CN1087134C - Integrated circuit heat dissipation method and device on printed circuit board - Google Patents
Integrated circuit heat dissipation method and device on printed circuit board Download PDFInfo
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- CN1087134C CN1087134C CN97119975A CN97119975A CN1087134C CN 1087134 C CN1087134 C CN 1087134C CN 97119975 A CN97119975 A CN 97119975A CN 97119975 A CN97119975 A CN 97119975A CN 1087134 C CN1087134 C CN 1087134C
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- Prior art keywords
- heat dissipation
- circuit board
- printed circuit
- heat
- integrated circuit
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000000463 material Substances 0.000 claims description 14
- 230000000694 effects Effects 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 235000012149 noodles Nutrition 0.000 claims 1
- 230000005855 radiation Effects 0.000 abstract description 18
- 238000005728 strengthening Methods 0.000 abstract 1
- 229920003023 plastic Polymers 0.000 description 9
- 239000004033 plastic Substances 0.000 description 9
- 238000001149 thermolysis Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation method for integrated circuit on printed circuit board includes the following steps: (1) directly pressing the bottom of a heat radiation body which has excellent heat radiation performance and plasticity on the integrated circuit; (2) conducting high-temperature heat energy generated by the integrated circuit to the heat radiation body in a direct contact mode; (3) positioning and fixing the heat radiator on the shell of the electronic equipment, so that the integrated circuit on the printed circuit board and the heat radiator and the shell form a direct contact heat transfer and radiation mode in sequence; (4) and directly conducting the heat radiator and high-temperature heat energy formed in the shell body to the shell body with excellent heat radiation performance and larger heat radiation area in a contact conduction mode and radiating the heat to the outside. The device composed of the components such as the shell, the printed circuit board, the radiator and the like is matched, and the device has the functions of strengthening the structural property, the heat radiation property, the practicability and the long service life.
Description
The present invention relates to cooling integrated method and device thereof on a kind of printed circuit board (PCB), or rather, be meant cooling integrated method and device thereof on a kind of printed circuit board (PCB) that has reinforced structure, thermal diffusivity, practicality and can increase the service life especially.
The hub (HUB) that uses in the present computer network, its material is nothing more than selecting iron or plastics for use.From actual behaviour in service; the thermal diffusivity of present irony hub is very poor; usually must above each integrated circuit, locate and be provided with fin; the high temperature that this integrated circuit (IC) is produced conducts to fin in advance; (for example the temperature rising can cause shortening useful life and the radio frequency interference of IC to use protection useful life of integrated circuit and electrical characteristic; the consideration of factors such as transmission signals) afterwards; these high temperature heat also will be dispersed in the inner space place of hub gradually, then the fan suction high temperature heat by being positioned at hub one side and discharging in the external world.Known to above-mentioned, now the hub that uses in theory must configuration fin and fan, enhance heat by this, thereby the useful life of keeping preferable electrical characteristic and prolonging integrated circuit; Yet in fact, high temperature heat is and still to be trapped in the inner space via the fan discharge of only making local suction, and the temperature that causes the inner space can not reach the designing requirement of the above-mentioned member of configuration still up to more than 70 ℃ or 80 ℃.As hub made of plastic, its thermal diffusivity is poorer, and it is more obvious to cause shortening influences such as integrated circuit useful life and radio frequency interference so similar temperature raises.In a word, these all are the significant deficiency that the present hub that uses must improve as early as possible.
The purpose of this invention is to provide and a kind ofly utilize preferable radiator material and increase area of dissipation and the cooling integrated method on the printed circuit board (PCB) in the external world of can dispelling the heat rapidly by the high temperature that direct contact conduction produces integrated circuit.
But providing a kind of modularization, another object of the present invention assembles the integrated circuit heat dissipation device on the printed circuit board (PCB) quickly and easily.
Another purpose of the present invention provides cooling integrated method and the device thereof on a kind of printed circuit board (PCB) that has reinforced structure, thermal diffusivity, practicality and can increase the service life.
