CN108511566A - A kind of LED production method - Google Patents

Abstract

The embodiment of the present invention proposes a kind of LED production method, is related to technical field of semiconductors.Pass through the base board of Light-Emitting Diode of the making with polarity identification point, then luminescence chip corresponding with polarity identification point position in the groove of each pedestal is installed and carry out die bond, then by die bond, the technique drying and cut, make formed include polarity identification point light emitting diode.LED production method provided by the invention has the light emitting diode made more beautiful, the advantages of being less prone to electrode reversed situation.

Description

A method of manufacturing a light emitting diode

technical field

The invention relates to the technical field of semiconductors, in particular to a method for manufacturing a light emitting diode.

Background technique

With the continuous development of the LED industry, the requirements for the products of the LED upstream, midstream and downstream industries are becoming more and more stringent. While constantly pursuing high brightness and reliability, the light-emitting volume is required to be as small as possible, which has certain advantages for downstream industrial structure, heat dissipation and optical design. The packaging structure of CSP (Chip Scale Package) has attracted widespread attention in the LED industry. Major manufacturers at home and abroad have launched corresponding products for CSP, which are used in mobile phone flashlights, car lights, TV backlights, and intelligent lighting.

However, when performing CSP at present, the appearance of the molded LED is not good, and the problem of electrode reversal is prone to occur during the placement process.

In view of this, how to solve the above problems is the focus of attention of those skilled in the art.

Contents of the invention

In view of this, the object of the present invention is to provide a method for manufacturing a light emitting diode, so as to solve the problems in the prior art that the diodes packaged by CSP are not good in appearance and are prone to electrode reversal during the patching process.

In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is as follows:

An embodiment of the present invention provides a method for manufacturing a light emitting diode, and the method for manufacturing a light emitting diode includes:

Making a base plate of light-emitting diodes with polarity identification points; wherein, the base plate includes a plurality of bases with grooves;

Installing a light-emitting chip corresponding to the position of the polarity recognition point in each groove of the base and performing crystal bonding;

Dispensing glue to the groove after solid crystal;

Drying the base plate after dispensing glue to form a semi-finished light-emitting diode;

The semi-finished light emitting diode is cut to form a plurality of light emitting diodes, wherein each light emitting diode includes at least one polarity identification point.

Further, the step of manufacturing the base plate of the light-emitting diode with the polarity identification point includes:

Inject white wall glue into the pre-set mold;

Baking and molding the white wall glue; to form the luminous base plate.

Further, the step of cutting the semi-finished light-emitting diode to form a plurality of light-emitting diodes includes:

cutting the LED semi-finished product along the preset position of the mould;

The cut LEDs are taken out from the mould.

Further, before the step of injecting white wall glue into the pre-set mold, the step of making the base plate of the light-emitting diode with polarity identification points also includes:

An adhesive film is adhered on the surface of the pre-set mould, so that the injected white wall glue is in contact with the adhesive film.

Further, the adhesive film includes a release film, a high temperature film or an ultraviolet film.

Further, before the step of baking and molding the white wall glue to form the light-emitting base plate, the step of manufacturing the base plate of the light-emitting diode with polarity identification points further includes:

A pressing plate is used to closely fit the mold injected with white wall glue, and the white wall glue is in contact with the pressing plate.

Further, the step of dispensing glue to the groove after die bonding includes:

Dispensing glue to the groove after crystal bonding, so that the glue surface formed after dispensing is in an arc shape concave toward the bottom of the groove.

Further, the step of dispensing glue to the groove after die bonding includes:

Apply fluorescent glue to the groove after crystal bonding.

Further, the step of dispensing glue to the groove after die bonding includes:

Spray powder to the groove after solid crystal;

Carry out some transparent glue to the described groove after dusting.

Further, the polarity identification points include bumps or depressions.

Compared with the prior art, the present invention has the following beneficial effects:

The invention provides a method for manufacturing a light-emitting diode, by making a base plate of a light-emitting diode with a polarity recognition point, and then installing a light-emitting chip corresponding to the position of the polarity recognition point in the groove of each base And carry out crystal bonding, and then through the processes of crystal bonding, drying and cutting, fabricate and form light emitting diodes including polarity identification points. On the one hand, since the base plate provided by the present invention includes a plurality of identical bases, it is easy to cut when cutting, and the appearance after cutting is more beautiful. On the other hand, and because the polarity identification point is set, it is easier to identify the polarity of the light-emitting diode produced in the post-chip process, and it is not easy to reverse the electrode.

In order to make the above-mentioned objects, features and advantages of the present invention more comprehensible, preferred embodiments will be described in detail below together with the accompanying drawings.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and thus It should be regarded as a limitation on the scope, and those skilled in the art can also obtain other related drawings based on these drawings without creative work.

