CN108218906A - A kind of organo-silicon compound and its preparation method and application and LED encapsulation material - Google Patents

Abstract

The invention relates to the field of LED packaging, and discloses an organosilicon compound, a preparation method and application thereof, and an LED packaging material. The LED encapsulation material contains silica gel and an organosilicon compound, and the organosilicon compound has a structure shown in formula (I): wherein, R ₁ -R ₈ are each independently an alkyl group of C ₁ -C ₅ , R ₉ and Each of R ₁₀ is independently a C ₁ -C ₈ alkylene group. After the organosilicon compound is added to the encapsulating silica gel, the adhesive force of the silica gel can be significantly improved, and the encapsulating silica gel can still maintain a high adhesive force for a long time after curing, thereby significantly improving the service life of the LED lamp bead.

Description

A kind of organosilicon compound and its preparation method and application and LED encapsulation material

technical field

The present invention relates to the field of LED packaging, in particular to an organosilicon compound, a preparation method of an organosilicon compound, an organosilicon compound prepared by the method, an application of the organosilicon compound as an adhesion promoter and a A kind of LED encapsulation material.

Background technique

A light emitting diode (LED) is a solid-state semiconductor device that can directly convert electrical energy into light energy. LED lighting has the characteristics of low energy consumption, small size, and long life. LED lighting will replace traditional light sources such as incandescent lamps and fluorescent lamps and become the fourth-generation lighting source. The heart of the LED lighting lamp is a semiconductor chip (lamp bead). One end of the semiconductor chip is attached to the bracket as the negative pole, and the other end is connected to the positive pole of the power supply. The entire semiconductor chip is encapsulated by epoxy resin or silica gel.

In recent years, the LED packaging industry has developed rapidly. Due to the weak anti-ozone ability of epoxy resin, it is easy to cause the colloid to turn yellow and affect the light transmission effect. Due to its excellent properties such as anti-atmospheric aging and ultraviolet aging, silicone materials are widely used in high-end products. Epoxy resins have been replaced by silicone materials in applications. However, the use of silica gel packaging has the problem of poor adhesion to the LED bracket, which will seriously affect the long-term reliability and service life of the LED lamp bead.

Contents of the invention

The present invention aims to solve the problem of poor adhesion between silica gel and LED brackets in the prior art when silica gel is used to package LED lamp beads, and provides a silicone that can significantly improve the adhesion between silica gel and LED bracket materials. Compound, a method for preparing an organosilicon compound, an organosilicon compound prepared by the method, an application of the organosilicon compound as an adhesion promoter, and an LED encapsulation material.

Specifically, the present invention provides an organosilicon compound, wherein the organosilicon compound has a structure shown in formula (I):

Wherein, R ₁ -R ₈ are each independently a C ₁ -C ₅ alkyl group, and R ₉ and R ₁₀ are each independently a C ₁ -C ₈ alkylene group.

The present invention also provides a method for preparing an organosilicon compound, wherein the method comprises:

(1) Carrying out the first dealcoholization reaction with diphenylsilanediol shown in formula (II) and ureidoalkoxysilane shown in formula (III) in the presence of the first basic catalyst and the first solvent ;

(2) performing a second dealcoholation reaction with the product of the first dealcoholization reaction and divinyldisiloxane represented by formula (IV) in the presence of a second basic catalyst and a second solvent;

Wherein, R ₉ is a C ₁ -C ₈ alkylene group, R ₁₁ -R ₁₃ are each independently a C ₁ -C ₅ alkyl group, R ₁₄ -R ₁₇ are each independently a C ₁ -C ₅ alkyl group .

The present invention also provides the organosilicon compound prepared by the above method.

The present invention also provides the use of the organosilicon compound as an adhesion promoter.

In addition, the present invention also provides an LED encapsulation material, which contains silica gel, wherein the LED encapsulation material also contains the organosilicon compound provided by the present invention.

After in-depth research, the inventors of the present invention found that after adding the organosilicon compound having the structure shown in formula (I) into the encapsulation silica gel, the adhesion between the silica gel and the LED bracket material can be significantly improved, and the encapsulation thus obtained After the material is cured, it can still maintain the adhesive force with the bracket material for a long time, so that the service life of the LED lamp bead can be significantly improved.

Other features and advantages of the present invention will be described in detail in the detailed description that follows.

