CN108200237B - Electronic device - Google Patents

Abstract

The invention discloses an electronic device. The electronic device comprises a shell, an output module, a vibration module and a piezoelectric element. The output module comprises an encapsulation shell, an infrared lamp and a light-transmitting component. The packaging shell comprises a packaging substrate, the infrared lamp and the light-passing assembly are packaged in the packaging shell, the infrared lamp is borne on the packaging substrate, and the light-passing assembly is located on a light-emitting light path of the infrared lamp. The light-transmitting component comprises a base body and a telescopic film, a light-transmitting hole is formed in the base body, and the telescopic film is accommodated in the light-transmitting hole. The flexible membrane can take place deformation and change and shelter from the area that leads to the unthreaded hole under the effect of electric field, and the infrared light that the infrared lamp sent can follow the encapsulation casing outgoing with different angle of vision. The vibration module is installed on the casing. The piezoelectric element is combined with the vibration module and is spaced from the output module, and the piezoelectric element is used for deforming when an electric signal is applied to the piezoelectric element so as to enable the vibration module to vibrate. The output module has higher integration level, smaller volume, higher conversation privacy of the electronic device and more beautiful appearance.

Description

electronic device

technical field

The present invention relates to the technical field of consumer electronics, and more particularly, to an electronic device.

Background technique

As the functions supported by mobile phones become more and more diverse, the types and numbers of functional devices that need to be set on mobile phones are also increasing. Proximity sensors, ambient light sensors, infrared light cameras, structured light projectors and other functional devices are configured in the middle of the mobile phone, and in order to arrange many functional devices, it will take up too much space on the mobile phone.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide an electronic device.

The electronic device of the embodiment of the present invention includes:

chassis;

An output module, the output module includes a package casing, an infrared lamp, and a light-passing component, the encapsulation shell includes a package substrate, and the infrared lamp and the light-passing component are encapsulated in the encapsulation casing. The infrared lamp is carried on the packaging substrate, and the light-passing component is located on the light-emitting light path of the infrared lamp. The light-passing component includes a base body and a stretchable film. The base body is provided with a light-passing hole, and the stretchable film Housed in the light-passing hole, the retractable film can deform under the action of the electric field and change the area that blocks the light-passing hole, and the infrared light emitted by the infrared lamp can be transmitted from the Encapsulation shell exit;

a vibration module mounted on the casing; and

A piezoelectric element, which is combined with the vibration module and is spaced from the output module, and is used for deforming when an electrical signal is applied to make the vibration module vibrate.

In some embodiments, the stretchable film includes a first surface combined with the inner wall of the light-passing hole, and a second surface opposite to the first surface, under the action of an electric field, the second surface It can be deformed relative to the first surface to change the area of the stretchable film shielding the light-transmitting hole.

In certain embodiments, the number of the light-passing holes is single, and the stretchable film can be deformed under the action of an electric field to change the area that blocks the single light-passing hole; or

The number of the light-passing holes is at least two, and the stretchable film can also change the number of the light-passing holes that are blocked under the action of the electric field.

In some embodiments, the vibration module includes a display screen and a light-transmitting cover plate, the display screen is disposed on the casing and forms a receiving cavity together with the casing, and the cover plate is combined with the casing. The casing is located on the side of the display screen away from the receiving cavity, the display screen is combined with the cover plate, and the casing is provided with spaced apart infrared through holes for the casing and a casing structure The light through hole and the vibration through hole of the casing, the infrared lamp corresponds to the infrared through hole of the casing, the structured light projector corresponds to the light through hole of the casing structure, and the piezoelectric element is accommodated in the The casing vibrates in the through hole and is combined with the cover plate.

In certain embodiments, the piezoelectric element and the display screen are attached to the cover plate by a joint.

In some embodiments, the output module further includes a chip, and the infrared lamp and the structured light projector are formed on the chip.

In some embodiments, the package housing further includes a package sidewall and a package top, the package sidewalls extend from the package substrate and are connected between the package top and the package substrate, the package A first light emitting window and a second light emitting window are formed on the top, the first light emitting window corresponds to the infrared lamp, and the second light emitting window corresponds to the structured light projector.

In some embodiments, the output module further includes a metal shielding plate, and the metal shielding plate is located in the package casing and between the infrared lamp and the structured light projector.

In some embodiments, the surface combined with the cover plate and the casing is formed with infrared-transmitting ink that only transmits infrared light, and the infrared-transmitting ink blocks the infrared through holes of the casing and the casing. At least one of the light through hole of the casing structure and the vibration through hole of the casing.

In some embodiments, the electronic device further includes a receiving module and an imaging module, the receiving module integrates a proximity sensor and a light sensor, and the imaging module includes a mirror base and is mounted on the mirror base The lens barrel and the image sensor accommodated in the lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, and the receiving module is arranged on the mounting surface.

In some embodiments, the electronic device further includes a proximity sensor, a light sensor, and an imaging module, the imaging module includes a mirror base, a lens barrel mounted on the mirror base, and a An image sensor in a lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, and at least one of the proximity sensor and the light sensor is arranged on the mounting surface.

In some embodiments, the electronic device further includes an infrared light camera and a visible light camera, the centers of the output module, the infrared light camera and the visible light camera are located on the same line segment, and the piezoelectric element is located on the same line segment. between the line segment and the top of the casing.

In some embodiments, the electronic device further includes an infrared light camera and a visible light camera, the number of the piezoelectric elements is multiple, the number of the vibration through holes of the casing is multiple, and the number of the piezoelectric elements is multiple. The elements correspond to a plurality of the vibration through holes of the casing, and each piezoelectric element is accommodated in the corresponding vibration through holes of the casing. The output module, the infrared light camera, the visible light camera and the The centers of the plurality of piezoelectric elements are located on the same line segment, and at least one of the output module, the infrared light camera and the visible light camera is disposed between two adjacent piezoelectric elements.

In some embodiments, the electronic device further includes an infrared light camera and a visible light camera, the piezoelectric element includes a piezoelectric body and a piezoelectric bump protruding from the piezoelectric body, and the casing vibrates through The number of holes is multiple, the piezoelectric bumps correspond to the vibration through holes of the casing, and each piezoelectric bump is partially accommodated in the vibration through holes of the casing and is connected with the vibration through holes of the casing. The cover plate is combined, the output module, the infrared light camera and the visible light camera are located between the cover plate and the piezoelectric body, the output module, the infrared light camera, the The visible light camera and the centers of the plurality of piezoelectric bumps are located on the same line segment, and the output module, the infrared light camera and the visible light camera are arranged between two adjacent piezoelectric bumps. at least one.

In the electronic device according to the embodiment of the present invention, by changing the area of the retractable film that blocks the light-passing hole, the infrared light emitted by the infrared lamp can be emitted from the package housing at different viewing angles, corresponding to different viewing angles, and the output module can be used as Close to infrared light or infrared fill light, the output module integrates the functions of emitting infrared light for infrared ranging and infrared fill light. Secondly, compared with the current electronic device that needs to be provided with a near-infrared light and an infrared supplementary light at the same time, the output module of the embodiment of the present invention only needs to be provided with an infrared light, which is small in size and saves the realization of infrared supplementary light and infrared light. Space for ranging functions. Furthermore, since only one infrared lamp needs to be placed on the packaging substrate for packaging, compared with the traditional infrared fill light and the near-infrared lamp, which need to be fabricated from different wafers and assembled on the PCB substrate for packaging, the packaging is improved. efficiency. Furthermore, the electronic device uses piezoelectric elements and vibration modules to realize bone conduction sound transmission, instead of the traditional air-conducted sound receiver structure. On the one hand, it effectively ensures the privacy of the call content. The receiver avoids opening a through hole corresponding to the receiver on the cover plate, and the process is simpler and the appearance is more beautiful.

Additional aspects and advantages of embodiments of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or learned by practice of embodiments of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:

1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the present invention;

3 and 4 are schematic state diagrams of an output module of an electronic device according to an embodiment of the present invention;

5 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;

6 is a state schematic diagram of a light-passing component of an electronic device according to an embodiment of the present invention;

7 and 8 are partial state schematic diagrams of a light-passing component of an electronic device according to another embodiment of the present invention;

9 is a schematic cross-sectional view of the electronic device in FIG. 1 along line IX-IX;

10 is a partial cross-sectional schematic diagram of the electronic device in FIG. 1 taken along line X-X;

11 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

12 is a schematic diagram of the arrangement of electronic components and piezoelectric elements of an electronic device according to an embodiment of the present invention;

13 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

14 and 15 are schematic diagrams of arrangement of electronic components and piezoelectric elements of an electronic device according to an embodiment of the present invention;

16 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

17 is a schematic cross-sectional view of the electronic device in FIG. 16 along line XVII-XVII;

18 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the present invention;

19 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention;

20 and 21 are partial cross-sectional schematic views of the electronic device according to the embodiment of the present invention taken along the position corresponding to the line XX-XX in FIG. 1;

22 to 30 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the present invention.

