CN108485836A - 军用电子设备基板的等离子体清洗气体和清洁方法 - Google Patents
军用电子设备基板的等离子体清洗气体和清洁方法 Download PDFInfo
- Publication number
- CN108485836A CN108485836A CN201810098286.XA CN201810098286A CN108485836A CN 108485836 A CN108485836 A CN 108485836A CN 201810098286 A CN201810098286 A CN 201810098286A CN 108485836 A CN108485836 A CN 108485836A
- Authority
- CN
- China
- Prior art keywords
- parts
- electronic equipment
- equipment substrate
- military electronic
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 238000004140 cleaning Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims abstract description 8
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- -1 oleoyl diethanol amine Chemical compound 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 25
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 24
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 22
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims abstract description 22
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 17
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 17
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 15
- COAUHYBSXMIJDK-UHFFFAOYSA-N 3,3-dichloro-1,1,1,2,2-pentafluoropropane Chemical compound FC(F)(F)C(F)(F)C(Cl)Cl COAUHYBSXMIJDK-UHFFFAOYSA-N 0.000 claims abstract description 12
- 244000060011 Cocos nucifera Species 0.000 claims abstract description 12
- 235000013162 Cocos nucifera Nutrition 0.000 claims abstract description 12
- 235000019501 Lemon oil Nutrition 0.000 claims abstract description 12
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 241000779819 Syncarpia glomulifera Species 0.000 claims abstract description 12
- 235000004279 alanine Nutrition 0.000 claims abstract description 12
- 150000001336 alkenes Chemical class 0.000 claims abstract description 12
- 229960003237 betaine Drugs 0.000 claims abstract description 12
- 239000012459 cleaning agent Substances 0.000 claims abstract description 12
- 229940043237 diethanolamine Drugs 0.000 claims abstract description 12
- 150000002191 fatty alcohols Chemical class 0.000 claims abstract description 12
- 239000010501 lemon oil Substances 0.000 claims abstract description 12
- 235000010288 sodium nitrite Nutrition 0.000 claims abstract description 12
- 229960001484 edetic acid Drugs 0.000 claims abstract description 11
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims abstract description 10
- 239000001739 pinus spp. Substances 0.000 claims abstract description 10
- 229940036248 turpentine Drugs 0.000 claims abstract description 10
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims abstract description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- 235000015165 citric acid Nutrition 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000010792 warming Methods 0.000 claims description 7
- 125000003963 dichloro group Chemical group Cl* 0.000 claims description 6
- UHCBBWUQDAVSMS-UHFFFAOYSA-N fluoroethane Chemical compound CCF UHCBBWUQDAVSMS-UHFFFAOYSA-N 0.000 claims description 6
- JRHNUZCXXOTJCA-UHFFFAOYSA-N 1-fluoropropane Chemical compound CCCF JRHNUZCXXOTJCA-UHFFFAOYSA-N 0.000 claims description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- 238000010790 dilution Methods 0.000 claims description 4
