CN108759219A - A kind of cooling device - Google Patents

Abstract

A cooling device, comprising a support frame, at least one fan, and an air exhaust port arranged on the support frame; the inside of the support frame includes at least one accommodating chamber for placing objects to be cooled; The air outlet and the air outlet, the fan is connected with the support frame; the air outlet is connected with the fan, and the fan accelerates the airflow flowing to the air outlet and discharges it from the air outlet; the inside of the support frame is affected by the suction of the fan to form a The air outlet extends to the air outlet air passage. By setting the accommodation chamber and the fan on the support frame, under the action of the pressure difference created by the fan, the tuyeres arranged on the two wall plates form an airflow, and the airflow flows on the surface of the object to be cooled, forming heat with the object to be cooled. Exchange, so as to quickly and evenly cool the object to be cooled. Not only the cooling rate is increased, but also the cooling effect is enhanced.

Description

a cooling device

technical field

The present application relates to the technical field of solar cell processing equipment, in particular to a cooling device.

Background technique

Currently, there are roughly four cooling methods for battery chips in the prior art. The first is to turn on the heating device directly, in the natural environment, and cool it by natural wind; the second is to remove it from the heating device, place it in the natural environment, and cool it by natural wind; the third is to remove it from the heating device The battery chip is removed from the heating device, placed in the natural environment, and the battery chip is cooled by the fan equipment; the fourth is removed from the heating device, placed in the natural environment, and the battery chip is cooled by the fan blowing. However, the above-mentioned cooling methods are all natural air cooling or blowing cooling, and in actual production and application, there are poor cooling effects such as slow cooling speed and uneven cooling.

Contents of the invention

(1) Purpose of the invention

The purpose of this application is to provide a cooling device. By setting a cooling chamber and a fan on the support frame, under the suction provided by the fan, the tuyeres arranged on the two wall plates form an airflow, and the airflow is on the surface of the object to be cooled. Flow, form heat exchange with the object to be cooled, so as to quickly and evenly cool the object to be cooled. Not only the cooling rate is increased, but also the cooling effect is enhanced.

(2) Technical solution

In order to solve the above problems, the first aspect of the present invention provides a cooling device, including at least one accommodation chamber, at least one fan and an air exhaust port; the wall plate of the accommodation chamber is provided with an air inlet and an air outlet; The accommodating chamber is used to place the object to be cooled; the fan communicates with the accommodating chamber; the air outlet communicates with the accommodating chamber; the air outlet communicates with the fan, and the fan will The airflow flowing to the air outlet is accelerated and discharged from the air outlet; an airflow channel extending from the air inlet to the air outlet and extending to the air outlet is formed in the accommodating chamber. .

Optionally, the cooling device further includes a support frame and an installation room; the air outlet is arranged on the support frame; the installation room is connected to the accommodation room, and the installation room passes through the outlet The air outlet communicates with the accommodating chamber; the air inlet and the air outlet are located on the wall plates on opposite sides of the accommodating chamber.

Optionally, the cooling device further includes a first flow guide layer, the first flow guide layer is vertically arranged in the support frame; the installation chamber communicates with the first flow guide layer.

Optionally, the cooling device further includes a first flow guide layer, the first flow guide layer is horizontally arranged in the support frame, and the installation chamber and the first flow guide layer are stacked up and down; the installation A chamber communicates with the first flow-guiding layer.

Optionally, the cooling device further includes a second flow guide layer; the second flow guide layer is disposed between the installation chamber and the accommodation chamber, and communicates the installation chamber with the accommodation chamber .

Optionally, at least two air outlets and at least two fans are arranged on the support frame; at least one partition is arranged in the installation room to form a plurality of installation spaces; each installation space is provided with a said air outlet and one said fan.

Optionally, the fan is a centrifugal fan, the motor end of the centrifugal fan is located outside the installation room, and the fan end of the centrifugal fan is located in the installation room.

Optionally, the fan is a centrifugal fan, the motor end of the centrifugal fan is located outside the installation room, and the fan end of the centrifugal fan is located in the installation room; the second guide layer and the installation room A through hole is provided at the connection of the fan end, and the air inlet end of the fan end is connected with the through hole.

Optionally, the fan is an axial fan, and the axial fan is installed inside the installation room.

Optionally, the fan is an axial-flow fan, and the axial-flow fan is installed inside the installation chamber; a through hole is provided at the connection between the second guide layer and the installation chamber, and the The air inlet end of the axial flow fan is arranged close to the through hole.

Optionally, at least two rails are provided inside the storage chamber; the rails extend from one end to the other along opposite sides of the bottom of the storage chamber; flow vertically.

Optionally, a protective layer is further provided on the side of the air inlet of the support frame; a plurality of ventilation holes are provided on the outer wall of the protective layer.

According to a second aspect of the present invention, there is provided a lamination device, comprising the cooling device as described in any one of the above items.