Detailed ways

The embodiments of the present invention will be further described below with reference to the accompanying drawings. The same or similar reference numbers refer to the same or similar elements or elements having the same or similar functions throughout the drawings.

In addition, the embodiments of the present invention described below in conjunction with the accompanying drawings are exemplary, and are only used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may be in direct contact between the first and second features, or the first and second features indirectly through an intermediary touch. Also, the first feature being "above", "over" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

Referring to FIG. 1 and FIG. 9 , the electronic device 100 according to the embodiment of the present invention includes a casing 20 , an electronic component, a vibration module 30 a and a piezoelectric element 70 . The electronic components include an output module 10 , a receiving module 50 (as shown in FIG. 11 ) and an imaging module 60 (as shown in FIG. 11 ). The electronic device 100 can be a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an ATM, etc. The embodiment of the present invention is described by taking the electronic device 100 as a mobile phone as an example, and it can be understood that the specific form of the electronic device 100 can be other , which is not limited here.

Please refer to FIG. 2 and FIG. 5 , the output module 10 is a single package structure, including a package housing 11 , an infrared lamp 12 , a light-transmitting component 13 and a structured light projector 14 .

The encapsulation housing 11 is used to encapsulate the infrared lamp 12 , the light-passing component 13 and the structured light projector 14 at the same time, or in other words, the infrared lamp 12 , the light-passing component 13 and the structured light projector 14 are encapsulated in the encapsulation casing 11 at the same time. The package housing 11 includes a package substrate 111 , a package sidewall 112 and a package top 113 . The package casing 11 may be made of an electromagnetic interference (Electromagnetic Interference, EMI) shielding material to prevent external electromagnetic interference from affecting the output module 10 .

The package substrate 111 is used to carry the infrared lamp 12 and the structured light projector 14 . When manufacturing the output module 10, the infrared lamp 12 and the structured light projector 14 can be formed on the chip 15, and then the infrared lamp 12, the structured light projector 14 and the chip 15 can be arranged on the package substrate 111 together. The chip 15 is bonded on the package substrate 111 . Meanwhile, the package substrate 111 can also be used to connect with other components of the electronic device 100 (eg, the chassis 20 of the electronic device 100 , the main board, etc.) to fix the output module 10 in the electronic device 100 .

The package sidewall 112 can be arranged around the infrared lamp 12, the light-transmitting component 13 and the structured light projector 14. The package sidewall 112 extends from the package substrate 111, and the package sidewall 112 can be combined with the package substrate 111. Preferably, the package sidewall 112 112 is detachably connected to the package substrate 111 , so that the infrared lamp 12 , the light-passing component 13 and the structured light projector 14 can be repaired after removing the package side wall 112 . The material for making the package side wall 112 may be a material that does not transmit infrared light, so as to prevent the infrared light emitted by the infrared lamp 12 or the structured light projector 14 from passing through the package side wall 112 .

The package top 113 is opposite to the package substrate 111 , and the package top 113 is connected to the package sidewall 112 . The package top 113 is formed with a first light exit window 1131 and a second light exit window 1132. The first light exit window 1131 corresponds to the infrared lamp 12, and the infrared light emitted by the infrared lamp 12 passes through the first light exit window 1131; Corresponding to the structured light projector 14 , the structured light (infrared light) emitted by the structured light projector 14 passes through the second light exit window 1132 . The package top 113 and the package side wall 112 can be formed integrally or separately. In one example, the first light-emitting window 1131 and the second light-emitting window 1132 are through holes, and the material for making the package top 113 is a material that does not transmit infrared light. In another example, the package top 113 is made of a material that does not transmit infrared light and a material that transmits infrared light. Specifically, the first light exit window 1131 and the second light exit window 1132 are made of materials that transmit infrared light. The remaining parts are made of materials that do not transmit infrared light. Further, the first light exit window 1131 and the second light exit window 1132 may be formed with a lens structure to improve the infrared light emitted from the first light exit window 1131 and the second light exit window 1132. The emission angle, for example, the second light exit window 1132 is formed with a concave lens structure, so that the light passing through the second light exit window 1132 is diffused and emitted outward; the first light exit window 1131 is formed with a convex lens structure, so that the light passing through the first light exit window 1131 The light gathers and shoots out.

Referring to FIGS. 5 and 6 , the light-passing component 13 is located on the light-emitting light path of the infrared lamp 12 , and the infrared light emitted by the infrared lamp 12 passes through the light-passing component 13 and then exits the light exit window 1131 . The light-transmitting component 13 includes a base body 131 and a stretchable film 133 .

The base body 131 may be made of a material that does not transmit infrared light and is conductive. The base body 131 may be connected to the package sidewall 112 through the connector 18 , and the connector 18 may be used for laying lines such as driving circuits of the light-passing component 13 . The base body 131 may also be embedded in the light exit window 1131 . The overall shape of the base body 131 may be a circle, a rectangle, an ellipse, or the like. The base 131 is provided with a light-passing hole 132 , the light-passing hole 132 penetrates the base 131 , and the infrared light emitted by the infrared lamp 12 passes through the light-passing hole 132 and then passes through the light-passing component 13 .

The stretchable film 133 is accommodated in the light-passing hole 132 . Specifically, the stretchable film 133 can be fixed in the light-passing hole 132 , and the stretchable film 133 blocks at least part of the light-emitting area of the light-passing hole 132 . The infrared light cannot pass through the stretchable film 133 or the transmittance of the stretchable film 133 to the infrared light is very low. The stretchable film 133 may be made of a material with electrostrictive effect, such as polyvinylidene fluoride (PVDE). The stretchable film 133 can deform under the action of an electric field. It can be understood that when the stretchable film 133 is deformed, the area of the stretchable film 133 that blocks the light-passing hole 132 also changes, that is, the area of the light-passing hole 132 that can pass light changes, resulting in the amount of light passing through the light-passing component 13 . and the distribution of light changes accordingly. In one example, by controlling the deformation of the stretchable film 133 , the infrared light emitted by the infrared lamp 12 can be emitted from the package housing 11 at different viewing angles. The emitted infrared light is used for different purposes. For example, as shown in FIG. 3 , when the infrared light emitted by the infrared lamp 12 is emitted from the package casing 11 with a field angle α ranging from 60° to 90° (hereinafter referred to as the first field angle), the first field angle It can be 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, or 90 degrees. On the surface, the infrared light camera 62 (as shown in FIG. 1 ) of the electronic device 100 receives the infrared light reflected by the object to obtain the image information of the object; as shown in FIG. When the angle of view is 10 degrees to 30 degrees (hereinafter referred to as the second angle of view), the second angle of view can be 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees, etc. It can be used for infrared ranging. The infrared light passes through the light exit window 1131 and reaches the surface of the object. The proximity sensor 51 (as shown in FIG. 10 ) of the electronic device 100 receives the infrared light reflected by the object to detect the distance from the object to the electronic device 100 . In the embodiment of the present invention, the field of view refers to the range covered by the infrared light exiting from the package casing 11 through the light exit window 1131 .

Referring to FIG. 6 , specifically, the stretchable film 133 includes a first surface 1331 and a second surface 1332 , the first surface 1331 is combined with the inner wall of the light-passing hole 132 , and the second surface 1332 is opposite to the first surface 1331 . In the embodiment shown in FIG. 6 , one light-passing hole 132 accommodates two stretchable films 133 , and the two stretchable films 133 may be symmetrically arranged in the light-passing hole 132 . As shown in FIG. 6(a), when no electric field is applied, the stretchable film 133 is in a natural state, a gap 1321 is formed between the two second surfaces 1332, and infrared light can pass through the gap 1321; as shown in FIG. 6(b) As shown, when an electric field acts on the stretchable film 133, specifically, the base body 131 can be connected to the negative electrode of the power source, the stretchable film 133 can be connected to the positive electrode of the power source, or the base body 131 can be connected to the positive electrode of the power source, and the stretchable film 133 can be connected to the power source The negative electrode is connected, the telescopic film 133 is deformed under the action of the electric field, the first surface 1331 is combined with the inner wall of the light-passing hole 132 and is difficult to move relative to the inner wall, the second surface 1332 has a high degree of freedom, and the second surface 1332 will The extension occurs and gradually reduces the size of the gap 1321 , that is, the area of the retractable film 133 to block the light-transmitting hole 132 is increased. By controlling the strength of the electric field, the amount of extension of the second surface 1332 can be controlled to control the light-passing area of the light-passing hole 132 , that is, the size of the gap 1321 . In one example, as shown in FIG. 6( c ), when the two second surfaces 1332 are completely abutted, the light-passing area of the light-passing hole 132 is zero, and infrared light cannot pass through the light-passing hole 132 . Of course, other numbers of stretchable films 133 may be arranged in one light-passing hole 132 , such as one, three, four, five, six, etc. The specific shape of the stretchable films 133 may also depend on the shape of the light-passing hole 132 and other factors. Adjustment is not limited here.

