon rubber, so that organic silicon pressure sensitive adhesive obtained has well
Comprehensive performance and high solids content, can also make organic silicon pressure sensitive adhesive obtained that there is preferably elasticity and cohesive strength.
R in M chain links1For methyl, hydrogen-based or vinyl, hydrogen-based and vinyl can be used for being condensed with organic silicon rubber
Reaction.
It should be understood that m can be 15,16,17,18,19 or 20 in Q chain links.
The numerical value of m represents the content of hydroxyl in Q chain links, and it is anti-with organic silicon rubber that the content of hydroxyl can influence organic siliconresin
The degree answered, and organic silicon pressure sensitive adhesive characteristic is influenced, such as adhesion strength and adhesive strength.The numerical value of m in the Q chain links of the present invention
Ranging from 15~20 so that organic silicon pressure sensitive adhesive, which is made, has preferable adhesion strength and adhesion strength.
The structural formula of organic silicon rubber isWherein, R2For methyl, vinyl,
Or phenyl, ranging from the 5000~10000 of n.Phenyl can increase the heat resistance of organic silicon pressure sensitive adhesive, and vinyl can be with other
Group crosslinks reaction.
Organic silicon rubber of the present invention has using hydroxyl as the linear structure of end group, and hydroxyl can be condensed with organic siliconresin
Reaction.
Ranging from the 5000~10000 of organic silicon rubber n so that the molecular weight of the organic silicon rubber is moderate so that be made
Organic silicon pressure sensitive adhesive have preferable flexibility, cohesive strength, low mobility, viscosity is good, solid content is high.
In an embodiment of the present invention, organic silicon rubber is methylhydroxy silicon rubber, vinylsiloxane rubber or phenyl silicon rubber
Glue.
The mass ratio of organic siliconresin and organic silicon rubber is ranging from：1:1~15:1.
It should be understood that the mass ratio of organic siliconresin and organic silicon rubber is：1:1,2:1,3:1,4:1,5:1,6:1,
7:1,8:1,9:1,10:1,11:1,12:1,13:1,14:1 or 15:1 etc..
The range of the organic siliconresin of technical solution of the present invention and the mass ratio of organic silicon rubber is set as 1:1~15:1,
So that organic silicon pressure sensitive adhesive obtained has preferable tack and holds viscosity.
By weight, raw material further includes 0~5 part of crosslinking agent.The crosslinking agent is containing hydrogen silicone oil, organic peroxide or alkane
Oxysilane.
The effect of the crosslinking agent is to increase the cohesive force of organic silicon pressure sensitive adhesive.
Containing hydrogen silicone oil refers to the silicone oil containing S-H keys.It should be understood that organic silicon rubber can also be handed over containing hydrogen silicone oil
Connection reaction.
Organic peroxide can be benzoyl peroxide, tert-butyl hydroperoxide, cumyl peroxide, 2,4 dichloro benzene
Formyl, 2,5- dimethyl -2,5- two (t-butylperoxy) hexane, two-(t-butylperoxyisopropyl) benzene etc..
Alkoxy silane can be epoxy silane, tetramethoxy-silicane, octyl trimethoxy silane, two tert-butoxy diacetyl
Oxysilane, methoxy silane, 3- (the third oxygen of 2,3- epoxies) propyl trimethoxy silicane, methyl triacetyl oxygen oximino silane, first
In base trimethoxy silane, vinyltrimethoxysilane, Ethoxysilane, npropoxysilane and butoxy silane at least
It is a kind of etc..
By weight, raw material further includes 0~5 part of reaction suppressor.
The reaction suppressor is alkynol compound, contains at least one of nitrogen compound and vinyl compound.
Reaction suppressor can slowed down reaction speed so that pressure sensitive adhesive storage period extend.
Alkynol compound can be ethynylcyclohexanol, 2- methyl -3- butyne-2-alcohols, 3-Phenyl-1-butyn-3-ol, 3- third
At least one of base -1- butine -3- alcohol.
Can be at least one of quinoline, methylhydrazine and phenylhydrazine containing nitrogen compound.
Vinyl compound can be perchloroethylene and/or tetravinyl tetramethyl-ring tetrasiloxane.
It should be noted that for above-mentioned organic siliconresin, catalyst, organic silicon rubber, organic solvent, crosslinking agent and
Reaction suppressor, can also be other materials, and the present invention is without limitation.
