CN108206236A - Piezoelectric vibrator and manufacturing method thereof - Google Patents

Abstract

The invention relates to a piezoelectric vibrator and a preparation method thereof. A piezoelectric vibrator, comprising: a substrate; the vibration layer is arranged on one side of the substrate and comprises an electrode layer and at least one piezoelectric ceramic layer which are arranged in a stacked mode, the electrode layer comprises a plurality of layers, and each piezoelectric ceramic layer is located between every two adjacent electrode layers; the polarization directions of the two adjacent piezoelectric ceramic layers are opposite, and the substrate and the vibration layer of the piezoelectric vibrator are integrated through lamination and sintering. The piezoelectric vibrator comprises a substrate and a vibration layer, wherein the vibration layer comprises an electrode layer and at least one piezoelectric ceramic layer which is arranged on one side of the substrate in a laminated mode, and the piezoelectric ceramic layer is integrated through lamination and sintering to form an integral structure. Because the piezoelectric vibrator is not adhered by the adhesive, but is in an integral structure by laminating and sintering, the structural strength and the reliability of the piezoelectric vibrator are not influenced by the adhesive, and the compressive strength, the impact strength and the reliability of the piezoelectric vibrator are improved.

Description

Piezoelectric vibrator and manufacturing method thereof

technical field

The invention relates to the technical field of piezoelectric devices, in particular to a piezoelectric vibrator and a preparation method thereof.

Background technique

At present, piezoelectric vibrators are widely used as sounding components in electronic products such as timers, communication equipment, electronic toys, alarms and computers.

However, a general piezoelectric vibrator is molded by bonding with an adhesive. However, the compressive strength and impact strength of the piezoelectric vibrator molded by adhesive bonding are poor, and the reliability of bonding cannot meet the use requirements.

Contents of the invention

Based on this, it is necessary to provide a piezoelectric vibrator with improved compressive strength, impact strength and reliability and a preparation method thereof for the problems of poor compressive strength, impact resistance and reliability of the transmission piezoelectric vibrator.

Piezo vibrators, including:

Substrate;

The vibrating layer is arranged on one side of the substrate, and includes stacked electrode layers and at least one piezoelectric ceramic layer, the electrode layer includes multiple layers, and each piezoelectric ceramic layer is located adjacent to the electrode between layers;

Wherein, the polarization directions of two adjacent piezoelectric ceramic layers are opposite, and the substrate and the vibration layer of the piezoelectric vibrator are integrated through lamination and sintering.

The above-mentioned piezoelectric vibrator includes a substrate and a vibrating layer, and the vibrating layer includes stacked electrode layers and at least one piezoelectric ceramic layer, which are integrated by lamination and sintering to form an integral structure. Since the piezoelectric vibrator does not bond the layers with an adhesive, but forms an integrated structure through lamination and sintering, the structural strength and reliability of the piezoelectric vibrator are not affected by the adhesive, thereby improving the reliability of the piezoelectric vibrator. Compressive strength, impact strength and reliability of piezoelectric vibrators.

In one embodiment, the substrate is made of ceramic glass, and several closed holes are distributed in the substrate.

In one embodiment, the holes in the ceramic substrate are evenly distributed.

In one embodiment, each electrode layer includes a first electrode and a second electrode spaced apart from the first electrode, and the first electrode and the second electrode of each electrode layer are Covering one side of the piezoelectric ceramic layer, and the covering area of the first electrode is larger than the covering area of the second electrode.

In one embodiment, the first electrode and the second electrode of each electrode layer are arranged side by side, and in each electrode layer, the direction from the first electrode to the second electrode is opposite to that of the second electrode. The direction from the first electrode to the second electrode in the adjacent electrode layers is opposite.

In one embodiment, the vibration layer further includes:

The first extraction electrode is electrically connected to the first electrode and the second electrode close to the same end of the vibration layer in the electrode layers of each layer;

The second lead-out electrode is electrically connected to the first electrode and the second electrode near the other end of the vibrating layer in each electrode layer.

In one embodiment, the vibrating layer is provided with two through holes that run through opposite sides thereof, the first extraction electrode is penetrated in one of the through holes, and the second extraction electrode is penetrated in the other. One said through hole, so that said first lead-out electrode and said second lead-out electrode are respectively lead out to the side surface of said vibrating layer away from said substrate.

In one embodiment, the first lead-out electrode and the second lead-out electrode are respectively lead out to end surfaces at opposite ends of the vibration layer.

A method for preparing a piezoelectric vibrator, comprising the steps of:

providing a substrate;

forming a vibrating layer on one side of the substrate to form an element embryo;

Laminating the element blank body, and cutting the element blank body to form a plurality of piezoelectric vibrators;

The piezoelectric vibrator is sintered and formed.