In the embodiment shown in FIG. 6 , the number of light-transmitting holes 132 opened on the base body 131 is single, and the deformation of the telescopic film 133 is changed by controlling the magnitude of the electric field, thereby changing the size of the gap 1321 to change the intensity of the infrared light. The viewing angle is, for example, the first viewing angle or the second viewing angle described above.

In the embodiment shown in FIG. 7 and FIG. 8 , the number of the light-passing holes 132 is at least two, and the retractable film 133 can also change the number of the light-passing holes 132 blocked under the action of the electric field. In this embodiment, the plurality of light-transmitting holes 132 are distributed in a radial array. The light-transmitting hole 132 in the center may correspond to the light-emitting center of the infrared lamp 12 , and the remaining light-transmitting holes 132 are distributed around the central light-transmitting hole 132 . , the retractable films 133 in different light-transmitting holes 132 can be independently connected to or disconnected from the power source. When all the telescopic films 133 are not energized, the transmission rate of the infrared light by the light-transmitting component 13 is the highest, and the field of view angle is also the largest (as shown in FIG. 7 ). , the retractable film 133 located in the light-passing holes 132 at the edge of the array can be controlled to deform and block the corresponding light-passing holes 132 (as shown in FIG. 8 ). Of course, in other embodiments, the distribution of the plurality of light-transmitting holes 132 may be other, and the distribution of the blocked light-transmitting holes 132 may also be set according to user requirements, for example, by controlling the distribution of the plurality of light-transmitting holes 132 In the open and closed state, the light emitted from the output module 10 is in the shape of an animal, a heart or the like.

Referring to FIG. 5 , the structured light projector 14 and the infrared lamp 12 can be formed on a chip 15 , which further reduces the volume of the structured light projector 14 and the infrared lamp 12 after integration, and the manufacturing process is relatively simple. The structured light projector 14 can emit structured light outward, the structured light can form an infrared laser speckle pattern, the structured light is projected onto the surface of the target object, and the structure modulated by the target object is collected by the infrared light camera 62 (as shown in FIG. 1 ). For the light pattern, a depth image of the target object is obtained by analyzing and calculating the modulated structured light pattern (at this time, the structured light projector 14 is used for stereo imaging). In the embodiment of the present invention, the structured light projector 14 includes a light source 141 , a mirror frame 142 , a lens 143 and diffractive optical elements (DOE) 144 . The light beam emitted by the light source 141 is collimated or converged by the lens 143 and then expanded by the diffractive optical element 144 and emitted outward in a certain beam pattern. Specifically, the light source 141 may be formed on the chip 15 , and the lens 143 and the diffractive optical element 144 may be fixed on the mirror frame 1422 , for example, fixed on the mirror frame 142 by means of gluing.

Please refer to FIG. 1 and FIG. 10 , the casing 20 includes a top portion 21 and a bottom portion 22 . At the positions corresponding to the electronic components and piezoelectric elements 70 , the casing 20 is provided with a casing infrared through hole 23 and a casing structure light through hole 23 . 24 and the casing vibration through hole 2a. When the output module 10 is disposed in the casing 20 , the infrared lamp 12 corresponds to the infrared through hole 23 of the casing, and the structured light projector 14 corresponds to the structural light through hole 24 of the casing. The correspondence between the infrared lamp 12 and the infrared through hole 23 of the casing means that the light emitted by the infrared lamp 12 can pass through the infrared through hole 23 of the casing. Specifically, the infrared lamp 12 may be directly opposite to the infrared through hole 23 of the casing. The light emitted by the infrared lamp 12 passes through the infrared through hole 23 of the casing after being acted by the light guide device. The structure light projector 14 corresponds to the casing structure light through hole 24 in the same way, and will not be repeated here. In the embodiment shown in FIG. 10 , the casing infrared through holes 23 and the casing structural light through holes 24 may be spaced apart from each other. Of course, in other embodiments, the casing infrared through holes 23 and the casing structured light The through holes 24 may be interconnected.

Please refer to FIG. 1 , FIG. 9 and FIG. 10 , the vibration module 30 a is installed on the casing 20 . The vibration module 30a may include a display screen 90 and a cover plate 30, or the display screen 90 and the cover plate 30 are combined to form the vibration module 30a, so as to improve the rigidity of the vibration module 30a. The display screen 90 is arranged on the casing 20 and forms a receiving cavity 91 with the casing 20 . Since the output module 10 according to the embodiment of the present invention can occupy a small volume, the volume of the casing 20 for disposing the display screen 90 can be correspondingly increased, so as to increase the screen ratio of the electronic device 100 . Specifically, the display screen 90 , the output module 10 and the piezoelectric element 70 are arranged between the top 21 and the bottom 22 . When the user is using the electronic device 100 normally, the top 21 is located above the bottom 22 , as shown in FIG. 1 , the output module 10 can be arranged between the display screen 90 and the top 21 . In other embodiments, the display screen 90 may be provided with a notch for the full screen, the display screen 90 surrounds the output module 10 , and the output module 10 is exposed from the notch of the display screen 90 .

Referring to FIG. 9 and FIG. 10 , the piezoelectric element 70 is made of ceramic or quartz crystal material, and the piezoelectric element 70 may be a monomorph, a bimorph or a laminated piezoelectric element 70 . The piezoelectric element 70 is combined with the vibration module 30 a and is spaced apart from the output module 10 . Specifically, the piezoelectric element 70 is accommodated in the vibration through hole 2a of the casing, combined with the cover plate 30, and is spaced from the casing 20. The piezoelectric element 70 may be partially accommodated in the vibration through hole 2a of the casing, or the piezoelectric element 70 may be partially accommodated in the vibration through hole 2a of the casing, or the pressure The electrical element 70 is completely accommodated in the vibration through hole 2a of the casing. When an electrical signal (voltage) is applied to both ends of the piezoelectric element 70, due to the inverse piezoelectric effect, the piezoelectric element 70 undergoes mechanical deformation, such as expansion or contraction, thereby driving the vibration module combined with the piezoelectric element 70. 30a vibrates according to the frequency of the electrical signal. When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the part of the user's body in contact with the vibration module 30a (eg, cartilage of the outer ear, teeth). In this way, the user can implement functions such as voice calls and listening to music through the piezoelectric element 70 and the vibration module 30a. In this embodiment of the present invention, the processor of the electronic device 100 is configured to acquire a sound signal, and apply an electrical signal corresponding to the sound signal to both ends of the piezoelectric element 70 .

It can be understood that the traditional receiver structure adopts air conduction sound, and the local sound pressure of the receiver is usually about 90dB to 100dB when the receiver is working. In a quiet surrounding environment (such as a general office environment of about 50dB), the sound is still transmitted to the surrounding 1 meter range. The reserve is about 50dB to 60dB, which causes the conversation content between the callers to be perceived by the surrounding, resulting in privacy leakage. The electronic device 100 according to the embodiment of the present invention adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, and the voice of the call is mainly perceived by the user through the vibration bone conduction, which can effectively ensure the privacy of the call content.

Referring to FIGS. 9 and 10 again, the piezoelectric element 70 and the display screen 90 are both attached to the cover plate 30 through the joint 30b. The bonding member 30b is an adhesive, double-sided tape, adhesive, etc. with thermal curing properties and ultraviolet curing properties. For example, the joint member 30b may be an optical elastic resin (colorless and transparent UV-curable acrylic adhesive). The area of the cover plate 30 combined with the piezoelectric element 70 is spaced apart from the area of the cover plate 30 combined with the display screen 90 to prevent the display of the display screen 90 from being disturbed by the piezoelectric element 70 . Of course, the cover plate 30 can also be joined to the casing 20 through the joint member 30b. Compared with the cover plate 30 being directly disposed on the casing 20, the vibration of the vibration module 30a can be prevented from being directly transmitted to the casing 20, so as to reduce the The possibility of the user dropping the electronic device 100 due to the excessive vibration of the casing 20 is avoided.

