CN108203776A - A kind of high-strength tin spelter soldering alloy and preparation method thereof - Google Patents
A kind of high-strength tin spelter soldering alloy and preparation method thereof Download PDFInfo
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- CN108203776A CN108203776A CN201711398407.4A CN201711398407A CN108203776A CN 108203776 A CN108203776 A CN 108203776A CN 201711398407 A CN201711398407 A CN 201711398407A CN 108203776 A CN108203776 A CN 108203776A
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- China
- Prior art keywords
- soldering alloy
- spelter
- strength
- strength tin
- tin spelter
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 54
- 239000000956 alloy Substances 0.000 title claims abstract description 54
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910000635 Spelter Inorganic materials 0.000 title claims abstract description 42
- 238000005476 soldering Methods 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229910052718 tin Inorganic materials 0.000 claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 229910052738 indium Inorganic materials 0.000 claims abstract description 23
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 23
- 238000003756 stirring Methods 0.000 claims abstract description 22
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 14
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 14
- 238000010792 warming Methods 0.000 claims abstract description 13
- 238000003723 Smelting Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 229910052684 Cerium Inorganic materials 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 238000004321 preservation Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 4
- 229910020994 Sn-Zn Inorganic materials 0.000 abstract description 3
- 229910009069 Sn—Zn Inorganic materials 0.000 abstract description 3
- 239000004615 ingredient Substances 0.000 abstract description 3
- 230000003993 interaction Effects 0.000 abstract description 3
- 239000010949 copper Substances 0.000 description 22
- 239000007788 liquid Substances 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention provides a kind of high-strength tin spelter soldering alloys and preparation method thereof, include the following steps：According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, keeps the temperature 40 minutes, stirring is continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.Compared with prior art, using Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves the shear strength of the Welding Sn-Zn material alloy of preparation, and with good wettability.
Description
Technical field
The present invention relates to solder alloy technical field more particularly to a kind of high-strength tin spelter soldering alloy and its preparation sides
Method.
Background technology
In recent years, the industries such as household electrical appliances and refrigeration rapidly develop, and in order to reduce production cost, are ensureing product electrical resistance
While energy, part copper material is replaced by aluminium, and since the conductivity of aluminium and copper approaches, the cheap of aluminium, density are small
The advantages that, mitigate the product quality of its related field, cost reduction.Traditional tin-lead solder is since the lead in solder is to environment
It is very big with the harmfulness of health, disabled by countries in the world.
In the prior art, solder and preparation method thereof has obtained extensive report, for example, application No. is
201110323871.3 Chinese patent literature report a kind of high spreadability tin-antimony-rare earth lead-free solder alloy and its preparation side
Method.The raw material weight percentage of the alloy is:Sb7.0-9.0wt%, In0.01-0.03wt%, Bi1-3wt%, Cd0.01-
0.03wt%, Sm0.01-0.03wt%, Nd0.01-0.03wt%, surplus Sn.Raw material is put into vacuum sense according to the above ratio
Melting in stove is answered, obtains master alloy, is then placed in remelting tubular type crucible and carries out remelting, remelting tubular type crucible is placed in quick quenching furnace
On runner wheel rim, it is ejected in turning for rotation after alloy molten from the hole of a diameter of 1mm of crucible bottom under ar gas acting
Wheel forms alloy strip on edge, then suitably crushes alloy strip, then places into ball mill and screening is taken out after grinding.Application
Number a kind of low melting point lead-free solder alloy is reported for 201210494897.9 Chinese patent literature, belong to welding material technology
Field.In order to solve the problem of that the high shear strength of existing solder alloy fusing point is low, a kind of low-melting point leadless solder is provided and is closed
Gold, the solder include the weight percent of following component：Bi：10%-30%；Ag：2.2%-3.0%；In：0.5%-1.0%；
P：0.004%-0.008%；Remaining is tin.The Co of RE and 0.0002%-0.0005% containing 0.002%-0.005%.
But the intensity of the solder alloy of above-mentioned report is up for further improving.
Invention content
Present invention solves the technical problem that be to provide a kind of high-strength tin spelter soldering alloy and preparation method thereof, intensity compared with
Height, wetability are good.
In view of this, it the present invention provides a kind of high-strength tin spelter soldering alloy, calculates in percentage by weight, using such as
It is prepared by lower raw material：Zn 13-18%, Cu 0.1-0.8%, Co 0.3-0.9%, In 0.6-1.5%, Ni 1.2-1.6%, Ce
0.01-0.08%, Sm 0.01-0.06%, P 0.1-0.3%, surplus Sn.
Preferably, Zn 13-16%.
Preferably, Cu 0.3-0.8%.
Preferably, Co 0.3-0.6%.
Preferably, In 0.9-1.5%.
Preferably, Ni 1.2-1.5%.
Preferably, Ce 0.03-0.08%.
Preferably, Sm 0.01-0.05%.
Preferably, P 0.1-0.2%.
Correspondingly, the present invention also provides a kind of preparation method of high-strength tin spelter soldering alloy, include the following steps：According to
Weight percent adds in Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn into smelting furnace, is warming up to 290 DEG C, keeps the temperature 40 minutes,
Stirring is continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.
The present invention provides a kind of high-strength tin spelter soldering alloy and preparation method thereof, includes the following steps：According to weight hundred
Divide ratio, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, be warming up to 290 DEG C, keep the temperature 40 minutes, stirring, after
It is continuous to be warming up to 510 DEG C, 40 minutes are kept the temperature, stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.With prior art phase
Than using Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves system
The shear strength of standby Welding Sn-Zn material alloy, and with good wettability.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are only for the feature and advantage that further illustrate the present invention rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of high-strength tin spelter soldering alloys, calculate in percentage by weight, using as follows
It is prepared by raw material：Zn 13-18%, Cu 0.1-0.8%, Co 0.3-0.9%, In 0.6-1.5%, Ni 1.2-1.6%, Ce
0.01-0.08%, Sm 0.01-0.06%, P 0.1-0.3%, surplus Sn.
Preferably, Zn 13-16%, Cu 0.3-0.8%, Co 0.3-0.6%, In 0.9-1.5%, Ni
1.2-1.5%, Ce 0.03-0.08%, Sm 0.01-0.05%, P 0.1-0.2%.
Correspondingly, the present invention also provides a kind of preparation method of high-strength tin spelter soldering alloy, include the following steps：According to
Weight percent adds in Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn into smelting furnace, is warming up to 290 DEG C, keeps the temperature 40 minutes,
Stirring is continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.
The present invention provides a kind of high-strength tin spelter soldering alloy and preparation method thereof, includes the following steps：According to weight hundred
Divide ratio, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, be warming up to 290 DEG C, keep the temperature 40 minutes, stirring, after
It is continuous to be warming up to 510 DEG C, 40 minutes are kept the temperature, stirring is cooled to room temperature, obtains high-strength tin spelter soldering alloy.With prior art phase
Than using Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn as raw material, each ingredient interaction influences each other the present invention, improves system
The shear strength of standby Welding Sn-Zn material alloy, and with good wettability.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
Raw material used in the embodiment of the present invention is purchased in market.
Embodiment 1
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight：
Zn 13%, Cu 0.8%, Co 0.3%, In 1.5%, Ni 1.2%, Ce 0.08%, Sm0.01%, P
0.3%, surplus Sn.
Preparation process：
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C,
Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder
Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 221 DEG C, liquid
Liquidus temperature is 235 DEG C, shear strength 36N/mm2, elongation percentage 71%.
Embodiment 2
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight：
Zn 18%, Cu 0.1%, Co 0.9%, In 0.6%, Ni 1.6%, Ce 0.01%, Sm0.06%, P
0.1%, surplus Sn.
Preparation process：
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C,
Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder
Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 220 DEG C, liquid
Liquidus temperature is 231 DEG C, shear strength 35N/mm2, elongation percentage 72%.
Embodiment 3
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight：
Zn 14%, Cu 0.5%, Co 0.4%, In 0.8%, Ni 1.3%, Ce 0.04%, Sm0.03%, P
0.2%, surplus Sn.
Preparation process：
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C,
Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder
Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 223 DEG C, liquid
Liquidus temperature is 232 DEG C, shear strength 35N/mm2, elongation percentage 70%.
Embodiment 4
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight：
Zn 17%, Cu 0.2%, Co 0.8%, In 0.6%, Ni 1.6%, Ce 0.02%, Sm0.05%, P
0.2%, surplus Sn.
Preparation process：
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C,
Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder
Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 223 DEG C, liquid
Liquidus temperature is 234 DEG C, shear strength 34N/mm2, elongation percentage 73%.
Embodiment 5
A kind of high-strength tin spelter soldering alloy, is calculated, is prepared using the following raw material in percentage by weight：
Zn 17%, Cu 0.6%, Co 0.8%, In 0.8%, Ni 1.5%, Ce 0.07%, Sm0.05%, P
0.3%, surplus Sn.
Preparation process：
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C,
Heat preservation 40 minutes, stirring are continuously heating to 510 DEG C, keep the temperature 40 minutes, and stirring is cooled to room temperature, obtains high-strength tin spelter solder
Alloy.
The performance of high-strength tin spelter soldering alloy manufactured in the present embodiment is detected, solidus temperature is 223 DEG C, liquid
Liquidus temperature is 234 DEG C, shear strength 37N/mm2, elongation percentage 70%.
The explanation of above example is only intended to facilitate the understanding of the method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Some improvements and modifications, these improvement and modification are also fallen within the protection scope of the claims of the present invention.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide range caused.
Claims (10)
1. a kind of high-strength tin spelter soldering alloy, which is characterized in that calculate, prepared using the following raw material in percentage by weight：
Zn 13-18%, Cu 0.1-0.8%, Co 0.3-0.9%, In 0.6-1.5%, Ni 1.2-1.6%, Ce 0.01-
0.08%th, Sm 0.01-0.06%, P 0.1-0.3%, surplus Sn.
2. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Zn 13-16%.
3. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Cu 0.3-0.8%.
4. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Co 0.3-0.6%.
5. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that In 0.9-1.5%.
6. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Ni 1.2-1.5%.
7. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Ce 0.03-0.08%.
8. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that Sm 0.01-0.05%.
9. high-strength tin spelter soldering alloy according to claim 1, which is characterized in that P 0.1-0.2%.
10. a kind of preparation method of high-strength tin spelter soldering alloy described in any one of claim 1-9, which is characterized in that
Include the following steps：
According to weight percent, Zn, Cu, Co, In, Ni, Ce, Sm, P, Sn are added in into smelting furnace, are warming up to 290 DEG C, heat preservation
40 minutes, stirring was continuously heating to 510 DEG C, keeps the temperature 40 minutes, and stirring is cooled to room temperature, and obtained the conjunction of high-strength tin spelter solder
Gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711398407.4A CN108203776A (en) | 2017-12-21 | 2017-12-21 | A kind of high-strength tin spelter soldering alloy and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711398407.4A CN108203776A (en) | 2017-12-21 | 2017-12-21 | A kind of high-strength tin spelter soldering alloy and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108203776A true CN108203776A (en) | 2018-06-26 |
Family
ID=62605853
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109483081A (en) * | 2018-12-03 | 2019-03-19 | 先导薄膜材料（广东）有限公司 | Metal targets bind solder and preparation method thereof |
| CN109595972A (en) * | 2018-11-01 | 2019-04-09 | 广西瑞祺丰新材料有限公司 | A kind of aluminium alloy cooling tube |
| CN109763024A (en) * | 2019-04-01 | 2019-05-17 | 杭州辰卓科技有限公司 | A kind of cladded type 80-120 degree heat transmission tinbase liquid metal material |
| CN112475664A (en) * | 2020-11-24 | 2021-03-12 | 苏州优诺电子材料科技有限公司 | Soldering tin alloy and preparation method thereof |
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| CN1390672A (en) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| US20050109822A1 (en) * | 2002-04-09 | 2005-05-26 | Ford Motor Company | Solder fillers for aluminum body parts and methods of applying the same |
| CN1981978A (en) * | 2005-12-28 | 2007-06-20 | 梁树华 | Lead-free soldering tin crease and its production |
| CN101208174A (en) * | 2005-06-03 | 2008-06-25 | 千住金属工业株式会社 | Lead-Free Solder Alloys |
| CN101618485A (en) * | 2009-08-03 | 2010-01-06 | 浙江强力焊锡材料有限公司 | Lead free brazing material |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20050109822A1 (en) * | 2002-04-09 | 2005-05-26 | Ford Motor Company | Solder fillers for aluminum body parts and methods of applying the same |
| CN1390672A (en) * | 2002-05-10 | 2003-01-15 | 大连理工大学 | Leadfree SnZn-base alloy solder containing rare-earth elements |
| CN101208174A (en) * | 2005-06-03 | 2008-06-25 | 千住金属工业株式会社 | Lead-Free Solder Alloys |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109595972A (en) * | 2018-11-01 | 2019-04-09 | 广西瑞祺丰新材料有限公司 | A kind of aluminium alloy cooling tube |
| CN109483081A (en) * | 2018-12-03 | 2019-03-19 | 先导薄膜材料（广东）有限公司 | Metal targets bind solder and preparation method thereof |
| CN109763024A (en) * | 2019-04-01 | 2019-05-17 | 杭州辰卓科技有限公司 | A kind of cladded type 80-120 degree heat transmission tinbase liquid metal material |
| CN112475664A (en) * | 2020-11-24 | 2021-03-12 | 苏州优诺电子材料科技有限公司 | Soldering tin alloy and preparation method thereof |
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