Technical solution summary:

The accommodating chamber and the fan are arranged on the supporting frame, and the fan is communicated with the air outlet. When the fan is working, the wind pressure inside and outside the cooling device will be different through the rotation of the fan. The air outlet is sucked out, forming an airflow flowing from one side to the other in the accommodation chamber. The airflow flows from one side of the storage chamber to the opposite side, exchanges heat with the object to be cooled placed in the storage chamber, and the hot airflow after the heat exchange is sent out to the outside through the air outlet. Thus, a circulating airflow channel is formed from the outside to the accommodating chamber and then to the outside, and the airflow flowing in the airflow channel exchanges heat with the object to be cooled to complete the cooling process of the object to be cooled in the accommodating chamber.

(3) Beneficial effects

The technical solution of the present invention has the following beneficial technical effects:

By setting the accommodating chamber and the fan on the support frame, under the action of the pressure difference created by the fan, an airflow is formed between the air inlet and the air outlet arranged on the two wall plates, and the airflow flows on the surface of the object to be cooled. It forms heat exchange with the object to be cooled, and then sends the hot air flow formed after the heat exchange to the outside of the cooling device. The circulating air flow channel continuously transports the air flow to form heat exchange with the object to be cooled, and the cycle reciprocates, so as to quickly and evenly cool the object. things to cool. Not only the cooling rate is increased, but also the cooling effect is enhanced.

Description of drawings

Fig. 1 is a schematic structural diagram of a cooling device according to an embodiment of the present application;

Fig. 2 is a cross-sectional structure diagram of a cooling device according to an embodiment of the present application;

Fig. 3 is a schematic diagram of the flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Fig. 4 is a schematic diagram of another flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Fig. 5 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Fig. 6 is a schematic diagram of another flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Fig. 7 is a schematic diagram of the flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Fig. 8 is a schematic diagram of another flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Fig. 9 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of a centrifugal fan;

Figure 10 is a schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Fig. 11 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Figure 12 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Fig. 13 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Figure 14 is a schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Figure 15 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Figure 16 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of an axial flow fan;

Fig. 17 is a schematic diagram of the overall structure of a cooling device according to an embodiment of the present application;

Fig. 18 is a schematic diagram showing the enlarged perspective relationship between the ventilation hole and the air inlet at point A in Fig. 17 .

Reference signs:

1: support frame; 11: storage room; 12: air inlet; 13: air outlet; 2: fan; 3: air exhaust; 4: installation room; 41: partition; 42: installation space; 5: first Diversion layer; 51: ventilation channel; 6: second diversion layer; 61: through hole; 7: track; 8: protective layer; 81: ventilation hole; 9: recycling layer.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in combination with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are exemplary only, and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concept of the present invention.

Apparently, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "first", "second", and "third" are used for description purposes only, and should not be understood as indicating or implying relative importance.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.

It should be noted that, in order to help understand the description of the embodiments with reference to the drawings, the horizontal or vertical "→" in Fig. 3-Fig. explain.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of a cooling device according to an embodiment of the present application.

According to an embodiment of the present invention, as shown in FIG. 1 , a cooling device is provided, including at least one accommodating chamber 11, at least one blower fan 2 and an air outlet 3; the wall of the accommodating chamber 11 is provided with The air inlet 12 and the air outlet 13; the accommodation chamber 11 is used to place the object to be cooled; the fan 2 communicates with the accommodation chamber 11; the air outlet 3 communicates with the accommodation chamber 11; The air outlet 13 communicates with the fan 2, and the fan 2 accelerates the airflow flowing to the air outlet 13 and discharges it from the air outlet 3; 12 to the air outlet 13 and extend to the airflow passage of the air outlet 3 . The air outlet 3 of the present application can be selected with a flanged air duct to facilitate connection with an external air duct, so as to transport the air flow from the inside of the cooling device to the outside. In this embodiment, the accommodating chamber 11 may include multiple or only one accommodating chamber. 11 and the wall plate where the air outlet 13 is located, so that when the fan 2 rotates, a pressure difference can be formed between the inside of the accommodating chamber 11 and the outside, thereby forming an airflow channel from the air inlet 12 to the air outlet 13 in the accommodating chamber 11 , the airflow in the airflow channel can evenly and quickly cool down the object to be cooled.

In this embodiment, the cooling device of the present application is suitable for lamination equipment, but not limited to lamination equipment. Wherein, in the optional embodiment of the present application, one or more fans 2 are provided. When the fans 2 rotate, the internal and external pressure of the cooling device changes. The speed enters the accommodation chamber 11 from the air inlet, accelerates or flows to the air outlet at a constant speed in the accommodation chamber 11, forms an airflow channel from the air inlet to the air outlet in the accommodation chamber 11, and controls the airflow through the setting position of the fan 2 Flow direction: controlled by the rotation speed of the fan 2 and the flow velocity of the airflow in the airflow channel, thereby accelerating the cooling speed of the object to be cooled in the accommodating chamber 11 .

The overall structure of the cooling device of the present application is light in weight and high in structural strength; through the unique air flow passage layout of the storage chamber 11, one or more storage chambers 11 can have a relatively average air resistance, thereby achieving a more balanced air resistance for the object to be cooled. Faster, more uniform cooling. In addition, the connection methods mentioned in the embodiments of the present application can be detachable connections, such as screw connections and clip connections, so as to facilitate the replacement of some parts when they are damaged, so as to save costs, but are not limited to the limitations listed above. Welded or riveted connections.