The cover plate 30 may be transparent, and the material of the cover plate 30 may be transparent glass, resin, plastic, or the like. The cover plate 30 is arranged on the casing 20. The cover plate 30 includes an inner surface 32 combined with the casing 20 and an outer surface 31 opposite to the inner surface 32. The light emitted by the output module 10 passes through the inner surface 32 and the inner surface 32 in turn. The outer surface 31 passes through the cover plate 30 afterward. In the embodiment shown in FIG. 10 , the cover plate 30 covers the infrared through hole 23 of the casing and the light through hole 24 of the casing structure, and the inner surface 32 of the cover plate 30 is coated with infrared transmission ink 40 , and the infrared transmission The ink 40 has a high transmittance to infrared light, for example, can reach 85% or more, and has a high attenuation rate to visible light, for example, can reach more than 70%, which makes it difficult for users to see the electrons with the naked eye during normal use. The area on the device 100 covered by the infrared transmissive ink 40 . Specifically, the infrared transmissive ink 40 may cover areas on the inner surface 32 that do not correspond to the display screen 90 .

The infrared transmission ink 40 can also block at least one of the casing infrared through hole 23, the casing structure light through hole 24 and the casing vibration through hole 2a, that is, the infrared transmission ink 40 can simultaneously cover the casing infrared through hole 23 , the casing structure light through hole 24 and the casing vibration through hole 2a (as shown in Figure 10), it is difficult for users to see the electronic The internal structure of the device 100 and the appearance of the electronic device 100 are more beautiful; the infrared transparent ink 40 can also cover the infrared through hole 23 of the casing, and does not cover the casing structure light through hole 24 and the casing vibration through hole 2a; The ink 40 can also cover the casing structure light through hole 24, and does not cover the casing infrared through hole 23 and the casing vibration through hole 2a; the infrared transmission ink 40 can also cover the casing vibration through hole 2a, and does not cover the machine casing. The infrared through hole 23 of the casing and the light through hole 24 of the casing structure; the infrared transmission ink 40 can also cover the infrared through hole 23 of the casing and the light through hole 24 of the casing structure, and does not cover the vibration through hole 2a of the casing; The ink 40 can also cover the casing structure light through hole 24 and the casing vibration through hole 2a, and does not cover the casing infrared through hole 23; the infrared transmission ink 40 can also cover the casing infrared through hole 23 and the casing vibration through hole 23. The hole 2a is not covered, and the light through hole 24 of the casing structure is not covered.

Please refer to FIG. 11 , the receiving module 50 integrates a proximity sensor 51 and a photo sensor 52 , and the proximity sensor 51 and the photo sensor 52 together form a single package. The infrared light emitted by the output module 10 is used for infrared ranging. After being reflected by an external object, it is received by the proximity sensor 51. The proximity sensor 51 determines the external object and the electronic device 100 according to the intensity of the received reflected infrared light. the distance between. The light sensor 52 receives the visible light in the ambient light, and detects the intensity of the visible light as a basis for controlling the display brightness of the display screen 90 . The proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50 , which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100 .

Please refer to FIG. 1 and FIG. 11 , the imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . The imaging module 60 includes a lens holder 63 , a lens barrel 64 and an image sensor 65 . The lens barrel 64 is mounted on the lens holder 63 , and the image sensor 65 is accommodated in the lens holder 63 . The lens mount 63 includes a mounting surface 631 located between the lens barrel 64 and the image sensor 65 . In the embodiment shown in FIG. 9 , the receiving module 50 is arranged on the installation surface 631 , specifically, the orthographic projection of the receiving module 50 on the plane where the installation surface 631 is located falls at least partially onto the installation surface 631 , so, The receiving module 50 and the imaging module 60 are set relatively compactly, and the lateral space occupied by the two is relatively small.

In the embodiment shown in FIG. 1 , the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 , and the centers of the output module 10 , the infrared light camera 62 , the visible light camera 61 and the piezoelectric element 70 are located on the same line segment. Specifically, from one end of the line segment to the other end are the output module 10, the visible light camera 61, the infrared light camera 62, and the piezoelectric element 70 (as shown in FIG. 12); or from one end of the line segment to the other end The output module is in sequence Group 10, piezoelectric element 70, visible light camera 61, infrared light camera 62 (as shown in FIG. 1); or from one end of the line segment to the other end, visible light camera 61, output module 10, piezoelectric element 70, infrared light Camera 62. Of course, the arrangement of the output module 10 , the infrared light camera 62 , the piezoelectric element 70 and the visible light camera 61 is not limited to the above examples, and other arrangements are also possible. For example, the centers of the electronic components and the piezoelectric element 70 are arranged in an arc. The center is arranged into a rectangle and other shapes.

Referring to FIG. 13 , in some embodiments, the centers of the output module 10 , the infrared camera 62 and the visible light camera 61 are located on the same line segment, and the piezoelectric element 70 is located between the line segment and the top 21 of the casing 20 . Specifically, from one end to the other end of the line segment are the output module 10, the infrared light camera 62, and the visible light camera 61; or from one end to the other end of the line segment are the output module 10, the visible light camera 61, and the infrared light camera. 62 (as shown in FIG. 13b ); or from one end of the line segment to the other end are the infrared camera 62 , the visible light camera 61 , and the output module 10 in sequence. Of course, the arrangement of the output module 10 , the infrared camera 62 and the visible camera 61 is not limited to the above examples. In the embodiment of the present invention, the center of the piezoelectric element 70 is not located on the line segment, which saves the lateral space occupied by the piezoelectric element 70 and various electronic components (the output module 10, the infrared camera 62, the visible camera 61, etc.). .

Further, please refer to FIG. 11, the receiving module 50 can be arranged on the installation surface 631 of the infrared camera 62, and can also be arranged on the installation surface 631 of the visible light camera 61. Of course, the receiving module 50 can also not be arranged on the installation surface 631. On the surface 631, the receiving module 50 can be arranged adjacent to the output module 10, and the proximity sensor 51 can easily receive the infrared light emitted by the proximity infrared lamp 13 and reflected by external objects; the receiving module 50 can also be connected with the piezoelectric The elements 70 are arranged adjacent to each other, which is not limited here.

To sum up, in the electronic device 100 according to the embodiment of the present invention, by changing the area of the retractable film 133 to block the light-passing hole 132, the infrared light emitted by the infrared lamp 12 can be emitted from the package housing 11 at different viewing angles, corresponding to different Field of view, the output module 10 can be used as a proximity infrared light or an infrared fill light. The output module 10 integrates the functions of emitting infrared light for infrared ranging and infrared fill light. Furthermore, since only one infrared lamp 12 needs to be disposed on the packaging substrate 111 for packaging, compared with the traditional infrared fill light and the near-infrared lamp, which need to be fabricated from different wafers and then assembled on the PCB substrate for packaging, improving the performance of the package. packaging efficiency. Furthermore, the electronic device 100 adopts the piezoelectric element 70 and the vibration module 30a to realize bone conduction sound transmission, instead of the traditional receiver structure of air conduction sound, on the one hand, it can effectively ensure the privacy of the call content; on the other hand, Since the original receiver is eliminated, the through hole corresponding to the receiver is avoided on the cover plate 30 , the process is simpler, the appearance is more beautiful, and dust or moisture can be prevented from entering the electronic device 100 .

It can be understood that the location of the light-passing component 13 is not limited to the above-mentioned embodiments. In other embodiments, the light-passing component 13 may also be disposed on the inner surface of the package top 113 by gluing and block the light exit window 1131 . Alternatively, the light passing component 13 may also be disposed in the light exit window 1131 .