Detailed ways

Specific embodiments of the present invention will be described in detail below. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

Neither the endpoints nor any values of the ranges disclosed herein are limited to such precise ranges or values, and these ranges or values are understood to include values approaching these ranges or values. For numerical ranges, between the endpoints of each range, between the endpoints of each range and individual point values, and between individual point values can be combined with each other to obtain one or more new numerical ranges, these values Ranges should be considered as specifically disclosed herein.

The organosilicon compound provided by the invention has the structure shown in formula (I):

Wherein, R ₁ -R ₈ are each independently a C ₁ -C ₅ alkyl group, and R ₉ and R ₁₀ are each independently a C ₁ -C ₈ alkylene group.

The C ₁ -C ₅ alkyl group can be straight chain or branched chain alkyl, specific examples include but not limited to: methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, iso Butyl, tert-butyl, n-pentyl, isopentyl, tert-pentyl or neopentyl.

The C ₁ -C ₈ alkylene group can be straight chain or branched chain alkylene group, specific examples include but not limited to: methylene group, ethylene group, n-propylene group, isopropylene group, n-butylene group Base, sec-butylene, isobutylene, tert-butylene, n-pentylene, isopentylene, tert-pentylene, neopentylene, hexylene, isohexylene, heptylene, iso- Heptyl, octylene or isooctylene.

According to the present invention, from the viewpoint of raw material availability, preferably, R ₁ -R ₈ are each independently a C ₁ -C ₃ alkyl group, R ₉ and R ₁₀ are each independently a C ₂ -C ₄ alkyl group. alkyl. Most preferably, R ₁ -R ₈ are all methyl groups, and R ₉ and R ₁₀ are both propylene groups.

The preparation method of organosilicon compound provided by the invention comprises:

(1) Carrying out the first dealcoholization reaction with diphenylsilanediol shown in formula (II) and ureidoalkoxysilane shown in formula (III) in the presence of the first basic catalyst and the first solvent ;

(2) performing a second dealcoholation reaction with the product of the first dealcoholization reaction and divinyldisiloxane represented by formula (IV) in the presence of a second basic catalyst and a second solvent;

Wherein, R ₉ is a C ₁ -C ₈ alkylene group, R ₁₁ -R ₁₃ are each independently a C ₁ -C ₅ alkyl group, R ₁₄ -R ₁₇ are each independently a C ₁ -C ₅ alkyl group . Wherein, the specific selection of the C ₁ -C ₈ alkylene group and the C ₁ -C ₅ alkyl group has been described above, and will not be repeated here.

According to the present invention, from the viewpoint of availability of raw materials, preferably, R ₉ is a C ₂ -C ₄ alkylene group, R ₁₁ -R ₁₃ are each independently a C ₁ -C ₃ alkyl group, R ₁₄ - Each of R ₁₇ is independently a C ₁ -C ₃ alkyl group. Most preferably, R ₉ is a propylene group, R ₁₁ -R ₁₃ are C ₁ -C ₃ alkyl groups, and R ₁₄ -R ₁₇ are methyl groups.

According to the present invention, from the viewpoint of convenience of description, the basic catalyst adopted in step (1) is called "the first basic catalyst", and the solvent adopted is called "the first solvent", and the corresponding dealcoholization The reaction is called "the first dealcoholization reaction"; the basic catalyst adopted in step (2) is called "the second basic catalyst", and the solvent adopted is called "the second solvent", and the corresponding dealcoholization The reaction is called "the second dealcoholation reaction".

According to the present invention, in step (1), in the presence of the first solvent, the ureidoalkoxysilane shown in the formula (III) is mixed with the diphenylsilanediol shown in the formula (II) in the first basic catalyst The dealcoholation reaction is carried out under the catalysis. In step (2), the divinyldisiloxane represented by formula (IV) reacts with water under the action of the second basic catalyst to form silanol, and then deals with the product of the first dealcoholization reaction reaction.

In the present invention, there is no special limitation on the amount of each substance used in the preparation process of the organosilicon compound. For example, the molar ratio of the amount of diphenylsilanediol to the amount of ureidoalkoxysilane can be (0.2-2): 1, preferably (0.5-1.5): 1, most preferably ( 0.5-1):1. The molar ratio of the amount of divinyldisiloxane to the amount of ureidoalkoxysilane can be (0.5-2): 1, preferably (1-2): 1, most preferably (1.5 -2): 1.