In the method for preparing piezoelectric vibrators described above, the vibrating layer is molded on one side of the substrate to form an element embryo body, and the element embryo body is laminated, and then the element embryo body is cut into a plurality of piezoelectric vibrators, and each piezoelectric vibrator is Sintering is performed to form a monolithic structure. Since the piezoelectric vibrator does not need to be bonded by adhesives, but is formed into an integrated structure through lamination and sintering, the structural strength and reliability of the piezoelectric vibrator are not affected by the adhesive, thereby improving The compressive strength, impact strength and reliability of the piezoelectric vibrator are studied.

In one embodiment, before the step of forming the element embryo body, the step of:

Electrode layers are formed on opposite sides of the piezoelectric ceramic plates, and at least one of the piezoelectric ceramic plates is stacked to form the vibration layer.

Description of drawings

FIG. 1 is a schematic structural diagram of a piezoelectric vibrator in an embodiment of the present invention;

FIG. 2 is a schematic diagram of an exploded structure of the piezoelectric vibrator in FIG. 1;

FIG. 3 is a schematic structural diagram of an electrode layer of the piezoelectric vibrator in FIG. 1;

4 is a flowchart of a method for manufacturing a piezoelectric vibrator in an embodiment of the present invention;

FIG. 5 is a flowchart of a method for manufacturing a piezoelectric vibrator in another embodiment of the present invention.

Among them, 10 piezoelectric vibrator; 100 substrate; 110 vibration layer; 112 piezoelectric ceramic layer; 114 electrode layer; 1140 first electrode; 1142 second electrode.

detailed description

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in FIGS. 1 and 2 , a piezoelectric vibrator 10 in an embodiment of the present application includes a substrate 100 and a vibrating layer 110 disposed on one side of the substrate 100 . The vibrating layer 110 includes stacked electrode layers 114 and at least one piezoelectric ceramic layer 112 , the electrode layer 114 includes multiple layers, and each piezoelectric ceramic layer 112 is located between adjacent electrode layers 114 .

Wherein, the polarization directions of two adjacent piezoelectric ceramic layers 112 are opposite, and the substrate 100 and the vibrating layer 110 of the piezoelectric vibrator 10 are integrated through lamination and sintering.

The above-mentioned piezoelectric vibrator 10 includes a substrate 100 and a vibrating layer 110, and the vibrating layer 110 includes a stacked electrode layer 114 and at least one piezoelectric ceramic layer 112, which are integrated by lamination and sintering to form an integral structure. Since the piezoelectric vibrator 10 does not bond the layers with an adhesive, but forms an integrated structure through lamination and sintering, the structural strength and reliability of the piezoelectric vibrator 10 are not affected by the adhesive, thus The compressive strength, impact strength and reliability of the piezoelectric vibrator 10 are improved.

In one embodiment, the material of the substrate 100 is ceramic glass, and a plurality of closed holes are distributed in the substrate. Further, several holes are uniformly distributed in the substrate 100 .

Specifically, the hole diameter is 20-100 μm.

Further, the density of the substrate 100 after sintering is less than or equal to 0.6 g/cm ³ , and the thickness is 1/4 of the working wavelength of the piezoelectric vibrator 10 .

Specifically, the vibrating layer 110 includes two piezoelectric ceramic layers 112 , and three electrode layers 114 are disposed on opposite sides of the vibrating layer 110 and between the two piezoelectric ceramic layers 112 .

In one embodiment, the substrate 100 includes the composition SiO ₂ , ZnO, Al ₂ O ₃ , B ₂ O ₃ , and the like.

In one embodiment, the sintering temperature of the piezoelectric vibrator 10 is 900-1000°C.

In one embodiment, the piezoelectric ceramic layer 112 has a thickness of 60 μm.

Please refer to FIG. 3 together. In one embodiment, each electrode layer 114 includes a first electrode 1140 and a second electrode 1142 spaced apart from the first electrode 1140. The first electrode 1140 and the second electrode 1142 of each electrode layer 114 Both electrodes 1142 cover one side of a piezoelectric ceramic layer 112 , and the covering area of the first electrode 1140 is larger than that of the second electrode 1142 .

Further, the first electrode 1140 and the second electrode 1142 of each electrode layer 114 are arranged side by side, and the direction from the first electrode 1140 to the second electrode 1142 in each electrode layer 114 and the direction from the first electrode 1142 to the adjacent electrode layer 114 are arranged by the first electrode 1140. The direction in which the electrode 1140 points to the second electrode 1142 is opposite.