The present invention also provides a kind of preparation methods of organic silicon pressure sensitive adhesive, include the following steps：
By weight, 20~80 parts of organic siliconresins, 5~55 parts of organic silicon rubbers and 30~90 parts of organic solvents are mixed,
Obtain mixture；
0.1~5 part of catalyst is provided, catalyst is added into mixture, has the mixture of catalyst to carry out addition
Heat treatment obtains colloid；And
Colloid is dried, organic silicon pressure sensitive adhesive is obtained.
In an embodiment of the present invention, organic silicon rubber is methylhydroxy silicon rubber, vinylsiloxane rubber or phenyl silicon rubber
Glue.
Organic solvent is at least one of benzene, toluene, ethyl acetate, dimethylbenzene, N-Methyl pyrrolidone and butanone.Have
Machine silicones and organic silicon rubber may be dissolved in the organic solvent, uniformly to mix.
The catalyst is the organic complex or organo-tin compound of platinum.
The main function of catalyst is to speed up reaction speed, the condensation that can be catalyzed between organic silicon rubber and organic siliconresin
Reaction.
A concentration of 1~100ul/L of the organic complex of platinum.The organic complex of platinum can be the molten of chloroplatinic acid polysiloxanes
At least one of liquid, chloroplatinic acid isopropanol complex, chloroplatinic acid diethyl phthalate complex compound.
Organic tin compound be selected from dibutyl tin dilaurate, tin dilaurate dioctyl tin, dibutyltin diacetate and
At least one of stannous octoate.
It should be understood that when thering is the mixture of catalyst to heat addition, the temperature model of the heat treatment
It is 70~90 DEG C to enclose, and the reaction time is 50~70min, so as to which condensation reaction occurs between organic silicon rubber and organic siliconresin.
In an embodiment of the present invention, above-mentioned steps dry colloid, obtain organic silicon pressure sensitive adhesive and include：It can be by the colloid
It is coated on a base material, then drying and processing is carried out to the colloid.The material of the base material can be plastics, non-woven fabrics or release film.It should
Plastics can be thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, thermoplastic polyamide elastomer, elastomer silicone,
Polyether-ether-ketone, polyarylate, polyetherimide, polyimides, polyphenylene sulfide, polyethylene naphthalate, poly terephthalic acid
At least one of glycol ester and polybutylene terephthalate (PBT).
In an embodiment of the present invention, the processing for drying colloid includes first time drying and processing and second of drying and processing,
The temperature range of the first time drying and processing is 60~120 DEG C, and the reaction time is 2~3min, organic molten in colloid to remove
The temperature range of agent, second of drying and processing is 80~160 DEG C, and the reaction time is 2~3min, to cure the colloid, is formed
Organic silicon pressure sensitive adhesive.
It can be condensed between organic silicon rubber and organic siliconresin during the heat treatment of technical solution of the present invention
Reaction, it also occur that cross-linking reaction, catalyst accelerate reaction speed between organic silicon rubber during second of drying and processing
Degree, to generate the organic silicon pressure sensitive adhesive of tridimensional network, which can be such that the organic silicon pressure sensitive adhesive has
There is fine and close structure, so that organic silicon pressure sensitive adhesive has preferable high temperature resistance, and organic siliconresin has molecular weight
Big and big modulus advantage, 20~80 parts are set as by organic siliconresin, are preferably caused so that organic silicon pressure sensitive adhesive also has
Organic silicon rubber is set as 5~55 parts by close property, caking property, to improve the film forming of organic silicon pressure sensitive adhesive, caking property and return
Elasticity so that using the vibrating diaphragm of the organic silicon pressure sensitive adhesive be not in polarization phenomena in vibration processes, so that using
The sound-producing device of the vibrating diaphragm has preferable sound quality and audition stability.
It is further comprising the steps of before drying colloid after obtaining colloid：
By weight, 0~5 part of crosslinking agent is provided；And
The crosslinking agent is added into the colloid.
The crosslinking agent is containing hydrogen silicone oil, organic peroxide or alkoxy silane.
The effect of the crosslinking agent is that reaction is crosslinked between making organic silicon rubber, increases the cohesion of organic silicon pressure sensitive adhesive
Power.
Containing hydrogen silicone oil refers to the silicone oil containing S-H keys.It should be understood that organic silicon rubber can also be handed over containing hydrogen silicone oil
Connection reaction.
Organic peroxide can be benzoyl peroxide, tert-butyl hydroperoxide, cumyl peroxide, 2,4 dichloro benzene
Formyl, 2,5- dimethyl -2,5- two (t-butylperoxy) hexane, two-(t-butylperoxyisopropyl) benzene etc..