Please refer to Fig. 2, Fig. 3-Fig. 6 and Fig. 10-13. Fig. 2 is a cross-sectional structure diagram of the cooling device according to the embodiment of the present application; Fig. 3-Fig. Figure 10-13 Schematic diagram of three flow directions of the airflow inside the support frame under the action of the axial flow fan.

In an optional embodiment, as shown in Figures 2-5 and Figures 10-12, the cooling device also includes a support frame 1 and an installation chamber 4; the air outlet 3 is arranged on the support frame 1; the installation chamber 4 is placed on the support Inside the frame 1, it is used to configure the fan 2; the installation chamber 4 is connected to the accommodation chamber 11, and the installation chamber 4 communicates with the accommodation chamber 11 through the air outlet 13; the air inlet 12 and the air outlet 13 are located on opposite sides of the accommodation chamber 11 on the siding. Optionally, the fan 2 is an axial flow fan, and the axial flow fan is installed inside the installation room 4; another option, the fan 2 is a centrifugal fan, and the motor end of the centrifugal fan is located outside the installation room 4, The fan end of the centrifugal fan is located in the installation chamber 4 .

In this embodiment, the installation chamber 4 can be placed on the inner side of the support frame 1, or can be installed on the top of the support frame 1, or can be installed on the bottom of the support frame 1, as long as it can communicate with the air outlet 13, forming a The airflow channel from the air outlet 13 to the air outlet 3 is within the protection scope of the present application. An optional solution of this embodiment is that the air inlet 12 and the air outlet 13 are respectively arranged on the two side walls of the support frame 1 perpendicular to the horizontal plane, and the two side walls are oppositely arranged. A linear airflow channel in the horizontal direction is formed in the chamber 11. It should be noted that, in this optional solution, the air flow uniformly passes over the upper surface of the object to be cooled, exchanges heat with the object to be cooled, and takes away heat from the object to be cooled. In this optional solution, the installation chamber 4 is installed outside the air outlet 13 , its size matches the wall plate where the air outlet 13 is located, and directly collects the airflow flowing out from the air outlet 13 . Wherein, the air inlet 12 and the air outlet 13 can be respectively set as multiple sets of first through holes arranged in an array, and the first through holes can be square holes or circular holes, but are not limited to the above-mentioned examples. The air inlet 12 and the air outlet 13 can be optionally arranged on corresponding positions on opposite side wall panels of the accommodating chamber 11 , but are not limited to the enumerated arrangement methods. In addition, the support frame 1 of the present application may be configured as a cube with legs, or as a cylinder with legs, but is not limited to the above-mentioned examples.

It should be noted that the supporting frame 1 can be configured as an assembled structure including a framework, laminates and wall panels, and the accommodating chamber 11 is formed by connecting the wall panels, intermediate interlayers and the framework. A cavity structure matching the shape of the support frame can also be fixed on the support frame. Wherein, the connection mode between the wall plate, the intermediate spacer and the frame can adopt a detachable connection method, such as snap connection and screw connection, but is not limited thereto. The support frame 1 can be configured as a multi-layer structure, or as a single-layer structure, and optionally as a multi-layer structure. When the support frame 1 is arranged as a multi-layer structure, the interior of the support frame 1 can be formed into a plurality of accommodating chambers 11 by setting an intermediate spacer; it can also be a plurality of cavity structures that match the shape of the support frame. Fastened to each layer of the support frame.

In an optional embodiment, as shown in Figure 6 and Figure 13, the cooling device further includes a first flow guide layer 5, which is vertically arranged in the support frame 1; the installation chamber 4 and the first flow guide layer Layer 5 is connected. Specifically, the air inlet 12 and the air outlet 13 are located on opposite sides of the support frame 1 in the horizontal direction; the installation chamber 4 and the accommodating chamber 11 are stacked up and down; the installation chamber 4 communicates with the first guide layer 5 . The fan 2 on the installation chamber 4 is an axial flow fan, and the axial flow fan is installed inside the installation chamber 4; or the fan 2 on the installation chamber 4 is a centrifugal fan, and the motor end of the centrifugal fan is located at the installation Outside the chamber 4, the fan end of the centrifugal fan is located in the installation chamber 4.