Cooling integrated method on the printed circuit board (PCB) of the present invention is achieved in that described printed circuit board (PCB) is positioned and is seated in an electronic equipment internal, and but its power end turn-on power of mat uses, and the integrated circuit in user mode can produce suitable high temperature, must dispel the heat at any time, it is characterized in that: this heat dissipating method includes the following step: the bottom that (1) utilizes a fine heat radiation property and has a plastic radiator directly presses above integrated circuit; (2) conduction pattern that the high temperature heat utilization that integrated circuit produced is directly contacted is to radiator; (3) the radiator location is packed on the shell body of electronic equipment, makes that the integrated circuit on the printed circuit board (PCB) forms the biography radiating mode that directly contacts with radiator each other in regular turn with shell body; (4) with radiator and outside the high temperature heat that forms of enclosure interior be directly conducted to the bigger shell body of excellent radiation performance and area of dissipation via the contact conduction pattern and dispel the heat in the external world.
Integrated circuit heat dissipation device on the printed circuit board (PCB) of the present invention is achieved in that described printed circuit board (PCB) is positioned and is seated in an electronic equipment internal, and but its power end turn-on power of mat uses, and the integrated circuit in user mode can produce suitable high temperature, must dispel the heat at any time, it is characterized in that: this heat abstractor includes housing, printed circuit board (PCB) and radiator, wherein but printed circuit board (PCB) is positioned and is seated in electronic equipment internal and its power end turn-on power use of mat, its middle shell is by fine heat radiation property and to have plastic material made and have the inner space that is closed substantially, the its inner rim face can be put other members for the location, outer edge surface then directly is contacted with the external world and is beneficial to heat radiation, and the left and right sides face of this housing can be offered the louvre of proper number according to need; Wherein the printed circuit board (PCB) allocation is placed on the housing inner edge surface and includes integrated circuit, but its mat power end turn-on power uses, must dispel the heat at any time and the integrated circuit in user mode can produce a suitable high temperature, and this described part high temperature heat is to be the part to be dispersed in enclosure interior and can to dispel the heat by louvre; Wherein radiator is to use excellent radiation performance, and it is made and but allocation is placed on the enclosure interior space to have plastic material, its top is combined in housing inner edge surface proximal portion, the bottom then directly presses on integrated circuit, thus make the high temperature heat that is trapped in integrated circuit can be in regular turn via radiator and housing and dispel the heat in the external world.
Wherein radiator and integrated circuit are the best with the direct contact heat conduction that is face and contacts.
Wherein radiator also can be directly one-body molded on the inner edge surface of housing.
Wherein the material of radiator can be aluminum metal.
The material of its middle shell can be aluminum metal.
Wherein said housing includes: upper cover body, for being the flap body of arcuation design haply, its two side ends is formed with the positioning runner group that is symmetrical, and the printed circuit board (PCB) both sides can be located and are nested with one group of positioning runner therein, and the radiator top then is combined in the upper cover body inner edge surface; Lower cover is nested with at another group positioning runner for the flap body that is plane formula haply can be positioned; Left cap, but its positioning combination in upper cover body left side, its side forms the louvre with auxiliary heat dissipation effect; Right cap, but its positioning combination on the upper cover body right side, the same louvre that forms in its side with auxiliary heat dissipation effect.
Wherein radiator is one haply and is the flap body that face contacts with integrated circuit, and its place, bottom forms plane pressure surface.
Wherein upper cover body can be formed with the display lamp window of linear distribution at place, contiguous front side, and is pasted with the name plate of corresponding aperture on this display lamp window.
Wherein upper cover body can be respectively arranged with the connecting hole that is corresponding with the adjoiner of left and right side cap, can cooperate for affixed element to be locked in this connecting hole and to strengthen mutual joint.
Can directly utilize upper cover body and integrated circuit directly to reach packing interaction at vertical type integrated circuit or semiconductor element, and can utilize affixed element that its certain location is made it firm engagement via the upper cover body side.