Alkoxy silane can be epoxy silane, tetramethoxy-silicane, octyl trimethoxy silane, two tert-butoxy diacetyl
Oxysilane, methoxy silane, 3- (the third oxygen of 2,3- epoxies) propyl trimethoxy silicane, methyl triacetyl oxygen oximino silane, first
In base trimethoxy silane, vinyltrimethoxysilane, Ethoxysilane, npropoxysilane and butoxy silane at least
It is a kind of etc..
It is further comprising the steps of before drying colloid after obtaining colloid：
By weight, 0~5 part of reaction suppressor is provided；And
The reaction suppressor is added into the colloid.
The reaction suppressor is alkynol compound, contains at least one of nitrogen compound and vinyl compound.
Reaction suppressor can slowed down reaction speed so that pressure sensitive adhesive storage period extend.
Alkynol compound can be ethynylcyclohexanol, 2- methyl -3- butyne-2-alcohols, 3-Phenyl-1-butyn-3-ol and 3-
At least one of propyl -1- butine -3- alcohol.
Can be at least one of quinoline, methylhydrazine and phenylhydrazine containing nitrogen compound.
Vinyl compound can be perchloroethylene and/or tetravinyl tetramethyl-ring tetrasiloxane.
Join Fig. 1-2, the present invention also provides a kind of structure of composite membrane 100.
Structure of composite membrane 100 includes two layers of the first base material layer 10 and at least one layer of pressure-sensitive adhesive layer 30, the pressure-sensitive adhesive layer 30 folder
Between two layers of the first base material layer 10, at least one layer in above-mentioned the first base material layer 10 is plastic basis material layer, the pressure sensitive adhesive
Layer 30 is the organic silicon pressure sensitive adhesive described in above-described embodiment.
Since the structure of composite membrane 100 uses whole technical solutions of above-mentioned all embodiments, at least have upper
All advantageous effects caused by the technical solution of embodiment are stated, this is no longer going to repeat them.
The material of the plastic basis material layer is polyether-ether-ketone, polyetherimide, polyphenylene oxide or polyethylene naphthalate.
Ranging from 2~40 μm of the thickness of the first base material layer 10.
Optionally, the thickness of the first base material layer 10 be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm,
12μm、13μm、14μm、15μm、16μm、17μm、18μm、19μm、20μm、21μm、22μm、23μm、24μm、25μm、26μm、27
μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm or 40 μm.
It should be understood that identical material can be selected in two layers of the first base material layer 10, different materials also can be selected.
At least one layer in the first base material layer 10 of technical solution of the present invention is plastic basis material layer, and the material of plastic basis material layer
Matter is polyether-ether-ketone, polyetherimide, polyphenylene oxide or polyethylene naphthalate so that in the first base material layer 10 extremely
Few one layer of softening temperature is more than 80 DEG C, has good heat-resisting quantity, and the thickness of the first base material layer 10 is 2~20 μm, is made
The structure of composite membrane 100 not only has preferable intensity and resilience, also there is excellent structural stability and preferably resistance to
It is high temperatures.
Ranging from 2~40 μm of the thickness of pressure-sensitive adhesive layer 30.
Optionally, the thickness of pressure-sensitive adhesive layer 30 be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12
μm、13μm、14μm、15μm、16μm、17μm、18μm、19μm、20μm、21μm、22μm、23μm、24μm、25μm、26μm、27μ
M, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, 35 μm, 36 μm, 37 μm, 38 μm, 39 μm or 40 μm.
Ranging from 2~40 μm of the thickness of the pressure-sensitive adhesive layer 30 of technical solution of the present invention so that using pressure-sensitive adhesive layer 30
Structure of composite membrane 100 have preferable high-temperature stability, even if when input voltage increases, the rigidity of structure of composite membrane 100 with
Damping capacity will not be decreased obviously.
Further, above-mentioned two layers of substrate layer 10 is plastic basis material layer.At this point, structure of composite membrane 100 is to stack gradually
The first plastic basis material layer, the first pressure-sensitive adhesive layer and the second plastic basis material layer.And first thermoplastic materials substrate layer and the second plastics base
The material of material interlayer can it is identical can not also be identical.
Optionally, the first plastic basis material layer is identical as the material of the second plastic basis material layer, such as is polyether-ether-ketone.This
When, structure of composite membrane is the polyether-ether-ketone stacked gradually, acrylic pressure-sensitive adhesivee and polyether-ether-ketone structure.Wherein, organic silicon
Pressure sensitive adhesive is the organic silicon pressure sensitive adhesive described in above-described embodiment.
