CN108538800A - Package structure - Google Patents

Abstract

The invention provides a packaging structure, which includes a packaging substrate, electronic components, a plurality of conductive glues and packaging colloids. The packaging substrate includes a carrier board, multiple pads and an insulating layer. The pads and the insulating layer are arranged on the carrier board. The insulating layer has a plurality of openings to expose the pads, and each pad includes a connecting portion and a protruding portion. The electronic components are arranged on the packaging substrate. The protruding portion of each pad extends from the connecting portion toward the direction of the electronic component. The conductive glue is arranged in the opening of the insulating layer. The electronic components are electrically connected to the protrusions through conductive glue. Packaging colloid covers electronic components, conductive adhesive and packaging substrates. The encapsulating colloid is filled between the electronic components and the packaging substrate. There is a gap between the electronic component and the packaging substrate, ranging from 30 microns to 110 microns. The encapsulating colloid fills the gap.

Description

Package structure

technical field

The invention relates to a semiconductor element, in particular to a packaging structure.

Background technique

System-in-Package (SiP) refers to the bonding of all or most of the electronic components of a system or subsystem on a circuit carrier. In addition, after the electronic components are assembled on the circuit carrier, the flux remaining on the circuit carrier must be cleaned to avoid affecting the reliability of the packaging structure. However, since the gap between the electronic component and the circuit carrier is very small, during reflow, the solder may flow into the gap between the electronic component and the circuit carrier and connect with each other, causing a short circuit between the pads , resulting in bridge (solder bridge) problems. In addition, after the reflow process, the solder flux remaining in the gap cannot be effectively removed, resulting in easy delamination during the reliability test, which affects the yield of the product.

Contents of the invention

Embodiments of the present invention provide a packaging structure, which can increase the gap between the packaging substrate and the electronic components, so as to facilitate subsequent manufacturing processes and increase product yield.

An embodiment of the present invention provides a packaging structure, which includes a packaging substrate, electronic components, a plurality of conductive glues, and packaging glue. The packaging substrate includes a carrier board, a plurality of pads and an insulating layer. The pads and the insulating layer are disposed on the carrier board, the insulating layer has a plurality of openings to expose the pads, and each pad includes a connecting portion and a protruding portion. The electronic components are arranged on the packaging substrate. The protruding portion of each pad extends from the connecting portion to the direction of the electronic component. The conductive adhesive is disposed in the opening of the insulating layer. The electronic component is electrically connected to the protruding part through the conductive glue. The packaging colloid covers the electronic components, conductive adhesive and packaging substrate. The encapsulant is filled between the electronic component and the encapsulation substrate.

An embodiment of the present invention provides a packaging structure, which includes a packaging substrate, electronic components, and packaging glue. The packaging substrate includes a carrier board and a plurality of pads. The pads are configured on the carrier board. Each pad includes a connecting portion and a protruding portion. The electronic components are arranged on the packaging substrate. The protruding portion of each pad extends from the connecting portion to the direction of the electronic component. The electronic component is electrically connected to the package substrate through the protruding portion of the pad. The encapsulant encapsulates the electronic components and the encapsulation substrate. There is a gap between the electronic component and the packaging substrate, which is between 30 microns and 110 microns. Encapsulation gel fills the gap.

Based on the above, in the package structure of the embodiment of the present invention, the protruding portion of the pad can support the electronic component, so as to increase the gap between the electronic component and the package substrate. Therefore, the solder flux in the gap can be effectively removed to avoid affecting the reliability of the packaging structure, and the bridging problem caused by solder flowing into the gap during the reflow process can be avoided, thereby increasing the yield rate of the product.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

1A to 1C are schematic cross-sectional views of a manufacturing process of a packaging structure according to an embodiment of the present invention.

FIG. 2 is a schematic top view of the package structure in FIG. 1A .

3A to 3C are schematic cross-sectional views of a manufacturing process of a packaging structure according to another embodiment of the present invention.

FIG. 4 is a schematic top view of the package structure in FIG. 3A .