Referring to FIGS. 10 and 14 , in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 . The casing 20 is provided with a casing infrared through hole 23 , a casing structural light through hole 24 , and a casing vibration through hole 2 a which are spaced apart from each other. The infrared lamp 12 corresponds to the infrared through hole 23 of the casing, and the structured light projector 14 corresponds to the structural light through hole 24 of the casing. The number of piezoelectric elements 70 is multiple, and the number of casing vibration through holes 2a is multiple, the multiple piezoelectric elements 70 correspond to the multiple casing vibration through holes 2a, and each piezoelectric element 70 is accommodated in a corresponding machine shell vibration through hole 2a. The centers of the output module 10 , the infrared light camera 62 , the visible light camera 61 and the plurality of piezoelectric elements 70 are located on the same line segment, and the output module 10 , the infrared light camera 62 , and the visible light are arranged between the two adjacent piezoelectric elements 70 . At least one of the cameras 61 . For example, the number of piezoelectric elements 70 is two, and from one end of the line segment to the other end are the piezoelectric element 70, the output module 10, the visible light camera 61, the infrared light camera 62, and the piezoelectric element 70 (as shown in FIG. 14 ). ); or the piezoelectric element 70, the output module 10, the visible light camera 61, the piezoelectric element 70, the infrared light camera 62, etc. in sequence from one end of the line segment to the other end. For another example, the number of piezoelectric elements 70 is three, and from one end of the line segment to the other end are the piezoelectric element 70, the output module 10, the piezoelectric element 70, the visible light camera 61, the infrared light camera 62, the piezoelectric element Element 70 (as shown in FIG. 15 ); or from one end of the line segment to the other end are piezoelectric element 70 , output module 10 , piezoelectric element 70 , visible light camera 61 , piezoelectric element 70 , infrared light camera 62 , etc. Of course, the number of the piezoelectric elements 70 and the arrangement of the piezoelectric elements 70 , the output module 10 , the infrared camera 62 , and the visible camera 61 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric elements 70 are combined with the cover plate 30 , specifically, the plurality of piezoelectric elements 70 are respectively attached to the cover plate 30 through the joint member 30b. The processor of the electronic device 100 is used to acquire the sound signal, and simultaneously apply an electrical signal corresponding to the sound signal to the two ends of the plurality of piezoelectric elements 70, and the plurality of piezoelectric elements 70 are all mechanically deformed. The electrical element 70 drives the vibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with the cover plate 30 . When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the part of the user's body in contact with the vibration module 30a (eg, cartilage of the outer ear, teeth).

In the embodiment of the present invention, a plurality of piezoelectric elements 70 drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30 at the same time, and the vibration of the vibration module 30a is more uniform and stronger, which is beneficial to bone conduction sound Steady conduction to the user's auditory nerve.

Referring to FIGS. 10 , 16 and 17 , in some embodiments, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 . The casing 20 is provided with a casing infrared through hole 23 , a casing structural light through hole 24 , and a casing vibration through hole 2 a which are spaced apart from each other. The infrared lamp 12 corresponds to the infrared through hole 23 of the casing, and the structured light projector 14 corresponds to the structural light through hole 24 of the casing. The piezoelectric element 70 includes a piezoelectric body 71 and a piezoelectric bump 72 extending from the piezoelectric body 71 . The electric bumps 72 correspond to the plurality of casing vibration through holes 2 a , and each piezoelectric bump 72 is partially accommodated in the corresponding casing vibration through holes 2 a and combined with the cover plate 30 . The output module 10 , the infrared light camera 62 and the visible light camera 61 are located between the cover plate 30 and the piezoelectric body 71 . The centers of the output module 10 , the infrared light camera 62 , the visible light camera 61 and the plurality of piezoelectric bumps 72 are located on the same line segment, and the output module 10 and the infrared light camera 62 are arranged between the two adjacent piezoelectric bumps 72 . , and at least one of the visible light camera 61 . For example, the number of the piezoelectric bumps 72 is two, and from one end of the line segment to the other end, the piezoelectric bumps 72 , the output module 10 , the visible light camera 61 , the infrared light camera 62 , and the piezoelectric bumps 72 ; From one end to the other end of the line segment are the piezoelectric bumps 72 , the output module 10 , the piezoelectric bumps 72 , the visible light camera 61 , the infrared light camera 62 , and the like. For another example, the number of the piezoelectric bumps 72 is three, and from one end of the line segment to the other end, the piezoelectric bumps 72, the output module 10, the piezoelectric bumps 72, the visible light camera 61, the infrared light camera 62, the pressure Electric bump 72; or piezoelectric bump 72, output module 10, piezoelectric bump 72, visible light camera 61, piezoelectric bump 72, infrared light camera 62, etc. from one end to the other end of the line segment. For another example, the number of piezoelectric bumps 72 is four, and from one end of the line segment to the other end, the piezoelectric bumps 72, the output module 10, the piezoelectric bumps 72, the visible light camera 61, the piezoelectric bumps 72, Infrared camera 62, piezoelectric bump 72 (as shown in Figure 17). Of course, the number of the piezoelectric bumps 72 and the arrangement of the piezoelectric bumps 72 , the output module 10 , the infrared light camera 62 , and the visible light camera 61 are not limited to the above examples. In the embodiment of the present invention, the plurality of piezoelectric bumps 72 are combined with the cover plate 30 , and more specifically, the plurality of piezoelectric bumps 72 are respectively attached to the cover plate 30 through the joint members 30 b. The processor of the electronic device 100 is used to obtain the sound signal, and apply an electrical signal corresponding to the sound signal to the piezoelectric element 70, and the piezoelectric element 70 including the piezoelectric body 71 and the piezoelectric bump 72 is mechanically deformed by Therefore, the plurality of piezoelectric bumps 72 drive the vibration module 30a to vibrate according to the frequency of the electrical signal from a plurality of different positions combined with the cover plate 30 . When the user's body is in contact with the vibration module 30a, the bone conduction sound is transmitted to the user's auditory nerve through the part of the user's body in contact with the vibration module 30a (eg, cartilage of the outer ear, teeth).

In the embodiment shown in FIG. 17 , the casing 20 is provided with a casing vibration through hole 2 a , an output through hole 25 , an infrared light through hole 27 , and a visible light through hole 28 which are spaced apart from each other. The vibration through hole 2 a of the casing corresponds to the piezoelectric bump 72 , the output through hole 25 corresponds to the output module 10 , the infrared light through hole 27 corresponds to the infrared light camera 62 , and the visible light through hole 28 corresponds to the visible light camera 61 . Wherein, the output through hole 25 can be replaced with the above-mentioned casing infrared through hole 23 and the casing structure light through hole 24, or the output through hole 25 is communicated with the above-mentioned casing infrared through hole 23 and the casing structure light through hole 24 form. In addition, the infrared light through hole 27 corresponds to the infrared light camera 62 means that the infrared light camera 62 can receive the infrared light reflected by the object from the infrared light through hole 27, and the visible light through hole 28 corresponds to the visible light camera 61 means that the visible light camera 61 can pass through the visible light Aperture 28 receives visible light reflected by the object.

In the embodiment of the present invention, the plurality of piezoelectric bumps 72 drive the vibration module 30a to vibrate from a plurality of different positions combined with the cover plate 30, and the vibration of the vibration module 30a is more uniform and stronger, which is beneficial to bone conduction sound It is stably conducted to the auditory nerve of the user; in addition, a plurality of piezoelectric bumps 72 protrude from the same piezoelectric body 71, which facilitates the simultaneous application of electrical signals to the plurality of piezoelectric bumps 72 to synchronously drive vibration from multiple different positions The module 30a vibrates; in addition, the output module 10, the visible light camera 61 and the infrared light camera 62 are located between the cover plate 30 and the piezoelectric body 71, and are interspersed with piezoelectric bumps 72, and the overall volume of the electronic device 100 is small , saving space.

Referring to FIG. 5 , in some embodiments, the output module 10 further includes a metal shielding plate 16 , the metal shielding plate 16 is located in the package casing 11 , and the metal shielding plate 16 is located between the structured light projector 14 and the infrared lamp 12 . between. The metal shielding plate 16 is located between the structured light projector 14 and the infrared lamp 12. On the one hand, the metal shielding plate 16 can shield the electromagnetic interference between the structured light projector 14 and the infrared lamp 12. The structured light projector 14 and the infrared lamp 12 The luminous intensity and timing will not affect each other. On the other hand, the metal shielding plate 16 can be used to isolate the cavity where the structured light projector 14 is located and the cavity where the infrared lamp 12 is located, so that light will not enter another cavity from one cavity. body.

Referring to FIG. 18 , in some embodiments, the output module 10 further includes an optical cover 17 . The optical cover 17 is made of a light-transmitting material, and the optical cover 17 is formed on the package substrate 111 and located in the package case 11 . Optical enclosure 17 encloses infrared lamp 12 . Specifically, the optical cover 17 can be formed by a glue injection molding process, and the optical cover 17 can be made of a transparent thermosetting epoxy resin, so as not to be easily softened during use, and the optical cover 17 can fix the position of the infrared lamp 12 , and make the infrared lamp 12 not easy to shake in the package housing 11 . At this time, the light-transmitting component 13 may be arranged inside the optical enclosure 17 or may be arranged outside the optical enclosure 17 .

Referring to FIG. 19 , in some embodiments, the proximity sensor 51 and the light sensor 52 may not be integrated in the receiving module 50 , or in other words, the proximity sensor 51 and the light sensor 52 are provided separately. At this time, the proximity sensor 51 can be arranged on the mounting surface 631 of the mirror base 63 ; the optical sensor 52 can also be arranged on the installation surface 631 of the mirror holder 63 ; or the proximity sensor 51 and the optical sensor 52 can be arranged on the mirror holder 63 at the same time on the mounting surface 631. The lens mount 63 may be the lens mount 63 of the infrared light camera 62 or the lens mount 63 of the visible light camera 61 .

