CN108727800A - A kind of composition of high-frequency microwave copper-clad plate - Google Patents
A kind of composition of high-frequency microwave copper-clad plate Download PDFInfo
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- CN108727800A CN108727800A CN201810491095.XA CN201810491095A CN108727800A CN 108727800 A CN108727800 A CN 108727800A CN 201810491095 A CN201810491095 A CN 201810491095A CN 108727800 A CN108727800 A CN 108727800A
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- 239000000203 mixture Substances 0.000 title claims abstract description 17
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 13
- 239000003063 flame retardant Substances 0.000 claims abstract description 11
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 11
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims abstract description 10
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229920000147 Styrene maleic anhydride Polymers 0.000 claims abstract description 9
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 239000000945 filler Substances 0.000 claims abstract description 5
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 3
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 claims description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 2
- 229930188012 Bromoether Natural products 0.000 claims description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- HJCMMOODWZOXML-UHFFFAOYSA-N bromo hypobromite Chemical compound BrOBr HJCMMOODWZOXML-UHFFFAOYSA-N 0.000 claims description 2
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 claims description 2
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 239000011863 silicon-based powder Substances 0.000 claims description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- 150000002978 peroxides Chemical group 0.000 claims 2
- BSZXAFXFTLXUFV-UHFFFAOYSA-N 1-phenylethylbenzene Chemical compound C=1C=CC=CC=1C(C)C1=CC=CC=C1 BSZXAFXFTLXUFV-UHFFFAOYSA-N 0.000 claims 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims 1
- 125000001246 bromo group Chemical class Br* 0.000 claims 1
- 239000003595 mist Substances 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- BZQKBFHEWDPQHD-UHFFFAOYSA-N 1,2,3,4,5-pentabromo-6-[2-(2,3,4,5,6-pentabromophenyl)ethyl]benzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1CCC1=C(Br)C(Br)=C(Br)C(Br)=C1Br BZQKBFHEWDPQHD-UHFFFAOYSA-N 0.000 description 2
- -1 Polytetrafluoroethylene Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L35/06—Copolymers with vinyl aromatic monomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention discloses a kind of composition of high-frequency microwave copper-clad plate, the composition, in parts by weight, component includes polyphenylene oxide 26-40 parts by weight, styrene-maleic anhydride copolymer 10-20 parts by weight, iso-cyanuric acid triallyl ester 10-30 parts by weight, initiator 2-5 parts by weight, filler 5-40 parts by weight, fire retardant 5-10 parts by weight.The copper-clad plate made of the composition has low-k, low dielectric loss, meets the application demand of high-frequency microwave product.
Description
Technical field
The present invention relates to a kind of compositions of high-frequency microwave copper-clad plate.
Background technology
With the fast development of electronics industry, the performance requirement of the copper-clad plate to based on is similarly growing.And
The factor that properties of product can directly be influenced is rooted in the dielectric constant (Dk) and dielectric loss angle tangent of substrate substantially
(Df) height specifically will appear as that copper-clad plate is required to have lower dielectric constant and dielectric loss.
Polyphenylene oxide resin has higher mechanical strength and heat resistance, and light, good stability of the dimension, hydroscopicity is low, dielectric
Constant and dielectric loss are small, in wide temperature range（-150℃~200℃）And in wide frequency range（10Hz~12GHz）
Dielectric constant is stablized, and is a kind of fine resin preparing copper-clad plate.But itself it is thermoplastic resin, is used alone and directly prepares
Its temperature capacity of copper-clad plate will be very poor, meanwhile, relatively excessive molecular weight, which is also not suitable for being used alone, prepares copper-clad plate.
Polytetrafluoroethylene (PTFE) has best dielectric constant and dielectric loss factor, is common a kind of in high-frequency microwave application
Resin, but make copper-clad plate temperature with it and need to reach 350 DEG C or more, it is higher to equipment requirement, and polytetrafluoroethylene material sheet
Body has hydrophobicity and the low characteristic of polarity, and it is highly difficult to carry out hole metallization and plating to it in assist side processing, is needed
The activation pre-treatment before doing electroless copper plating to the high strong oxidizing property such as such as tetrahydrofuran, strong acid and strong base, corrosive solution is used,
There is complex process, the smell is awful, and the unfavorable factors such as serious pollution environment.