Further, the vibrating layer 110 further includes a first extraction electrode (not shown in the figure) and a second extraction electrode (not shown in the figure).

The first lead-out electrode is electrically connected to the first electrode 1140 and the second electrode 1142 near the same end of the vibration layer in each electrode layer 114 .

The second lead-out electrode is electrically connected to the first electrode 1140 and the second electrode 1142 at the other end of each electrode layer 114 that is close to the vibrating layer 110 and opposite. In this way, when the first lead-out electrode and the second lead-out electrode are electrically connected to an external power source, an operating voltage is provided for each piezoelectric ceramic layer 112 .

In one embodiment, the vibrating layer 110 is provided with two through holes (not shown) that run through opposite sides thereof, the first extraction electrode is penetrated in one of the through holes, and the second extraction electrode is penetrated in the other. A said through hole is used to respectively lead out the first lead-out electrode and the second lead-out electrode to the side surface of the vibrating layer away from the substrate.

Alternatively, the first lead-out electrode and the second lead-out electrode are respectively lead out to the end surfaces of opposite ends of the vibration layer 110, so that the electrodes in the electrode layer 114 can be pulled out to the vibration layer 110 without opening holes in the vibration layer 110. The outer side is convenient for electrical connection with an external power supply without reducing the strength of the vibration layer 110 .

It can be understood that, the side faces of the opposite two sides of the vibrating layer 110 are perpendicular to the end faces of the opposite ends of the vibrating layer 110 . That is to say, the vertical lines on opposite sides of the vibrating layer 110 run through each piezoelectric ceramic layer 112 vertically, and the vertical lines on opposite ends of the vibrating layer 110 are parallel to each piezoelectric ceramic layer 112 .

In one embodiment, the first electrode 1140 and the second electrode 1142 are both rectangular. In another embodiment, the first electrode 1140 and the second electrode 1142 may also have other shapes, as long as the covering area of the first electrode 1140 is larger than that of the second electrode 1142 .

Please refer to Fig. 4 and Fig. 5, according to the above-mentioned piezoelectric vibrator, the present application also provides a method for preparing a piezoelectric vibrator, including steps:

S110: providing a substrate;

S120: forming a vibrating layer on one side of the substrate to form an element embryo;

S130: Laminating the component blank body, and cutting the component blank body to form a plurality of piezoelectric vibrators;

S140: Sintering and molding the piezoelectric vibrator.

In the method for preparing piezoelectric vibrators described above, the vibrating layer is molded on one side of the substrate to form an element embryo body, and the element embryo body is laminated, and then the element embryo body is cut into a plurality of piezoelectric vibrators, and each piezoelectric vibrator is Sintering is performed to form a monolithic structure. Since the piezoelectric vibrator does not need to be bonded with adhesives, but is formed into an integrated structure through lamination and sintering, the structural strength and reliability of the piezoelectric vibrator are not affected by the adhesive. Therefore, the compressive strength, impact strength and reliability of the piezoelectric vibrator are improved.

Specifically, the substrate is made of ceramic glass, and several closed holes are distributed in the substrate. Further, several holes are uniformly distributed in the substrate.

Specifically, the hole diameter is 20-100 μm.

Specifically, the sintering temperature of the piezoelectric vibrator is 900-1000°C.

Specifically, the density of the substrate after sintering is less than or equal to 0.6 g/cm ³ , and the thickness is 1/4 of the working wavelength of the piezoelectric vibrator.

In one embodiment, step S150 is also included after step S140:

Polarize each piezoelectric ceramic plate separately;

Wherein, the polarization directions of two adjacent piezoelectric ceramic plates are opposite.

Further, step S121 is also included before step S120:

Electrode layers are formed on opposite sides of the piezoelectric ceramic plate, and at least one piezoelectric ceramic plate formed with the electrode layer is stacked to form a vibration layer.

Specifically, in step S121, a printing process is used to form electrode layers covering opposite sides of the piezoelectric ceramic plate.

It can be understood that the electrode layers formed in step S121 all include the first electrode and the second electrode.

Specifically, the first electrode and the second electrode of the electrode layer formed in step S121 cover one side of the piezoelectric ceramic plate side by side and spaced apart, and the covering area of the first electrode is larger than that of the second electrode.

Further, in step S121 , the direction from the first electrode to the second electrode in each electrode layer is opposite to the direction from the first electrode to the second electrode in the adjacent electrode layer. That is to say, the arrangement directions of the first electrodes and the second electrodes in the two adjacent electrode layers are opposite.