FIG. 1 shows a flow chart of a method for manufacturing a light emitting diode provided by an embodiment of the present invention.

FIG. 2 shows a schematic cross-sectional view of a light emitting diode provided by an embodiment of the present invention.

FIG. 3 shows a schematic diagram of sub-steps of step S101 in FIG. 1 provided by an embodiment of the present invention.

FIG. 4 shows a schematic diagram of sub-steps of step S103 in FIG. 1 provided by an embodiment of the present invention.

Icons: 100-light-emitting diode; 110-base; 120-light-emitting chip; 130-dispensing layer; 140-polarity identification point.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures. At the same time, in the description of the present invention, it should also be noted that unless otherwise specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations. Some embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

Please refer to FIG. 1, an embodiment of the present invention provides a method for manufacturing a light emitting diode 100, the method for manufacturing the light emitting diode 100 includes:

Step S101 , fabricate the base 110 board of the light-emitting diode with the polarity identification point 140 .

In this embodiment, in order to process more quickly, the base 110 includes a plurality of grooved bases 110, so that all the bases 110 can be processed at the same time to form a plurality of light-emitting diodes 100, and then the plurality of light-emitting diodes 100 to form individual LEDs 100 by cutting. Certainly, in some other embodiments, the base 110 board may also include only one base 110 , that is, no cutting step is required in the later stage, which is not limited in this embodiment.

Moreover, in order to prevent the occurrence of motor reversal in the process of patching the LED 100 in the later stage, in this embodiment, the base 110 board has a polarity identification point 140 . Wherein, each base 110 of the base 110 board is provided with at least one memorable identification point.

Wherein, step S101 includes:

Sub-step S1011, adhering an adhesive film on the surface of the pre-set mold.

In this embodiment, the base 110 of the light-emitting diode 100 is manufactured through a pre-set mold. During the manufacturing process, white wall glue needs to be injected into the mold. The molds are easy to adhere to each other, so the base 110 may be damaged when taken out later, which will affect the pass rate of the light emitting diode 100 . In view of this, in this embodiment, it is necessary to adhere a layer of adhesive film on the surface of the pre-set mold first, so that it is easier to take out the light emitting diode 100 from the base 110 board.

It should be noted that, in this embodiment, the sticking film includes a release film, a high-temperature film or an ultraviolet film, etc., which have a double-sided sticking process. When the LED 100 needs to be taken out, due to the film with a double-sided sticking Therefore, it is easier to take out and less likely to damage the LED 100 .

Sub-step S1012, inject white wall glue into the preset mould.

After adhering the adhesive film, white wall glue needs to be injected into the mold. Because the white wall glue has good molding consistency and good repeatability, the light and color consistency is better in the later dispensing operation. Certainly, in some other embodiments, the base 110 may also be made of other materials, which is not limited in this embodiment.

In this embodiment, the mold is provided with a plurality of protrusions, so that each manufactured base 110 includes a groove for placing the light-emitting chip 120 . In this embodiment, the plane formed by the notch of the groove is parallel to the plane of the groove bottom of the groove and has a preset ratio, and the area of the plane of the notch of the groove is larger than the area of the plane of the notch of the groove , so that the light-emitting area of the light-emitting diode 100 presents a cup-shaped structure.

As an implementation of this embodiment, the cross section of the groove wall of the groove is a straight line, for example, the notch of the groove is rectangular, the groove bottom of the groove is also rectangular, and the cross section of the groove gradually increases from top to bottom. get smaller. Since the base 110 of this embodiment uses white wall glue, the repeatability is good, and the white wall glue is used for one-time molding, the slope is consistent, and the length of the slope is also consistent, so the influence on the photoelectric parameters is small and the concentration is higher.

Moreover, it should be noted that the slope of the white wall of the base 110 is helpful for light extraction, so that the light emitting diode 100 provided in this embodiment has higher brightness than the common single-sided light emitting diode 100 manufactured by the SCP process. At the same time, since the area of the plane of the notch of the groove is larger than the area of the plane of the notch of the groove, the light emitted by the light-emitting chip 120 propagates in the direction of outward diffusion, which is beneficial for lighting.

As another implementation of this embodiment, the cross section of the groove wall is a curve, for example, the notch of the groove is rectangular, the groove bottom of the groove is also rectangular, and the cross section of the groove is from top to bottom It becomes larger first and then smaller, so as to meet different needs in use.

Moreover, in this embodiment, the groove of the base 110 of the light-emitting diode 100 can also be set to other shapes, that is, the notch of the groove and the groove bottom of the groove can be set to other shapes, such as a triangle or a circle. For example, there is no limitation on this, the workers only need to make different molds, and then inject the white wall glue into the mold, and then dry it to make the white wall glue base 110 . Simultaneously, the inclination angle of the groove wall of the groove can also be set according to actual needs, and the staff can make unused moulds, and then inject white wall glue into the moulds, which can be dried to form the white wall base 110 . Therefore, in this embodiment, there is no limitation on the shape of the groove of the LED 100 and the inclination of the groove wall.