Invention content
In view of this, the main purpose of the present invention is to provide a kind of composition of high-frequency microwave copper-clad plate, made of cover copper
Plate has many advantages, such as low-k, low dielectric loss, while having good processability.
To achieve the above object, the present invention is using following technical solution：A kind of composition of high-frequency microwave copper-clad plate, packet
It has included：
A）Polyphenylene oxide 26-40 parts by weight；
B）Styrene-maleic anhydride copolymer 10-20 parts by weight；
C）Iso-cyanuric acid triallyl ester 10-30 parts by weight；
D）Initiator 2-5 parts by weight；
E）Filler 5-40 parts by weight；
F）Fire retardant 5-10 parts by weight.
The molecular structural formula of the styrene-maleic anhydride copolymer is as follows：
M in formula:n=3:1 or 4:1;
The molecular structural formula of the iso-cyanuric acid triallyl ester is as follows：
。
The iso-cyanuric acid triallyl ester（Triallylisocyanurate, abbreviation TAIC）Crosslinking agent is a kind of
Multi-functional olefinic monomer containing triazine ring, appearance colorless are mainly used for the crosslinking of various thermoplasticity and thermoset macromolecule material
It is modified, heat resistance, solvent resistance, ageing-resistant, mechanical strength and electrical property of material etc. can be improved, is the pass of high molecular material
Key functional aid.
Further, the polyphenylene oxide be a kind of low-k, low dielectric loss resin, abbreviation PPO or PPE,
Between molecular weight is 50000 ~ 80000.
Further, the initiator is benzoyl peroxide, cumyl peroxide, 2,3- dimethyl -2,3 diphenyl
Butane, dual-tert-butyl cumyl peroxide, peroxidized t-butyl perbenzoate, the peroxidating -2- ethyl acids tert-butyl ester, phenol,
At least one of divinylbenzene, bisphenol-A.
Further, the fire retardant be decabromodiphenylethane, deca-BDE, brominated epoxy resin, tetrabromobisphenol A,
At least one of hexabromocyclododecane, eight bromo ether, brominated Polystyrene.
Further, the filler is in ball-shaped silicon micro powder, melting silicon powder, aluminium hydroxide, hollow silicon microballoon, talcum powder
At least one.
The present invention has clear advantage and advantageous effect, beneficial effects of the present invention compared with prior art：1, polyphenyl
Ether resin does main body, and plank can obtain lower dielectric constant and dielectric loss, while have good machinability；
2, styrene-maleic anhydride copolymer equally has higher heat resistance and lower water imbibition；
3, iso-cyanuric acid triallyl ester comes higher Tg, better dimensional stability to strip；
4, the addition of initiator reduces the requirement of reaction condition；
5, inorganic filler is added, the inorganic fillers such as selected fused silica, aluminium oxide can reduce the coefficient of expansion, improve resistance to
It is hot, promoted fire retardancy the effects that.
Specific implementation mode
It for correlated performance described above, can be illustrated and described, be had as follows according to following examples and comparative example
Embodiment 1-18 and comparative example 1-4.
The ratio of its related substances is in terms of being 100 parts by weight by organic matters such as A1, A2, A3, B1, B2, B3, C in component
It calculates, the ratio that other components account for is the ratio of the organic matter total weight.
(A1) polyphenylene oxide（Molecular weight 60000）；
(A2) polyphenylene oxide（Molecular weight 40000）；
(A3) polyphenylene oxide（Molecular weight 90000）；
(B1) styrene-maleic anhydride copolymer (m:n=3:1)；
(B2) styrene-maleic anhydride copolymer (m:n=4:1)；
(B3) styrene-maleic anhydride copolymer (m:n=6:1)；
(C) iso-cyanuric acid triallyl ester；
(D) cumyl peroxide；
(E) fused silica；
(F) decabromodiphenylethane.