Characteristics of the present invention are that heat dissipating method adopts following step in proper order: 1, utilize a fine heat radiation property and have plastic radiator bottom directly to press above integrated circuit; 2, the conduction pattern that the high temperature heat utilization that integrated circuit produced is directly contacted conducts on the radiator; 3,, make integrated circuit on the printed circuit board (PCB) form in regular turn each other with shell body and directly contact with radiator with the shell body of radiator positioning combination at electronic equipment; 4, radiator and the high temperature heat that is formed on shell body inside are directly conducted to shell body via the contact conduction pattern and dispel the heat in the external world.And cooperate to include the heat abstractor that members such as housing, printed circuit board (PCB) and radiator are formed, and the function that can have reinforced structure, thermal diffusivity, practicality and can increase the service life.
Below in conjunction with accompanying drawing and preferred embodiment, purpose of the present invention, effect and structural feature are described.
Fig. 1 is the schematic perspective view of first embodiment of the invention;
Fig. 2 is a three-dimensional exploded view of the present invention;
Fig. 3 is a cross-sectional schematic of the present invention;
Fig. 4 is another cross-sectional schematic of the present invention;
Fig. 5 is the cross-sectional schematic of second embodiment of the invention;
Fig. 6 is the cross-sectional schematic of third embodiment of the invention;
Fig. 7 is the floor map of wherein a kind of printed circuit board (PCB) 1 of the present invention;
Please consult stereogram of the present invention, three-dimensional exploded view and the cross-sectional schematic shown in Fig. 1-Fig. 4 difference simultaneously.
As seen from the figure, cooling integrated method on the printed circuit board (PCB) of the present invention, described printed circuit board (PCB) 1 can be positioned and be seated in an electronic equipment (hub that this equipment can the similar HUB of being commonly called as, or for network communication with equipment etc.) inside, and but its power end 11 turn-on powers of mat use, and the integrated circuit above the printed circuit board (PCB) 1 10 can produce suitable high temperature in user mode, (usually about more than 70 ℃ or 80 ℃) at any time must dispel the heat, wherein a kind of floor map of printed circuit board (PCB) 1 as shown in Figure 7, above-mentioned electronic equipment has a shell body 2 that is closed substantially usually, and but allocation is placed on the related elements of shell body 2 inner spaces, usually frequency of operation height or gate number are many, when density was high, the temperature that integrated circuit 10 is produced was high more.One of feature of the present invention is that this heat dissipating method includes the following step:
1, the bottom that utilizes a fine heat radiation property and have a plastic radiator 4 directly presses above integrated circuit 10; Wherein the material of this radiator 3 can be thermal conductivity good and plasticity is good and the aluminum metal that helps extrusion modling for best, and radiator 3 and integrated circuit 10 are the best with the heat conduction that is face and directly contacts with the increase area of dissipation.2, the conduction pattern of the direct contact of the high temperature heat utilization that integrated circuit 10 is produced is to radiator 3; Also be that high temperature heat very easily conducts to radiator 3 and makes its temperature be reduced to rapidly to be about 40 ℃ or following, particularly utilize the heat conduction that directly contacts.3, radiator 3 location are packed on the shell body 2 of electronic equipment, make that the integrated circuit on the printed circuit board (PCB) forms the biography radiating mode that directly contacts with radiator each other in regular turn with shell body; In like manner, the aluminum metal that the material of this shell body 2 can be that thermal conductivity is good, plasticity is good and helps extrusion modling is for best, and the two sides of shell body 2 also can be offered the louvre 20 of supplying with auxiliary heat dissipation on demand, use auxiliary heat dissipation.(because the temperature of integrated circuit 10 is not when high, only need just can reach good thermolysis and louvre 20 need be set with the very big shell body 2 of area of dissipation), and this radiator 3 also can be equivalently be molded directly within on the inner edge surface of shell body 2 with combination or the mode that is formed in one.4, be directly conducted to the bigger shell body 2 of excellent radiation performance and area of dissipation via the contact conduction pattern and dispel the heat with radiator 3 and in the inner high temperature heat that form of shell body 2 in the external world, so that cooling rapidly.Also be that high temperature heat conducts to shell body 2 via radiator 3 very simply, and via the thermolysis of the entire area of shell body 2 and dispel the heat to the external world fast, so that cooling rapidly, the heat exchange pattern that particularly utilizes directly contact and increase area of dissipation especially, can be at short notice with the temperature of shell body inner space from 70 ℃ of-80 ℃ of rapid drawdowns to about 40 ℃ or following.