Further, structure of composite membrane 100 includes two layers of pressure-sensitive adhesive layer 30, and structure of composite membrane 100 further includes one second base
Material layer 50, which includes the first surface 51 being oppositely arranged and second surface 50, wherein a pressure-sensitive adhesive layer 30 presss from both sides
Between the first surface 51 and a first base material layer 10 of the second substrate layer 50, another pressure-sensitive adhesive layer 30 is located in the second base material
Between the second surface 53 and another the first base material layer 10 of layer 50.An at least pressure-sensitive adhesive layer in above-mentioned two layers of pressure-sensitive adhesive layer is upper
The organic silicon pressure-sensitive adhesive layer described in embodiment is stated, another pressure-sensitive adhesive layer may be the organic silicon pressure described in above-described embodiment
Quick glue-line can also be the pressure-sensitive adhesive layer of other materials, for example, acrylic compounds glue-line, the present invention is without limitation.
The material of second substrate layer 50 is thermoplastic elastomer (TPE) or engineering plastics.Wherein, thermoplastic elastomer (TPE) is selected from thermoplastic
Property polyester elastomer, thermoplastic polyurethane elastomer, at least one of thermoplastic polyamide elastomer and elastomer silicone.
Engineering plastics be selected from polyether-ether-ketone, polyarylate, polyetherimide, polyimides, polyphenylene sulfide, polyethylene naphthalate,
At least one of polyethylene terephthalate and polybutylene terephthalate (PBT).
Can also be other materials it should be noted that being directed to 10 and second substrate layer 50 of above-mentioned the first base material layer, e.g.,
Non-woven fabrics, the present invention are without limitation.
Ranging from 1~30 μm of the thickness of second substrate layer 50.
Optionally, the thickness of the second substrate layer 50 be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm,
12μm、13μm、14μm、15μm、16μm、17μm、18μm、19μm、20μm、21μm、22μm、23μm、24μm、25μm、26μm、27
μm, 28 μm, 29 μm or 30 μm.
The structure of composite membrane 100 of technical solution of the present invention includes two layers of the first base material layer 10, two layers of pressure-sensitive adhesive layer 30 and one
Second substrate layer 50, wherein a pressure-sensitive adhesive layer 30 be located in the second substrate layer 50 first surface 51 and a first base material layer 10 it
Between, another pressure-sensitive adhesive layer 30 is located between the second surface 53 of the second substrate layer 50 and another the first base material layer 10, to increase
The deflection of the structure of composite membrane 100 and anti-polarization capacity.
Join Fig. 3, the present invention also provides a kind of vibrating diaphragms 200.
Vibrating diaphragm 200 has structure of composite membrane.
In an embodiment of the present invention, the overall thickness of vibrating diaphragm 200 is 6 μm~110 μm.
Since the vibrating diaphragm 200 uses whole technical solutions of above-mentioned all embodiments, at least there is above-mentioned implementation
All advantageous effects caused by the technical solution of example, this is no longer going to repeat them.
In addition, the first base material layer 10 provides required rigidity for the vibration of vibrating diaphragm 200, higher transient response is obtained.Pressure
Quick glue-line 30 has higher cohesive force so that the being consistent property of vibration of each layer of vibrating diaphragm 200.Moreover, pressure-sensitive adhesive layer 30
With preferable damping characteristic, the vibration balancing under large amplitude can be improved, inhibits polarization, so that vibrating diaphragm 200 is in high/low temperature
Under working environment, higher sound quality and audition stability are all had.
Vibrating diaphragm 200 includes an at least ring portion 21, which has structure of composite membrane 100.
Vibrating diaphragm 200 further includes top dome portion 23, which connect with ring portion 21.
In one embodiment of the invention, vibrating diaphragm 200 includes two ring portions 21.
In one embodiment of the invention, top dome portion 23 is integrally formed with ring portion 21.
In one embodiment of the invention, top dome portion 23 uses unlike material with ring portion 21.
In one embodiment of the invention, top dome portion 23 is located at the center of vibrating diaphragm 200, and ring portion 21 is located in vibrating diaphragm 200
The side of heart position, around the center of vibrating diaphragm 200.
The present invention is to provide a kind of sound-producing device (not shown).Sound-producing device includes the vibrating diaphragm 200.
Since the sound-producing device uses whole technical solutions of above-mentioned all embodiments, at least there is above-mentioned implementation
All advantageous effects caused by the technical solution of example, this is no longer going to repeat them.
In one embodiment of the invention, sound-producing device further includes voice coil (not shown), vibrating diaphragm 200 and voice coil strong bond, with
Promote the performance of vibrating diaphragm 200.