The present invention laminate base material be using above-mentioned resin combination through toluene dissolving be mixed evenly, 80 DEG C ~
100 DEG C are heated 3-5 hour, are then impregnated with, and are glued, heating, drying, pressing and etc. it is obtained, wherein pressing the copper thickness used
For 0.5 ounce (18um is thick), through hot press, control material temperature keeps the temperature 180min at 180-210 DEG C, presses.
One composition of table is calculated with parts by weight
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | |
| A1 | 36 | 40 | 26 | 60 | 40 | 10 | 40 |
| A2 | |||||||
| A3 | |||||||
| B1 | 20 | 14 | 10 | 20 | 10 | 10 | 15 |
| B2 | |||||||
| B3 | |||||||
| C | 16 | 13 | 24 | 10 | 30 | 10 | 15 |
| D | 3 | 3 | 4 | 3.5 | 3 | 2 | |
| E | 18 | 15 | 30 | 10 | 60 | 10 | |
| F | 7 | 7 | 6 | 6.5 | 10 | 7 | 18 |
Two or more performance formula of table
| Condition | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | |
| Glass fabric | Model | 1080 | 1080 | 1080 | 1080 | 1080 | 1080 | 1080 |
| Peel strength (Hoz) | N/mm | 0.8 | 0.9 | 0.8 | 1.1 | Do not cure | 0 | 0.7 |
| Cupric floats 288 DEG C of tin | min | >10 | >10 | >10 | 0 | Do not cure | 0 | 2 |
| 288 DEG C of wicking | min | >10 | >10 | >10 | 0 | Do not cure | 0 | >10 |
| Dielectric constant | 10GHz | 3.4 | 3.4 | 3.5 | 3.2 | Do not cure | 3.7 | 3.4 |
| Dielectric loss value | 10GHz | 0.0040 | 0.0038 | 0.0041 | 0.0047 | Do not cure | 0.0041 | 0.0042 |
| Conventional heavy copper copper facing | OK | OK | OK | NG | Do not cure | NG | OK | |
| Hole wall slight crack | Nothing | Nothing | Nothing | Have | Do not cure | Have | Have | |
| It is fire-retardant | V-0 | V-0 | V-0 | V-2 | Do not cure | V-0 | V-0 |
Three composition of table is calculated with parts by weight
| Embodiment 8 | Embodiment 9 | Embodiment 10 | Embodiment 11 | Embodiment 12 | Embodiment 13 | Embodiment 14 | |
| A1 | 40 | 40 | 40 | 47 | 30 | 30 | 15 |
| A2 | |||||||
| A3 | |||||||
| B1 | 14 | 30 | 20 | 20 | 40 | 40 | |
| B2 | |||||||
| B3 | |||||||
| C | 30 | 13 | 20 | 10 | 10 | 15 | |
| D | 2 | 1 | 2.5 | 3 | 10 | 4 | 3 |
| E | 20 | 25 | 20 | 10 | 21 | 15 | 30 |
| F | 8 | 7 | 7.5 | 9 | 1 | 7 |
Four or more performance formula of table
| Condition | Embodiment 8 | Embodiment 9 | Embodiment 10 | Embodiment 11 | Embodiment 12 | Embodiment 13 | Embodiment 14 | |
| Glass fabric | Model | 1080 | 1080 | Do not cure | 1080 | 1080 | 1080 | Do not cure |
| Peel strength (Hoz) | N/mm | 0.8 | 0.2 | Do not cure | 0.7 | 0.6 | 0 | Do not cure |
| Cupric floats 288 DEG C of tin | min | 3 | 0 | Do not cure | 2 | 0 | 0 | Do not cure |
| 288 DEG C of wicking | min | >10 | 0 | Do not cure | >10 | 0 | 0 | Do not cure |
| Dielectric constant | 10GHz | 3.5 | 3.5 | Do not cure | 3.3 | 3.6 | 3.7 | Do not cure |
| Dielectric loss value | 10GHz | 0.0055 | 0.0046 | Do not cure | 0.0045 | 0.0055 | 0.0047 | Do not cure |
| Conventional heavy copper copper facing | OK | OK | Do not cure | OK | NG | NG | Do not cure | |