- 239000012895 dilution Substances 0.000 claims description 4
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 claims description 2
- ZYRCHSMEYOVADI-UHFFFAOYSA-N FC(C(F)(F)F)(C)F.[Cl] Chemical compound FC(C(F)(F)F)(C)F.[Cl] ZYRCHSMEYOVADI-UHFFFAOYSA-N 0.000 claims description 2
- XRPKRSLLVXAECN-UHFFFAOYSA-N CCCC.[F] Chemical compound CCCC.[F] XRPKRSLLVXAECN-UHFFFAOYSA-N 0.000 claims 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000002351 wastewater Substances 0.000 abstract description 4
- 239000006260 foam Substances 0.000 abstract description 3
- 238000005187 foaming Methods 0.000 abstract description 3
- 239000004615 ingredient Substances 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 230000001681 protective effect Effects 0.000 abstract description 3
- 239000002516 radical scavenger Substances 0.000 abstract description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/88—Ampholytes; Electroneutral compounds
- C11D1/94—Mixtures with anionic, cationic or non-ionic compounds
- C11D1/945—Mixtures with anionic, cationic or non-ionic compounds containing a combination of non-ionic compounds differently alcoxylised or with different alkylated chains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/046—Salts
- C11D3/048—Nitrates or nitrites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/18—Hydrocarbons
- C11D3/188—Terpenes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/2017—Monohydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2072—Aldehydes-ketones
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2096—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/24—Organic compounds containing halogen
- C11D3/245—Organic compounds containing halogen containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/38—Products with no well-defined composition, e.g. natural products
- C11D3/382—Vegetable products, e.g. soya meal, wood flour, sawdust
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/88—Ampholytes; Electroneutral compounds
- C11D1/90—Betaines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
本发明属于清洗剂技术领域，具体涉及一种军用电子设备基板的等离子体清洗剂及清洁方法。本发明的清洗剂包括：壬基酚聚氧乙烯醚、椰子油酰二乙醇胺、十八烷基二羟乙基甜菜碱、N‑十二烷基丙氨酸、乙二胺四乙酸、柠檬酸、异丙醇、精制柠檬油烯、环氧丙烷、精制松节油、脂肪醇聚氧乙烯醚、亚硝酸钠、二氯五氟丙烷、丙酮、水。本发明的军用电子设备基板的等离子体清洗剂，去污能力强，且产品中的任何一种成分对基板没有腐蚀作用，防锈性能强，可以在清洗物表面形成保护膜，防止其再次氧化；产品具有低泡沫性能，泡沫少，便于清洗，可减少污水排放量；产品性能稳定，性价比优于国内同类产品，价格低廉，而且产品的生产方法简单，可操作性强。
Description
技术领域
本发明属于清洗剂技术领域，具体涉及一种军用电子设备基板的等离子体清洗剂，还涉及上述的清洗剂应用于军用电子设备基板的清洁方法。
背景技术
电子设备基板是制造PCB的基本材料，一般情况下，基板就是覆铜箔层压板，单、双面印制板在制造中是在基板材料-覆铜箔层压板上，有选择地进行孔加工、化学镀铜、电镀铜、蚀刻等加工，得到所需电路图形。另一类多层印制板的制造，也是以内芯薄型覆铜箔板为底基，将导电图形层与半固化片交替地经一次性层压黏合在一起，形成3层以上导电图形层间互连。它具有导电、绝缘和支撑三个方面的功能。印制板的性能、质量、制造中的加工性、制造成本、制造水平等，在很大程度上取决于基板材料。
等离子体清洗剂可有效清洁顽固污渍，不留痕迹，安全可靠。使用等离子体清洗剂事产生的泡面量少，便于清洗，可有效减少污水排放量。
发明内容
为了解决上述的技术问题，本发明提供了一种军用电子设备基板的等离子体清洗剂，还提供了上述的清洗剂的清洁方法。
军用电子设备基板的等离子体清洗剂，包括下述的重量份数的原料：
壬基酚聚氧乙烯醚 5-15 椰子油酰二乙醇胺5-20
十八烷基二羟乙基甜菜碱 1-10 N-十二烷基丙氨酸 1-9
乙二胺四乙酸1-4 柠檬酸1-3
异丙醇1-5 精制柠檬油烯1-4
环氧丙烷1-4 精制松节油1-4
脂肪醇聚氧乙烯醚1-4 亚硝酸钠1-4
二氯五氟丙烷1-3 丙酮1-5
水20-60。
优选的，军用电子设备基板的等离子体清洗剂，包括下述的重量份数的原料：
壬基酚聚氧乙烯醚 10 椰子油酰二乙醇胺15
十八烷基二羟乙基甜菜碱5 N-十二烷基丙氨酸6
乙二胺四乙酸2 柠檬酸2
异丙醇3 精制柠檬油烯2
环氧丙烷2 精制松节油2