Can from Fig. 1-Fig. 4, know equally as for device used in the present invention, printed circuit board (PCB) 1 in the integrated circuit heat dissipation device on the printed circuit board (PCB) of the present invention can be positioned and be seated in an electronic equipment (hub that this equipment can the similar HUB of being commonly called as, or for network communication with equipment etc.) inside, and but its power end 11 turn-on powers of mat use, and the integrated circuit above the printed circuit board (PCB) 1 10 can produce suitable high temperature in user mode, (usually about more than 70 ℃ or 80 ℃) at any time must dispel the heat, wherein a kind of floor map of printed circuit board (PCB) 1 as shown in Figure 7, above-mentioned electronic equipment has a shell body 2 that is closed substantially usually, and but allocation is placed on the related elements of shell body 2 inner spaces, usually frequency of operation height or gate number are many, when density was high, the temperature that integrated circuit 10 is produced was high more.Two of feature of the present invention is that this heat abstractor includes: housing 2 is by fine heat radiation property and to have plastic material made and have the inner space that is closed substantially, the its inner rim face can be put other members for the location, and outer edge surface then directly is contacted with the external world; Wherein the two sides of shell body 2 can be offered the louvre 20 of proper number according to need.Wherein the material of shell body can be aluminum metal.Wherein printed circuit board (PCB) 1 allocation is placed on housing 2 inner edge surfaces and includes integrated circuit at least, but its mat power end 11 turn-on powers use, and the integrated circuit 10 in user mode can must dispel the heat by suitable high temperature of generation at any time, use the useful life and the electrical characteristic of protection integrated circuit 10, and this described part high temperature heat is to be the part to be dispersed in housing 2 inner and can pass through fine heat radiation property and the bigger housing 2 of area of dissipation dispels the heat and louvre 20 auxiliary heat dissipations; Wherein radiator 3 is to use excellent radiation performance, and it is made and but allocation is placed on housing 2 inner spaces to have plastic material, its top is combined in housing 2 inner edge surface proximal portions, the bottom then directly presses on integrated circuit 10, thus make be trapped in that integrated circuit 10 produces high temperature heat can be in regular turn dispel the heat in the external world via radiator 3 and housing 2.The material of radiator 3 can be with thermal conductivity good and plasticity is good and the aluminum metal that is beneficial to extrusion modling (or pull moulding) for best, and this radiator 3 and integrated circuit 10 are the best with the heat conduction that directly is face and contacts to increase area of dissipation, and, radiator 3 is one haply and is the flap body that face contacts with integrated circuit 10, its place, bottom is formed with plane substantive pressure surface 30, use the contact-making surface that increases with integrated circuit 10, thereby promote thermolysis.
