CN108406097A - A kind of laser processing device and processing method being suitable for processing superhard material - Google Patents
A kind of laser processing device and processing method being suitable for processing superhard material Download PDFInfo
- Publication number
- CN108406097A CN108406097A CN201810535592.5A CN201810535592A CN108406097A CN 108406097 A CN108406097 A CN 108406097A CN 201810535592 A CN201810535592 A CN 201810535592A CN 108406097 A CN108406097 A CN 108406097A
- Authority
- CN
- China
- Prior art keywords
- focus
- laser
- unit
- polyhedron
- material surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 152
- 238000003672 processing method Methods 0.000 title abstract description 6
- 230000033001 locomotion Effects 0.000 claims abstract description 36
- 230000008859 change Effects 0.000 claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims description 50
- 239000010432 diamond Substances 0.000 claims description 42
- 229910003460 diamond Inorganic materials 0.000 claims description 37
- 239000000571 coke Substances 0.000 claims description 9
- 238000003698 laser cutting Methods 0.000 claims description 8
- 238000010147 laser engraving Methods 0.000 claims description 4
- 238000007648 laser printing Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims 1
- 238000005520 cutting process Methods 0.000 description 14
- 230000007246 mechanism Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000011514 reflex Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011435 rock Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004939 coking Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of laser processing device and processing method being suitable for processing superhard material.Described device includes polyhedron focusing unit, rotary unit and focus adjustment unit, the polyhedron focusing unit is for making incident laser be focused into focus on material surface, the rotary unit is by driving at least part of the polyhedron focusing unit to rotate to make the focus be moved back and forth in the material surface, and the focus adjustment unit is for adjusting the polyhedron focusing unit to change position of the focus on the thickness direction of the material surface.The processing method includes：Incident laser is set to be focused into focus on material surface；Changing the exit direction of incident laser by rotary motion makes the focus be moved back and forth in the material surface；Change position of the focus on the thickness direction of the material surface.The present invention can greatly improve processing efficiency, hence it is evident that improve processing quality, be processed advantageously to thicker superhard material.
Description
Technical field
The present invention relates to technical field of laser processing, more particularly to a kind of laser processing device being suitable for processing superhard material
It sets and processing method.
Background technology
Requirement with modern processing manufacturing industry to high-speed cutting processing is continuously improved, for various difficult cutting composite woods
Material, engineering ceramic material etc., conventional tool has been unable to meet the needs of high-speed cutting, and ultra-hard cutting tool is to solve above ask
The effective means of topic, wherein the application of diamond cutter is relatively broad.Diamond has high hardness, good wearability
With thermal conductivity, low-friction coefficient and coefficient of thermal expansion, the superiority for being difficult to substitute is embodied in modern machining, is known as
The present age improves one of most promising cutter material of productivity.Currently, application of the diamond cutter in mechanical processing is increasingly general
And, it has also become indispensable important tool in modern material processing.
Diamond is a kind of superhard material, and the method for processing diamond has grinding wheel mechanical processing, electric spark to put
Electric wire cutting processing, laser cutting process, and the mode of laser cutting process gradually increases now, but conventional laser is cut
The mode cut is to move material to be cut by way of axis movement, and laser focus on light beam is cut on material.Generally cut
The movement velocity cut is hundreds of millimeters per second, although two ways is many soon earlier above for cutting speed, is still taken longer.Separately
Outside, be cut by laser using scanning galvanometer in some cutting modes, but the speed highest of scanning galvanometer namely arrive it is per second
It is several meters, time-consuming also longer, and the mode of scan incision can not cut thicker material.
Invention content
The purpose of the present invention is to solve longer technical problem is taken to the processing of superhard material in the prior art, carry
Go out a kind of laser processing device and processing method being suitable for processing superhard material.
In order to solve the above technical problems, the present invention uses following technical scheme：
A kind of laser processing device being suitable for processing superhard material, including：Polyhedron focusing unit, rotary unit and coke
Point adjusts unit, and for the polyhedron focusing unit for making incident laser be focused into focus on material surface, the rotation is single
Member is by driving at least part of the polyhedron focusing unit to rotate to keep the focus reciprocal in the material surface
Movement, the focus adjustment unit is for adjusting the polyhedron focusing unit to change the focus in the material surface
Position on thickness direction.
In some preferred embodiments, the polyhedron focusing unit is equipped with and can be focused to the incident laser
The first optical element, the focus adjustment unit is by changing first optical element position in the optical path or change
The optical parameter of first optical element changes position of the focus on the thickness direction of the material surface.
In further preferred embodiment, the polyhedron focusing unit includes focusing unit and polyhedral elements,
The focusing unit is first optical element, and the focusing unit is for being focused the incident laser to form focusing
Light beam, the polyhedral elements are used to the Focused Beam Reflectance to the material surface forming focus, the rotary unit
The polyhedral elements rotation can be driven to make the focus be moved back and forth in the material surface.
In further preferred embodiment, the polyhedron focusing unit is more curved surfaces equipped with multiple curved surface elements
Body unit, the curved surface elements are first optical element, and the curved surface elements can be by the incident laser in the material
Focus is focused on surface, the rotary unit can drive more curved body unit rotations to make the focus in the material
Expect that surface moves back and forth；The curvature of curved surface of the curved surface elements is adjustable.