The preparation method of the organic silicon pressure sensitive adhesive of the present invention includes following embodiment：
Embodiment one：
By weight, 5 parts of methylhydroxy silicon rubber, 20 parts of organic siliconresins, 30 parts of benzene are provided, by methylhydroxy silicon rubber
It is dissolved in benzene with organic siliconresin, obtains mixture.Wherein, the mass ratio of methylhydroxy silicon rubber and organic siliconresin is 1:
4, the quantity of M chain links and Q chain links ratio is 1 in organic siliconresin:0.7, R1For methyl, ranging from the 15 of m.
0.1 part of chloroplatinic acid isopropanol complex is provided, chloroplatinic acid isopropanol complex is added into mixture, to being added
There is the mixture of chloroplatinic acid isopropanol complex to be heated, obtains colloid.Wherein the temperature of the heat treatment is 80 DEG C,
Time is 70min, and chloroplatinic acid isopropanol complex can promote as catalyst between methylhydroxy silicon rubber and organic siliconresin
Condensation reaction occurs.
After colloid cooling, colloid is coated on release film.
First time drying and processing, to remove benzene, the first time drying and processing are carried out to the colloid being coated on release film
Temperature is 85 DEG C, time 2.3min.
Second of drying and processing is carried out to the colloid after first time drying and processing, obtains organic silicon pressure sensitive adhesive, this
The temperature of secondary drying processing is 160 DEG C, time 3min.
Embodiment two：
By weight, 15 parts of methylhydroxy silicon rubber, 30 parts of organic siliconresins, 54 parts of toluene are provided, by methylhydroxy silicon
Rubber and organic siliconresin are dissolved in toluene, obtain mixture.Wherein, the quality of methylhydroxy silicon rubber and organic siliconresin
Than being 1:2, the quantity of M chain links and Q chain links ratio is 1 in organic siliconresin:0.75, R1For hydrogen-based, ranging from the 17 of m.
0.5 part of dibutyl tin dilaurate is provided, dibutyl tin dilaurate is added into mixture, has two to addition
Butyl tin dilaurate tin heat, and obtains colloid.Wherein, the temperature of the heat treatment is 90 DEG C, and the time is
50min, dibutyl tin dilaurate can promote to be condensed between methylhydroxy silicon rubber and organic siliconresin as catalyst
Reaction.
After colloid cooling, 0.5 part of benzoyl peroxide is provided, benzoyl peroxide is added into colloid, stirring is equal
It is even.
It will be coated on polyether-ether-ketone base material added with the colloid of benzoyl peroxide, first time drying and processing carried out to it,
To remove toluene, the temperature of the first time drying and processing is 90 DEG C, time 2min.
Second of drying and processing is carried out to the colloid after first time drying and processing, colloid solidification obtains organic silicon pressure
The temperature of quick glue, second of drying and processing is 155 DEG C, time 2min.
Wherein, the cross-linking reaction that benzoyl peroxide can promote to occur between methylhydroxy silicon rubber as crosslinking agent.
Embodiment three：
By weight, 25 parts of vinylsiloxane rubbers, 40 parts of organic siliconresins, 32.3 parts of toluene are provided, by vinyl silicon rubber
Glue and organic siliconresin are dissolved in toluene, obtain mixture.Wherein, the mass ratio of vinylsiloxane rubber and organic siliconresin is
5:8, the quantity of M chain links and Q chain links ratio is 1 in organic siliconresin:0.7, R1For hydrogen-based, ranging from the 18 of m.
1 part of stannous octoate is provided, stannous octoate is added to mixture, has the mixture of stannous octoate to add addition
Heat treatment obtains colloid.Wherein, the temperature of the heat treatment is 80 DEG C, and time 60min, stannous octoate can as catalyst
Promote that condensation reaction occurs between vinylsiloxane rubber and organic siliconresin.
After colloid cooling, 0.1 part of ethynylcyclohexanol is provided, 2 parts of containing hydrogen silicone oils, 0.5 part of chloroplatinic acid polysiloxanes
Solution, by ethynylcyclohexanol, the solution of containing hydrogen silicone oil and chloroplatinic acid polysiloxanes is added into colloid, stirs evenly.
Will be added with ethynylcyclohexanol, the colloid of the solution of containing hydrogen silicone oil and chloroplatinic acid polysiloxanes is coated on polyetherimide
On amido material, first time drying and processing is carried out to it, to remove toluene, the temperature of the first time drying and processing is 80 DEG C, the time
For 2.5min.