Specifically, the first electrode and the second electrode of the electrode layer formed in step S121 may be in a rectangular shape, or may be in other shapes such as a circle or an ellipse.

In one embodiment, step S123 is further included between step S121 and step S120:

The first electrode and the second electrode in each electrode layer are drawn out to the surface of the vibrating layer away from the substrate respectively.

Specifically, step S123 specifically includes:

Two through-holes are opened through the opposite sides of the vibrating layer, and the first lead-out electrode is formed in one of the through-holes by hole filling, and the second lead-out electrode is formed in the other through-hole, and the first lead-out electrode and each The first electrode and the second electrode near the same end of the vibrating layer in the electrode layer are electrically connected. The second lead-out electrode is electrically connected to the first electrode and the second electrode at the opposite end of the vibration layer in each electrode layer.

In another embodiment, step S123 may not be included between step S121 and step S120, but step S151 may be included after step S150:

The first electrode and the second electrode in each electrode layer are drawn out to the end surfaces of opposite ends of the vibrating layer respectively.

Specifically, step S151 specifically includes:

Extend the first electrode and the second electrode of each electrode layer to the end of the corresponding vibration layer, and electrically connect the first electrode and the second electrode extending to one end of the vibration layer to form a first lead-out electrode, and The first electrode extending to the opposite end of the vibration layer is electrically connected to the second electrode to form a second lead-out electrode.

It can be understood that the first lead-out electrode and the second lead-out electrode are used to electrically connect with an external power source, and provide working voltage for each piezoelectric ceramic plate, so that the piezoelectric vibrator is in a bending vibration mode.

Specifically, the first extraction electrode and the second extraction electrode in step S151 can be formed by printing or sputtering process.

The various technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of concise description, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, should be considered as within the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and the descriptions thereof are relatively specific and detailed, but should not be construed as limiting the patent scope of the invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention should be based on the appended claims.

Claims (10)

1. A piezoelectric vibrator, characterized in that it comprises: Substrate; The vibrating layer is arranged on one side of the substrate, and includes stacked electrode layers and at least one piezoelectric ceramic layer, the electrode layer includes multiple layers, and each piezoelectric ceramic layer is located adjacent to the electrode between layers; Wherein, the polarization directions of two adjacent piezoelectric ceramic layers are opposite, and the substrate and the vibration layer of the piezoelectric vibrator are integrated through lamination and sintering. 2 . The piezoelectric vibrator according to claim 1 , wherein the substrate is made of ceramic glass, and a plurality of closed holes are distributed in the substrate. 3 . 3. The piezoelectric vibrator according to claim 2, wherein the holes in the ceramic substrate are uniformly distributed. 4. The piezoelectric vibrator according to claim 1, wherein each electrode layer comprises a first electrode and a second electrode spaced apart from the first electrode, and each electrode layer comprises Both the first electrode and the second electrode cover one side of the piezoelectric ceramic layer, and the covering area of the first electrode is larger than that of the second electrode. 5. The piezoelectric vibrator according to claim 4, wherein the first electrode and the second electrode of each electrode layer are arranged side by side, and each electrode layer is composed of the first electrode The direction from one electrode to the second electrode is opposite to the direction from the first electrode to the second electrode in the adjacent electrode layer. 6. The piezoelectric vibrator according to claim 5, wherein the vibration layer further comprises: The first extraction electrode is electrically connected to the first electrode and the second electrode close to the same end of the vibration layer in the electrode layers of each layer; The second lead-out electrode is electrically connected to the first electrode and the second electrode near the other end of the vibrating layer in each electrode layer. 7. The piezoelectric vibrator according to claim 6, wherein the vibrating layer is provided with two through holes passing through opposite sides of the vibrating layer, and the first lead-out electrode is disposed in one of the through holes The second lead-out electrode is passed through the other through-hole, so that the first lead-out electrode and the second lead-out electrode are respectively lead out to the surface of the vibrating layer on a side away from the substrate. 8 . The piezoelectric vibrator according to claim 6 , wherein the first lead-out electrode and the second lead-out electrode are respectively lead out to end surfaces at opposite ends of the vibration layer. 9. A method for preparing a piezoelectric vibrator, comprising the steps of: providing a substrate; forming a vibrating layer on one side of the substrate to form an element embryo; Laminating the element blank body, and cutting the element blank body to form a plurality of piezoelectric vibrators; The piezoelectric vibrator is sintered and formed. 10. The method for manufacturing a piezoelectric vibrator according to claim 9, further comprising the step of: Electrode layers are formed on opposite sides of the piezoelectric ceramic plates, and at least one of the piezoelectric ceramic plates is stacked to form the vibration layer.