The present invention is not particularly limited to the type of the first basic catalyst and the second basic catalyst, which can be various existing substances capable of catalyzing the dealcoholization reaction, for example, the first basic catalyst and the second basic catalyst The basic catalysts are preferably each independently at least one of triethylamine, triethylenediamine, pyridine and diazabicycle. In addition, relative to 1 mol of the diphenylsilanediol represented by the formula (II), the amount of the first basic catalyst can be 0.5-8g, preferably 1-5g, most preferably 2.5-4.5g ; The amount of the second basic catalyst can be 1-7g, preferably 2-5g, most preferably 2.5-4.5g.

The present invention has no particular limitation on the types of the first solvent and the second solvent, which may be various existing liquid inert substances that hydrolyze alkoxy groups into hydroxyl groups and can be used as reaction media, for example, the first solvent and the second solvent are preferably each independently at least one of tetrahydrofuran, dioxane, dimethylformamide and dimethylacetamide. In addition, relative to 1 mol of diphenylsilanediol represented by the formula (II), the amount of the first solvent may be 100-300g, preferably 150-250g, most preferably 200-250g; The amount of the second solvent may be 100-300 g, preferably 150-250 g, most preferably 200-250 g.

In the present invention, the conditions of the first dealcoholization reaction and the second dealcoholization reaction are not particularly limited, and both may be the same or different. Preferably, both independently include low-temperature polymerization and high-temperature polymerization carried out sequentially. Polymerization, and the conditions of the low-temperature polymerization include a temperature of 0-5°C and a time of 2-8h, the conditions of the high-temperature polymerization include a temperature of 40-80°C and a time of 2-10h; more preferably, The two independently include a low-temperature polymerization reaction and a high-temperature polymerization reaction carried out in sequence, and the conditions of the low-temperature polymerization reaction include a temperature of 0-5° C. and a time of 2-4 h, and the conditions of the high-temperature polymerization reaction include a temperature of 50 ° C. -60°C and the time is 2-6h.

The present invention has no special limitation on the order of adding the substances in step (1) and step (2), and the reaction products can be mixed according to various existing orders. According to a specific embodiment of the present invention, in step (1), the ureidoalkoxysilane shown in formula (III) can be mixed with the first basic catalyst first, and the ureidoalkoxysilane shown in formula (II) Diphenylsilanediol is mixed with the first solvent, and then the latter is added dropwise to the former. In step (2), the divinyldisiloxane shown in formula (IV), the second basic catalyst and part of the second solvent can be mixed first, and the product of the first dealcoholization reaction can be mixed with the remaining The second solvent is mixed before the latter is added dropwise to the former.

According to the present invention, preferably, the preparation method of the organosilicon compound further comprises using an acid to neutralize the basic catalyst in the reaction product after step (1) and/or step (2), and then adding alcohol to separate the layers The neutralized salt was removed, and finally the solvent was distilled off under reduced pressure to obtain the target product. Wherein, the acid may be at least one of formic acid, acetic acid, propionic acid, butyric acid, oxalic acid, malonic acid, succinic acid, benzoic acid, and phenylacetic acid. The alcohol may be at least one of methanol, ethanol, ethylene glycol, isopropanol, and n-butanol.

The present invention also provides the organosilicon compound prepared by the above method.

The present invention also provides the use of the organosilicon compound as an adhesion promoter.

In addition, the present invention also provides an LED encapsulation material, which contains silica gel, wherein the LED encapsulation material also contains the organosilicon compound provided by the present invention.

The amount of the organosilicon compound used in the present invention is not particularly limited. Preferably, the weight ratio of the organosilicon compound to silica gel is (0.005-0.05): 1, more preferably (0.005-0.025): 1, most preferably It is (0.01-0.02):1. In addition, based on the total weight of the LED packaging material, the content of the silica gel is preferably 95-99.5% by weight, more preferably 97.5-99.5% by weight, most preferably 98-99% by weight; the organosilicon compound The content of is preferably 0.5-5% by weight, more preferably 0.5-2.5% by weight, most preferably 1-2% by weight.

The main improvement of the present invention is that the organic silicon compound described in the present invention is added to the existing silica gel for LED packaging to improve the adhesive performance, and the type of silica gel can be the same as that of the prior art, specifically, it can be the existing Various silica gels that can be used as LED packaging materials are known to those skilled in the art, and will not be repeated here.