Second of drying and processing is carried out to the colloid after first time drying and processing, colloid solidification obtains organic silicon pressure
The temperature of quick glue, second of drying and processing is 160 DEG C, time 2.5min.
Wherein, ethynylcyclohexanol as reaction suppressor can slowed down reaction speed, containing hydrogen silicone oil can promote as crosslinking agent
Into crosslinking reaction between vinylsiloxane rubber, meanwhile, which can also crosslink with vinylsiloxane rubber reacts.
The solution of chloroplatinic acid polysiloxanes can accelerate reaction speed as catalyst.
Example IV：
By weight, 30 parts of phenyl siloxane rubbers, 30 parts of organic siliconresins, 39 parts of ethyl acetate are provided, by phenyl siloxane rubber
It is dissolved in ethyl acetate with organic siliconresin, obtains mixture.Wherein, the mass ratio of phenyl siloxane rubber and organic siliconresin is
1:1, the quantity of M chain links and Q chain links ratio is 1 in organic siliconresin:0.8, R1 is hydrogen-based, ranging from the 20 of m.
0.5 part of dibutyl tin dilaurate is provided, dibutyl tin dilaurate is added to mixture, there are two fourths to addition
The mixture of base tin dilaurate tin is heated, and colloid is obtained.Wherein, the temperature of the heat treatment is 70 DEG C, and the time is
55min, dibutyl tin dilaurate can promote that condensation reaction occurs between phenyl siloxane rubber and organic siliconresin as catalyst.
After colloid cooling, 0.5 part of benzoyl peroxide is provided, benzoyl peroxide is added into colloid, stirring is equal
It is even.
It will be coated on polyphenylene oxide base material added with the colloid of benzoyl peroxide, first time drying and processing carried out to it, with
Ethyl acetate is removed, the temperature of the first time drying and processing is 70 DEG C, time 2.7min.
Second of drying and processing is carried out to the colloid after first time drying and processing, colloid solidification obtains organic silicon pressure
The temperature of quick glue, second of drying and processing is 160 DEG C, time 2.6min.
Wherein, the cross-linking reaction that benzoyl peroxide can promote to occur between methylhydroxy silicon rubber as crosslinking agent.
It these are only the preferred embodiment of the present invention, be not intended to limit the scope of the invention, it is every in the present invention
Inventive concept under, using equivalent structure transformation made by description of the invention and accompanying drawing content, be applied directly or indirectly in
Other related technical areas are included in the scope of patent protection of the present invention.
Claims (14)
1. a kind of organic silicon pressure sensitive adhesive, which is characterized in that by weight, the making raw material packet of the organic silicon pressure sensitive adhesive
It includes：
20~80 parts of organic siliconresin；
0.1~5 part of catalyst；
5~55 parts of organic silicon rubber；And
30~90 parts of organic solvent.
2. organic silicon pressure sensitive adhesive as described in claim 1, which is characterized in that the organic siliconresin includes M chain links and Q chains
Section, the M chain links areThe Q chain links areThe quantity ratio of the M chain links and Q chain links is 1:0.6
~0.9, wherein R1For methyl, hydrogen-based or vinyl, ranging from the 15~20 of m.
3. organic silicon pressure sensitive adhesive as described in claim 1, which is characterized in that the structural formula of the organic silicon rubber isWherein, R2For methyl, vinyl or phenyl, ranging from the 5000~10000 of n.
4. organic silicon pressure sensitive adhesive as described in claim 1, which is characterized in that the organic siliconresin and organic silicon rubber
Mass ratio is ranging from：1:1~15:1.
5. such as Claims 1-4 any one of them organic silicon pressure sensitive adhesive, which is characterized in that by weight, the raw material is also
Including 0~5 part of crosslinking agent, which is containing hydrogen silicone oil, organic peroxide or alkoxy silane；And/or
By weight, the raw material further includes 0~5 part of reaction suppressor, which is alkynol compound, nitrogenous change
Close at least one of object and vinyl compound；And/or
The organic solvent is at least one of benzene, toluene, ethyl acetate, dimethylbenzene, N-Methyl pyrrolidone and butanone；
And/or
The catalyst is the organic complex or organo-tin compound of platinum.
6. a kind of preparation method of organic silicon pressure sensitive adhesive, includes the following steps：
By weight, 30~90 parts of 20~80 parts of organic siliconresin, 5~55 parts of organic silicon rubber and organic solvent are mixed, is obtained
Mixture；
0.1~5 part of catalyst is provided, catalyst is added into mixture, has the mixture of catalyst to heat addition
Processing obtains colloid；And
The colloid is dried, organic silicon pressure sensitive adhesive is obtained.