In further preferred embodiment, the polyhedral elements are more curved body lists equipped with multiple curved surface elements
Member, the focusing unit and the curved surface elements are first optical element, and the curved surface elements can be by the incident laser
It is focused into focus on the material surface.
In some preferred embodiments, the polyhedron focusing unit be tool there are three, four, five, six, seven
A, eight faces structure is the structure at least nine faces；The rotary speed of the rotary unit and/or direction can
It adjusts；The speed of the rotary unit is 8-15m/s；The thickness of the machinable superhard material of laser processing device is 0.1-
10mm；The type of the superhard material includes diamond and engineering ceramic material, and the diamond includes PCD Buddha's warrior attendants
Stone, CBN diamonds, cvd diamond；The concrete type of the laser processing device includes laser cutting device, laser engraving dress
It sets, laser print apparatus.
On the other hand, the present invention provides a kind of laser processing being suitable for processing superhard material, including：
Incident laser is set to be focused into focus on material surface；
Changing the exit direction of incident laser by rotary motion makes the focus be moved back and forth in the material surface；
Change position of the focus on the thickness direction of the material surface.
In some preferred embodiments, described to make incident laser be focused into focus on material surface to include：
So that the incident laser is formed focus on light beam, then the Focused Beam Reflectance to the material surface is formed into coke
Point；
Alternatively, the incident laser is first made to form divergent beams, then the divergent beams are reflexed into the material surface
Form focus；
Alternatively, the incident laser is focused into focus on the material surface by way of reflection.
In some preferred embodiments, the position for changing the focus on the thickness direction of the material surface
Set including：
By mechanical movement change can to the position of the first optical element that the incident laser is focused in the optical path,
To change position of the focus on the thickness direction of the material surface；
It can be to the optical parameter for the first optical element that the incident laser is focused, to change alternatively, changing
State position of the focus on the thickness direction of the material surface.
In some preferred embodiments, first being processed on one side from material, then from the another side of the material into
Row processing；
The concrete type of the laser processing includes laser cutting, laser engraving, laser printing.
Compared with prior art, beneficial effects of the present invention have：
Incident laser is set to be focused into focus on material surface by polyhedron focusing unit, then the rotation for passing through rotary unit
Transhipment is dynamic to make focus be moved back and forth in material surface, that is to say, that polyhedron focusing unit is at least under the action of rotary unit
A part of rotatable, focus can be fast moved in material surface by improving the rotating speed of rotation, to be processed to material.Cooperation
Focus adjustment unit keeps focus mobile from top to bottom on material, can be laser machined in a thickness direction to material.This
Invention can be used for processing a variety of materials, especially suitable for being processed to superhard material：Since focus can be quick in material surface
It moves and can from top to bottom be moved on material, it, can be such as golden to superhard material in combination with the laser pulse of high-peak power
Hard rock tablet is processed, such as hacking processing, can greatly improve processing efficiency, hence it is evident that processing quality is improved, in addition to thicker
Superhard material be processed also advantageously.
In a preferred embodiment, the present invention also has the advantages that：
Further, it is equipped with the adjustable curved surface elements of curvature of curved surface on polyhedron focusing unit, passes through focal adjustments list
The curvature of curved surface of curved surface elements is adjusted in member, and position of the focus on the thickness direction of material surface can be changed, thus
Material is processed on thickness direction, there is advantage that is compact-sized, saving installation space.
Description of the drawings
Fig. 1 is the structural schematic diagram of the laser processing device for being suitable for processing superhard material of the present invention；
Fig. 2 is a kind of structural schematic diagram of variant of the laser processing device of the present invention；
Fig. 3 is the structural schematic diagram of another variant of the laser processing device of the present invention；
Fig. 4 is the structural schematic diagram of the third variant of the laser processing device of the present invention；
Fig. 5 shows variation of the focus in thickness direction；
Fig. 6 shows the polyhedron focusing unit with the curved surface elements of different curve curvature；
Fig. 7 is the structural schematic diagram of the 4th kind of variant of the laser processing device of the present invention；
Fig. 8 is the structural schematic diagram of the 5th kind of variant of the laser processing device of the present invention；
Fig. 9 is the flow chart of the laser processing of the present invention.
Specific implementation mode
The present invention can laser machine a variety of materials, such as metal material, nonmetallic materials, especially suitable for super
Hard material is laser machined, and the type of superhard material includes diamond and engineering ceramic material, and diamond includes
PCD diamonds (Polycrystalline diamond, PCD), CBN diamonds (Cubic Boron Nitride, CBN), CVD
Diamond (Chemical VaporDeposition, CVD).The concrete type of laser processing include laser cutting, laser engraving,
Laser printing.It mainly elaborates below to embodiments of the present invention by taking the cutting processing of diamond tablet as an example.It should
, it is emphasized that following the description is only exemplary, the range being not intended to be limiting of the invention and its application.
With reference to figure 1, the laser processing device suitable for processing superhard material includes polyhedron focusing unit 1, rotary unit 2
With focus adjustment unit 3.