In this embodiment, the first guide layer 5 is vertically arranged on one side of the support frame 1, and is connected to the wall plate where the air outlet 13 is located; the first guide layer 5 is away from the side of the air outlet 13, Its bottom can be provided with leg, to support the first deflector layer 5, or the first deflector layer 5 can cover and be arranged on the side far away from the air inlet 12 of the wallboard where the air outlet 13 is located, and its bottom end can be connected with the support frame 1 The bottom of the same height, can be higher than the bottom of the support frame 1. The installation chamber 4 can be arranged on the top end of the accommodation chamber 11 , also can be arranged on the bottom end of the accommodation chamber 11 , or one installation chamber 4 can be arranged on the top end and the bottom end of the accommodation chamber 11 respectively. Here, the installation chamber 4 is set on the top of the accommodating chamber 11 for illustration: at the position near the top of the first flow guide layer 5, and on the side connected to the wall plate where the air outlet 13 is located, an air passage 51 is provided, and the installation chamber 4 is ventilated. The channel 51 communicates with the first flow guide layer 5 . Therefore, under the action of the suction force of the fan 2 , the external air can be formed into an airflow in the accommodating chamber 11 , and the hot airflow after heat exchange can be transported to the installation chamber 4 through the first guide layer 5 . Wherein, the air duct 51 can be an opening equal in size to the joint of the first flow guide layer 5 and the installation chamber 4, or can be a plurality of air duct holes arranged at the joint, and the air duct holes can be randomly arranged or arranged in a row. cloth. Here, the shape of the air duct hole is not limited. When the fan 2 is an axial flow fan 2, the fan 2 is arranged at a position where the air duct opening is close to the air duct hole. In this application, through the design of the first flow guide layer 5, the external air forms an air flow in the accommodation chamber 11, and is guided out through the first flow guide layer 5, which not only strengthens the circulation of the air flow channel, but also makes the air flow contact with the object to be cooled. The surface reaches the maximum, which improves the heat exchange effect; and reduces the footprint and area of the entire cooling device.

Please refer to FIGS. 17 and 18. FIG. 17 is a schematic diagram of the overall structure of a cooling device according to an embodiment of the present application; FIG. 18 is a schematic diagram of the enlarged perspective relationship between the ventilation hole and the air inlet at A in FIG. 17.

In an optional embodiment, as shown in FIG. 17 , a protective layer 8 is further provided on the side of the air inlet 12 of the support frame 1 ; a plurality of ventilation holes 81 are provided on the outer wall of the protective layer 8 . The protective layer 8 is covered on the outside of the wall plate where the air inlet 12 is located, and the protective layer 8 is provided with a ventilation hole 81 at a position corresponding to the air inlet 12. The ventilation hole 81 is used for air circulation, so that when the fan 2 operates, the external Air can enter the air inlet 12 through the ventilation hole 81 and form an airflow. It should be noted that the ventilation holes 81 arranged on the protective layer 8 can be randomly arranged on the protective layer, and can also be arranged in a corresponding array with the air inlets 12. The number and arrangement of the ventilation holes 81 are not to affect the entry of external air. The flow rate in the accommodation chamber 11 is sufficient. The hole can be a round hole, a square hole or a long waist hole, preferably a long waist hole. As shown in FIG. 18 , looking directly into the cooling device from one side of the protective layer, the air inlet corresponding to the position of the ventilation hole can be seen through the ventilation hole 81 . Through the setting of the protective layer 8, the operator can prevent the fingers from getting caught in the air inlet 12 and causing danger during work. Specifically, the fan 2 may be an axial flow fan or a centrifugal fan, and the installation method of the fan is the same as that of the above-mentioned embodiment, and will not be repeated here.

In this embodiment, the installation chamber 4 can be installed on one side of the support frame 1, or can be installed on the top of the support frame 1, or can be installed on the bottom of the support frame 1, as long as it can communicate with the air outlet 13, forming a The air flow channel from 13 to the air outlet 3 is within the protection scope of the present application. The protective layer 8 is covered on the outside of the wall plate where the air inlet 12 is located, and the protective layer 8 is provided with a ventilation hole 81 at a position corresponding to the air inlet 12. The ventilation hole 81 is used for air circulation, so that when the fan 2 operates, the external Air can enter the air inlet 12 through the ventilation hole 81 and form an airflow. The hole can be a round hole, a square hole or a long waist hole, preferably a long waist hole.

Please refer to FIG. 2 . FIG. 2 is a cross-sectional structure diagram of a cooling device according to an embodiment of the present application.

In an optional embodiment, as shown in FIG. 2, the cooling device further includes a recovery layer 9; it is arranged at the bottom of the support frame 1, and the bottom end of the recovery layer 9 is higher than the bottom end of the support frame 1. .

In this embodiment, the recovery layer 9 is connected to the conveyor belt. In the production line, after the products in the tray are processed in the next step, the tray is transported with the previous process of the conveyor belt, passes through the recovery layer, and is finally transported to the first process using the tray. Prepare for next use. Through the setting of the recovery layer 9, on the one hand, the occupied space of the equipment is saved; on the other hand, the workload of the staff is reduced.

Please refer to Figure 7, Figure 8 and Figures 14 and 15, Figure 7 and Figure 8 are schematic diagrams of the two flow directions of the internal airflow of the support frame under the action of a centrifugal fan; Figures 14 and 15 are the two flow directions of the internal airflow of the support frame under the action of an axial flow fan schematic diagram.

In an optional embodiment, as shown in Figure 7, Figure 8, 14 and 15, the cooling device further includes a first flow guide layer 5, the first flow guide layer 5 is horizontally arranged in the support frame 1, and the installation chamber 4 and The first flow guide layer 5 is stacked up and down; the installation chamber 4 communicates with the first flow guide layer 5 . Specifically, the first guide layer 5 is arranged above or below the accommodating chamber 11; the air inlet 12 and the air outlet 13 are located on opposite sides of the support frame 1 in the vertical direction; the installation chamber 4 is correspondingly arranged on the first guide Above or below the flow layer 5.

