CN108601232A - A kind of laser ablation PCB circuit board line pattern processing technology - Google Patents
A kind of laser ablation PCB circuit board line pattern processing technology Download PDFInfo
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- CN108601232A CN108601232A CN201810407975.4A CN201810407975A CN108601232A CN 108601232 A CN108601232 A CN 108601232A CN 201810407975 A CN201810407975 A CN 201810407975A CN 108601232 A CN108601232 A CN 108601232A
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- glue
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- laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of laser ablation PCB circuit board line pattern processing technology, includes the following steps, S1：Reserved circuit plate base material substrate；And surface cleaning is carried out to board substrate substrate；Pass through acid or alkaline solution, light water or pure water, the Desmear cleaning wire bodies of Plasma plasma gas or potassium permanganate proportioning carry out the surface of board substrate substrate to clean/polish-brush action, and carry out roughing in surface using abrasive blasting method or mechanical milling method, in the selection of specific curing mode, cured using solvent type, room temperature curing, heat cure and ultraviolet light solidification, the corresponding filling mode of filling process is pressed using Vacuum Heat, hot pressing, it impregnates, showering, dipping, coating, printing, injection, sputtering and electrophoresis and anode oxidation process, good processing effect can be reached, the application technological process is simple, technique effect is good.
Description
[technical field]
High, colloid removal that the present invention relates to laser ablation PCB circuit board technical fields more particularly to a kind of processing precision
The good laser ablation PCB circuit board line pattern processing technology of effect.
[background technology]
The flexible FPC circuits made at present of the materials such as PI and LCP, using in traditional PCB/FPC production procedures
The preparative layer mode of " yellow light " preparative layer, " exposure " " development " " etching " can not obtain thinner circuit, and work as conductor metal layer
In " line-spacing (Line Space) " than the thickness of conductor wire body " line width (Linewidth) " and conductor also than it is small in the case of,
Traditional etching (Ecthing) occur can not effectively etch totally, or etching is excessive, excessive, leads to that client cannot be obtained
Satisfied circuit.
The molding of traditional etching method, circuit does not accomplish that up and down (circuit top can be thinner than following circuit, forms ladder straight
Shape causes signal to interfere up and down) and circuit circular arc R is excessive around the corner, can not accomplish that corner is straight, to influence line
The loss of road signal.
How process could be effectively saved, reduce extra process, improve the density and precision of circuit forming, it is final real
The making of existing ultra fine-line, is that those skilled in the art often considers the problems of, also carried out accordingly a large amount of research and development and
Experiment, and achieve preferable achievement.
[invention content]
To overcome the problems of prior art, a kind of processing precision of present invention offer is high, colloid removal effect is good
Laser ablation PCB circuit board line pattern processing technology.
The scheme that the present invention solves technical problem is to provide a kind of laser ablation PCB circuit board line pattern processing technology,
Include the following steps,
S1：Reserved circuit plate base material substrate；And surface cleaning is carried out to board substrate substrate；It is molten by acid or alkalinity
The Desmear cleaning wire bodies of liquid, light water or pure water, Plasma plasma gas or potassium permanganate proportioning serve as a contrast board substrate
The surface at bottom carries out cleaning/polish-brush action, and carries out roughing in surface using abrasive blasting method or mechanical milling method；
S2：Carry out the combination of board substrate substrate and line pattern conductor layer；Preparation conducting adhesive glue, and by heat conduction
Glue (solid, semi-solid preparation shape or liquid) is bonded by coating, heating pressing, immersion, printing process means, makes board substrate
Substrate is bonded with line pattern conductor layer；The line pattern conductor layer is by using part removal foil spare in advance
Material/plank unnecessary portion (such as common PCB/FPC wet etchings are punched with CNC or mold) gained afterwards, or using not having
There is finished complete foil/plank；
S3：Line pattern conductor layer laser ablation:Using laser beam to unwanted place in line pattern conductor layer
It is etched and is removed using laser beam, laser forms the circuit and figure of needs when etching away unwanted line pattern conductor material
Shape；Meanwhile after laser ablation, again by PCB line pattern production technologies, gone again using wet etching (acidity and alkalinity)
Except the unwanted some materials of part；
S4：After the completion of step S3, etched surface is cleaned；By acid or alkaline solution, light water or pure water,
The Desmear cleaning wire bodies of Plasma plasma gas or potassium permanganate proportioning are to laser ablation rear surface and the groove body after etching
It inside carries out cleaning/polish-brush action, and utilizes the oxide and carbon residue after abrasive blasting method or mechanical milling method removal laser ablation
Substance；
S5：Laser ablation groove body is filled and is cured；The corresponding curing mode of the solidification process includes solvent type
Solidification, room temperature curing, heat cure and ultraviolet light solidification；The corresponding filling mode of the filling process includes Vacuum Heat pressing, heat
Pressing, immersion, showering, dipping, coating, printing, injection, sputtering and electrophoresis and anode oxidation process；
S6：The protective layer being combined with line pattern conductor layer table is formed in line pattern conductor layer surface；
S7：Etching removal board substrate substrate；Concrete mode includes being etched using acid or alkalinity wet method
It removes the board substrate substrate of bottom, irradiated using UV, generate living radical or ion radical, to cause polymerization, crosslinking
And graft reaction, colloidal adhesive lose viscous force, and then remove base material substrate, by heating (hot pressing, baking oven baking to product
Roasting, hot wind is blown, heating platform, hot-water soak etc.), so that the adhesive glue on base material substrate is lost viscous force, and then remove base material substrate
Base material substrate is either removed by direct craft or tool stress；
S8：Remove board substrate substrate floor glue；
S9：Working process is completed.
Preferably, the conducting adhesive glue in the step S2 is using epoxy resin glue, acrylic acid series glue, acrylic
Glue, organic silica gel glue, inorganic silica gel glue, TPI glue, organic high-temp glue or inorganic high-temp glue (phenolic resin glue, ureaformaldehyde
Resin glue, heatproof epoxy glue, polyimides glue, thermoplastic polyimide glue)；And the thickness range of conducting adhesive glue layer is
2um-2000um。
Preferably, the board substrate substrate include copper, aluminium, stainless steel, glass, silicon chip, quartz, aluminium oxide ceramics,
Aluminium nitride ceramics, glass fibre, FR4, carbon fiber, timber, macromolecule Pet, PI (polyimides, Polyimide), TPI, LCP,
Peek, PPS, PEN, PTFE, PVC, PC, ABS high-molecular organic material and inorganic polymer；And the material of board substrate substrate
Thickness range is 1um-5000um.
Preferably, the laser employed in the step S3 is subnanosecond, picosecond, nanosecond, femtosecond or excimer laser
Device.
Preferably, it is 492nm to the green light light between 577nm that the laser employed in the step S3, which is wave-length coverage,
Source laser device, wave-length coverage be 300nm to the UV purple lights light source laser between 400nm, wave-length coverage be 622nm to 2500nm
Between CO2Infrared light supply laser, wave-length coverage are 200nm to the dark purple radiant lasers of UV or 10nm between 299nm
To the EUV light source laser between 199nm；Laser cutting depth bounds are 1um-5000um.
Preferably, the line pattern conductor layer includes copper, aluminium, silicon, tin, gold, silver or nickel foil material and sheet material；And line map
The thickness range of shape conductor layer is 1um-5000um.
Preferably, epoxy resin glue, acrylic acid series glue, acrylic system are used to the filling of groove body in the step S5
Glue, organic silica gel glue, inorganic silica gel glue, TPI glue, polymeric liquid crystal copolymer (Liquid Crystal
) or polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene) Polymer；Fill glue thickness range be 2um extremely
5000um；Either using coatings (insulating coatings) and PCB three-proofing coatings (Conformal Coating)
Carry out the filling of groove body；The coatings (insulating coatings) and PCB three-proofing coatings (Conformal
Coating it) is made of base-material, fire retardant, curing agent, color stuffing and solvent, and base-material includes polyester-imide, polyvinyl alcohol contracting first
Aldehyde, poly- amino formicester, polyester, polyamidoimide, PEI (polyimides polyester Polyester-imide), UEW (polyamine group formic acid
Fat Polyester-thane), nylon, aromatic polyamides, polyamide, epoxy (phenol oxygen) and aromatic polyamides, solderability polyester it is sub-
Amine paint, gather cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, span come phthalimide resin, organic siliconresin, propylene
Acid esters, silicone, polyurethane, organosilicon, polyurethane, acetal tree refer to, neoprene, polyvinyl chloride, polybutene or butadiene-styrene rubber.
Preferably, in the step S6 use hot pressing and printing technique, line pattern conductor layer surface bond with
One layer of insulation material layer is coated, which includes PI (polyimides Polyimide)+glue (epoxy resin or propylene
Acid and acrylic system), thermoplastic polyimides (thermoplastic polyimide), PP, FR4, PPS, PEN, PEEK,
Polymeric liquid crystal copolymer (Liquid Crystal Polymer) or polytetrafluoroethylene (PTFE) (Poly tetra
Fluoroethylene) material；And the thickness range of the insulation material layer is 5 microns to 250 microns.
Preferably, the mode that base material substrate surface glue removes in the step S8 includes by erosion acid or that alkalinity is slight
Quarter, Plasma plasmas, liquid form colloid and destroy, and fall off；Either the glue of base material substrate surface is carried out using laser
The etching of large area, and then remove colloid；Abrasive blasting method or mechanical milling method are either used, by the colloid of base material substrate surface
It is removed；Either using the principle of UV lamp irradiation, to light-sensitive emulsion and then cause polymerization, crosslinking and graft reaction, colloid is viscous
Mixture etc. loses viscous force, and then removes colloid；Either by being heated to product, (hot pressing, baking oven baking, hot wind blow, heat
Platform, hot-water soak etc.), so that the glue of substrate surface is generated and falls off.
Compared with prior art, a kind of laser ablation PCB circuit board line pattern processing technology of the present invention is by using sharp
Photoengraving line pattern conductor layer, and laser ablation groove body is filled and is cured, in the selection of specific curing mode, adopt
Cured with solvent type solidification, room temperature curing, heat cure and ultraviolet light, the corresponding filling mode of filling process uses vacuum hotpressing
Conjunction, hot pressing, immersion, showering, dipping, coating, printing, injection, sputtering and electrophoresis and anode oxidation process can reach very
Good processing effect, the application technological process is simple, and technique effect is good.
[description of the drawings]
Fig. 1 and Fig. 2 is a kind of flow diagram of laser ablation PCB circuit board line pattern processing technology of the present invention.
[specific implementation mode]
To make the purpose of the present invention, technical solution and advantage be more clearly understood, with reference to the accompanying drawings and embodiments, to this
Invention is further elaborated.It should be appreciated that specific embodiment described herein is used only for explaining the present invention, not
For limiting the invention.
It please refers to Fig.1 and Fig. 2, a kind of laser ablation PCB circuit board line pattern processing technology 1 of the present invention, including following
Step,
S1：Reserved circuit plate base material substrate；And surface cleaning is carried out to board substrate substrate；It is molten by acid or alkalinity
The Desmear cleaning wire bodies of liquid, light water or pure water, Plasma plasma gas or potassium permanganate proportioning serve as a contrast board substrate
The surface at bottom carries out cleaning/polish-brush action, and carries out roughing in surface using abrasive blasting method or mechanical milling method；
S2：Carry out the combination of board substrate substrate and line pattern conductor layer；Preparation conducting adhesive glue, and by heat conduction
Glue (solid, semi-solid preparation shape or liquid) is bonded by coating, heating pressing, immersion, printing process means, makes board substrate
Substrate is bonded with line pattern conductor layer；The line pattern conductor layer is by using part removal foil spare in advance
Material/plank unnecessary portion (such as common PCB/FPC wet etchings are punched with CNC or mold) gained afterwards, or using not having
There is finished complete foil/plank；
S3：Line pattern conductor layer laser ablation:Using laser beam to unwanted place in line pattern conductor layer
It is etched and is removed using laser beam, laser forms the circuit and figure of needs when etching away unwanted line pattern conductor material
Shape；Meanwhile after laser ablation, again by PCB line pattern production technologies, gone again using wet etching (acidity and alkalinity)
Except the unwanted some materials of part；
S4：After the completion of step S3, etched surface is cleaned；By acid or alkaline solution, light water or pure water,
The Desmear cleaning wire bodies of Plasma plasma gas or potassium permanganate proportioning are to laser ablation rear surface and the groove body after etching
It inside carries out cleaning/polish-brush action, and utilizes the oxide and carbon residue after abrasive blasting method or mechanical milling method removal laser ablation
Substance；
S5：Laser ablation groove body is filled and is cured；The corresponding curing mode of the solidification process includes solvent type
Solidification, room temperature curing, heat cure and ultraviolet light solidification；The corresponding filling mode of the filling process includes Vacuum Heat pressing, heat
Pressing, immersion, showering, dipping, coating, printing, injection, sputtering and electrophoresis and anode oxidation process；
S6：The protective layer being combined with line pattern conductor layer table is formed in line pattern conductor layer surface；
S7：Etching removal board substrate substrate；Concrete mode includes being etched using acid or alkalinity wet method
It removes the board substrate substrate of bottom, irradiated using UV, generate living radical or ion radical, to cause polymerization, crosslinking
And graft reaction, colloidal adhesive lose viscous force, and then remove base material substrate, by heating (hot pressing, baking oven baking to product
Roasting, hot wind is blown, heating platform, hot-water soak etc.), so that the adhesive glue on base material substrate is lost viscous force, and then remove base material substrate
Base material substrate is either removed by direct craft or tool stress；
S8：Remove board substrate substrate floor glue；
S9：Working process is completed.
The application is filled and cures by using laser ablation line pattern conductor layer, and to laser ablation groove body,
In the selection of specific curing mode, cured using solvent type solidification, room temperature curing, heat cure and ultraviolet light, filling process pair
The filling mode answered uses Vacuum Heat pressing, hot pressing, immersion, showering, dipping, coating, printing, injection, sputtering and electrophoresis
With anode oxidation process, good processing effect can be reached, the application technological process is simple, and technique effect is good.
Preferably, the conducting adhesive glue in the step S2 is using epoxy resin glue, acrylic acid series glue, acrylic
Glue, organic silica gel glue, inorganic silica gel glue, TPI glue, organic high-temp glue or inorganic high-temp glue (phenolic resin glue, ureaformaldehyde
Resin glue, heatproof epoxy glue, polyimides glue, thermoplastic polyimide glue)；And the thickness range of conducting adhesive glue layer is
2um-2000um。
Preferably, the board substrate substrate include copper, aluminium, stainless steel, glass, silicon chip, quartz, aluminium oxide ceramics,
Aluminium nitride ceramics, glass fibre, FR4, carbon fiber, timber, macromolecule Pet, PI (polyimides, Polyimide), TPI, LCP,
Peek, PPS, PEN, PTFE, PVC, PC, ABS high-molecular organic material and inorganic polymer；And the material of board substrate substrate
Thickness range is 1um-5000um.
Preferably, the laser employed in the step S3 is subnanosecond, picosecond, nanosecond, femtosecond or excimer laser
Device.
Preferably, it is 492nm to the green light light between 577nm that the laser employed in the step S3, which is wave-length coverage,
Source laser device, wave-length coverage be 300nm to the UV purple lights light source laser between 400nm, wave-length coverage be 622nm to 2500nm
Between CO2Infrared light supply laser, wave-length coverage are 200nm to the dark purple radiant lasers of UV or 10nm between 299nm
To the EUV light source laser between 199nm；Laser cutting depth bounds are 1um-5000um.
Preferably, the line pattern conductor layer includes copper, aluminium, silicon, tin, gold, silver or nickel foil material and sheet material；And line map
The thickness range of shape conductor layer is 1um-5000um.
Preferably, epoxy resin glue, acrylic acid series glue, acrylic system are used to the filling of groove body in the step S5
Glue, organic silica gel glue, inorganic silica gel glue, TPI glue, polymeric liquid crystal copolymer (Liquid Crystal
) or polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene) Polymer；Fill glue thickness range be 2um extremely
5000um；Either using coatings (insulating coatings) and PCB three-proofing coatings (Conformal Coating)
Carry out the filling of groove body；The coatings (insulating coatings) and PCB three-proofing coatings (Conformal
Coating it) is made of base-material, fire retardant, curing agent, color stuffing and solvent, and base-material includes polyester-imide, polyvinyl alcohol contracting first
Aldehyde, poly- amino formicester, polyester, polyamidoimide, PEI (polyimides polyester Polyester-imide), UEW (polyamine group formic acid
Fat Polyester-thane), nylon, aromatic polyamides, polyamide, epoxy (phenol oxygen) and aromatic polyamides, solderability polyester it is sub-
Amine paint, gather cruel resin, poly-vinegar phthalimide resin, poly- ammonia cruel, epoxy resin, span come phthalimide resin, organic siliconresin, propylene
Acid esters, silicone, polyurethane, organosilicon, polyurethane, acetal tree refer to, neoprene, polyvinyl chloride, polybutene or butadiene-styrene rubber.
Preferably, in the step S6 use hot pressing and printing technique, line pattern conductor layer surface bond with
One layer of insulation material layer is coated, which includes PI (polyimides Polyimide)+glue (epoxy resin or propylene
Acid and acrylic system), thermoplastic polyimides (thermoplastic polyimide), PP, FR4, PPS, PEN, PEEK,
Polymeric liquid crystal copolymer (Liquid Crystal Polymer) or polytetrafluoroethylene (PTFE) (Poly tetra
Fluoroethylene) material；And the thickness range of the insulation material layer is 5 microns to 250 microns.
Preferably, the mode that base material substrate surface glue removes in the step S8 includes by erosion acid or that alkalinity is slight
Quarter, Plasma plasmas, liquid form colloid and destroy, and fall off；Either the glue of base material substrate surface is carried out using laser
The etching of large area, and then remove colloid；Abrasive blasting method or mechanical milling method are either used, by the colloid of base material substrate surface
It is removed；Either using the principle of UV lamp irradiation, to light-sensitive emulsion and then cause polymerization, crosslinking and graft reaction, colloid is viscous
Mixture etc. loses viscous force, and then removes colloid；Either by being heated to product, (hot pressing, baking oven baking, hot wind blow, heat
Platform, hot-water soak etc.), so that the glue of substrate surface is generated and falls off.
Compared with prior art, a kind of laser ablation PCB circuit board line pattern processing technology of the present invention 1 is by using swashing
Photoengraving line pattern conductor layer, and laser ablation groove body is filled and is cured, in the selection of specific curing mode, adopt
Cured with solvent type solidification, room temperature curing, heat cure and ultraviolet light, the corresponding filling mode of filling process uses vacuum hotpressing
Conjunction, hot pressing, immersion, showering, dipping, coating, printing, injection, sputtering and electrophoresis and anode oxidation process can reach very
Good processing effect, the application technological process is simple, and technique effect is good.
The embodiments of the present invention described above are not intended to limit the scope of the present invention.It is any in the present invention
Spirit and principle within made by modifications, equivalent substitutions and improvements etc., should be included in the claim protection model of the present invention
Within enclosing.
Claims (9)
1. a kind of laser ablation PCB circuit board line pattern processing technology, it is characterised in that：Include the following steps,
S1：Reserved circuit plate base material substrate；And surface cleaning is carried out to board substrate substrate；By acid or alkaline solution,
The Desmear of light water or pure water, Plasma plasma gas or potassium permanganate proportioning cleans wire body to board substrate substrate
Surface clean/polish-brush action, and utilize abrasive blasting method or mechanical milling method progress roughing in surface；
S2：Carry out the combination of board substrate substrate and line pattern conductor layer；Preparation bond glue, and will bond glue (Gu
Body, semi-solid preparation shape or liquid) by coating, heating pressing, immersion, printing process means, make board substrate substrate and circuit
Figure conductor layer is bonded；The line pattern conductor layer is to remove foil/plank spare in advance not by using part
Part (such as common PCB/FPC wet etchings are punched with CNC or mold) gained afterwards is needed, or could be used without finished
Complete foil/plank；
S3：Line pattern conductor layer laser ablation:Unwanted place in line pattern conductor layer is used using laser beam
Laser beam etching removal, laser form the circuit and figure of needs when etching away unwanted line pattern conductor material；Together
When, after laser ablation, again by PCB line pattern production technologies, using wet etching (acid with alkalinity) removal office again
The unwanted some materials in portion；
S4：After the completion of step S3, etched surface is cleaned；Pass through acid or alkaline solution, light water or pure water, Plasma etc.
The Desmear cleaning wire bodies of ionized gas or potassium permanganate proportioning are clear to being carried out in laser ablation rear surface and the groove body after etching
Clean/polish-brush action, and utilize the oxide and carbon residue substance after abrasive blasting method or mechanical milling method removal laser ablation；
S5：Laser ablation groove body is filled and is cured；The corresponding curing mode of the solidification process include solvent type solidification,
Room temperature curing, heat cure and ultraviolet light solidification；The corresponding filling mode of the filling process include Vacuum Heat pressing, hot pressing,
Immersion, showering, dipping, coating, printing, injection, sputtering and electrophoresis and anode oxidation process；
S6：The protective layer being combined with line pattern conductor layer table is formed in line pattern conductor layer surface；
S7：Etching removal board substrate substrate；Concrete mode includes being etched removal using acid or alkalinity wet method
The board substrate substrate of bottom is irradiated using UV, generates living radical or ion radical, to cause polymerization, be crosslinked and connect
Branch reaction, colloidal adhesive lose viscous force, and then remove base material substrate, by heating (hot pressing, baking oven baking, heat to product
Wind, heating platform, hot-water soak etc.), so that the adhesive glue on base material substrate is lost viscous force, and then remove base material substrate either
Base material substrate is removed by direct craft or tool stress；
S8：Remove board substrate substrate floor glue；
S9：Working process is completed.
2. a kind of laser ablation PCB circuit board line pattern processing technology as described in claim 1, it is characterised in that：It is described
Conducting adhesive glue in step S2 using epoxy resin glue, acrylic acid series glue, acrylic glue, organic silica gel glue,
Inorganic silica gel glue, TPI glue, organic high-temp glue or inorganic high-temp glue (phenolic resin glue, urea-formaldehyde resin adhesive, heatproof epoxy glue,
Polyimides glue, thermoplastic polyimide glue)；And the thickness range of conducting adhesive glue layer is 2um-2000um.
3. a kind of laser ablation PCB circuit board line pattern processing technology as claimed in claim 1 or 2, it is characterised in that：Institute
It includes copper, aluminium, stainless steel, glass, silicon chip, quartz, aluminium oxide ceramics, aluminium nitride ceramics, glass fibers to state board substrate substrate
Dimension, FR4, carbon fiber, timber, macromolecule Pet, PI (polyimides, Polyimide), TPI, LCP, Peek, PPS, PEN,
PTFE, PVC, PC, ABS high-molecular organic material and inorganic polymer；And the material thickness range of board substrate substrate is
1um-5000um。
4. a kind of laser ablation PCB circuit board line pattern processing technology as described in claim 1, it is characterised in that：It is described
Laser employed in step S3 is subnanosecond, picosecond, nanosecond, femtosecond or excimer laser.
5. a kind of laser ablation PCB circuit board line pattern processing technology as described in claim 1 or 4, it is characterised in that：Institute
It is 492nm to the green-light source laser between 577nm, wave-length coverage that state the laser employed in step S3, which be wave-length coverage,
It is 622nm to CO between 2500nm for 300nm to the UV purple lights light source laser between 400nm, wave-length coverage2Infrared light supply
Laser, wave-length coverage be 200nm between 299nm the dark purple radiant lasers of UV or 10nm to extremely purple between 199nm
Outer light source laser；Laser cutting depth bounds are 1um-5000um.
6. a kind of laser ablation PCB circuit board line pattern processing technology as described in claim 1, it is characterised in that：It is described
Line pattern conductor layer includes copper, aluminium, silicon, tin, gold, silver or nickel foil material and sheet material；And the thickness range of line pattern conductor layer
For 1um-5000um.
7. a kind of laser ablation PCB circuit board line pattern processing technology as described in claim 1, it is characterised in that：It is described
In step S5 to the filling of groove body using epoxy resin glue, acrylic acid series glue, acrylic system glue, organic silica gel glue,
Inorganic silica gel glue, TPI glue, polymeric liquid crystal copolymer (Liquid Crystal Polymer) or polytetrafluoroethylene (PTFE)
(Poly tetra fluoroethylene)；The thickness range for filling glue is 2um to 5000um；Either applied using insulation
Expect that (insulating coatings) carries out the filling of groove body with PCB three-proofing coatings (Conformal Coating)；The insulation
Coating (insulating coatings) and PCB three-proofing coatings (Conformal Coating) by base-material, fire retardant, curing agent,
Color stuffing and solvent composition, and base-material includes polyester-imide, polyvinyl formal, poly- amino formicester, polyester, polyamide acyl Asia
Amine, PEI (polyimides polyester Polyester-imide), UEW (polyurethane Polyester-thane), nylon, fragrance
Polyamide, polyamide, epoxy (phenol oxygen) and aromatic polyamides, gather cruel resin, poly-vinegar phthalimide tree at solderability polyester-imide paint
Fat, poly- ammonia is cruel, epoxy resin, span carry out phthalimide resin, organic siliconresin, acrylate, silicone, polyurethane, organosilicon, poly-
Urethane, acetal tree refer to, neoprene, polyvinyl chloride, polybutene or butadiene-styrene rubber.
8. a kind of laser ablation PCB circuit board line pattern processing technology as claimed in claim 1 or 7, it is characterised in that：Institute
The technique for using hot pressing and printing in step S6 is stated, bonded in line pattern conductor layer surface and coats one layer of insulating materials
Layer, the insulation material layer include PI (polyimides Polyimide)+glue (epoxy resin or acrylic acid and acrylic system),
Thermoplastic polyimides (thermoplastic polyimide), PP, FR4, PPS, PEN, PEEK, polymeric liquid crystal copolymer
(Liquid Crystal Polymer) or polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene) material；And the insulation
The thickness range of material layer is 5 microns to 250 microns.
9. a kind of laser ablation PCB circuit board line pattern processing technology as described in claim 1, it is characterised in that：It is described
The mode that base material substrate surface glue removes in step S8 includes by etching acid or that alkalinity is slight, Plasma plasmas, liquid
Colloid is formed and is destroyed, and is fallen off；The etching of large area is either carried out to the glue of base material substrate surface using laser, and then is removed
Colloid；Abrasive blasting method or mechanical milling method are either used, the colloid of base material substrate surface is removed；Either use UV
The principle of light irradiation to light-sensitive emulsion and then causes polymerization, crosslinking and graft reaction, and colloidal adhesive etc. loses viscous force, and then goes
Except colloid；Either by heating (hot pressing, baking oven baking, hot wind are blown, heating platform, hot-water soak etc.) to product, make base
The glue generation of face falls off.