Polyhedron focusing unit 1 is for making incident laser be focused into focus 101 on material surface.Incident laser 100 from
Polyhedron focusing unit 1 be emitted after, focus 101 is focused on material surface, that is to say, that polyhedron focusing unit 1 have pair
The function that incident laser 100 is focused.Moreover, polyhedron focusing unit 1 is polyhedral structure, for there are three tools, four, five
A, six, seven, eight faces structure is the structure at least nine faces, and the particular number in face can be according to focus
It is arranged in the movable length of material surface.
Rotary unit 2 is by driving at least part of polyhedron focusing unit 1 to rotate to make focus in material surface
It moves back and forth.It is rotated that is, rotary unit 2 can be the entire polyhedron focusing unit 1 of driving, can also be driving multi-panel
A part of structure of body focusing unit 1 rotates, and principle is：Under the action of rotary unit 2, incident laser 100 is from polyhedron
The focus 101 that focusing unit 1 is formed after being emitted can be moved back and forth in material surface.Here reciprocating motion can be reciprocating linear
Movement can also be reciprocal curvilinear motion or the movement of reciprocal broken line, can be specifically arranged according to actual processing demand, this hair
Bright to be not limited, wherein linear reciprocating motion is more advantageous to carries out rapid processing, such as high-speed cutting to superhard material.Rotation
It can be contact that unit 2, which drives the mode of at least part rotation of polyhedron focusing unit 1, for example, rotary unit 2 with
Polyhedron focusing unit 1 can also be contactless, for example rotary unit 2 passes through magnetic field power drive polyhedron by axis connection
Focusing unit 1 rotates.In addition, the rotary speed of rotary unit 2 and/or direction are adjustable, it can so change laser processing device
Process velocity and/or machine direction, the rotary speed of rotary unit 2 can be 8-15m/s, which can meet mostly
Process the requirement of occasion.
Focus adjustment unit 3 be used for adjust polyhedron focusing unit 1 with change focus 101 material surface thickness direction
On position so that laser processing device can be processed on the thickness direction of material.Focus adjustment unit 3 can lead to
It crosses and changes the position in the optical path of polyhedron focusing unit 1 or change the optical parameter of polyhedron focusing unit 1 to change coke
Position of the point on the thickness direction of material surface.
On the other hand, the present invention provide it is a kind of be suitable for processing the laser processing of superhard material, this method can be with
Above-mentioned laser processing device is not used, and above-mentioned laser processing device can also be used.With reference to the laser processing of the present invention
The method laser processing device above-mentioned to the present invention illustrates.With reference to figure 9, laser processing of the invention includes step
S100 to step S300.
Step S100, incident laser 100 is made to be focused into focus on material surface.It is exemplary, keep incident laser 100 incident
To polyhedron focusing unit 1, incident laser 100 is focused into focus after the outgoing of polyhedron focusing unit 1 on material surface
101。
Step S200, changing the exit direction of incident laser by rotary motion makes focus be moved back and forth in material surface.
It is exemplary, start rotary unit 2, at least part rotation of driving polyhedron focusing unit 1, the changeable incidence of the rotary motion
The exit direction of laser 100, to make focus be moved back and forth in material surface.Certainly, as previously mentioned, it can be past to move back and forth
Linear motion can also be reciprocal curvilinear motion or the movement of reciprocal broken line.
Step S300, change position of the focus on the thickness direction of material surface.Incident laser 100 is focused in polyhedron
Under the action of unit 1 and rotary unit 2, material surface is processed, such as cutting processing, when needs are in the thickness side of material
Upwards when being processed, the position in the optical path of polyhedron focusing unit 1 is changed by focus adjustment unit 3 or changes multi-panel
The optical parameter of body focusing unit 1, you can change position of the focus on the thickness direction of material surface, for example focus is existed
Move down 0.5mm on material surface, to allow incident laser 100 to cut away the material of 0.5mm thickness.In the process of processing
In, it can constantly change position of the focus on the thickness direction of material surface, for example make focus past again on material surface
Lower mobile 0.5mm so repeats to cut away the material of 0.5mm thickness again.
In addition, with reference to figure 2, focus control system 8 can also be set, according to the parameter being set in advance, polyhedron focuses single
After at least part of member 1 rotates a fixing turn, one signal of output to focus control system 8, focus control system 8 controls coke
Point, which adjusts unit 3, makes the distance and number of the movement setting of focus 101, to realize automation processing.It is focus adjustment unit 3, more
Signal transmission between face body focusing unit 1 and focus control system 8 can be wire transmission, such as focus adjustment unit 3, more
Face body focusing unit 1 is connect with focus control system 8 respectively, or wireless transmission.
Certainly, when being processed to material, can first being processed on one side from material, half cut to material
It when depth, then is processed from the another side of material, during which can readjust polyhedron focusing unit 1 so that incident swash
Light 100 forms focus 101 in the another side of material, in this way can more efficiently cutting material, can also cut thicker material.
The step of laser processing of the present invention, is not limited to said sequence, for example step S300 can be located at step S200
Before.