脂肪醇聚氧乙烯醚2 亚硝酸钠2
二氯五氟丙烷2 丙酮3
水40份。
优选的，还包括：甲氧基九氟丁烷4份，一氯五氟丙烷2份，二氯一氟乙烷3份。
上述的军用电子设备基板的等离子体清洗剂，其制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚 10 份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2 份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
军用电子设备基板的等离子体清洗剂，其特征在于，该清洗剂的制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚 10 份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2 份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份、甲氧基九氟丁烷4份，一氯五氟丙烷2份，二氯一氟乙烷3份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
将上述的清洗剂稀释3-5倍，再均匀喷涂于军用电子设备基板表面，过3-8分钟，然后再采用清水冲洗，最后，再次喷涂权利要求1中的清洗剂，再次用清水冲洗。
本发明的有益效果在于，本发明的军用电子设备基板的等离子体清洗剂，其优点是去污能力强，且产品中的任何一种成分对基板没有腐蚀作用，防锈性能达到了0级，而且还可以在清洗物表面形成保护膜，防止其再次氧化；产品具有低泡沫性能，泡沫少，便于清洗，可减少污水排放量；产品性能稳定，性价比优于国内同类产品，价格低廉，而且产品的生产方法简单，可操作性强。
具体实施方式
下面结合具体实施例对本发明作更进一步的说明，以便本领域的技术人员更了解本发明，但并不因此限制本发明。
实施例1
军用电子设备基板的等离子体清洗剂，其制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚10份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
实施例1中所得到的产品，其清洗力高，无残留，而且绝缘性能好，大大降低了在带电清洗过程中潜在的漏电危险。
其耐电压值达到了25KV；
除此之外，其优点还有，去污能力强，且产品中的任何一种成分对基板没有腐蚀作用，防锈性能达到了0级，而且还可以在清洗物表面形成保护膜，防止其再次氧化；产品具有低泡沫性能，泡沫少，便于清洗，可减少污水排放量；产品性能稳定，性价比优于国内同类产品，价格低廉，而且产品的生产方法简单，可操作性强。
实施例2
军用电子设备基板的等离子体清洗剂，其制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚10份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份、甲氧基九氟丁烷4份，一氯五氟丙烷2份，二氯一氟乙烷3份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
实施例3
将上述的清洗剂稀释3-5倍，再均匀喷涂于军用电子设备基板表面，过3-8分钟，然后再采用清水冲洗，最后，再次喷涂权利要求1中的清洗剂，再次用清水冲洗干净。
Claims (8)
1.军用电子设备基板的等离子体清洗剂，包括下述的重量份数的原料：
壬基酚聚氧乙烯醚 5-15 椰子油酰二乙醇胺5-20
十八烷基二羟乙基甜菜碱 1-10 N-十二烷基丙氨酸 1-9
乙二胺四乙酸1-4 柠檬酸1-3
异丙醇1-5 精制柠檬油烯1-4
环氧丙烷1-4 精制松节油1-4
脂肪醇聚氧乙烯醚1-4 亚硝酸钠1-4
二氯五氟丙烷1-3 丙酮1-5
水20-60。
2.如权利要求1所述的军用电子设备基板的等离子体清洗剂，其特征在于，包括下述的重量份数的原料：
壬基酚聚氧乙烯醚 10 椰子油酰二乙醇胺15
十八烷基二羟乙基甜菜碱5 N-十二烷基丙氨酸6
乙二胺四乙酸2 柠檬酸2
异丙醇3 精制柠檬油烯2
环氧丙烷2 精制松节油2
脂肪醇聚氧乙烯醚2 亚硝酸钠2
二氯五氟丙烷2 丙酮3
水40份。
3.如权利要求1所述的军用电子设备基板的等离子体清洗剂，其特征在于，还包括：甲氧基九氟丁烷4份，一氯五氟丙烷2份，二氯一氟乙烷3份。
4.如权利要求1所述的军用电子设备基板的等离子体清洗剂，其特征在于，该清洗剂的制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚10 份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2 份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
5.如权利要求1所述的军用电子设备基板的等离子体清洗剂，其特征在于，该清洗剂的制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚10份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2 份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份、甲氧基九氟丁烷4份，一氯五氟丙烷2份，二氯一氟乙烷3份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
6.军用电子设备基板的等离子体清洗剂，其制备方法包括下述的步骤：
（1）按配比将20份水加入到反应釜中，升温至35-45℃，然后分别加入壬基酚聚氧乙烯醚10份、椰子油酰二乙醇胺15份、十八烷基二羟乙基甜菜碱5份、 N-十二烷基丙氨酸6份、乙二胺四乙酸2份、柠檬酸2份；
（2）再将20份水加入到反应釜中，再加入精制柠檬油烯2 份、环氧丙烷2份、精制松节油2份、脂肪醇聚氧乙烯醚2份、亚硝酸钠2份、二氯五氟丙烷2份、甲氧基九氟丁烷4份，一氯五氟丙烷2份，二氯一氟乙烷3份；搅拌均匀；
（3）最后将异丙醇3 份、丙酮3份加入到（2）的物料中，搅拌均匀，得产品。
7.如权利要求1所述的军用电子设备基板的等离子体清洗剂的清洁方法：将权利要求1中的清洗剂稀释3-5倍，再均匀喷涂于军用电子设备基板表面，过3-8分钟，然后再采用清水冲洗，最后，再次喷涂权利要求1中的清洗剂，再次用清水冲洗。
8.如权利要求1所述的军用电子设备基板的等离子体清洗剂的清洁方法：将权利要求1中的清洗剂稀释4倍，再均匀喷涂于军用电子设备基板表面，过6分钟，然后再采用清水冲洗，最后，再次喷涂权利要求1中的清洗剂，再次用清水冲洗。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810098286.XA CN108485836A (zh) | 2018-01-31 | 2018-01-31 | 军用电子设备基板的等离子体清洗气体和清洁方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810098286.XA CN108485836A (zh) | 2018-01-31 | 2018-01-31 | 军用电子设备基板的等离子体清洗气体和清洁方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108485836A true CN108485836A (zh) | 2018-09-04 |