Step S1013, using a pressing plate to closely fit the mold injected with white wall glue, and the white wall glue is in contact with the pressing plate.

In this embodiment, in order to make the manufactured base 110 more beautiful and prevent the white wall glue liquid from flowing out, it is necessary to use a pressing plate to closely fit the mold injected with white wall glue so that the white wall glue is in contact with the pressing plate.

Sub-step S1014, baking and molding the white wall glue; to form the base 110 board.

In this embodiment, since the white wall glue is thermoplastic, the white wall needs to be baked and formed. Since the molds need to be baked together in an oven, the molds provided in this embodiment are high temperature resistant molds.

It should be noted that since the polarity identification point 140 is set on the mold, after the white wall glue is injected into the mold, the base 110 formed by the white wall glue will also generate a corresponding polarity at the polarity identification point 140 set on the mold. Sex identification point 140. For example, when the polarity recognition point 140 on the mold is a bump, then the polarity recognition point 140 on the base 110 is a depression; and when the polarity recognition point 140 on the mold is a depression, then The polarity identification point 140 on the base 110 is a bump. Moreover, in this embodiment, the polarity identification point 140 is set as a bump or a depression, but in other embodiments, the polarity identification point 140 can also be set as another shape, and this embodiment does not do so. Any restrictions.

Moreover, as an implementation of this embodiment, the polarity identification point 140 is set at the end of the base 110 away from the groove, and as another implementation of this embodiment, the polarity identification point 140 is set at the end of the base 110 The wall of the groove of 110 is not limited in this embodiment.

Step S102 , installing the light-emitting chip 120 corresponding to the position of the polarity identification point 140 in the groove of each base 110 and performing die bonding.

After manufacturing the bases 110 of the light emitting diodes 100 , it is necessary to install the light emitting chips 120 in the grooves of each base 110 and carry out the die bonding operation. It should be noted that, in this embodiment, in order to make the light of the light emitting diode 100 uniform, the light emitting chip 120 is installed at the center of the bottom of the groove. Since the light-emitting chip 120 can be regarded as a point light source, in practical applications, when the light-emitting chip 120 is placed in the middle of the bottom, the light emitted by the light-emitting chip 120 can propagate along the direction of the groove, and the light is reflected by the white wall. more uniform.

Moreover, the light emitting chip 120 provided in this embodiment adopts an LED chip, of course, in some other embodiments, the LED chip can also adopt other chips, which is not limited in this embodiment.

Step S103 , dispensing glue into the groove after die bonding.

After installing the light-emitting chip 120 , in order to fix the light-emitting chip 120 , in this embodiment, it is also necessary to perform glue dispensing in the groove after die bonding, so as to form the glue dispensing layer 130 .

Sub-step S1031, apply fluorescent glue to the groove after the crystal bonding.

As a way of dispensing glue in this embodiment, fluorescent glue can be applied to the groove after solid crystal, and the light emitted by the light-emitting chip 120 is emitted after passing through the fluorescent glue layer. On the one hand, by setting the fluorescent glue layer, it can play a role. The function of protecting the light-emitting chip 120; since the light-emitting chip 120 is not in contact with the external environment after the fluorescent glue layer is set, it will not come into contact with some dust and impurities, thereby prolonging the service life of the light-emitting chip 120120, and thus increasing the overall light-emitting diode. 100 service life. Moreover, by arranging the fluorescent glue layer, it can also play a certain role in blocking external forces. For example, when the light-emitting diode 100 is subjected to external force, the external force will not directly act on the light-emitting chip 120 of the light-emitting diode 100, but will act on the base 110 and the light-emitting diode 100. The fluorescent adhesive layer prevents the light-emitting chip 120 from being damaged, further prolonging the service life of the light-emitting diode 100 .

Sub-step S1032, spraying powder into the groove after the die bonding.

As another way of dispensing glue in this embodiment, powder can be directly sprayed on the grooves after die bonding.

Sub-step S1033, apply transparent glue to the groove after powder spraying.

By spraying powder and adding some transparent glue, it can achieve the same effect as using fluorescent glue.

Moreover, it needs to be explained that in order to make the dispensing in the subcontracting operation difficult to adhere to the suction nozzle, reduce the probability of machine error reporting and manual adjustment, and save man-hours and costs, the application-side placement is to reduce machine error reporting and manual adjustment. The opening rate improves production efficiency and yield, and saves man-hours and costs. In this embodiment, the glue surface after dispensing is curved toward the bottom of the groove.