As described above, with reference to figure 1, incident laser 100 is set to be focused on material surface by polyhedron focusing unit 1
Polyhedron focusing unit 1 is set to move the laser beam of focusing into horizontal deflection at focus 101, then by the rotary motion of rotary unit 2
It is dynamic, change the shooting angle of incident laser 100, to make focus 101 be moved back and forth in material surface, that is to say, that single in rotation
At least part of polyhedron focusing unit 1 is rotatable under the action of member 2, and the rotating speed for improving rotation can be quick in material surface
Moving focal point 101, for example 101 high-speed straight-line of focus is made to move, to be processed to material.Cooperation focus adjustment unit 3 makes
Focus 101 is mobile from top to bottom on material, can be laser machined in a thickness direction to material.Since focus 101 can
It fast moves and can from top to bottom be moved on material in material surface, in combination with the laser pulse pair with high-peak power
Material carries out rapid processing, can greatly improve processing efficiency, hence it is evident that and processing quality is improved, can be used for processing a variety of materials, such as
It cuts fragment or material removes processing, thicker material is processed advantageously.
The present invention is further illustrated below：
On laser processing, incident laser 100 is first set to form focus on light beam 200, then focus on light beam 200 is reflexed to
Material surface forms focus.It is illustrated with reference to the laser processing device of the present invention.
With reference to figure 1, polyhedron focusing unit 1 is equipped with the first optical element 10 that can be focused to incident laser 100.
That is the first optical element 10 have the function of focus, can be specifically convex lens, curved mirror, curved surface film or it is other can be right
The optical element that incident laser 100 is focused, exemplary, the focusing focal length of the first optical element 10 is 125mm.Focal adjustments
Unit 3 is changed by changing the optical parameter of the first optical element 10 of position or change of the first optical element 10 in the optical path
Position of the zoom point on the thickness direction of material surface.Wherein, optical parameter includes the curvature of curved surface of optical element, refraction
Rate focuses focal length, for example replaces different the first optical elements 10 for focusing focal length.
With reference to figure 1, polyhedron focusing unit 1 includes focusing unit 11 and polyhedral elements 12.Focusing unit 11 is first
Optical element, focusing unit 11 is for being focused incident laser 100 to form focus on light beam 200, exemplary, focusing unit 11
For convex lens.Polyhedral elements 12 can be rotated around its center, and polyhedral elements 12 are used to focus on light beam 200 reflexing to material table
Face namely the surface of diamond tablet 300 301 form focus 101, wherein the working face that surface 301 namely laser machines.
Polyhedral elements 12 can be the multiple surface rotating mirror for the reflectance coating that corresponding laser wavelength is coated on each face, can also be equipped with more
The polyhedral structure of a speculum.Rotary unit 2 can drive polyhedral elements 12 to rotate, and polyhedral elements 12 are that polyhedron focuses
The part rotation of a part namely rotary unit 2 driving the polyhedron focusing unit 1 of unit 1, polyhedral elements 12 are such as more
Face tilting mirror plays reflex to focus on light beam 200, changes the angle of reflected focus beam 200 by the rotation of multiple surface rotating mirror,
Exemplary to make focus 101 do linear reciprocating motion on the surface of diamond tablet 300 301, rotary unit 2 passes through axis
It is connect with polyhedral elements 12, rotary unit 2 can drive 12 high speed rotation of polyhedral elements when rotating.
It can pass through mechanical movement on laser processing for changing position of the focus 101 in thickness direction
Change the position of the first optical element in the optical path, the range of position change can be 0-10mm, to change focus 101 in gold
Position on the thickness direction on the surface 301 of hard rock tablet 300.Exemplary, with reference to figure 1, focus adjustment unit 3 is linear motion
Mechanism such as linear motion axis, focusing unit 11 are arranged on focus adjustment unit 3.Focus adjustment unit 3 is changeable to focus list
Position of the member 11 on the direction that incident laser 100 is propagated, to change focus 101 on the surface of diamond tablet 300 301
Position on thickness direction.
With reference to figure 1, diamond tablet 300 is fixed on rotating jig 7, and variously-shaped tablet can be clamped in rotating jig 7,
For example rectangular and round material, rotating jig 7 also have the function of rotation.Incident light 100 first passes through focusing unit 11 and becomes poly-
Defocused laser beam 200 is then focused into light beam 200 and is incident to polyhedral elements 12, and rotary unit 2 drives polyhedral elements 12 to revolve at a high speed
Turn, focus on light beam 200 by each face of polyhedral elements 12 reflex to diamond tablet 300 surface 301 formed focus 101 and
Fast linear motion is done on surface 301, to be cut to diamond tablet 300.Adjust focus adjustment unit 3 namely straight line
Motion makes focusing unit 11 move linearly along the direction that incident laser 100 is propagated, and focus 101 can be made in diamond tablet
It is moved down on 300 surface 301, it is on the contrary then move up, to be cut to 300 through-thickness of diamond tablet, so
It repeats, the more cuts the more deep, finally cut off diamond tablet 300.Also diamond tablet 300 can be made to be turned to by rotating jig 7
Another side, to be cut to another side.
Above the present invention is described, but the present invention can also have the mode of some modifications, such as：
Focusing unit 11 can also be that curved mirror, parallel incident laser 100 are radiated on curved mirror, and curved mirror is to incidence
Laser 100 is focused to form focus on light beam 200, which is incident to polyhedral elements 12, and polyhedral elements 12 will gather
The surface 301 that defocused laser beam 200 reflexes to i.e. diamond tablet 300 forms focus 101.Change curved surface by focus adjustment unit 3
Focus 101 can be changed on the surface of diamond tablet 300 in mirror position in the optical path or the curvature of curved surface for changing curved mirror
Position on 301 thickness direction.