The present invention will be described in detail below by way of examples.

In the following examples and comparative examples, silica gel was purchased from Beijing Kehua New Material Technology Co., Ltd., and the brand name was SK6130.

Preparation Example 1

This preparation example is used to illustrate the organosilicon compound provided by the present invention and its preparation method.

(1) The first dealcoholization reaction:

Set the temperature of the oil bath to 0° C., add 22.2 g (0.1 mol) of ureapropyltrimethoxysilane and 0.2 g of pyridine into the three-necked flask, and start stirring. Weigh 10g (0.05mol) of diphenylsilanediol and dissolve it in 10g of tetrahydrofuran, then pour the resulting solution into a constant pressure dropping funnel, and drop it into the above-mentioned three-necked flask within 20 minutes. The reaction was stirred under low temperature for 2h, and then the temperature was raised to 60°C to continue the reaction for 3h, and the reaction was stopped. Neutralize pyridine with formic acid, add a small amount of anhydrous methanol, remove pyridine-formate by layering, and then distill off the solvent tetrahydrofuran in the target product under reduced pressure to obtain a urea-based prepolymer containing methoxy-terminated, dry and store , the yield was 90%.

(2) The second dealcoholization reaction:

Set the temperature of the oil bath to 50°C, add 0.2g of pyridine, 37.2g (0.2mol) of tetramethyldivinyldisiloxane and 0.36g of water into the three-necked flask, stir the reaction for 3h and cool down to 0°C. Weigh 28g of the above-mentioned prepolymer and dissolve it in 15g of tetrahydrofuran, then place the obtained solution in a constant pressure dropping funnel, and drop it into a three-necked flask within 40 minutes. Continue to react at 60°C for 5h, then stop the reaction. Neutralize pyridine with formic acid, add a small amount of anhydrous methanol, separate layers to remove pyridine-formate, and then distill off the solvent tetrahydrofuran in the target product under reduced pressure to obtain an organosilicon compound (denoted as G1), with a yield of 90% .

According to infrared and nuclear magnetic detection, the organosilicon compound has the structure shown in formula (I), wherein, R ₁ -R ₈ are all methyl groups, and R ₉ and R ₁₀ are all propylene groups.

Preparation example 2

This preparation example is used to illustrate the organosilicon compound provided by the present invention and its preparation method.

(1) The first dealcoholization reaction:

Set the temperature of the oil bath to 5° C., add 22.2 g (0.1 mol) of ureapropyltrimethoxysilane and 0.2 g of diazabicyclo into the three-necked flask, and start stirring. Weigh 10g (0.05mol) of diphenylsilanediol and dissolve it in 10g of tetrahydrofuran, then pour the resulting solution into a constant pressure dropping funnel, and drop it into the above-mentioned three-necked flask within 30 minutes. The reaction was stirred under low temperature for 2h, and then the temperature was raised to 60°C to continue the reaction for 3h, and the reaction was stopped. Neutralize the diazabicyclo with formic acid, add a small amount of anhydrous methanol, remove the diazabicyclo-formate by layering, and then distill off the solvent tetrahydrofuran in the target product under reduced pressure to obtain the compound containing the terminal methoxy group. Urea-based prepolymer, stored dry, with a yield of 95%.

(2) The second dealcoholization reaction:

Set the temperature of the oil bath to 50°C, add 0.2g of diazabicyclo, 37.2g (0.2mol) of tetramethyldivinyldisiloxane and 0.36g of water into the three-necked flask, stir and react for 3 hours, then cool down to 5°C. Weigh 28g of the above-mentioned prepolymer and dissolve it in 15g of dimethylformamide, then place the resulting solution in a constant pressure dropping funnel, drop it into a three-necked flask within 35 minutes, and continue to stir and react at 5°C after the dropwise addition is completed After 3h, the temperature was raised to 60°C to continue the reaction for 5h to stop the reaction. Neutralize the diazabicyclo with formic acid, add a small amount of anhydrous methanol, remove the diazabicyclo-formate by layering, and then distill off the solvent dimethylformamide in the target product under reduced pressure to obtain organosilicon Compound (denoted as G2), the yield was 93%.

According to infrared and nuclear magnetic detection, the organosilicon compound has the structure shown in formula (I), wherein, R ₁ -R ₈ are all methyl groups, and R ₉ and R ₁₀ are all propylene groups.

Preparation example 3

This preparation example is used to illustrate the organosilicon compound provided by the present invention and its preparation method.

(1) The first dealcoholization reaction:

Set the temperature of the oil bath to 3° C., add 22.2 g (0.1 mol) of ureapropyltrimethoxysilane and 0.2 g of triethylenetetramine into the three-necked flask, and start stirring. Weigh 10g (0.05mol) of diphenylsilanediol and dissolve it in 10g of tetrahydrofuran, then pour the resulting solution into a constant pressure dropping funnel, and drop it into the above-mentioned three-necked flask within 25 minutes. The reaction was stirred under low temperature for 2h, and then the temperature was raised to 60°C to continue the reaction for 3h, and the reaction was stopped. Neutralize triethylenetetramine with formic acid, add a small amount of anhydrous methanol, remove triethylenetetramine-formate by layering, and then distill off the solvent tetrahydrofuran in the target product under reduced pressure to obtain a ureido group containing a methoxy-terminal The prepolymer was stored dry, with a yield of 89%.

(2) The second dealcoholization reaction:

Set the temperature of the oil bath at 50°C, add 0.2g of triethylenetetramine, 37.2g (0.2mol) of tetramethyldivinyldisiloxane and 0.36g of water into the three-necked flask, stir the reaction for 3h and cool down to 3 ℃. Weigh 28g of the above prepolymer and dissolve it in 15g of dioxane, then place the obtained solution in a constant pressure dropping funnel, drop it into a three-necked flask within 38 minutes, and continue to stir and react at 3°C for 3h after the dropwise addition is completed , then the temperature was raised to 60° C. to continue the reaction for 5 h, and the reaction was stopped. Neutralize triethylenetetramine with formic acid, add a small amount of anhydrous methanol, remove triethylenetetramine-formate by layering, then distill off the solvent dioxane in the target product under reduced pressure to obtain organosilicon compound (note is G3), the yield was 87%.

According to infrared and nuclear magnetic detection, the organosilicon compound has the structure shown in formula (I), wherein, R ₁ -R ₈ are all methyl groups, and R ₉ and R ₁₀ are all propylene groups.

Example 1

This embodiment is used to illustrate the preparation method of the LED encapsulation material provided by the present invention.

Stir and blend 99g of silica gel and 1g of organosilicon compound G1 evenly to obtain an LED packaging material, which is denoted as C1.

Example 2

This embodiment is used to illustrate the preparation method of the LED encapsulation material provided by the present invention.

Stir and blend 98g of silica gel and 2g of organosilicon compound G2 evenly to obtain an LED encapsulation material, denoted as C2.

Example 3

This embodiment is used to illustrate the preparation method of the LED encapsulation material provided by the present invention.

Stir and blend 98.5g of silica gel and 1.5g of organosilicon compound G3 evenly to obtain an LED packaging material, which is denoted as C3.

Example 4

This embodiment is used to illustrate the preparation method of the LED encapsulation material provided by the present invention.

Stir and blend 99.8g of silica gel and 0.2g of organosilicon compound G1 evenly to obtain an LED packaging material, which is denoted as C4.

Comparative example 1

This comparative example is used to illustrate the preparation method of the reference LED encapsulation material.

A blank silica gel sample was used as a comparative sample, and no organic silicon compound was added to obtain a reference LED packaging material, which was denoted as DC1.

test case

The test example is used to illustrate the test of the adhesive force of the LED encapsulation material.

Take two pieces of silver-plated copper sheets with specifications of 80mm in length, 20mm in width, and 0.65mm in thickness, and use packaging materials C1-C4 and reference packaging material DC1 to evenly coat the copper sheets with a thickness of 1mm between the two silver surfaces. Coating, two silver sheets are placed in parallel and the overlapping length is 20mm. Then post-cured at 150°C for 4 hours, cooled to room temperature, and the adhesion test was carried out immediately after the sample was prepared and after being placed under the condition of 85°C/85%RH for 100 hours. Specifically, an adhesion tester (purchased from Shenzhen Sansi Zongheng Technology Co., Ltd., model CMT4503) was used to reversely stretch the surfaces of the two silver sheets at a speed of 5mm/min, and the tensile force during the test was tested. Maximum value, during the adhesion test, 5 samples were tested in parallel in each embodiment and comparative example, and the test results of the 5 samples were averaged as the adhesion test results of the embodiment and comparative example. The results are shown in Table 1.

Table 1

Numbering Adhesive force (placed for 0 hours, MPa) Adhesive force (placed for 100 hours, MPa) Example 1 3.55 3.48 Example 2 3.64 3.60 Example 3 3.82 3.83 Example 4 3.13 3.06 Comparative example 1 2.89 2.56

It can be seen from the above results that after adding the organosilicon compound with the structure shown in formula (I) into the encapsulation silica gel, the adhesive force of the silica gel can be significantly improved, and the encapsulation silica gel can still maintain high adhesion for a long time after curing. Force, which can significantly improve the service life of LED lamp beads.

The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present invention, various simple modifications can be made to the technical solutions of the present invention. These simple modifications All belong to the protection scope of the present invention.

In addition, it should be noted that the various specific technical features described in the above specific implementation manners may be combined in any suitable manner if there is no contradiction. In order to avoid unnecessary repetition, various possible combinations are not further described in the present invention.

In addition, various combinations of different embodiments of the present invention can also be combined arbitrarily, as long as they do not violate the idea of the present invention, they should also be regarded as the disclosed content of the present invention.

Claims (11)

1. a kind of organo-silicon compound, which is characterized in that the organo-silicon compound have the structure shown in formula (I)：

Wherein, R₁-R₈It is each independently C₁-C₅Alkyl, R₉And R₁₀It is each independently C₁-C₈Alkylidene.

2. organo-silicon compound according to claim 1, wherein, R₁-R₈It is each independently C₁-C₃Alkyl, R₉And R₁₀ It is each independently C₂-C₄Alkylidene.

3. a kind of preparation method of organo-silicon compound, which is characterized in that this method includes：

(1) by the urea groups alkoxy silane shown in the diphenyl silanediol shown in formula (II) and formula (III) in the first base catalysis The first dealcoholization is carried out in the presence of agent and the first solvent；

(2) by the divinyl disiloxane shown in the product of first dealcoholization and formula (IV) in the second basic catalyst With the second dealcoholization is carried out in the presence of the second solvent；

Wherein, R₉For C₁-C₈Alkylidene, R₁₁-R₁₃It is each independently C₁-C₅Alkyl, R₁₄-R₁₇It is each independently C₁-C₅ Alkyl.

4. according to the method described in claim 3, wherein, R₉For C₂-C₄Alkylidene, R₁₁-R₁₃It is each independently C₁-C₃'s Alkyl, R₁₄-R₁₇It is each independently C₁-C₃Alkyl.

5. method according to claim 3 or 4, wherein, the dosage of the diphenyl silanediol and the urea groups alkoxy The molar ratio of the dosage of silane is (0.2-2): 1；The dosage of the divinyl disiloxane and the urea groups alkoxy silane Dosage molar ratio be (0.5-2): 1.

6. method according to claim 3 or 4, wherein, first basic catalyst and the second basic catalyst are respectively It independently is at least one of triethylamine, triethylene diamine, pyridine and diazabicylo；First solvent and the second solvent It is each independently at least one of tetrahydrofuran, dioxane, dimethylformamide and dimethylacetylamide.

7. method according to claim 3 or 4, wherein, the condition phase of first dealcoholization and the second dealcoholization It is same or different, and the low temperature polymerization reaction for including carrying out successively each independently is reacted, and the low temperature polymerization with high temperature polymerization The condition of reaction is 0-5 DEG C including temperature and the time is 2-8h, and it is 40-80 DEG C that the condition of the high temperature polymerization reaction, which includes temperature, And the time is 2-10h.

8. the organo-silicon compound being prepared as the method described in any one in claim 3-7.

9. application of the organo-silicon compound described in claim 1,2 or 8 as adhesive accelerant.

10. a kind of LED encapsulation material, the LED encapsulation material contains silica gel, which is characterized in that the LED encapsulation material also contains The organo-silicon compound having the right described in requirement 1,2 or 8.

11. LED encapsulation material according to claim 10, wherein, on the basis of the total weight of the LED encapsulation material, The content of the silica gel is 95-99.5 weight %, and the content of the organo-silicon compound is 0.5-5 weight %.