Conveying device based on FPC electroplating
Technical Field
The invention relates to the field of machinery, in particular to a conveying device based on FPC electroplating.
Background
A flexible printed circuit board (FPC, flexible Printed Circuit) is a flexible printed circuit board made of polyimide or polyester film as a base material, which has high reliability and is excellent. The wiring density is high, the weight is light, the thickness is thin, the flexibility is good.
In general, a substrate for manufacturing an FPC may be an FPC substrate, which may include a roll-shaped FPC substrate and a sheet-shaped FPC substrate, and the roll-shaped FPC substrate is sleeved on an unwinding roller, and the other end thereof is fixed on a winding roller. When the rolled FPC substrate is processed, the rolled FPC substrate is unfolded and then processed when the unwinding roller and the winding roller are required to rotate simultaneously.
Currently, the FPC-plating-based apparatus is only suitable for a rolled FPC substrate, and there is no apparatus for carrying the FPC substrate.
Disclosure of Invention
The invention provides a conveying device based on FPC electroplating, which is used for effectively conveying a flaky FPC substrate.
The invention relates to a carrying device based on FPC electroplating, which comprises:
The device comprises a horizontal input mechanism, a first posture adjusting mechanism, a chain type conveying mechanism, a second posture adjusting mechanism and a horizontal output mechanism;
The horizontal input mechanism is used for conveying the flaky FPC substrates to the first posture adjusting mechanism one by one;
the first posture adjusting mechanism is used for overturning the FPC substrate in the horizontal state to be in the vertical state;
the chain type conveying mechanism is used for conveying the FPC substrate to the second posture adjusting mechanism;
the second posture adjusting mechanism is used for turning the FPC substrate in a vertical state into a horizontal state, and outputting the FPC substrate by the horizontal output mechanism for subsequent processing;
The chain transportation mechanism further comprises a clamping assembly for clamping the FPC substrate;
The clamping assembly comprises a main body and left and right clamps, and an elastic piece for enabling the left and right clamps to be opened and closed is arranged between the main body and the upper parts of the left and right clamps;
And in the process that the chain type conveying mechanism conveys the FPC substrates to the second posture adjusting mechanism, the FPC substrates are immersed into liquid in the electroplating bath all the time, and the interval distance between the FPC substrates is kept between 2 and 12 mm.
Alternatively to this, the method may comprise,
The clamping assembly is made of stainless steel.
Alternatively to this, the method may comprise,
The clamp is bent into a U shape by stainless steel plates.
Alternatively to this, the method may comprise,
The upper outer sides of the left clamp and the right clamp are provided with rotatable rollers;
the chain type conveying mechanism also comprises an opening and closing mechanism;
The opening and closing mechanism includes: left and right guide rails provided along a carrying direction for moving the rollers of the clamping assembly between the left and right guide rails;
the left guide rail and the right guide rail form a bent part at a preset position of the plating bath, the bent part reduces the distance between the left guide rail and the right guide rail, and the left guide rail and the right guide rail are used for enabling the upper ends of the left clamp and the right clamp to generate opposite acting force after the rollers enter the bent part, compressing the springs and causing the lower ends of the left clamp and the right clamp to open.
Alternatively to this, the method may comprise,
The tips of the left and right clamps are detachably mounted with contact portions for contacting the FPC substrate.
Alternatively to this, the method may comprise,
The contact part is connected with the left clamp and the right clamp in a sliding way.
Alternatively to this, the method may comprise,
The main body is made of reinforced plastic;
the main body is connected with the contact part by a copper plate and a coated copper wire conductor;
The rollers are made of stainless steel or engineering plastics and other plastic resins;
the contact portion is covered with rubber, soft plastic or resin except for a contact portion with the PFC substrate.
Alternatively to this, the method may comprise,
The chain conveyor mechanism further includes: a plurality of connecting members provided between the left and right driven sprockets, the drive sprocket, the left and right conveying chains to be wound, and the left and right conveying chains;
A clamping assembly is mounted on the connecting member.
Alternatively to this, the method may comprise,
The connecting part is made of metal, and when the connecting part is contacted with a preset cathode rod through the upper part of the electroplating bath, the clamping assembly, the cathode rod and the anode and the FPC substrate form current.
Alternatively to this, the method may comprise,
The distance between the left conveying chain and the right conveying chain is larger than the width of the electroplating bath.
From the above technical solutions, the embodiment of the present invention has the following advantages:
The invention provides a conveying device based on FPC electroplating, which comprises a horizontal input mechanism, a first posture adjusting mechanism, a chain type conveying mechanism, a second posture adjusting mechanism and a horizontal output mechanism; the horizontal input mechanism is used for conveying flaky FPC substrates to the first posture adjusting mechanism one by one; the first posture adjusting mechanism is used for overturning the FPC substrate in the horizontal state to be in the vertical state; the chain type conveying mechanism is used for conveying the FPC substrate to the second posture adjusting mechanism; the second posture adjusting mechanism is used for turning the FPC substrate in a vertical state into a horizontal state, and outputting the FPC substrate by the horizontal output mechanism for subsequent processing; the chain type conveying mechanism further comprises a clamping assembly for clamping the FPC substrate; the clamping assembly comprises a main body and left and right clamps, and an elastic piece which is used for enabling the left and right clamps to be opened and closed is arranged between the main body and the upper parts of the left and right clamps; and the chain type conveying mechanism conveys the FPC substrates to the second posture adjusting mechanism, the FPC substrates are immersed into the liquid in the electroplating bath all the time, and the interval distance between the FPC substrates is kept between 2 and 12 mm. In the prior art, the carrying of the FPC substrates cannot be realized, the flaky FPC substrates are firstly transported to a first posture adjusting mechanism one by one through a horizontal input mechanism, then the FPC substrates in a horizontal state are turned to a vertical state through the first posture adjusting mechanism, then the FPC substrates are transported to a second posture adjusting mechanism through a chain type transporting mechanism, then the FPC substrates in the vertical state are turned to the horizontal state through the second posture adjusting mechanism, and finally the FPC substrates are output by a horizontal output mechanism for subsequent processing. Compared with the prior art, the invention realizes the effective carrying of the flaky FPC substrate.
Further, the chain transport mechanism further comprises a clamping assembly for clamping the FPC substrate; the clamping assembly comprises a main body and left and right clamps, and an elastic piece for enabling the left and right clamps to be opened and closed is arranged between the main body and the upper parts of the left and right clamps; and in the process that the chain type conveying mechanism conveys the FPC substrates to the second posture adjusting mechanism, the FPC substrates are immersed into liquid in the electroplating bath all the time, and the interval distance between the FPC substrates is kept between 2 and 12 mm. Thereby serving to better fix the FPC substrate and control the time of plating.
Drawings
FIG. 1 is an enlarged view of a portion of an embodiment of an electroplating apparatus according to the present invention;
FIG. 2 is a schematic view of a clamping assembly according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a handling device according to an embodiment of the present invention;
Fig. 4 is a schematic structural view of a first embodiment of an opening and closing mechanism of a clamping assembly of a handling device according to an embodiment of the present invention;
Fig. 5 is a schematic structural view of a second embodiment of an opening and closing mechanism of a clamping assembly of a handling device according to an embodiment of the present invention.
The specific embodiment is as follows:
The invention provides a conveying device based on FPC electroplating, which comprises a horizontal input mechanism, a first posture adjusting mechanism, a chain type conveying mechanism, a second posture adjusting mechanism and a horizontal output mechanism; the horizontal input mechanism is used for conveying flaky FPC substrates to the first posture adjusting mechanism one by one; the first posture adjusting mechanism is used for overturning the FPC substrate in the horizontal state to be in the vertical state; the chain type conveying mechanism is used for conveying the FPC substrate to the second posture adjusting mechanism; the second posture adjusting mechanism is used for turning the FPC substrate in a vertical state into a horizontal state, and outputting the FPC substrate by the horizontal output mechanism for subsequent processing; the chain type conveying mechanism further comprises a clamping assembly for clamping the FPC substrate; the clamping assembly comprises a main body and left and right clamps, and an elastic piece which is used for enabling the left and right clamps to be opened and closed is arranged between the main body and the upper parts of the left and right clamps; and the chain type conveying mechanism conveys the FPC substrates to the second posture adjusting mechanism, the FPC substrates are immersed into the liquid in the electroplating bath all the time, and the interval distance between the FPC substrates is kept between 2 and 12 mm. In the prior art, the carrying of the FPC substrates cannot be realized, the flaky FPC substrates are firstly transported to a first posture adjusting mechanism one by one through a horizontal input mechanism, then the FPC substrates in a horizontal state are turned to a vertical state through the first posture adjusting mechanism, then the FPC substrates are transported to a second posture adjusting mechanism through a chain type transporting mechanism, then the FPC substrates in the vertical state are turned to the horizontal state through the second posture adjusting mechanism, and finally the FPC substrates are output by a horizontal output mechanism for subsequent processing. Compared with the prior art, the invention realizes the effective carrying of the flaky FPC substrate.
Further, the chain transport mechanism further comprises a clamping assembly for clamping the FPC substrate; the clamping assembly comprises a main body and left and right clamps, and an elastic piece for enabling the left and right clamps to be opened and closed is arranged between the main body and the upper parts of the left and right clamps; and in the process that the chain type conveying mechanism conveys the FPC substrates to the second posture adjusting mechanism, the FPC substrates are immersed into liquid in the electroplating bath all the time, and the interval distance between the FPC substrates is kept between 2 and 12 mm. Thereby serving to better fix the FPC substrate and control the time of plating.
The above-described handling device is described below with examples in specific applications:
The handling device 70 has a clamping assembly 170 for clamping the FPC substrate. The carrier device 70 carries the FPC substrate at a speed of 0.5m/min to 3.0m/min, preferably 1.0 m/min. For example, when the FPC substrate is transported at a speed of 1.0m/min, it takes 3 minutes to reach the inlet portion 61 of the electrolytic plating tank 60 from the outlet portion 42 of the electroless plating tank 40. If the time is about 3 minutes, the electroless plating layer C will not oxidize even if the FPC substrate passes through water.
Fig. 2 is a schematic structural view of the clamping assembly 170. The clamp assembly 170 includes a T-shaped main body 171 and left and right clamps 172, and an elastic member such as a spring 174 is provided between the main body 171 and upper portions of the left and right clamps 172, and the left and right clamps 172 can be opened and closed freely.
The roller 175 mounted on the upper outer side of the clamp 172 is freely rotatable, and the contact portion 173 for holding the FPC substrate mounted on the tip of the clamp 172 is freely attachable or detachable, or is freely slidable. The clamping assembly 170 is typically made of energizable stainless steel, but the body 171 may be made of reinforced plastic. When the main body 171 made of reinforced plastic is used, the main body 171 and the contact portion 173 are connected by a copper plate, a conductor such as a coated copper wire, or the like, and can be energized. The clamp 172 is bent in a U-shape from a stainless steel plate. The roller 175 may be made of stainless steel, but is preferably made of plastic resin such as engineering plastic for weight saving. The contact portion 173 is covered with a resin such as rubber or soft plastic (except for the contact point with the FPC substrate).
As described above, the contact portion 173 is attachable to and detachable from, or freely slidable from, the clip assembly 170, and thus can be easily used as a clip assembly corresponding to the size and shape of the FPC substrate, such as the width and length thereof.
Fig. 3 is a schematic view of the conveying device 70. The conveying device 70 moves the clamp assembly 170 for holding the FPC substrate, and is composed of a plurality of connection members 272 (see fig. 1) provided between left and right driven sprockets (not shown) and a drive sprocket 71 provided above the inlet side of the pretreatment unit 30 and above the outlet side of the electrolytic bath 60, and the left and right conveying chains 271 and 271 wound therearound.
The attachment member 272 has mounted thereon the clamping assembly 170. In addition, the connection member 272 is made of metal, and is brought into contact with the cathode rod 69 provided in the electrolytic plating tank 60 when passing over the electrolytic plating tank 60, and the current flowing between the anode 65 and the FPC substrate is grounded to the outside through the clamp assembly 170 and the cathode rod 69.
The distance between the left and right conveyance chains 271 may be larger than the width of the electrolytic plating tank 60. After the carrying chain 271 is provided at this position, even if foreign matter such as dust, metal powder, grease, etc., falls onto the carrying chain 271, the plating solution of the electrolytic plating tank 60 is not mixed.
Fig. 5 is a schematic view of the opening and closing mechanism 275 of the clamp assembly 170 in the conveying device 70.
An opening and closing mechanism 275 for opening and closing the clamp assembly 170 in the electrolytic plating tank 60 is described herein. The electroless plating vessel 40, the pretreatment unit 30, and the washing tank of the washing unit 50 may have the same structure.
The opening and closing mechanism 275 is composed of "left and right guide rails 276 provided at substantially the same height as the rollers 175 of the clamp unit 170 and along the conveying direction". The guide rail 276 is formed with a curved portion 276A at a predetermined position of the electrolytic plating tank 60 to reduce the left-right spacing. When the roller 175 of the movable clamp assembly 170 abuts the curved portion 276A, the clamp 172 is opened and the FPC substrate is released, exceeding the force of the spring 174. Also, after the clamping assembly 170 passes through the bending portion 276A, the clamp is closed again due to the elastic force of the spring 174, clamping the FPC substrate. Such an opening and closing mechanism 275 can arbitrarily set the opening and closing position of the clamp assembly 170. However, in the above embodiment, the opening/closing mechanism 275 bends the guide rail 276 to form the bent portion 276A, but as shown in fig. 5, the opening/closing mechanism 275 may be composed of a linear guide rail 277 and a bending member 278. Such a bending member 278 may be added with an open and closed position later.
It will be clear to those skilled in the art that, for convenience and brevity of description, reference may be made to the corresponding process in the foregoing method embodiment for the specific working process of the apparatus described above, which is not described herein again. In the several embodiments provided by the present application, it should be understood that the disclosed apparatus may be implemented in other ways.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.