Referring to FIG. 20 , in some embodiments, the cover plate 30 may also be provided with a cover plate infrared through hole 33 . The cover plate infrared through hole 33 corresponds to the chassis infrared through hole 23 , and the infrared light emitted by the infrared lamp 12 passes through the cover plate 30 . After passing through the infrared through hole 23 of the casing, the electronic device 100 can be passed through the infrared through hole 33 of the cover plate. At this time, the infrared transparent ink 40 can be provided at the position corresponding to the light through hole 24 of the casing structure on the cover plate 30 , and it is difficult for the user to see the structured light projector 14 inside the electronic device 100 through the light through hole 24 of the casing structure. The appearance of the electronic device 100 is beautiful.

Referring to FIG. 21 , in some embodiments, the cover plate 30 may also have a cover plate structure light through hole 34 , the cover plate structure light through hole 34 corresponds to the casing structure light through hole 24 , and the structured light projector 14 emits light. After passing through the light through hole 24 of the casing structure, the infrared light can pass through the electronic device 100 through the light through hole 34 of the cover plate structure. At this time, the infrared transparent ink 40 can be provided on the cover 30 at the position corresponding to the infrared through hole 23 of the casing, and it is difficult for the user to see the infrared lamp 12 and the light-transmitting component 13 inside the electronic device 100 through the infrared through hole 23 of the casing. , the appearance of the electronic device 100 is more beautiful.

Referring to FIG. 22 , in some embodiments, the imaging module 60 further includes a substrate 66 , the image sensor 65 is disposed on the substrate 66 , and the receiving module 50 can also be fixed on the substrate 66 . Specifically, an FPC is provided on the base plate 66, a part of the base plate 66 is located in the mirror base 63, and the other part protrudes from the mirror base 63. One end of the FPC is located in the mirror base 63 and is used to carry the image sensor 65, and the other end can be connected to the mirror base 63. The main board of the electronic device 100 is connected. When the receiving module 50 is arranged on the base plate 66, the receiving module 50 is arranged outside the lens holder 63, and the receiving module 50 can also be connected to the FPC.

Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52, and the proximity sensor 51 and the photoreceptor 52 together form a single-package structure, which reduces the gap between the two when they are assembled separately and saves electronics. Installation space within the device 100 . In other embodiments, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 or/and a light sensor 52, and the proximity sensor 51 and the light sensor 52 are each a single package structure. That is, the receiving module 50 provided on the substrate 66 is the proximity sensor 51 with a single package structure; or, the receiving module 50 provided on the substrate 66 is the photo sensor 52 with a single package structure; The receiving module 50 is a proximity sensor 51 with a single package structure and a photo sensor 52 with a single package structure.

The imaging module 60 may be one or both of the visible light camera 61 and the infrared light camera 62 . Specifically, the receiving module 50 can be fixed on the substrate 66 of the visible light camera 61 ; the receiving module 50 can be fixed on the substrate 66 of the infrared camera 62 . When the proximity sensor 51 and the light sensor 52 are packaged separately, the proximity sensor 51 can be fixed on the substrate 66 of the visible light camera 61, and the light sensor 52 can be fixed on the substrate 66 of the infrared light camera 62; 52 can be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 can be fixed on the substrate 66 of the infrared camera 62; alternatively, both the proximity sensor 51 and the light sensor 52 are fixed on the substrate 66 of the visible light camera 61; or, Both the proximity sensor 51 and the light sensor 52 are fixed on the substrate 66 of the infrared camera 62 .

Further, the base plate 66 also includes a reinforcing plate, and the reinforcing plate is arranged on the side opposite to the receiving module 50 to increase the overall strength of the base plate 66, so that the FPC is not easily folded, and the receiving module 50 (or close to When the sensor 51 or the photoreceptor 52) is installed on the substrate 66, the shaking is less likely to occur. In one example, the receiving module 50 (or the proximity sensor 51 or the light sensor 52 ) may also be fixed on the outer side wall of the mirror base 63 , for example, by bonding.

Referring to FIG. 23 , in some embodiments, the electronic device 100 and the imaging module 60 in the above-mentioned embodiments can be replaced with the following structures: the imaging module 60 includes an image sensor 65 , a camera housing 67 and a lens module 68 . The top surface 670 of the camera housing 67 is a stepped surface. The top surface 670 includes a first sub-top surface 671, a second sub-top surface 672, and a third sub-top surface 673. The second sub-top surface 672 and the first sub-top surface 671 is connected obliquely and forms a cutout 675 with the first sub-top surface 671, the third sub-top surface 673 is connected obliquely with the second sub-top surface 672, and the second sub-top surface 672 is located on the first sub-top surface 671 and the third sub-top surface. 673 to connect the first sub-top surface 671 and the third sub-top surface 673 . The angle between the second sub-top surface 672 and the first sub-top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub-top surface 672 and the third sub-top surface 673 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is, the cutout 675 is located at the edge of the top surface 670 . The third sub-top surface 673 defines a light exit hole 674 , and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light exit hole 674 . The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68. The light outside the electronic device 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65. The image sensor 65 transmits the light signal. converted to electrical signals. The receiving module 50 is disposed at the first sub-top surface 671 , and the receiving module 50 includes a proximity sensor 51 and a light sensor 52 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and the receiving module 50 is a single package formed by the proximity sensor 51 and the photo sensor 52 . The direction of the line connecting the center of the proximity sensor 51 and the light sensor 52 may be consistent with the extending direction of the cutout 675 (as shown in FIG. 23 ); The angle formed by the vertical direction or the two is an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62 .

The imaging module 60 of the present embodiment is provided with a cutout 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are set more compactly, and the transverse The space is small, which saves the installation space in the electronic device 100 ; at the same time, the proximity sensor 51 and the light sensor 52 are jointly packaged into the receiving module 50 , which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100 .

Please continue to refer to FIG. 23 . In some embodiments, the receiving module 50 of the above-mentioned embodiments is disposed on the first sub-top surface 671 and is located outside the camera housing 67 . Specifically, the entire receiving module 50 is perpendicular to the The projections of the first sub-top surface 671 may all be located in the first sub-top surface 671 (as shown in FIG. 23 ); or, part of the receiving module 50 is located on the first sub-top surface along the projection perpendicular to the first sub-top surface 671 Inside 671. That is to say, at least a part of the receiving module 50 is located directly above the first sub-top surface 671. In this way, the receiving module 50 and the imaging module 60 are set more compactly, and the lateral space occupied by the two is small, which further saves The installation space in the electronic device 100 is reduced. In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. In this case, the proximity sensor 51 and the light sensor are each a single package. The devices 52 may also all be disposed on the first sub-top surface 671 .

Referring to FIG. 24 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the proximity sensor 51 and does not include the photo sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and the photo sensor 52 are each a single package structure, the proximity sensor 51 is arranged on the first sub-top surface 671 , and the photo sensor 52 is arranged at any position other than the first sub-top surface 671 .

Please continue to refer to FIG. 24 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the light sensor 52 , but does not include the proximity sensor 51 . In this case, the light sensor 52 (or the receiving module 50 ) and the Each of the proximity sensors 51 is a single package structure, the photo sensor 52 is arranged on the first sub-top surface 671 , and the proximity sensor 51 is arranged at any position other than the first sub-top surface 671 .

Referring to FIG. 25 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the proximity sensor 51 without the light sensor 52, and the light sensor 52 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 25 , the first sub-top surface 671 of the above embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 Can pass through the light-transmitting hole 676 and pass to the photoreceptor 52 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Referring to FIG. 26 , in some embodiments, the first sub-top surface 671 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light-transmitting hole 676 may be a light-transmitting hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart from each other and corresponding to each other. Proximity to the light-transmitting holes corresponding to the sensor 51 and the light sensor 52 , the light outside the electronic device 100 can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. In this case, the proximity sensor 51 and the light sensor are each a single package. The cameras 52 can also be arranged in the camera housing 67 and correspond to the light-transmitting holes 676 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Referring to FIG. 26 , in some embodiments, the first sub-top surface 671 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed. The receiving module 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, the substrate 66 is provided with an FPC, one end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65 , and the other end can be connected to the main board of the electronic device 100 . In other embodiments, the receiving module 50 may also be connected to the FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52. The proximity sensor 51 and the photoreceptor 52 together form a single package structure, reducing the gap between the two when they are assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the light sensor 52 is not integrated in the receiving module 50, that is to say, the receiving module 50 is a single package structure of the proximity sensor 51, and the light sensor The sensor 51 is also a single package structure, and the light sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; When extended, the light sensor 52 may also be fixed to the base plate 66 and located outside the camera housing 67 .