7. the preparation method of organic silicon pressure sensitive adhesive as claimed in claim 6, which is characterized in that after the acquisition colloid, dry
It is further comprising the steps of before doing the colloid：
By weight, 0~5 part of crosslinking agent is provided；And
The crosslinking agent is added into the colloid.
8. the preparation method of organic silicon pressure sensitive adhesive as claimed in claim 6, which is characterized in that after the acquisition colloid, dry
It is further comprising the steps of before doing the colloid：
By weight, 0~5 part of reaction suppressor is provided；And
The reaction suppressor is added into the colloid.
9. a kind of structure of composite membrane, which is characterized in that the structure of composite membrane includes two layers of the first base material layer and at least one layer of pressure
Quick glue-line, the pressure-sensitive adhesive layer are located between two layers of the first base material layer, and at least one layer of two layers of the first base material layer is plastics
The material of substrate layer, the pressure-sensitive adhesive layer is claim 1-5 any one of them organic silicon pressure sensitive adhesives.
10. structure of composite membrane as claimed in claim 9, which is characterized in that the material of the plastic basis material layer is polyether-ether-ketone, gathers
Etherimide, polyphenylene oxide or polyethylene naphthalate；And/or
Ranging from 2~40 μm of the thickness of the first base material layer；And/or
Ranging from 2~40 μm of the thickness of the pressure-sensitive adhesive layer.
11. the structure of composite membrane as described in claim 9 or 10, which is characterized in that the structure of composite membrane includes pressure-sensitive two layers
Glue-line, the structure of composite membrane further include one second substrate layer, which includes the first surface being oppositely arranged and
Two surfaces, wherein a pressure-sensitive adhesive layer is located between the first surface of the second substrate layer and a first base material layer, another pressure sensitive adhesive
Layer is located between the second surface of the second substrate layer and another the first base material layer.
12. structure of composite membrane as claimed in claim 11, which is characterized in that the material of second substrate layer is thermoplastic elastomehc
Property body or engineering plastics, the thermoplastic elastomer (TPE) is selected from thermoplastic polyester elastomer, thermoplastic polyurethane elastomer, thermoplasticity
At least one of polyamide elastomer and elastomer silicone, the engineering plastics are selected from polyether-ether-ketone, polyarylate, polyethers acyl
Imines, polyimides, polyphenylene sulfide, polyethylene naphthalate, polyethylene terephthalate and poly terephthalic acid
At least one of butanediol ester；And/or
Ranging from 1~30 μm of the thickness of second substrate layer.
13. a kind of vibrating diaphragm, which is characterized in that the vibrating diaphragm has such as claim 9 to 12 any one of them structure of composite membrane.
14. a kind of sound-producing device, which is characterized in that the sound-producing device includes vibrating diaphragm as claimed in claim 13.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810627422 | 2018-06-15 | ||
| CN201810627422X | 2018-06-15 |
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| CN108774488A true CN108774488A (en) | 2018-11-09 |
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|---|---|---|---|
| CN201810695211.XA Pending CN108774488A (en) | 2018-06-15 | 2018-06-28 | Organic silicon pressure sensitive adhesive and preparation method thereof, structure of composite membrane, vibrating diaphragm and sound-producing device |
Country Status (2)
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| CN (1) | CN108774488A (en) |
| WO (1) | WO2019237601A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019237601A1 (en) * | 2018-06-15 | 2019-12-19 | 歌尔股份有限公司 | Organosilicon pressure sensitive adhesive and preparation method therefor, composite film structure, vibration film, and sound generating device |
| CN111876126A (en) * | 2020-08-01 | 2020-11-03 | 烟台德邦科技有限公司 | High-adhesion organic silicon pressure-sensitive adhesive and preparation method thereof |
| CN111961414A (en) * | 2020-08-12 | 2020-11-20 | 芜湖徽氏新材料科技有限公司 | Preparation method of substrate-free anisotropic double-sided adhesive tape |