Step S104, drying the base plate 110 after dispensing glue to form a semi-finished product of the light emitting diode 100 .

A plurality of light emitting diodes 100 can be obtained by drying the base 110 plate after glue dispensing. At this time, the plurality of light emitting diodes 100 remain in a state of adhesion, that is, a semi-finished product of the light emitting diodes 100 is formed at this time.

Step S105 , cutting the semi-finished light emitting diode 100 to form a plurality of light emitting diodes 100 , wherein each light emitting diode 100 includes at least one polarity identification point 140 .

After obtaining the light emitting diode 100 , the light emitting diode 100 needs to be cut to form individual light emitting diodes 100 .

Wherein, step S105 includes:

Sub-step S1051, cutting the semi-finished light emitting diode 100 along the preset position of the mould.

In this embodiment, since the base 110 of the light-emitting diode 100 is made by using a mold, cutting can be performed directly on the mold, and the cutting position is preset on the mold. On the one hand, through the preset cutting position along the mould, the cutting can be made more convenient, thereby improving the operation speed. On the other hand, because the predetermined cutting position in the mold can arrange each light emitting diode 100 uniformly, the cutting operation is more beautiful and there will be no unevenness.

Sub-step S1052, taking out the cut light-emitting diodes from the mold.

After the light emitting diodes 100 are cut, a plurality of light emitting diodes 100 can be formed, and then the light emitting diodes 100 are taken out from the mold.

To sum up, the present invention provides a method for manufacturing light-emitting diodes, by making the base plate of light-emitting diodes with polarity identification points, and then installing polarity identification points in the grooves of each base The light-emitting chips corresponding to the positions are solidified, and then the light-emitting diodes including polarity identification points are fabricated and formed through the processes of solidifying, drying and cutting. On the one hand, since the base plate provided by the present invention includes a plurality of identical bases, it is easy to cut when cutting, and the appearance after cutting is more beautiful. On the other hand, since the polarity identification point is set, it is easier to identify the polarity of the light-emitting diode produced in the post-slide process, and it is not easy to reverse the electrode.

It should be noted that in this article, relative terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply these No such actual relationship or order exists between entities or operations. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising said element.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention. It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

Claims (10)

1. a kind of LED production method, which is characterized in that the LED production method includes：

Make the base board of the Light-Emitting Diode with polarity identification point；Wherein, the base board includes multiple bottoms with groove Seat；

Luminescence chip corresponding with the polarity identification point position is installed in the groove of each pedestal and carries out die bond；

Dispensing is carried out to the groove after die bond；

Base board after dispensing is dried, to form light emitting diode semi-finished product；

The light emitting diode semi-finished product are cut, to form more light emitting diodes, wherein every light-emitting diodes Guan Jun includes at least one polarity identification point.

2. LED production method as described in claim 1, which is characterized in that described to make with polarity identification point The step of base board of Light-Emitting Diode includes：

White wall glue is injected into the mold pre-seted；

Baking molding is carried out to the white wall glue；To form the light-emitting base plate.

3. LED production method as claimed in claim 2, which is characterized in that it is described to the light emitting diode half at Product are cut, and include the step of more light emitting diodes to be formed：

The light emitting diode semi-finished product are cut along the presetting position of the mold；

More Light-Emitting Diodes after cutting are taken out from the mold.

4. LED production method as claimed in claim 2, which is characterized in that noted into the mold pre-seted described Before the step of entering white wall glue, it is described make with polarity identification point Light-Emitting Diode base board the step of further include：

In the surface adhesion adhesive film of the mold pre-seted, so that the white wall glue of injection is contacted with the adhesive film.

5. LED production method as claimed in claim 4, which is characterized in that the adhesive film includes release film, height Warm film or antiultraviolet film.

6. LED production method as claimed in claim 2, which is characterized in that dried to the white wall glue described It is roasted into type；Before the step of forming the light-emitting base plate, the bottom for making the Light-Emitting Diode with polarity identification point The step of seat board further includes：

It is fitted closely using a pressing plate and the mold after the white wall glue of injection, and the white wall glue is contacted with the pressing plate.

7. LED production method as described in claim 1, which is characterized in that the groove to after die bond into The step of row dispensing includes：

Dispensing is carried out to the groove after die bond, so that the glue surface formed after dispensing is in the arc to the bottom notch of the groove Shape.

8. LED production method as described in claim 1, which is characterized in that the groove to after die bond into The step of row dispensing includes：

A fluorescent glue is carried out to the groove after die bond.

9. LED production method as described in claim 1, which is characterized in that the groove to after die bond into The step of row dispensing includes：

It dusts to the groove after die bond；

A transparent adhesive tape is carried out to the groove after dusting.

10. LED production method as described in claim 1, which is characterized in that the polarity identification point includes convex block Or recess.