In yet another embodiment, the receiving module 50 only includes the light sensor 52 , and the proximity sensor 51 is not integrated in the receiving module 50 , that is, the receiving module 50 is a single package structure of the light sensor 52 . , the proximity sensor 51 is also a single package structure, the photo sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; or, when a part of the substrate 66 is located in the camera housing 67, the other part The proximity sensor 51 can also be fixed on the base plate 66 and located outside the camera housing 67 when it is protruded inside 67 .

The receiving module 50 of this embodiment is disposed in the camera casing 67, which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a base plate 66 and the receiving module 50 is set on the base plate 66 , so that the receiving module 50 can be stably installed in the camera housing 67 .

Referring to FIG. 27 , in some embodiments, the electronic device 100 and the imaging module 60 of the above-mentioned embodiments can be replaced with the following structures: the imaging module 60 is a dual-camera module, including two image sensors 65 and a camera housing. 67 and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first stepped surface 677 , a second stepped surface 678 lower than the first stepped surface 677 , and a first connecting surface 679 a. The first connecting surface 679a is connected obliquely with the second stepped surface 678 and forms a cutout 675 with the second stepped surface 678. The first connecting surface 679a is connected obliquely with the first stepped surface 677. Between the second stepped surfaces 678 , the first stepped surface 677 and the second stepped surface 678 are connected. The included angle between the first connecting surface 679a and the first stepped surface 677 may be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second stepped surface 678 may be an obtuse angle or a right angle. The cutout 675 is opened on one end of the camera housing 67 , that is, the cutout 675 is located at the edge of the top surface 670 . The two light-exiting through holes 674 are both opened on the first step surface 677 and located on the same side of the cutout 675 . The two lens modules 68 are accommodated in the camera housing 67 and correspond to the two light exit holes 674 respectively. The two image sensors 65 are accommodated in the camera housing 67 and correspond to the two lens modules 68 respectively. The electronic device The light outside 100 can pass through the light exit hole 674 and the lens module 68 and be transmitted to the image sensor 65 . In this embodiment, the imaging module 60 may be a visible light camera 61 , and in this case, the two lens modules 68 are both lens modules corresponding to the visible light camera 61 . The receiving module 50 is disposed on the second step surface 678 and is located outside the camera housing 67 . The receiving module 50 is a single package jointly formed by the proximity sensor 51 and the photo sensor 52 . The direction of the center line connecting the proximity sensor 51 and the photoreceptor 52 may be consistent with the extending direction of the incision 675; shown) or the angle formed by the two is an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared light camera 62 , and in this case, the two lens modules 68 are lens modules corresponding to the infrared light camera 62 . In yet another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62 , and one of the lens modules 68 is a lens module corresponding to the infrared light camera 62 , and the other lens module 68 is a visible light camera 61 The corresponding lens module.

The imaging module 60 of this embodiment is provided with a cutout 675, and the receiving module 50 is disposed on the second stepped surface 678, so that the receiving module 50 and the imaging module 60 are set more compactly, and the lateral space occupied by the two together At the same time, the proximity sensor 51 and the light sensor 52 are packaged together to form the receiving module 50, which reduces the gap when the two are assembled separately and saves the installation space in the electronic device 100.

Referring to FIG. 28 , in some embodiments, the cutout 675 of the above embodiment is opened at the middle position of the top surface 670 , and the first step surface 677 is divided into a first sub-step surface 677a and a second sub-step surface by the cutout 675 677b, the first sub-ladder surface 677a and the second sub-ladder surface 677b are located on opposite sides of the cutout 675, respectively, and the two light-emitting through holes 674 are respectively opened on the first sub-ladder surface 677a and the second sub-ladder surface 677b, and are installed on the The lens modules 68 in the camera housing 67 are also located on opposite sides of the cutout 675 . At this time, the cutout 675 is surrounded by the second stepped surface 678, the first connecting surface 679a and the second connecting surface 679b, and the first connecting surface 679a is connected obliquely to the first sub-top surface 677a and the second stepped surface 678 and is located in the first sub-surface 679a. Between the top surface 677 a and the second stepped surface 678 , the second connecting surface 679 b connects the second sub top surface 677 b and the second stepped surface 678 obliquely and is located between the second sub top surface 677 b and the second stepped surface 678 . In this embodiment, the first stepped surface 677 and the second stepped surface 678 are parallel, the included angle between the first connecting surface 679a and the first sub-stepped surface 677a is an obtuse angle, and the included angle between the second connecting surface 679b and the second sub-stepped surface 677b is an obtuse angle. The angle is obtuse. In other embodiments, the included angle between the first connecting surface 679a and the first sub-step 677a is a right angle, and the included angle between the second connecting surface 679b and the second sub-step 677b is a right angle. Compared with opening the cutout 675 at the edge position of the top surface 670 , the opening of the cutout 675 in the middle position of the top surface 670 in this embodiment can make the width of the cutout 675 wider, thereby facilitating the setting of the receiving module 50 on the second stepped surface. 678 on.

Referring to FIGS. 27 and 28 , in some embodiments, the receiving module 50 of the above-mentioned embodiments is disposed on the second step surface 678 and is located outside the camera housing 67 . Specifically, when the cutout 675 is opened at the edge of the top surface 670, the entire receiving module 50 can be located in the second stepped surface 678 along the projection perpendicular to the second stepped surface 678; The projection on the second stepped surface 678 is located within the second stepped surface 678 (as shown in FIG. 27 ). That is, at least a part of the receiving module 50 is located directly above the second stepped surface 678 . When the cutout 675 is opened at the middle position of the top surface 670 , the entire receiving module 50 can be located in the second stepped surface 678 along the projection perpendicular to the second stepped surface 678 (as shown in FIG. 28 ). In this way, the receiving module 50 and the imaging module 60 are set more compactly, and the lateral space occupied by the two is small, which further saves the installation space in the electronic device 100 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. In this case, the proximity sensor 51 and the light sensor are each a single package. All of the traps 52 may also be provided on the second step surface 678 .

Referring to FIG. 28 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the proximity sensor 51 , and the receiving module 50 does not include the photo sensor 52 . In this case, the proximity sensor 51 (or the receiving module 50 ) and the light sensor 52 are each a single package structure, the proximity sensor 51 is arranged on the second step surface 678 , and the light sensor 52 is arranged on the casing 20 outside the imaging module 60 .

Please refer to FIG. 28 , in some embodiments, the receiving module 50 of the above-mentioned embodiments only includes the photo sensor 52 , and the receiving module 50 does not include the proximity sensor 51 . In this case, the photo sensor 52 (or the receiving module 50) The proximity sensor 51 and the proximity sensor 51 are each in a single package structure, the photo sensor 52 is arranged on the second step surface 678 , and the proximity sensor 51 is arranged on the casing 20 outside the imaging module 60 .

Referring to FIG. 29 , the second step surface 678 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the proximity sensor 51 without the light sensor 52, and the light sensor 52 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 It can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 29 , the second step surface 678 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 only includes the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of light-transmitting holes 676 can be one, and the light outside the electronic device 100 Can pass through the light-transmitting hole 676 and pass to the photoreceptor 52 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Referring to FIG. 30 , in some embodiments, the second step surface 678 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . Specifically, when the receiving module 50 is integrated with the proximity sensor 51 and the light sensor 52, the light-transmitting hole 676 may be a light-transmitting hole corresponding to both the proximity sensor 51 and the light sensor 52 or two spaced apart from each other and corresponding to each other. Proximity to the light-transmitting holes corresponding to the sensor 51 and the light sensor 52 , the light outside the electronic device 100 can pass through the light-transmitting hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50 . In other embodiments, the receiving module 50 includes a proximity sensor 51 and a light sensor 52, but the proximity sensor 51 and the light sensor 52 are two separate single packages. In this case, the proximity sensor 51 and the light sensor are each a single package. The cameras 52 can also be arranged in the camera housing 67 and correspond to the light-transmitting holes 676 . The receiving module 50 in this embodiment is disposed in the camera casing 67 , which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20 .

Please continue to refer to FIG. 30 , in some embodiments, the second step surface 678 of the above-mentioned embodiment is provided with a light-transmitting hole 676 , and the receiving module 50 is located in the camera housing 67 and corresponds to the light-transmitting hole 676 . The imaging module 60 further includes a substrate 66 on which the image sensor 65 is disposed. The receiving module 50 can also be fixed on the substrate 66 and accommodated in the camera housing 67 . Specifically, the substrate 66 is provided with an FPC, one end of the FPC is located in the camera housing 67 and is used to carry the image sensor 65 , and the other end can be connected to the main board of the electronic device 100 . In other embodiments, the receiving module 50 may also be connected to the FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a photoreceptor 52. The proximity sensor 51 and the photoreceptor 52 together form a single package structure, reducing the gap between the two when they are assembled separately. The installation space in the electronic device 100 is saved.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the light sensor 52 is not integrated in the receiving module 50, that is to say, the receiving module 50 is a single package structure of the proximity sensor 51, and the light sensor The device 51 is also a single package structure, the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; When out, the light sensor 52 can also be fixed on the base plate 66 and located outside the camera housing 67 .

In yet another embodiment, the receiving module 50 only includes the light sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the light sensor 52, The proximity sensor 51 is also a single package structure. The proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; When extended, the proximity sensor 51 may also be fixed to the base plate 66 and located outside the camera housing 67 .

The receiving module 50 of this embodiment is disposed in the camera casing 67, which makes the structures of the receiving module 50 and the camera casing 67 more stable and facilitates the installation of the receiving module 50 and the imaging module 60 on the casing 20; , the imaging module 60 is provided with a base plate 66 and the receiving module 50 is set on the base plate 66 , so that the receiving module 50 can be stably installed in the camera housing 67 .

In the description of this specification, reference is made to the terms "some embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples." Described means that a particular feature, structure, material, or characteristic described in connection with the described embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features delimited with "first", "second" may expressly or implicitly include at least one of said features. In the description of the present invention, "plurality" means at least two, such as two, three, unless expressly and specifically defined otherwise.

Although the embodiments of the present invention have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present invention. Embodiments are subject to changes, modifications, substitutions and alterations, and the scope of the present invention is defined by the claims and their equivalents.

Claims (12)

1. an electronic device, is characterized in that, comprises: chassis; An output module, the output module includes a package housing, an infrared lamp, a light-passing component and a structured light projector, the package shell includes a package substrate, the structured light projector, the infrared lamp and the The light component is packaged in the package housing, the infrared lamp and the structured light projector are carried on the package substrate, the light passing component is located on the light emitting light path of the infrared light, and the light passing component includes The base body and the telescopic film, the base body is provided with a light-passing hole, the telescopic film is accommodated and fixed in the light-passing hole, and the telescopic film can be deformed under the action of an electric field and change the amount of shielding the light-passing hole. area, the infrared light emitted by the infrared lamp can be emitted from the encapsulation shell at different viewing angles, the stretchable film is made of a material with electrostrictive effect, and the stretchable film includes a The inner wall of the hole is combined with the first surface and the second surface opposite to the first surface. Under the action of the electric field, the second surface can be deformed relative to the first surface to change the shielding area of the telescopic film. The area of the light-passing hole, one of the light-passing holes accommodates two of the telescopic films, the two telescopic films are symmetrically arranged in the light-passing hole, when no electric field is applied, the telescopic films are in In a natural state, a gap is formed between the two second surfaces, and infrared light can pass through the gap; a vibration module mounted on the casing; and a piezoelectric element, the piezoelectric element is combined with the vibration module and spaced from the output module, and the piezoelectric element is used to deform when an electrical signal is applied to make the vibration module vibrate; The package housing further includes package sidewalls and a package top, the package sidewalls extend from the package substrate and are connected between the package top and the package substrate, and the package top is formed with a first light exit window and a second light exit window, the first light exit window corresponds to the infrared lamp, and the second light exit window corresponds to the structured light projector; The first light-emitting window and the second light-emitting window are made of materials that transmit infrared light, and the rest are made of materials that do not transmit infrared light. The second light-emitting window is formed with a concave lens structure, so that the The light of the second light-exiting window is diffused and emitted outward; the first light-exiting window is formed with a convex lens structure, so that the light passing through the first light-exiting window is gathered and emitted outward; The electronic device further includes a proximity sensor and an imaging module. The imaging module includes an image sensor, a camera housing and a lens module. The top surface of the camera housing is a stepped surface, and the top surface includes a first sub-surface. A top surface, a second sub-top surface, and a third sub-top surface, the second sub-top surface and the first sub-top surface are connected obliquely and form a cutout with the first sub-top surface, and the third sub-top surface The top surface is provided with a light-emitting through hole, the lens module is accommodated in the camera casing and corresponds to the light-exiting through-hole, the image sensor is accommodated in the camera casing and corresponds to the lens module, and the proximity A sensor is provided at the first sub-top surface. 2 . The electronic device according to claim 1 , wherein the number of the light-passing holes is single, and the retractable film can be deformed under the action of an electric field to change the area that blocks the single light-passing hole; 3 . or The number of the light-passing holes is at least two, and the stretchable film can also change the number of the light-passing holes blocked by the electric field. 3 . The electronic device according to claim 1 , wherein the vibration module comprises a display screen and a light-transmitting cover plate, and the display screen is disposed on the casing and formed together with the casing. 4 . an accommodating cavity, the cover plate is combined with the casing and is located on the side of the display screen away from the accommodating cavity, the display screen is combined with the cover plate, and the casing is provided with spaced apart Infrared through holes of the casing, light through holes of the casing structure, and vibration through holes of the casing, the infrared lamps correspond to the infrared through holes of the casing, and the structured light projector corresponds to the light through holes of the casing structure , the piezoelectric element is accommodated in the vibration through hole of the casing and combined with the cover plate. 4. The electronic device of claim 3, wherein the piezoelectric element and the display screen are attached to the cover plate by a joint. 5 . The electronic device according to claim 1 , wherein the output module further comprises a chip, and the infrared lamp and the structured light projector are formed on the chip. 6 . 6 . The electronic device according to claim 1 , wherein the output module further comprises a metal shielding plate, and the metal shielding plate is located in the package casing, and is located between the infrared lamps and the structured light. 7 . between the projectors. 7 . The electronic device according to claim 4 , wherein an infrared-transmitting ink that only transmits infrared light is formed on a surface where the cover plate is combined with the casing, and the infrared-transmitting ink blocks the At least one of the casing infrared through hole, the casing structure light through hole and the casing vibration through hole. 8 . The electronic device according to claim 1 , wherein the electronic device further comprises a receiving module and an imaging module, the receiving module is integrated with a proximity sensor and a light sensor, and the imaging module comprises a mirror. 9 . a seat, a lens barrel mounted on the lens seat, and an image sensor accommodated in the lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, the receiving mold Groups are provided on the mounting surface. 9 . The electronic device according to claim 1 , wherein the electronic device further comprises a proximity sensor, a light sensor, and an imaging module, and the imaging module comprises a mirror base and is mounted on the mirror base. 10 . The lens barrel and the image sensor accommodated in the lens seat, the lens seat includes a mounting surface between the lens barrel and the image sensor, at least one of the proximity sensor and the photo sensor one is provided on the mounting surface. 10 . The electronic device according to claim 1 , wherein the electronic device further comprises an infrared light camera and a visible light camera, and the centers of the output module, the infrared light camera and the visible light camera are located on the same line segment. 11 . above, the piezoelectric element is located between the line segment and the top of the casing. 11 . The electronic device according to claim 3 , wherein the electronic device further comprises an infrared light camera and a visible light camera, the number of the piezoelectric elements is multiple, and the number of the vibration through holes of the casing is 11 . A plurality of the piezoelectric elements correspond to a plurality of the vibration through holes of the casing, each of the piezoelectric elements is accommodated in the corresponding vibration through holes of the casing, the output module, the The centers of the infrared camera, the visible light camera and the piezoelectric elements are located on the same line segment, and the output module, the infrared camera and the piezoelectric elements are arranged between two adjacent piezoelectric elements. At least one of the visible light cameras. 12 . The electronic device according to claim 3 , wherein the electronic device further comprises an infrared light camera and a visible light camera, and the piezoelectric element comprises a piezoelectric body and a piezoelectric body extending from the piezoelectric body. 13 . The number of the vibration through holes of the casing is plural, the plurality of piezoelectric bumps correspond to the plurality of vibration through holes of the casing, and each piezoelectric bump is partially accommodated in a corresponding The casing vibrates in the through hole and is combined with the cover plate, the output module, the infrared light camera and the visible light camera are located between the cover plate and the piezoelectric body, and the output module , The center of the infrared camera, the visible light camera and a plurality of the piezoelectric bumps are located on the same line segment, and the output module, the infrared at least one of a light camera and the visible light camera.

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