| CN114686140A (en) * | 2020-12-31 | 2022-07-01 | 太湖金张科技股份有限公司 | Silica gel protection film that low silicon shifted |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101177595A (en) * | 2007-12-13 | 2008-05-14 | 同济大学 | Moisture-curing silicone pressure-sensitive adhesive reinforced by nano-MQ silicone resin and preparation method thereof |
| CN101560372A (en) * | 2009-04-02 | 2009-10-21 | 佛山市华联有机硅有限公司 | Method for preparing one-step molding organic silicon self-adhesive pressure sensitive adhesive |
| CN102051154A (en) * | 2010-11-26 | 2011-05-11 | 株洲时代电气绝缘有限责任公司 | Organic silicon pressure-sensitive adhesive and preparation method thereof |
| CN102127389A (en) * | 2011-01-11 | 2011-07-20 | 广东达美新材料有限公司 | High-solid-content high-temperature-resistant organic-silicone pressure-sensitive adhesive and preparation method thereof |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102061142B (en) * | 2010-11-23 | 2013-05-29 | 吉林华丰有机硅有限公司 | Process for preparing organic silicon pressure-sensitive adhesive |
| CN102876249B (en) * | 2012-08-31 | 2013-10-16 | 江苏创基新材料有限公司 | Preparation method of peelable type organosilicon pressure-sensitive adhesive |
| CN103409103B (en) * | 2013-05-20 | 2015-02-18 | 广东信翼新材料股份有限公司 | Environment-friendly high-temperature-resistant organic silicon pressure-sensitive adhesive and preparation method thereof |
| CN203747985U (en) * | 2013-12-09 | 2014-07-30 | 歌尔声学股份有限公司 | Diaphragm and loudspeaker employing diaphragm |
| CN105778849A (en) * | 2014-12-17 | 2016-07-20 | 党庆风 | Polysiloxane pressure-sensitive adhesive and preparation method therefor |
| CN105188000B (en) * | 2015-09-18 | 2019-07-19 | 歌尔股份有限公司 | A kind of loudspeaker |
| CN205213032U (en) * | 2015-09-18 | 2016-05-04 | 歌尔声学股份有限公司 | Loudspeaker diaphragm |
| CN106398636A (en) * | 2016-08-31 | 2017-02-15 | 湖北新四海化工股份有限公司 | Environment-friendly organosilicone pressure-sensitive adhesive and preparation method thereof |
| DE102017202623A1 (en) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibration-damping silicone pressure-sensitive adhesive |
| DE102017202624A1 (en) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibration-damping silicone pressure-sensitive adhesive |
| DE102017202621A1 (en) * | 2017-02-17 | 2018-08-23 | Tesa Se | Vibration-damping silicone pressure-sensitive adhesive |
| CN108774488A (en) * | 2018-06-15 | 2018-11-09 | 歌尔股份有限公司 | Organic silicon pressure sensitive adhesive and preparation method thereof, structure of composite membrane, vibrating diaphragm and sound-producing device |
| CN109021915A (en) * | 2018-06-15 | 2018-12-18 | 歌尔股份有限公司 | Organic silicon pressure sensitive adhesive and preparation method thereof, structure of composite membrane, vibrating diaphragm and sounding device |
-
2018
- 2018-06-28 CN CN201810695211.XA patent/CN108774488A/en active Pending
- 2018-10-13 WO PCT/CN2018/110159 patent/WO2019237601A1/en not_active Ceased
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101177595A (en) * | 2007-12-13 | 2008-05-14 | 同济大学 | Moisture-curing silicone pressure-sensitive adhesive reinforced by nano-MQ silicone resin and preparation method thereof |
| CN101560372A (en) * | 2009-04-02 | 2009-10-21 | 佛山市华联有机硅有限公司 | Method for preparing one-step molding organic silicon self-adhesive pressure sensitive adhesive |
| CN102051154A (en) * | 2010-11-26 | 2011-05-11 | 株洲时代电气绝缘有限责任公司 | Organic silicon pressure-sensitive adhesive and preparation method thereof |
| CN102127389A (en) * | 2011-01-11 | 2011-07-20 | 广东达美新材料有限公司 | High-solid-content high-temperature-resistant organic-silicone pressure-sensitive adhesive and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019237601A1 (en) * | 2018-06-15 | 2019-12-19 | 歌尔股份有限公司 | Organosilicon pressure sensitive adhesive and preparation method therefor, composite film structure, vibration film, and sound generating device |
| CN111876126A (en) * | 2020-08-01 | 2020-11-03 | 烟台德邦科技有限公司 | High-adhesion organic silicon pressure-sensitive adhesive and preparation method thereof |
| CN111961414A (en) * | 2020-08-12 | 2020-11-20 | 芜湖徽氏新材料科技有限公司 | Preparation method of substrate-free anisotropic double-sided adhesive tape |
| CN114686140A (en) * | 2020-12-31 | 2022-07-01 | 太湖金张科技股份有限公司 | Silica gel protection film that low silicon shifted |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019237601A1 (en) | 2019-12-19 |
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