Include as for above-mentioned housing: upper cover body 21, for being the flap body of arcuation design haply, its two side ends is formed with the positioning runner group 210 that is symmetrical, has the firm rapidly effect of assembling (show among the figure and have two groups of positioning runners at least).Printed circuit board (PCB) 1 both sides can be located and are nested with one group of positioning runner therein, radiator 3 tops then are entrenched in the caulking groove 211 of upper cover body 21 inner edge surfaces, wherein upper cover body 21 can be formed with the display lamp window 212 of linear distribution at place, contiguous front side, and is pasted with the name plate 213 of corresponding aperture on this display lamp window 212.Certainly radiator 3 also can be equivalently be molded directly within on the inner edge surface of shell body 2 with combination or the mode that is formed in one.Lower cover 22 is nested with another group positioning runner in positioning runner group 210 for the flap body that is plane formula haply can be positioned; Left cap 23, but positioning combination in upper cover body 21 left sides, its side can be according to need and form the louvre 20 with auxiliary heat dissipation effect; Right cap 24, positioning combination are on upper cover body 21 right sides, and its side can form the louvre 20 with auxiliary heat dissipation effect equally according to need.Wherein upper cover body 21 can be respectively arranged with the connecting hole 4 that is corresponding with the adjoiner of left and right side cap 23,24, can cooperate for affixed element 5 to be locked in this connecting hole 4 and to strengthen mutual joint, has the effect of reinforced structure.And by among the figure as can be known, affixed element 5 is after locking, its end is hidden in the connect apertures 4 and outside can not being revealed in, thereby has safe and practical effect, more shows the integrality of the present invention to each member designs by this.
In addition as can be known from the cross-sectional schematic of second embodiment of the invention shown in Figure 5, radiator of the present invention also can be molded directly within on the inner edge surface of shell body with integrated mode equivalently, as shown in the figure, upper cover body 60 is the flap body of arcuation design equally, its two side ends is formed with the positioning runner group 61 that is symmetrical, has assembling firm effect rapidly, printed circuit board (PCB) 70 both sides can be located and are nested with one group of positioning runner therein, radiator 80 then can be molded directly within the inner edge surface of upper cover body 60 equivalently in one-body molded mode, and, this radiator 80 and integrated circuit 71 are the best with the heat conduction that directly is face and contacts to increase area of dissipation, and radiator 80 is one haply and is the flap body that face contacts with integrated circuit 71, its place, bottom is formed with plane substantive pressure surface 81, use the contact area that increases with integrated circuit 71, thereby can promote thermolysis.Upper cover body 60 can be formed with the display lamp window 62 of linear distribution at place, contiguous front side, and above this display lamp window 62 can cooperate a name that offers corresponding aperture a plate 63 is fitted in, also be that radiator 80 also can be molded directly within on the inner edge surface of shell body in integrated mode equivalently.
In addition as can be known from the cross-sectional schematic of third embodiment of the invention shown in Figure 6, integrated circuit 91 (or being semiconductor element) for vertical type, also can directly utilize upper cover body 90 directly to reach with integrated circuit 91 in fact combines, and in order to reach the effect of certain firm engagement, equally also can be same as the previously described embodiments, the affixed element that utilizes similar screw from upper cover body 90 dual-sides is with its certain location.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97119975A CN1087134C (en) | 1997-10-31 | 1997-10-31 | Integrated circuit heat dissipation method and device on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97119975A CN1087134C (en) | 1997-10-31 | 1997-10-31 | Integrated circuit heat dissipation method and device on printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1216892A CN1216892A (en) | 1999-05-19 |
| CN1087134C true CN1087134C (en) | 2002-07-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97119975A Expired - Fee Related CN1087134C (en) | 1997-10-31 | 1997-10-31 | Integrated circuit heat dissipation method and device on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1087134C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101082284B1 (en) * | 2009-09-15 | 2011-11-09 | 삼성모바일디스플레이주식회사 | Flat panel display |
| CN105324018B (en) * | 2015-12-05 | 2017-08-25 | 重庆元创自动化设备有限公司 | Integrated circuit heat radiating device special |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87107471A (en) * | 1986-12-16 | 1988-06-29 | 默林·格伦 | Static converters dedicated to uninterruptible power supply systems |
| CN2254616Y (en) * | 1995-11-29 | 1997-05-21 | 彭新治 | Flip-chip radiating electronic ballast |
-
1997
- 1997-10-31 CN CN97119975A patent/CN1087134C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87107471A (en) * | 1986-12-16 | 1988-06-29 | 默林·格伦 | Static converters dedicated to uninterruptible power supply systems |
| CN2254616Y (en) * | 1995-11-29 | 1997-05-21 | 彭新治 | Flip-chip radiating electronic ballast |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1216892A (en) | 1999-05-19 |
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