In this embodiment, when the support frame 1 is arranged in multiple layers, the interior of the support frame 1 is divided into a plurality of cooling chambers, and a plurality of first passageways are arranged between every two accommodating chambers 11 stacked up and down. As for the holes, a plurality of first through holes may be arranged on the connection surface in an array, or may be arranged on the connection surface in any manner. As long as the external air can form an airflow in the accommodating chamber 11 and flow according to the airflow channel.

In an optional embodiment, as shown in FIG. 7 and FIG. 14 , the cooling device further includes a first flow guide layer 5 , which is horizontally arranged in the support frame 1 , and arranged in the accommodating chamber 11 Above; the air inlet 12 and the air outlet 13 are located on opposite sides of the support frame 1 in the vertical direction; the installation chamber 4 is arranged above the first guide layer 5 . In this embodiment, an air flow channel from the bottom end to the top end is formed in the accommodating chamber 11 through the suction force of the fan 2 .

In another optional embodiment, as shown in FIG. 8 and FIG. 15 , the cooling device further includes a first flow guide layer 5 , and the first flow guide layer 5 is horizontally arranged in the support frame 1 and is arranged in the accommodating chamber 11 The air inlet 12 and the air outlet 13 are located on opposite sides of the support frame 1 in the vertical direction; the installation chamber 4 is arranged below the first guide layer 5 . In this embodiment, an airflow channel from the top to the bottom is formed in the accommodation chamber 11 through the suction force of the blower 2 .

Please refer to Fig. 9 and Fig. 16, Fig. 9 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of a centrifugal fan; Fig. 16 is another schematic diagram of the flow direction of the internal airflow of the support frame under the action of an axial flow fan.

In an optional embodiment, as shown in Figure 9 and Figure 16, the cooling device further includes a second flow guide layer 6; the second flow guide layer 6 is arranged between the installation chamber 4 and the accommodation chamber 11, and will install The chamber 4 communicates with the accommodation chamber 11 .

In this embodiment, the second flow guiding layer 6 can be arranged on the top end of the accommodating chamber 11 or on the bottom end of the accommodating chamber 11, no matter whether the second flow guiding layer 6 is arranged on the top end of the accommodating chamber 11 or At the bottom end, the second flow guiding layer 6 is disposed between the accommodation chamber 11 and the installation chamber 4 . In addition, when there are multiple accommodating chambers 11, the accommodating chambers 11 may be a plurality of accommodating chambers 11 stacked up and down, or may be a plurality of accommodating chambers 11 connected vertically. An air inlet 12 and an air outlet 13 are respectively provided on opposite sides of each accommodating chamber 11 . The second flow guiding layer 6 is arranged at a position overlapping with the accommodating chamber 11 up and down.

Now take three accommodating chambers 11 stacked up and down, and the second guide layer 6 is arranged on the top of the first accommodating chamber 11 from top to bottom, and is connected with the accommodating chamber 11 as an example for illustration: the first A guide layer 5 is arranged on one side of the three air outlets 13 leading to the accommodating chamber 11 , and is covered and connected to the wall plate where the air outlets 13 are located. An air channel 51 is provided at the position near the top of the first air guide layer 5 and connected to the wall plate where the air outlet 13 is located, and the second air guide layer 6 communicates with the first air guide layer 5 through the air channel 51 . The second flow guide layer 6 is connected to the installation chamber 4 , and a through hole 61 is provided on the board layer connected with the two so that the air flow can flow from the second flow guide layer 6 to the installation chamber 4 through the through hole 61 . Wherein, the through hole 61 may be set as a through hole as large as the air duct port of the fan, or may be smaller than the air duct port, or may be larger than the air duct port. In addition, the through hole 1 can be configured as a circular, square or polygonal through hole 61 . In another case, the through hole 61 may be composed of a plurality of small ventilation holes arranged randomly or arranged in an array. When starting to work, under the action of the suction of the fan 2, the external air can be formed into an airflow in the accommodation chamber 11, and the hot air flow through the heat exchange can be transported to the Installation room 4. Wherein, the air duct 51 can be an opening equal in size to the junction of the first air guide layer 5 and the second air guide layer 6, or can be a plurality of air duct holes arranged at the joint, and the air duct holes can be arranged randomly or It can be displayed and arranged. Here, the shape of the air duct hole is not limited. Through the design of the second flow guide layer 6, the air flow channel formed after the second flow guide layer 6 communicates with the first flow guide layer 5 can evenly distribute the air flow of each layer of the accommodation chamber 11, thereby enhancing cooling effect, cooling more evenly. In addition, the second air guide layer 6 finally returns the airflow to the top and removes it. This design saves the space of the airflow channel and reduces the volume of the entire cooling device.