Explanation of reference signs

100, 200: package structure

110, 210: package substrate

110a, 210a: first surface

110b, 210b: second surface

112, 212: carrier board

114, 214: pad

114a, 214a: connection part

114b, 214b: protrusions

116, 216: insulating layer

116a, 216a: openings

120, 220: electronic components

122, 222: conductive terminal

130, 230: Conductive adhesive

140, 240: encapsulation colloid

217: Conductive pattern

218: Conductive Via

219: Conductive contact

A: area

C: Clearance

D: Depth

H: height

Detailed ways

1A to 1C are schematic cross-sectional views of a manufacturing process of a package structure according to an embodiment of the present invention, and FIG. 2 is a schematic top view of the package structure in FIG. 1A . Referring to FIG. 1A to FIG. 2 , firstly, a packaging substrate 110 is provided. The packaging substrate 110 includes a carrier 112 , a plurality of pads 114 and an insulating layer 116 . The pads 114 and the insulating layer 116 are disposed on the carrier 112 . In addition, the insulation layer 116 has a plurality of openings 116 a to expose the pads 114 . Each pad 114 has a connecting portion 114a and a protruding portion 114b. The packaging substrate 110 has a first surface 110a and a second surface 110b opposite to the first surface 110a. The protruding portion 114b of each pad 114 extends from the second surface 110b of the packaging substrate 110 to the first surface 110a of the packaging substrate 110 . In this embodiment, the insulating layer 116 can also be disposed in a region A between two adjacent pads 114 . In other embodiments, the insulating layer 116 may not be disposed in the region A to expose the carrier 112 , and details about this type of package substrate 110 will be described in the following embodiments.

For example, the carrier 112 may be a core layer formed of a glass substrate, polyimide resin or other similar polymers. However, the present invention is not limited thereto, and other suitable core layer materials can also be used as the carrier 112 as long as the material can carry the package structure formed thereon and withstand subsequent manufacturing processes. In addition, in one embodiment, the carrier board 112 may also have conductive vias to electrically connect the pads 114 disposed on the first surface 110a of the carrier board 112 with the external terminals disposed on the second surface 110b. The details of the packaging substrate 110 will be described in the embodiments described later. Moreover, the contact pad 114 is made of conductive metal, such as aluminum, copper, aluminum alloy or alloy with copper, for example, but the invention is not limited thereto.

In addition, in this embodiment, the protruding portion 114b of the pad 114 is, for example, a plurality of conductive pillars, which are made by electroplating, evaporation or deposition. Taking electroplating as an example, after the lithography is performed, the patterned film is used to define the predetermined position of the protruding portion 114b, and then the conductive pillar is fabricated on the predetermined position through the electroplating process. The protruding portion 114b is, for example, a square shape, a column shape, a thin column shape or other patterns, and its material is, for example, a single metal or a composite metal, but the present invention is not limited thereto. The protrusions 114b of each pad 114 may have the same material, height and shape. Therefore, the protruding portion 114b can be formed simultaneously during the manufacturing process to save manufacturing cost. It can be understood that the protruding portion 114b of each pad 114 may also have different materials, heights and shapes, depending on design requirements, but the present invention is not limited thereto. In addition, the protruding portion 114b can be presented in other possible forms or be in other possible shapes, and details about other types of protruding portion 114b will be described in the embodiments described later.

In this embodiment, the insulating layer 116 includes, for example, epoxy resin or photosensitive resin, and is formed on the carrier 112 by coating or screen printing to insulate and protect the carrier 112 and prevent internal wires from being exposed. cause a short circuit. However, the present invention does not limit the material and formation method of the insulating layer 116 . In addition, the height H of the protruding portion 114 b of each pad 114 may be greater than the depth D of the opening 116 a of the insulating layer 116 . For example, the opening 116 a can be formed by coating the insulating layer 116 with a photoresist, and then performing patterning by exposing, developing, and etching. However, the present invention is not limited thereto.

Next, a plurality of conductive adhesives 130 are disposed in the openings 116 a of the insulating layer 116 , and the electronic components 120 are disposed on the packaging substrate 110 to perform a reflow process. The electronic component 120 is electrically connected to the packaging substrate 110 through the conductive glue 130 . In detail, the conductive glue 130 covers the protruding portion 114 b of the pad 114 , and the electronic component 120 is electrically connected to the protruding portion 114 b of the pad 114 through the conductive glue 130 . In addition, in this embodiment, the conductive adhesive 130 partially covers the insulating layer 116 of the packaging substrate 110 and the conductive terminals 122 of the electronic component 120 . The conductive glue 130 is, for example, solder paste, which is bonded and electrically connected between the packaging substrate 110 and the electronic component 120 by soldering, thereby preventing the electronic component 120 from being displaced in subsequent manufacturing processes. However, the conductive adhesive can also be other conductive adhesive materials, and its forming method and material are not limited thereto.