It can also be that polyhedral elements 12 are arranged on straight-line motion mechanism such as linear motion axis, change polyhedral elements
12 position on the direction that incident laser 100 is propagated, since the variation of beam angle can allow the focus 101 of focus on light beam 200
It moves up or down accordingly, focus 101 also just can be changed on the thickness direction on the surface of diamond tablet 300 301
Position；Alternatively, focusing unit 11 and polyhedral elements 12 are arranged on straight-line motion mechanism, change focusing unit 11 and multi-panel
Position of the body unit 12 on the direction that incident laser 100 is propagated, changeable focus 101 is on the surface of diamond tablet 300
Position on 301 thickness direction；It can be applied to different occasions in this way, be conducive to expand the scope of application.
Rotary unit 2 can also be rotated by magnetic field power drive polyhedral elements 12, and exemplary, polyhedral elements 12 can turn
Dynamicly rack-mount, the sides of polyhedral elements 12 is equipped with the first magnet, and the side of rotary unit 2 also is provided with rotatable
Second magnet, when rotary unit 2 rotates, the second magnet also rotates, and under the action of a magnetic force, the second magnet drives the first magnet
Rotation, to make polyhedral elements 12 rotate.Such disassembly and installation being advantageous in that convenient for equipment.
With reference to figure 3, polyhedral elements 12 are more curved surface body units equipped with multiple curved surface elements 13, focusing unit 11 and song
Face element part 13 is the first optical element, and curved surface elements 13 can gather incident laser 100 on the surface of diamond tablet 300 301
Coke is at focus 101.That is incident laser 100 is focused by focusing unit 11 after focus on light beam 200, is incident to curved surface
The curved surface of element 13, curved surface elements 13 reflect incident laser 100 and it are made to be focused into focus 101 on surface 301.
The present invention can also be achieved：
On laser processing, incident laser 100 is made to be focused into focus on material surface by way of reflection
101.It is illustrated with reference to laser processing device.
With reference to figure 4, polyhedron focusing unit 1 is more curved surface body units equipped with multiple curved surface elements 13, that is to say, that more
Face body focusing unit 1 has multiple curved surfaces, and the curvature in each polyhedral face is consistent, and the shape of curved surface can be round or side
Shape.Curved surface elements 13 are used for that laser beam is reflected and focused, and the angle of laser beam exits can be adjusted.Curved surface elements
13 be the first optical element, and incident laser 100 can be focused coking by curved surface elements 13 on the surface of diamond tablet 300 301
Point 101, exemplary, curved surface elements can be curved reflector, camber reflection film or other can be carried out to incident laser 100
The optical element for reflecting and focusing.Rotary unit 2 can drive the rotation of polyhedron focusing unit 1 namely rotary unit 2 to drive entirely
Polyhedron focusing unit 1 rotates, the mobile laser beam of the reflection deflection of curved surface elements 13 on polyhedron focusing unit 1, to make coke
Point 101 is in 301 linear reciprocating motion of the surface of diamond tablet 300.
For changing position of the focus 101 in thickness direction, on laser processing, change the first optics member
The optical parameter of part, to change position of the focus 101 on the thickness direction on the surface of diamond tablet 300 301.Reference chart
4, exemplary, the curvature of curved surface of curved surface elements 13 is adjustable, to make laser processing device can be in a thickness direction to Buddha's warrior attendant building stones
Piece 300 is cut.Focus adjustment unit 3 is the mechanism that can be adjusted to the curvature of curved surface of curved surface elements 13, can be with
The stretching structure of the curved face contact of curved surface elements 13 can also be the curvature of curved surface by non-contacting mode to curved surface elements 13
The curvature regulating mechanism being adjusted.It can be specifically hydraulic telescopic machanism for telescoping mechanism, can also be air pressure telescopic machine
Structure.Can be specifically Pneumatic adjusting mechanism for curvature regulating mechanism, such as：By vacuumizing inside polyhedron focusing unit 1
Mode makes the interior pressure of curved surface be less than outside atmospheric pressure, and outside atmospheric pressure compressing curved surface makes curvature of curved surface subtract
It is small, or the plenum in polyhedron focusing unit 1 so that the interior pressure of curved surface is more than outside atmospheric pressure, interior pressure compression
Curved surface makes curvature of curved surface increase；Each curved surface of polyhedron focusing unit 1 is individually processed, and polyhedral structure is then combined into,
Integral module processing and fabricating, the interior location of polyhedron focusing unit 1 can also be used to hollow out inflation, built in pressure sensor dress
It sets to be detected to pressure；Curvature regulating mechanism can also be flux control mechanism, such as the negative camber 131 of curved surface elements 13
Equipped with magnet, polyhedron focusing unit 1 is internally provided with the adjustable magnetic element of magnetic field intensity, and magnetic element generates magnetic field and inhales
Draw the magnet being arranged on negative camber 131, curvature of curved surface can also be adjusted in this way.It is exemplary, with reference to figure 4, focus tune
It is the hydraulic telescopic machanism with the curved face contact of curved surface elements 13 to save unit 3, is arranged in the inside of polyhedron focusing unit 1, burnt
Point adjusts unit 3 and is contacted with the negative camber 131 of curved surface elements 13, and the curvature of negative camber 131 can be made when focus adjustment unit 3 stretches
Become larger or becomes smaller.