Family
ID=63344283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810098286.XA Pending CN108485836A (zh) | 2018-01-31 | 2018-01-31 | 军用电子设备基板的等离子体清洗气体和清洁方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108485836A (zh) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1156756A (zh) * | 1996-02-06 | 1997-08-13 | 北京·松下彩色显象管有限公司 | 显象管金属部件用水系去油清洗剂及其制备方法 |
| CN1417314A (zh) * | 2001-11-02 | 2003-05-14 | 广州南沙经济技术开发区高奇环保技术有限公司 | 精密电子设备带电清洁剂 |
| CN1181173C (zh) * | 2001-07-23 | 2004-12-22 | 山东大学 | 一种用于超大规模集成电路芯片的清洗剂组合物及其制备方法 |
| KR20060009895A (ko) * | 2003-05-07 | 2006-02-01 | 아지노모토 가부시키가이샤 | 세정제 조성물 |
| CN1727462A (zh) * | 2001-11-02 | 2006-02-01 | 广州南沙经济技术开发区高奇环保技术有限公司 | 精密电子设备带电清洁剂 |
| CN101962601A (zh) * | 2010-10-31 | 2011-02-02 | 无锡龙腾画材有限公司 | 一种环保型柑桔皮提取柠檬烯除胶去污剂及其制备方法 |
-
2018
- 2018-01-31 CN CN201810098286.XA patent/CN108485836A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1156756A (zh) * | 1996-02-06 | 1997-08-13 | 北京·松下彩色显象管有限公司 | 显象管金属部件用水系去油清洗剂及其制备方法 |
| CN1181173C (zh) * | 2001-07-23 | 2004-12-22 | 山东大学 | 一种用于超大规模集成电路芯片的清洗剂组合物及其制备方法 |
| CN1417314A (zh) * | 2001-11-02 | 2003-05-14 | 广州南沙经济技术开发区高奇环保技术有限公司 | 精密电子设备带电清洁剂 |
| CN1727462A (zh) * | 2001-11-02 | 2006-02-01 | 广州南沙经济技术开发区高奇环保技术有限公司 | 精密电子设备带电清洁剂 |
| KR20060009895A (ko) * | 2003-05-07 | 2006-02-01 | 아지노모토 가부시키가이샤 | 세정제 조성물 |
| CN101962601A (zh) * | 2010-10-31 | 2011-02-02 | 无锡龙腾画材有限公司 | 一种环保型柑桔皮提取柠檬烯除胶去污剂及其制备方法 |
Non-Patent Citations (1)
| Title |
|---|
| 李东光: "《工业清洗剂配方与制备》", 31 August 2009, 中国纺织出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100828979B1 (ko) | 에칭액, 에칭 방법 및 프린트 배선판 | |
| CN102046849B (zh) | 增进抗酸性的组合物 | |
| JP2562810B2 (ja) | 過マンガン酸ナトリウムのアルカリ性水性溶液及び樹脂回路基板の処理方法 | |
| TWI499696B (zh) | 電鍍用預處理劑，電鍍用預處理方法，以及電鍍方法 | |
| CN101910468A (zh) | 用于铜或铜合金的蚀刻液、蚀刻前处理液及蚀刻方法 | |
| US6830627B1 (en) | Copper cleaning compositions, processes and products derived therefrom | |
| CN102427673B (zh) | 盲孔pcb板的加工方法 | |
| EP1179973B2 (en) | Composition for circuit board manufacture | |
| KR101590081B1 (ko) | 인쇄회로기판 내층의 표면처리 방법 | |
| CN108485836A (zh) | 军用电子设备基板的等离子体清洗气体和清洁方法 | |
| CN111424272A (zh) | 一种用于印刷电路板的棕化液 | |
| KR20130067302A (ko) | 프린트 배선판의 제조 방법 및 그 프린트 배선판의 제조 방법을 이용해 얻어진 프린트 배선판 | |
| JP4069387B2 (ja) | エッチング液 | |
| WO2005048663A2 (en) | Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards | |
| KR101375237B1 (ko) | 전자파 차폐용 얇은 금속화 필름의 제조방법 및 그에 의한 금속화 필름 | |
| US20130186764A1 (en) | Low Etch Process for Direct Metallization | |
| JP3673357B2 (ja) | めっき用の前処理洗浄剤 | |
| US6454954B1 (en) | Desmear etchant and use thereof | |
| CN111472002A (zh) | 一种用于印刷电路板的缓蚀剂 | |
| CN104293500A (zh) | 一种用于清洗印制电路板的化学制剂 | |
| KR20110099639A (ko) | 전기도금용 전처리제，전기도금의 전처리방법 및 전기도금방법 | |
| US20230199972A1 (en) | One-Step Oxide Bath for Improving Adhesion of Polymeric Materials to Metal Substrates | |
| JP3129596B2 (ja) | プリント配線板のめっきレジストの除去方法 | |
| JP2015078443A (ja) | 電気銅めっき用前処理剤、電気銅めっきの前処理方法及び電気銅めっき方法 | |
| JP2571867B2 (ja) | プリント配線板の製造法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180904 |
|
| RJ01 | Rejection of invention patent application after publication |