In addition, according to electrical and performance requirements, the electronic component 120 is, for example, an active component, a passive component or a combination thereof. For example, the active element can be an integrated circuit, an optoelectronic element, or a micro-electromechanical element. The passive element is, for example, a capacitor, a resistor, or an inductor. However, the present invention is not limited thereto. In addition, there is a gap C between the electronic component 120 and the packaging substrate 110 .

Furthermore, the electronic component 120 has a plurality of conductive terminals 122 . The conductive terminals 122 respectively correspond to one of the pads 114 . The number of the protrusions 114 b of the pad 114 is at least three to support the conductive terminals 122 . For example, one of the pads 114 corresponding to the conductive terminal 122 may have a single conductive column, and the other may have a pair of conductive columns. That is to say, the pad 114 corresponding to the conductive terminal 122 has a total of three conductive posts to support the conductive terminal 122 with the minimum number of conductive posts, and these conductive posts are not collinear but arranged in a triangle to achieve a three-point balance. The condition further supports the electronic component 120 stably, and enables the electronic component 120 to maintain balance without falling over. The surface of the protruding portion 114b of the pad 114 facing the conductive terminal 122 is located on the same plane, and extends from the connecting portion 114a toward the conductive terminal 122 of the electronic component 120 to support the conductive terminal 122 . It can be understood that the figure shows a pair of conductive terminals and a pair of pads, and each pad has three conductive columns, but the invention is not limited thereto. For example, the size of the conductive pillars is at least 30 microns. It can be understood that the larger the size of the conductive pillars, the more firmly the electronic component 120 can be supported, and the number of the conductive pillars can also be reduced. However, the present invention does not limit the number or arrangement of the conductive posts, as long as the protruding portion 114 b can support the electronic component 120 so that there is a gap C between the electronic component 120 and the packaging substrate 110 .

Finally, the encapsulant 140 is used to cover the electronic component 120 , the conductive adhesive 130 and the packaging substrate 110 , and the encapsulant 140 is filled between the electronic component 120 and the packaging substrate 110 to form the packaging structure 100 . That is to say, the encapsulant 140 is filled into the gap C to form an insulating barrier, so as to prevent the solder bridge problem between the pads 114 from affecting the yield of the product. In addition, the thickness of the encapsulant 140 filled in the gap C is between 30 microns and 110 microns. For example, the encapsulant 140 can be a non-conductive material, such as epoxy resin, epoxy molding compound (EMC) or other polymer molding materials, using molding (molding), lamination (lamination) Or formed on the electronic component 120 and the packaging substrate 110 in other appropriate ways to protect the electronic component 120 and the packaging substrate 110 . However, the present invention does not limit the material and forming method of the encapsulant 140 .

3A to 3C are schematic cross-sectional views of a manufacturing process of a packaging structure according to another embodiment of the present invention, and FIG. 4 is a schematic top view of the packaging structure of FIG. 3A . Referring to FIG. 3A to FIG. 4 , the manufacturing process of the packaging structure 200 of this embodiment is similar to the manufacturing process of the packaging structure 100 , wherein the same or similar components use the same or similar reference numerals, which will not be repeated here. The difference between the package structure 200 and the package structure 100 is, for example, that the protruding portion 214b of the pad 214 may be in the shape of a thumbtack. For example, stud bumps or solder ball bumps are formed on the connecting portion 214a by wire bonding as the protruding portion 214b. However, the embodiment of the present invention does not limit the manufacturing method, material and shape of the protruding portion 214 b, as long as the protruding portion 214 b can maintain a good distance between the electronic component 220 and the packaging substrate 210 . Furthermore, in the package structure 200 , the height H of the protruding portion 214 b is smaller than or equal to the depth D of the opening 216 a of the insulating layer 216 . In addition, the electronic component 220 may be connected to the protruding portion 214 b of the pad 214 via the conductive glue 230 . For example, during the reflow process, the degree of melting of the conductive adhesive can be adjusted depending on the height of the required conductive adhesive, thereby adjusting the gap C between the electronic component 220 and the package substrate 210, so that the electronic component 220 is set on the package substrate 210 .

In addition, in the package structure 200 , the carrier 212 is exposed at an area A corresponding to the pads 214 of the electronic component 220 . That is to say, the insulating layer 216 is not provided in the region A, so as to increase the gap C between the electronic component 220 and the package substrate 210 in the region A. Referring to FIG. In addition, the packaging structure 200 can also provide an insulating layer 216 and a conductive pattern 217 on the second surface 210 b of the packaging substrate 210 . The pads 214 on the first surface 210a of the package substrate 210 and the conductive patterns 217 on the second surface 210b correspond to each other, and the pads 214 on the first surface 210a and the second surface 210b are electrically connected by the conductive vias 218 of the carrier 212 . The conductive pattern 217 on the two surfaces 210b. Furthermore, the second surface 210 b of the packaging substrate 210 is further provided with a plurality of conductive contacts 219 . The conductive contacts 219 are, for example, conductive balls (such as solder balls, copper balls, or nickel balls, etc.), which are bonded to the conductive pattern 217 by using a ball placement process and a reflow process, but the invention is not limited thereto. By forming the conductive pattern 217 and the conductive contact 219 on the second surface 210 b of the package substrate 210 , the variability of the package structure product is increased.

To sum up, the present invention supports the electronic components through the protrusions of the pads, so as to increase the gap between the package substrate and the electronic components. Thereby, the solder flux in the gap can be effectively removed to avoid affecting the reliability of the package structure, and the bridging problem can be avoided. In addition, increasing the gap between the packaging substrate and the electronic component can easily fill the gap with encapsulant, so as to reduce the problem of delamination caused by the thermal stress generated by the thermal expansion difference between the electronic component and the packaging substrate. In addition, by not disposing an insulating layer in the area between the pads corresponding to the electronic components, the maximum thickness of the encapsulant filled between the packaging substrate and the electronic components is further increased to avoid undue electrical contact between the pads. Sexual bridging, thereby increasing the yield of the product.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of protection of the invention should be defined by the claims.

Claims (10)

1. a kind of encapsulating structure, which is characterized in that including：

Package substrate, including support plate, multiple connection pads and insulating layer, the connection pad are configured at the support plate with the insulating layer On, the insulating layer has multiple openings to expose the connection pad, and each connection pad includes interconnecting piece and protrusion；

Electronic component is set on the package substrate, wherein the protrusion of each connection pad is from the interconnecting piece toward institute The direction for stating electronic component extends；

Multiple conducting resinls are set in the opening of the insulating layer, wherein the electronic component by the conducting resinl with The protrusion is electrically connected；And

Packing colloid coats the electronic component, the conducting resinl and the package substrate, wherein the packing colloid inserts institute It states between electronic component and the package substrate.

2. encapsulating structure according to claim 1, wherein there is gap between the electronic component and the package substrate, The packing colloid is inserted in the gap, and the maximum gauge of the packing colloid in the filling gap is between 30 microns To between 110 microns.

3. encapsulating structure according to claim 1, wherein the electronic component has multiple conducting terminals, each conduction Terminal corresponds respectively to one of described connection pad of the package substrate, and the quantity of the protrusion of the connection pad is three It is a to support the conducting terminal.

4. encapsulating structure according to claim 3, wherein the conducting resinl coats the protrusion of the connection pad, and institute Coat the insulating layer of the package substrate and the conducting terminal of the electronic component with stating conductive glue.

5. encapsulating structure according to claim 1, wherein the height of the protrusion of the connection pad is more than the insulation The depth of the opening of layer.

6. encapsulating structure according to claim 1, wherein the protrusion of the connection pad is drawing pin shape.

7. encapsulating structure according to claim 6, wherein the height of the protrusion of the connection pad is less than or equal to institute State the depth of the opening of insulating layer.

8. a kind of encapsulating structure, which is characterized in that including：

Package substrate, including support plate and multiple connection pads, the connection pad are configured on the support plate, and each connection pad includes connecting Socket part and protrusion；

Electronic component is set on the package substrate, wherein the protrusion of each connection pad is from the interconnecting piece toward institute The direction for stating electronic component extends, and the electronic component is electrically connected by the protrusion of the connection pad with the package substrate It connects；And

Packing colloid coats the electronic component and the package substrate, wherein the electronic component and the package substrate it Between there is gap, between 30 microns to 110 microns, the packing colloid inserts the gap in the gap.

9. encapsulating structure according to claim 8, wherein the package substrate further includes：

Insulating layer is set on the support plate of the package substrate, has multiple openings to expose the connection pad；And

Multiple conducting resinls are set in the opening of the insulating layer, wherein the electronic component by the conducting resinl with The package substrate is electrically connected.

10. encapsulating structure according to claim 8, the electronic component has multiple conducting terminals, each conducting end Son corresponds respectively to one of described connection pad of the package substrate, and the quantity of the protrusion of the connection pad is three To support the conducting terminal.