| Hole wall slight crack | Nothing | Nothing | Do not cure | Nothing | Have | Have | Do not cure | |
| It is fire-retardant | V-1 | V-1 | Do not cure | It is not fire-retardant | V-0 | It is not fire-retardant | Do not cure |
Five composition of table is calculated with parts by weight
Six or more performance formula of table
| Condition | Embodiment 15 | Embodiment 16 | Embodiment 17 | Embodiment 18 | Comparative example 1 | Comparative example 2 | |
| Glass fabric | Model | 1080 | Do not cure | 1080 | 1080 | 1080 | 1080 |
| Peel strength (Hoz) | N/mm | 0.3 | Do not cure | 0.1 | 0.4 | 0.3 | 0.2 |
| Cupric floats 288 DEG C of tin | min | 1 | Do not cure | 0 | 2 | 0 | 1 |
| 288 DEG C of wicking | min | 3 | Do not cure | 0 | 5 | 0 | >10 |
| Dielectric constant | 10GHz | 3.6 | Do not cure | 3.4 | 3.3 | 3.5 | 3.5 |
| Dielectric loss value | 10GHz | 0.0048 | Do not cure | 0.0043 | 0.0045 | 0.0047 | 0.0053 |
| Conventional heavy copper copper facing | NG | Do not cure | NG | NG | NG | NG | |
| Hole wall slight crack | Have | Do not cure | Have | Have | Have | Have | |
| It is fire-retardant | V-2 | Do not cure | v-1 | v-1 | v-1 | v-1 |
Seven composition of table is calculated with parts by weight
Eight or more performance formula of table
| Condition | Comparative example 3 | Comparative example 4 | Comparative example 5 | Comparative example 6 | Comparative example 7 | Comparative example 8 | |
| Glass fabric | Model | 1080 | 1080 | 1080 | Do not cure | 1080 | Do not cure |
| Peel strength (Hoz) | N/mm | 0.4 | 0.6 | 0.6 | Do not cure | 0.9 | Do not cure |
| Cupric floats 288 DEG C of tin | min | 1 | 2 | 3 | Do not cure | >10 | Do not cure |
| 288 DEG C of wicking | min | 3 | >10 | 7 | Do not cure | >10 | Do not cure |
| Dielectric constant | 10GHz | 3.5 | 3.4 | 3.4 | Do not cure | 3.5 | Do not cure |
| Dielectric loss value | 10GHz | 0.0047 | 0.0046 | 0.0035 | Do not cure | 0.0039 | Do not cure |
| Conventional heavy copper copper facing | NG | NG | OK | Do not cure | OK | Do not cure | |
| Hole wall slight crack | Have | Have | Nothing | Do not cure | Nothing | Do not cure | |
| It is fire-retardant | v-1 | v-1 | v-1 | Do not cure | V-0 | Do not cure |
According to the above results it is found that the plank made using the present invention can obtain low-k, low dielectric loss is resistance to
The copper copper facing performances such as easily are sunk in hot good, drilling, are had good sheet fabrication, be disclosure satisfy that highfrequency transmission systems to printing electricity
The requirement of road plate.
The above implementation is only the section Example of the present invention, not makees any limit to the technical scope of the present invention
System, therefore every any trickle amendment, equivalent variations and modification made to the above embodiment according to the technical essence of the invention,
In the range of still falling within technical solution of the present invention.