The variation numerical basis of the curvature of curved surface r of curved surface elements 13 is in the material thickness processed of needs, with reference to figure 5 and Fig. 6,
Variation of the curvature from r1, r2, r3, r4, r5, r6 ... rn etc. can be achieved.Pass through Curvature varying so that focus 101 is from material upper table
Face is moved toward lower surface, to make laser processing device be cut in a thickness direction to diamond tablet 300.It is exemplary,
The focusing task distance of polyhedron focusing unit 1 is 100mm, and the thickness of diamond tablet 300 is 3mm, the song of curved surface elements 13
Face curvature setting value is respectively r1=100mm, r2=100.5mm, r3=101mm, r4=101.5mm, r5=102mm, r6=
102.5mm, variation principle are to carry out corresponding variation according to the working depth 0.5mm of focus 101, but not limited to this numerical value,
Under the conditions of different laser parameters according to laser beam foucing can working depth range be adjusted, gradually move down the position of focus 101
It sets, until rapidoprint is completed, the thickness of machinable superhard material is 0.1-10mm.
The structure that laser processing device can so be simplified, makes its more compact structure.
The present invention can also be achieved：
An adjusting unit, which can also be arranged, makes focus 101 increase a freedom of motion on material surface, to make
Focus 101 does two dimensional motion on material surface.Such as the structure that polyhedron focusing unit 1 can be made to move in the vertical direction,
Certainly, incident laser 100 should also be as moving in the vertical direction accordingly at this time；Or setting can make polyhedron focusing unit 1
The structure of deflection.In this way, focus 101 can be made to do reciprocal curvilinear motion or the movement of reciprocal broken line in material surface, two dimension is realized
Three dimensional slots then can be achieved in cutting, cooperation focus adjustment unit 3.
In some applications, with reference to figure 1, expand unit 4 can also be set, expand unit 4 be used for laser beam into
Row expands and debugs the dispersion angle of laser beam, 2-10 power beam expansion lens can be selected, diopter is adjustable.Expand unit 4 is arranged more
The front of face body focusing unit 1, incident laser 100 after expand unit 4 by being incident to polyhedron focusing unit 1.
In some applications, with reference to figure 7, collimation unit 5 can also be set, the setting of collimation unit 5 is poly- in polyhedron
The front of burnt unit 1, incident laser 100 after collimation unit 5 by being incident to polyhedron focusing unit 1.Collimation unit 5 is used for
To being collimated from the laser beam of Transmission Fibers transmission outgoing, collimation unit 5 can be combined with the such as focus lamp of focusing unit 11
It uses, for example the collimation unit that collimation focal length is 100mm and the focus lamp that focusing focal length is 125mm is selected to be combined into collimation focusing
Collimation focusing microscope group 50 is mounted on straight-line motion mechanism, allows collimation focusing microscope group 50 in light by mechanical movement by microscope group 50
Shu Fangxiang is moved, moving range 0-10mm, can also realize position change of the focus in thickness direction.
In some applications, with reference to figure 8, laser processing includes：Incident laser 100 is first set to form diverging light
Beam, then divergent beams are reflexed into material surface and form focus 101.Second for making the diverging of incident laser 100 can be set
Optical element 6, the second optical element 6 have it is at least one can make incident light emit face, it is exemplary, can be concavees lens,
Curved surface transmitting mirror, the camber reflection film being arranged in other structures or other optical elements for making incident laser 100 dissipate.Light
It learns element 6 to be arranged in the front of polyhedron focusing unit 1, so that incident laser 100 is formed divergent beams by the second optical element 6
600, divergent beams 600 are incident to polyhedron focusing unit 1, and divergent beams 600 are reflexed to material by polyhedron focusing unit 1
Surface forms focus 101.
The concrete type of the laser processing device of the present invention includes laser cutting device, laser carving device, laser printing
Device.
As described above, since focus can be fast moved in material surface and can from top to bottom be moved on material,
For example moved from top to bottom according to adjustable-speed, it is used cooperatively with the laser pulse with high-peak power, high-power cooperation is high
The mobile cutting of speed, is conducive to radiate and is cut or removed to material, especially suitable for being processed to superhard material, than
High-speed cutting, such as hacking processing such as are carried out to diamond tablet, processing efficiency can be greatly improved, hence it is evident that processing quality is improved,
Thicker superhard material is processed also advantageously.
The above content is specific/preferred embodiment further description made for the present invention is combined, cannot recognize
The specific implementation of the fixed present invention is confined to these explanations.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, some replacements or modification can also be made to the embodiment that these have been described,
And these are substituted or variant all shall be regarded as belonging to protection scope of the present invention.
Claims (10)
1. a kind of laser processing device being suitable for processing superhard material, it is characterised in that including：Polyhedron focusing unit, rotation
Unit and focus adjustment unit, the polyhedron focusing unit is for making incident laser be focused into focus on material surface, institute
Rotary unit is stated by driving at least part of the polyhedron focusing unit to rotate to make the focus in the material
Surface moves back and forth, and the focus adjustment unit is for adjusting the polyhedron focusing unit to change the focus in the material
Expect the position on the thickness direction on surface.