In this embodiment, the accommodating chamber 11 is a cooling space formed by a framework, wall panels and laminates. This framework structure makes the entire cooling device light in weight and high in structural strength; and the cooling device is designed to The unique air flow channel layout is formed in the storage chamber 11, so that each storage chamber 11 has a relatively average air resistance, and the heat after the heat exchange of the cooled object flows out of the device with the air flow, which enhances the cooling effect; the air flow flows evenly Each surface of the object to be cooled can cool the object to be cooled more evenly.

Please refer to FIGS. 1 and 2. FIG. 1 is a schematic structural view of a cooling device according to an embodiment of the present application; FIG. 2 is a cross-sectional structural view of a cooling device according to an embodiment of the present application.

In an optional embodiment, as shown in FIG. 1 and FIG. 2 , at least two air outlets 3 and at least two fans 2 are arranged on the support frame 1; at least one partition 41 is arranged in the installation chamber 4, forming A plurality of installation spaces 42; each installation space 42 is provided with an air outlet 3 and a fan 2.

In this embodiment, when there are multiple fans 2, a plurality of second through holes 61 are provided in the installation chamber 4, which are respectively arranged in one-to-one correspondence with a plurality of installation spaces 42, so that the formed air flow passes through different locations. The second through hole 61 is transported to different installation spaces 42 , and then exhausted from the air outlet 3 provided in each installation space 42 . In this embodiment, the partition 41 divides the installation chamber 4 into a plurality of installation spaces 42. When the fan 2 is in operation, the airflow is sucked in from the bottom of the fan 2 end, and the airflow is thrown out from the opening of the side wall of the fan 2 end. In the corresponding installation space 42, it is discharged from the air outlet 3 of the installation space 42 to the outside of the equipment. This prevents the occurrence of interference between the two blowers 2 when the airflow is thrown out at the same time, which affects the generation of the airflow channel and the phenomenon that the airflow circulation is affected.

In an optional embodiment, the fan 2 is a centrifugal fan 2 , the motor end of the centrifugal fan 2 is located outside the installation room 4 , and the fan 2 end of the centrifugal fan 2 is located in the installation room 4 . The specific distance from the side of the installation chamber 4 close to the air outlet 13 to the side away from the air outlet 13 is preferably the same as the height of the end of the fan 2, and may also be greater than the height of the end of the fan 2. But not limited to the above list. In this application, the setting of the fan 2 makes the cooling device form an air circulation from the outside of the device to the inside of the device and then to the outside of the device when the fan 2 is working, and the air with a lower external temperature forms an air flow in the accommodating chamber 11 and interacts with the object to be cooled The heat exchange, the air flow transfers the heat of the object to be cooled to the outside of the cooling device, even outside. Thereby enhancing the cooling effect.

Please refer to FIG. 9 . FIG. 9 is another schematic diagram of the flow direction of the airflow inside the support frame under the action of the centrifugal fan.

In an optional embodiment, as shown in FIG. 9 , the fan 2 is a centrifugal fan 2, the motor end of the centrifugal fan 2 is located outside the installation chamber 4, and the fan 2 end of the centrifugal fan 2 is located in the installation chamber 4; A through hole 61 is provided at the joint between the second flow guide layer 6 and the installation chamber 4 , and the air inlet end of the fan 2 is connected to the through hole 61 .

In this embodiment, there are three accommodating chambers 11 stacked up and down, and the second guide layer 6 is arranged on the top of the first accommodating chamber 11 from top to bottom, and is connected with the accommodating chamber 11 as Example for illustration: the first deflector layer 5 is arranged on the side of the three air outlets 13 leading to the accommodating chamber 11 , and is covered and connected to the wall plate where the air outlets 13 are located. An air channel 51 is provided at the position near the top of the first air guide layer 5 and connected to the wall plate where the air outlet 13 is located, and the second air guide layer 6 communicates with the first air guide layer 5 through the air channel 51 . The second flow guide layer 6 is connected to the installation chamber 4 , and a through hole 61 is provided in the intermediate layer connecting the two so that air can flow from the second flow guide layer 6 to the installation chamber 4 through the through hole 61 . The fan 2 is a centrifugal fan 2, the motor end of the centrifugal fan 2 is located outside the installation room 4, and the fan 2 end of the centrifugal fan 2 is located in the installation room 4; the connection between the second guide layer 6 and the installation room 4 is set There is a through hole 61, and the air inlet end of the blower fan 2 is connected with the through hole 61. When starting to work, the centrifugal fan 2 operates, and under the suction of the fan 2, the external air can be formed into an air flow in the accommodating chamber 11, and the hot air flow through the heat exchange will pass through the first guide layer 5 and the second flow guide layer. The second flow-guiding layer 6 is transported to the installation chamber 4 . Wherein, the air duct 51 can be an opening equal in size to the junction of the first air guide layer 5 and the second air guide layer 6, or can be a plurality of air duct holes arranged at the joint, and the air duct holes can be arranged randomly or It can be displayed and arranged. Here, the shape of the air duct hole is not limited. The through hole 61 can be connected with the port at the end of the fan 2 through a sealing member, so as to improve the directional drainage effect of the centrifugal fan 2 on the airflow. The sealing element may be a wind guide ring, but not limited thereto. Through the design of the second flow guide layer 6, the air flow channel formed after the second flow guide layer 6 communicates with the first flow guide layer 5 can evenly distribute the air flow of each layer of the accommodation chamber 11, thereby enhancing cooling effect, cooling more evenly. In addition, the second air guide layer 6 finally returns the airflow to the top and removes it. This design saves the space of the airflow channel and reduces the volume of the entire cooling device.