Claims (5)
1. a kind of composition of high-frequency microwave copper-clad plate, which is characterized in that include：
Polyphenylene oxide 26-40 parts by weight；
Styrene-maleic anhydride copolymer 10-20 parts by weight；
Iso-cyanuric acid triallyl ester 10-30 parts by weight；
Initiator 2-5 parts by weight；
Filler 5-40 parts by weight；
Fire retardant 5-10 parts by weight；
The molecular structural formula of the styrene-maleic anhydride copolymer is as follows：
M in formula:n=3:1 or 4:1;
The molecular structural formula of the iso-cyanuric acid triallyl ester is as follows：
。
2. a kind of composition of high-frequency microwave copper-clad plate according to claim 1, which is characterized in that the polyphenylene oxide is one
Kind low-k, low dielectric loss resin, abbreviation PPO or PPE, between molecular weight is 50000 ~ 80000.
3. a kind of composition of high-frequency microwave copper-clad plate according to claim 1, which is characterized in that the initiator is peroxide
Change benzoyl, cumyl peroxide, -2,3 diphenyl butane of 2,3- dimethyl, dual-tert-butyl cumyl peroxide, peroxide
Change at least one of t-butyl perbenzoate, the peroxidating -2- ethyl acids tert-butyl ester, phenol, divinylbenzene, bisphenol-A.
4. a kind of composition of high-frequency microwave copper-clad plate according to claim 1, which is characterized in that the fire retardant is ten bromines
In diphenylethane, deca-BDE, brominated epoxy resin, tetrabromobisphenol A, hexabromocyclododecane, eight bromo ether, brominated Polystyrene
At least one.
5. a kind of composition of high-frequency microwave copper-clad plate according to claim 1, which is characterized in that the filler is spherical silicon
At least one of micro mist, melting silicon powder, aluminium hydroxide, hollow silicon microballoon, talcum powder.
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| CN201810491095.XA CN108727800A (en) | 2018-05-21 | 2018-05-21 | A kind of composition of high-frequency microwave copper-clad plate |
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| CN201810491095.XA CN108727800A (en) | 2018-05-21 | 2018-05-21 | A kind of composition of high-frequency microwave copper-clad plate |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109942921A (en) * | 2019-03-25 | 2019-06-28 | 郴州功田电子陶瓷技术有限公司 | A kind of high-frequency copper-clad plate composition applied to communication antenna substrate |
| CN111825943A (en) * | 2020-07-27 | 2020-10-27 | 郴州功田电子陶瓷技术有限公司 | Resin composition for carbon-hydrogen copper-clad plate |
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| CN104072684A (en) * | 2014-06-30 | 2014-10-01 | 铜陵浩荣华科复合基板有限公司 | Manufacturing method of resin for high-frequency copper clad plates |
| CN106589748A (en) * | 2016-11-30 | 2017-04-26 | 华南协同创新研究院 | Resin composition for copper foil-clad base plate in high-frequency and high-speed field and application thereof |
| CN107227015A (en) * | 2016-03-23 | 2017-10-03 | 联茂电子股份有限公司 | low dielectric material |
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| US20130252003A1 (en) * | 2012-03-23 | 2013-09-26 | Taiwan Union Technology Corporation | Resin composition and uses of the same |
| CN104072684A (en) * | 2014-06-30 | 2014-10-01 | 铜陵浩荣华科复合基板有限公司 | Manufacturing method of resin for high-frequency copper clad plates |
| CN107227015A (en) * | 2016-03-23 | 2017-10-03 | 联茂电子股份有限公司 | low dielectric material |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109942921A (en) * | 2019-03-25 | 2019-06-28 | 郴州功田电子陶瓷技术有限公司 | A kind of high-frequency copper-clad plate composition applied to communication antenna substrate |
| CN109942921B (en) * | 2019-03-25 | 2021-06-18 | 郴州功田电子陶瓷技术有限公司 | High-frequency copper-clad plate composition applied to communication antenna base material |
| CN111825943A (en) * | 2020-07-27 | 2020-10-27 | 郴州功田电子陶瓷技术有限公司 | Resin composition for carbon-hydrogen copper-clad plate |
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