2. laser processing device according to claim 1, it is characterised in that：The polyhedron focusing unit is equipped with can be to institute
The first optical element that incident laser is focused is stated, the focus adjustment unit is by changing first optical element in light
Position in road or change the optical parameter of first optical element come change the focus the material surface thickness
Spend the position on direction.
3. laser processing device according to claim 2, it is characterised in that：The polyhedron focusing unit includes focusing list
Member and polyhedral elements, the focusing unit are first optical element, and the focusing unit is used for the incident laser
It is focused to form focus on light beam, the polyhedral elements are used to the Focused Beam Reflectance to the material surface forming coke
Point, the rotary unit can drive the polyhedral elements rotation to make the focus be moved back and forth in the material surface.
4. laser processing device according to claim 2, it is characterised in that：The polyhedron focusing unit is equipped with multiple
More curved surface body units of curved surface elements, the curved surface elements be first optical element, the curved surface elements can by it is described enter
It penetrates laser and is focused into focus on the material surface, the rotary unit can drive more curved body unit rotations to make
The focus is moved back and forth in the material surface；The curvature of curved surface of the curved surface elements is adjustable.
5. laser processing device according to claim 3, it is characterised in that：The polyhedral elements are equipped with multiple curved surfaces
More curved surface body units of element, the focusing unit and the curved surface elements are first optical element, the curved surface elements
The incident laser can be focused into focus on the material surface.
6. laser processing device according to any one of claims 1 to 5, it is characterised in that：The polyhedron focusing unit
For there are three tools, the structure in four, five, six, seven, eight faces or be the structure at least nine faces；The rotation
Rotary speed and/or the direction for turning unit are adjustable；The speed of the rotary unit is 8-15m/s；The laser processing device can
The thickness of the superhard material of processing is 0.1-10mm；The type of the superhard material includes diamond and engineering ceramics material
Material, the diamond includes PCD diamonds, CBN diamonds, cvd diamond；The concrete type of the laser processing device
Including laser cutting device, laser carving device, laser print apparatus.
7. a kind of laser processing being suitable for processing superhard material, it is characterised in that including：
Incident laser is set to be focused into focus on material surface；
Changing the exit direction of incident laser by rotary motion makes the focus be moved back and forth in the material surface；
Change position of the focus on the thickness direction of the material surface.
8. laser processing according to claim 7, it is characterised in that described that incident laser is made to gather on material surface
Coke includes at focus：
So that the incident laser is formed focus on light beam, then the Focused Beam Reflectance to the material surface is formed into focus；
Alternatively, the incident laser is first made to form divergent beams, then the divergent beams are reflexed into the material surface and are formed
Focus；
Alternatively, the incident laser is focused into focus on the material surface by way of reflection.
9. laser processing according to claim 7 or 8, it is characterised in that described to change the focus in the material
Position on the thickness direction on surface includes：
By mechanical movement change can to the position of the first optical element that the incident laser is focused in the optical path, to
Change position of the focus on the thickness direction of the material surface；
It can be to the optical parameter for the first optical element that the incident laser is focused, to change the coke alternatively, changing
Position of the point on the thickness direction of the material surface.
10. laser processing according to claim 7 or 8, it is characterised in that：
First being processed on one side from material, then be processed from the another side of the material；
The concrete type of the laser processing includes laser cutting, laser engraving, laser printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810535592.5A CN108406097A (en) | 2018-05-29 | 2018-05-29 | A kind of laser processing device and processing method being suitable for processing superhard material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810535592.5A CN108406097A (en) | 2018-05-29 | 2018-05-29 | A kind of laser processing device and processing method being suitable for processing superhard material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108406097A true CN108406097A (en) | 2018-08-17 |
Family
ID=63140844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810535592.5A Pending CN108406097A (en) | 2018-05-29 | 2018-05-29 | A kind of laser processing device and processing method being suitable for processing superhard material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108406097A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434473A (en) * | 2019-07-11 | 2019-11-12 | 大族激光科技产业集团股份有限公司 | Laser marking equipment and its focus height adjustment method |
| CN113953658A (en) * | 2020-07-17 | 2022-01-21 | 大众汽车股份公司 | Processing device and method for processing material |
| CN116493760A (en) * | 2023-04-24 | 2023-07-28 | 中国长江电力股份有限公司 | Laser honing device and method applied to the surface of the conduction part of the hydroelectric unit |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6450010A (en) * | 1987-08-21 | 1989-02-27 | Fuji Photo Film Co Ltd | Light beam scanner |