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| CN201810407975.4A CN108601232A (en) | 2018-05-02 | 2018-05-02 | A kind of laser ablation PCB circuit board line pattern processing technology |
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| CN201810407975.4A CN108601232A (en) | 2018-05-02 | 2018-05-02 | A kind of laser ablation PCB circuit board line pattern processing technology |
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| CN111112643A (en) * | 2020-02-28 | 2020-05-08 | 山东大学 | Nano silver wire preparation method for nanosecond laser-assisted thermal decomposition of silver nitrate, nano silver wire and application |
| CN111993758A (en) * | 2020-09-10 | 2020-11-27 | 昆山良品丝印器材有限公司 | Solar cell printing screen and manufacturing process thereof |
| CN112739035A (en) * | 2020-12-25 | 2021-04-30 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of superfine thick conductor circuit board |
| CN114669866A (en) * | 2022-04-08 | 2022-06-28 | 吉林建筑科技学院 | Laser ablation manufacturing method applied to net-shaped product |
| CN115131496A (en) * | 2021-03-29 | 2022-09-30 | 中国石油化工股份有限公司 | Method and system for making microscopic model of original coal rock |
| CN115637428A (en) * | 2022-10-28 | 2023-01-24 | 东莞仁海科技股份有限公司 | Glass-based PCB board preparation process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4970369A (en) * | 1984-06-08 | 1990-11-13 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device manufacturing methods |
| CN1671270A (en) * | 2004-03-17 | 2005-09-21 | 三星电子株式会社 | Method of manufacturing tape wiring substrate |
| CN104837300A (en) * | 2015-05-19 | 2015-08-12 | 上海安费诺永亿通讯电子有限公司 | Thick metal circuit board in NFC or wireless charging technology and manufacturing method thereof |
| CN106063393A (en) * | 2015-02-16 | 2016-10-26 | 日本梅克特隆株式会社 | Manufacturing method of flexible printed wiring board |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
-
2018
- 2018-05-02 CN CN201810407975.4A patent/CN108601232A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4970369A (en) * | 1984-06-08 | 1990-11-13 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device manufacturing methods |
| CN1671270A (en) * | 2004-03-17 | 2005-09-21 | 三星电子株式会社 | Method of manufacturing tape wiring substrate |
| CN106063393A (en) * | 2015-02-16 | 2016-10-26 | 日本梅克特隆株式会社 | Manufacturing method of flexible printed wiring board |
| CN104837300A (en) * | 2015-05-19 | 2015-08-12 | 上海安费诺永亿通讯电子有限公司 | Thick metal circuit board in NFC or wireless charging technology and manufacturing method thereof |
| CN107949164A (en) * | 2017-11-27 | 2018-04-20 | 深圳光韵达激光应用技术有限公司 | A kind of circuit substrate coil line etch process with higher rate |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862705A (en) * | 2019-03-29 | 2019-06-07 | 深圳光韵达激光应用技术有限公司 | A kind of PCB circuit board manufacture craft preparing high aspect ratio fine rule road |
| CN111112643A (en) * | 2020-02-28 | 2020-05-08 | 山东大学 | Nano silver wire preparation method for nanosecond laser-assisted thermal decomposition of silver nitrate, nano silver wire and application |
| CN111993758A (en) * | 2020-09-10 | 2020-11-27 | 昆山良品丝印器材有限公司 | Solar cell printing screen and manufacturing process thereof |
| CN112739035A (en) * | 2020-12-25 | 2021-04-30 | 深圳光韵达激光应用技术有限公司 | Manufacturing process of superfine thick conductor circuit board |
| CN115131496A (en) * | 2021-03-29 | 2022-09-30 | 中国石油化工股份有限公司 | Method and system for making microscopic model of original coal rock |
| CN114669866A (en) * | 2022-04-08 | 2022-06-28 | 吉林建筑科技学院 | Laser ablation manufacturing method applied to net-shaped product |
| CN115637428A (en) * | 2022-10-28 | 2023-01-24 | 东莞仁海科技股份有限公司 | Glass-based PCB board preparation process |
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