In this embodiment, the accommodating chamber 11 is a cooling space formed by a framework, wall panels and laminates. This framework structure makes the entire cooling device light in weight and high in structural strength; and the cooling device is designed to The unique air flow channel layout is formed in the storage chamber 11, so that each storage chamber 11 has a relatively average air resistance, and the heat after the heat exchange of the cooled object flows out of the device with the air flow, which enhances the cooling effect; the air flow flows evenly Each surface of the object to be cooled can cool the object to be cooled more evenly.

Please refer to FIG. 16 . FIG. 16 is another schematic view of the flow direction of the airflow inside the support frame under the action of an axial flow fan.

In an optional embodiment, as shown in FIG. 16 , the fan 2 is an axial flow fan, and the axial flow fan is installed inside the installation chamber 4 .

The distance from the side of the specific installation chamber 4 close to the air outlet 13 to the side away from the air outlet 13 is preferably the same as the height of the axial flow fan, and can also be greater than the height of the axial flow fan, but it is not limited to the above-mentioned enumeration, as long as It is sufficient that the installation chamber 4 can accommodate the body of the axial flow fan. In this application, the setting of the fan 2 makes the cooling device form an air circulation from the outside of the device to the inside of the device and then to the outside of the device when the fan 2 is working, and the air with a lower external temperature forms an air flow in the accommodating chamber 11 and interacts with the object to be cooled The heat exchange, the air flow transfers the heat of the object to be cooled to the outside of the cooling device, even outside. Thereby enhancing the cooling effect. In an optional embodiment, the fan 2 is an axial flow fan, and the axial flow fan is installed inside the installation chamber 4; a through hole 61 is provided at the connection between the second guide layer 6 and the installation chamber 4, and the axial flow fan The air inlet end of the fan is arranged close to the through hole 61 .

In this embodiment, there are three accommodating chambers 11 stacked up and down, and the second guide layer 6 is arranged on the top of the first accommodating chamber 11 from top to bottom, and is connected with the accommodating chamber 11 as Example for illustration: the first deflector layer 5 is arranged on the side of the three air outlets 13 leading to the accommodating chamber 11 , and is covered and connected to the wall plate where the air outlets 13 are located. An air channel 51 is provided at the position near the top of the first air guide layer 5 and connected to the wall plate where the air outlet 13 is located, and the second air guide layer 6 communicates with the first air guide layer 5 through the air channel 51 . The second flow guide layer 6 is connected to the installation chamber 4 , and a through hole 61 is provided in the intermediate layer connecting the two so that air can flow from the second flow guide layer 6 to the installation chamber 4 through the through hole 61 . The fan 2 is an axial flow fan 2, and the axial flow fan 2 is installed inside the installation room 4; a through hole 61 is provided at the connection between the second guide layer 6 and the installation room 4, and the air inlet end of the axial flow fan is close to The through hole 61 is provided. When starting to work, the centrifugal fan operates, and under the action of the wind pressure difference produced by the fan 2, the external air can be formed into an airflow in the accommodating chamber 11, and the hot airflow through the heat exchange can pass through the first guide layer 5 and the second flow-guiding layer 6 are transported to the installation chamber 4. Wherein, the air duct 51 can be an opening equal in size to the junction of the first air guide layer 5 and the second air guide layer 6, or can be a plurality of air duct holes arranged at the joint, and the air duct holes can be arranged randomly or It can be displayed and arranged. Here, the shape of the air duct hole is not limited. Through the design of the second flow guide layer 6, the air flow channel formed after the second flow guide layer 6 communicates with the first flow guide layer 5 can evenly distribute the air flow of each layer of the accommodation chamber 11, thereby enhancing cooling effect, cooling more evenly. In addition, the second air guide layer 6 finally returns the airflow to the top and removes it. This design saves the space of the airflow channel and reduces the volume of the entire cooling device.

Please refer to FIG. 2 . FIG. 2 is a cross-sectional structure diagram of a cooling device according to an embodiment of the present application.

In an optional embodiment, as shown in FIG. 2 , at least two rails 7 are provided inside the accommodating chamber 11; the rails 7 extend from one end to the other along the opposite sides of the bottom of the accommodating chamber 11; the rails 7 The extending direction is perpendicular to the flow direction of the cooling airflow.

In an optional embodiment, at least two rails 7 are arranged inside the accommodating chamber 11; the rails 7 are respectively arranged parallel to the wall plates on opposite sides of the accommodating chamber 11; the plane formed by the two rails 7 is higher than the The bottom surface of the accommodation chamber 11.

In this embodiment, the product of the production line is transported to this process. When the product enters the storage chamber 11 along with the tray, after the tray enters the storage chamber 11 along the slide rail, under the action of the fan 2, the air flow from the object to be cooled The upper surface of the tray and the lower surface of the tray flow evenly and quickly for heat exchange. Thereby the cooling of the object to be cooled is completed.

In an optional embodiment, the wall plate on one side of the accommodating chamber 11 is provided with a feeding door, and the feeding door is hingedly connected with the support frame 1; Either end is hingedly connected to the support frame 1. Optionally, the top of the feeding door is hingedly connected to the support frame 1. When feeding into the tray, it can be pulled up at a certain angle to realize feeding. The certain angle is 60°-90°, but not limited to the above list.

According to another embodiment of the present invention, a laminating device is provided, including the cooling device as described in any one of the above embodiments.

The present invention aims to protect a cooling device. By setting the accommodation chamber 11 and the fan 2 on the support frame 1, under the action of the suction force provided by the fan 2, the tuyeres arranged on the two wall plates form an airflow, and the airflow is in the waiting state. The surface of the cooling object flows and forms heat exchange with the object to be cooled, thereby cooling the object to be cooled quickly and uniformly. Not only the cooling rate is increased, but also the cooling effect is enhanced.

It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and not to limit the present invention. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present invention shall fall within the protection scope of the present invention. Furthermore, it is intended that the appended claims of the present invention embrace all changes and modifications that come within the scope and metesques of the appended claims, or equivalents of such scope and metes and bounds.

Claims (13)

1. A cooling device, characterized in that it comprises at least one accommodating chamber (11), at least one blower fan (2) and an air outlet (3); An air inlet (12) and an air outlet (13) are arranged on the wall plate of the accommodating chamber (11); the accommodating chamber (11) is used for placing objects to be cooled; The fan (2) communicates with the accommodation chamber (11); The air outlet (3) communicates with the accommodation chamber (11); The air outlet (13) is communicated with the fan (2), and the fan (2) accelerates the airflow flowing to the air outlet (13) to be discharged from the air outlet (3); An air flow channel extending from the air inlet (12) to the air outlet (13) and extending to the air exhaust port (3) is formed in the accommodation chamber (11). 2. The cooling device according to claim 1, further comprising a support frame (1) and an installation chamber (4); The air outlet (3) is arranged on the support frame (1); The installation chamber (4) is placed in the support frame (1) for configuring the fan (2); The installation chamber (4) is connected to the accommodation chamber (11), and the installation chamber (4) communicates with the accommodation chamber (11) through the air outlet (13); The air inlet (12) and the air outlet (13) are located on the wall plates on opposite sides of the accommodating chamber (11). 3. The cooling device according to claim 2, characterized in that it further comprises a first flow guide layer (5), and the first flow guide layer (5) is vertically arranged in the support frame (1); The installation chamber (4) communicates with the first flow-guiding layer (5). 4. The cooling device according to claim 2, characterized in that it further comprises a first flow guide layer (5), the first flow guide layer (5) is horizontally arranged in the support frame, and the installation chamber (4) stacked up and down with the first diversion layer; The installation chamber (4) communicates with the first flow-guiding layer (5). 5. The cooling device according to claim 3, further comprising a second flow guide layer (6); The second guide layer (6) is arranged between the installation chamber (4) and the accommodation chamber (11), and communicates the installation chamber (4) with the accommodation chamber (11). 6. The cooling device according to any one of claims 2-5, characterized in that, The support frame (1) is provided with at least two air outlets (3) and at least two fans (2); At least one partition (41) is arranged in the installation chamber (4), forming a plurality of installation spaces (42); Each of the installation spaces (42) is provided with one air outlet (3) and one fan (2). 7. The cooling device according to any one of claims 2-4, characterized in that, The fan (2) is a centrifugal fan, the motor end of the centrifugal fan is located outside the installation room (4), and the fan end of the centrifugal fan is located in the installation room (4). 8. The cooling device according to claim 5, characterized in that, The fan (2) is a centrifugal fan, the motor end of the centrifugal fan is located outside the installation room (4), and the fan end of the centrifugal fan is located in the installation room (4); A through hole (61) is provided at the junction of the second guide layer (6) and the installation chamber (4), and the air inlet end of the fan end is connected with the through hole (61). 9. The cooling device according to any one of claims 2-4, characterized in that, The fan (2) is an axial flow fan, and the axial flow fan is placed inside the installation chamber (4). 10. The cooling device according to claim 5, characterized in that, The fan (2) is an axial flow fan, and the axial flow fan is placed inside the installation chamber (4); A through hole (61) is provided at the junction of the second guide layer (6) and the installation chamber (4), and the air inlet end of the axial flow fan is arranged close to the through hole (61). 11. The cooling device according to claim 1, characterized in that at least two tracks (7) are arranged inside the cooling chamber (11); The tracks (7) extend from one end to the other end along opposite sides of the bottom of the accommodating chamber (11); The direction in which the track (7) extends is perpendicular to the flow direction of the cooling airflow. 12. The cooling device according to claim 2, characterized in that a protective layer (8) is also provided on the side of the air inlet (12) of the support frame (1); A plurality of ventilation holes (81) are arranged on the outer wall of the protective layer (8). 13. A laminating device, characterized by comprising the cooling device according to any one of claims 1-12.