| JPH05249307A (en) * | 1992-03-04 | 1993-09-28 | Sharp Corp | Optical path controller and information recording and reproducing device using the same |
| JPH06110001A (en) * | 1992-09-24 | 1994-04-22 | Nippon Electric Ind Co Ltd | Polygon mirror for projection optical system |
| JPH09293915A (en) * | 1996-04-24 | 1997-11-11 | Sumitomo Electric Ind Ltd | Laser curvature variable mirror and manufacturing method thereof |
| JPH1172605A (en) * | 1997-08-29 | 1999-03-16 | Ishikawajima Harima Heavy Ind Co Ltd | Variable curvature mirror and lens |
| JP2000326084A (en) * | 1999-05-20 | 2000-11-28 | Amada Eng Center Co Ltd | Method and device for curvature adjustment of variable curvature mirror |
| US20020018407A1 (en) * | 2000-08-02 | 2002-02-14 | Hiraku Komoto | Optical pickup device |
| CN2573142Y (en) * | 2002-08-12 | 2003-09-17 | 天津工业大学 | Laser wide-band scanning rotary mirror |
| JP2005338459A (en) * | 2004-05-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Optical deflector, optical scanning device, and image forming apparatus |
| DE102012016788A1 (en) * | 2012-08-23 | 2014-02-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Polygon type laser scanner used in material processing field, has deflecting mirror whose mirror surface is three-dimensionally shaped such that laser beam is periodically guided along single or multiple curved scanning paths |
| CN208358024U (en) * | 2018-05-29 | 2019-01-11 | 深圳光韵达光电科技股份有限公司 | A kind of laser processing device suitable for processing superhard material |
-
2018
- 2018-05-29 CN CN201810535592.5A patent/CN108406097A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6450010A (en) * | 1987-08-21 | 1989-02-27 | Fuji Photo Film Co Ltd | Light beam scanner |
| JPH05249307A (en) * | 1992-03-04 | 1993-09-28 | Sharp Corp | Optical path controller and information recording and reproducing device using the same |
| JPH06110001A (en) * | 1992-09-24 | 1994-04-22 | Nippon Electric Ind Co Ltd | Polygon mirror for projection optical system |
| JPH09293915A (en) * | 1996-04-24 | 1997-11-11 | Sumitomo Electric Ind Ltd | Laser curvature variable mirror and manufacturing method thereof |
| JPH1172605A (en) * | 1997-08-29 | 1999-03-16 | Ishikawajima Harima Heavy Ind Co Ltd | Variable curvature mirror and lens |
| JP2000326084A (en) * | 1999-05-20 | 2000-11-28 | Amada Eng Center Co Ltd | Method and device for curvature adjustment of variable curvature mirror |
| US20020018407A1 (en) * | 2000-08-02 | 2002-02-14 | Hiraku Komoto | Optical pickup device |
| CN2573142Y (en) * | 2002-08-12 | 2003-09-17 | 天津工业大学 | Laser wide-band scanning rotary mirror |
| JP2005338459A (en) * | 2004-05-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | Optical deflector, optical scanning device, and image forming apparatus |
| DE102012016788A1 (en) * | 2012-08-23 | 2014-02-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Polygon type laser scanner used in material processing field, has deflecting mirror whose mirror surface is three-dimensionally shaped such that laser beam is periodically guided along single or multiple curved scanning paths |
| CN208358024U (en) * | 2018-05-29 | 2019-01-11 | 深圳光韵达光电科技股份有限公司 | A kind of laser processing device suitable for processing superhard material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434473A (en) * | 2019-07-11 | 2019-11-12 | 大族激光科技产业集团股份有限公司 | Laser marking equipment and its focus height adjustment method |
| CN110434473B (en) * | 2019-07-11 | 2021-05-04 | 大族激光科技产业集团股份有限公司 | Laser marking equipment and its focus height adjustment method |
| CN113953658A (en) * | 2020-07-17 | 2022-01-21 | 大众汽车股份公司 | Processing device and method for processing material |
| CN116493760A (en) * | 2023-04-24 | 2023-07-28 | 中国长江电力股份有限公司 | Laser honing device and method applied to the surface of the conduction part of the hydroelectric unit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110681992B (en) | Adjustable broadband laser processing optical system and processing method | |
| CN204122928U (en) | A kind of big width laser engraving machine | |
| US8497451B2 (en) | Brittle nonmetallic workpiece and method and device for making same | |
| CN102642082B (en) | There is laser process equipment and the laser processing of changeable laser system | |
| JP4731082B2 (en) | Method and apparatus for cutting flat workpieces made from brittle materials | |
| CN107065155B (en) | Variable-focus optical unit for laser cleaning and laser cleaning device | |
| JP5060893B2 (en) | Laser processing equipment | |
| CN103658975B (en) | Laser beam splitting and processing device | |
| CN208358024U (en) | A kind of laser processing device suitable for processing superhard material | |
| CN104972226A (en) | Double-head laser machining device and machining method | |
| CN107243690A (en) | A kind of laser multifocal dynamic machining method and system | |
| CN104384727B (en) | The devices and methods therefor of optical-fiber laser processed alumina pottery | |
| CN108406097A (en) | A kind of laser processing device and processing method being suitable for processing superhard material | |
| CN206732372U (en) | A kind of ultrafast picosecond laser Precision Machining equipment of the more laser heads of large format | |
| WO2009119458A1 (en) | Beam processing apparatus, beam processing method, and beam processing substrate | |
| KR102570759B1 (en) | Laser processing apparatus and method thereof | |
| CN109397056A (en) | A kind of cutting method and its scribing machine of chip wafer | |
| CN105479015A (en) | Large-format laser machine | |
| KR20130006045A (en) | Laser machining apparatus and method | |
| WO2024216677A1 (en) | Ultrafast laser-based diamond polishing device and method | |
| JP2004299969A (en) | How to slice silica glass | |
| CN220825581U (en) | Cultivate diamond surface laser burnishing device | |
| CN110919200A (en) | Laser processing device and method suitable for processing superhard material | |
| CN207534187U (en) | laser drilling device | |
| KR101124509B1 (en) | Laser processing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |