CN1081128C - 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法 - Google Patents
软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法 Download PDFInfo
- Publication number
- CN1081128C CN1081128C CN99116606A CN99116606A CN1081128C CN 1081128 C CN1081128 C CN 1081128C CN 99116606 A CN99116606 A CN 99116606A CN 99116606 A CN99116606 A CN 99116606A CN 1081128 C CN1081128 C CN 1081128C
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- Prior art keywords
- metal
- plastic film
- plate
- clad
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 66
- 239000002184 metal Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 229920006254 polymer film Polymers 0.000 title 1
- 239000002985 plastic film Substances 0.000 claims abstract description 33
- 229920006255 plastic film Polymers 0.000 claims abstract description 33
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 claims description 37
- 229920002521 macromolecule Polymers 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005056 compaction Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 7
- 238000003825 pressing Methods 0.000 abstract description 4
- 238000004321 preservation Methods 0.000 abstract 2
- 230000003139 buffering effect Effects 0.000 abstract 1
- 239000002655 kraft paper Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 10
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000005030 aluminium foil Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002650 laminated plastic Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Abstract
Description
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99116606A CN1081128C (zh) | 1999-08-18 | 1999-08-18 | 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN99116606A CN1081128C (zh) | 1999-08-18 | 1999-08-18 | 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1241488A CN1241488A (zh) | 2000-01-19 |
| CN1081128C true CN1081128C (zh) | 2002-03-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99116606A Expired - Lifetime CN1081128C (zh) | 1999-08-18 | 1999-08-18 | 软性印刷电路板专用的高分子塑料薄膜双面复合金属板的制造方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1081128C (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1091822C (zh) * | 1999-09-09 | 2002-10-02 | 沈阳防锈包装材料公司 | 不锈钢板耐热垫纸及其生产方法 |
| CN101374383B (zh) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | 绝缘基膜、电路板基板及电路板 |
| CN103722793B (zh) * | 2012-10-12 | 2016-07-06 | 昆山雅森电子材料科技有限公司 | 用于印刷电路板压合的硅钢箔及使用该硅钢箔的压合方法 |
| CN104202927A (zh) * | 2014-09-12 | 2014-12-10 | 高德(无锡)电子有限公司 | 一种软硬结合半成品印刷线路板的生产工艺 |
| CN109322888A (zh) * | 2018-11-02 | 2019-02-12 | 广州凯立达电子有限公司 | 深水耐压的手表底盖与压电陶瓷片的粘贴固化方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047049A (zh) * | 1989-05-05 | 1990-11-21 | 古尔德有限公司 | 有保护的导电箔以及在后继加工期间保护电镀层金属箔的过程 |
| CN1102804A (zh) * | 1993-02-10 | 1995-05-24 | 塞达尔公司 | 用于制造印刷电路的塑料绝缘层的方法 |
| CN1106813A (zh) * | 1993-07-05 | 1995-08-16 | 杜法尔国际研究公司 | 具有5-ht1a-拮抗活性的2,3-二氢-1,4-苯并二噁英-5-基-哌嗪衍生物 |
| CN1113071A (zh) * | 1994-03-30 | 1995-12-06 | 三井金属矿业株式会社 | 镀铜膜层叠板用铜箔 |
| CN1115329A (zh) * | 1994-03-30 | 1996-01-24 | 古尔德电子有限公司 | 环氧粘合剂及使用它们的铜箔和层板 |
| CN1129423A (zh) * | 1993-08-23 | 1996-08-21 | 帕利克斯公司 | 多层印刷电路板及其制备方法 |
| CN1129171A (zh) * | 1994-09-21 | 1996-08-21 | 山内株式会社 | 压型机用缓冲材料 |
| CN1141574A (zh) * | 1995-05-01 | 1997-01-29 | 三井金属矿业株式会社 | 多层印刷电路板及其制造方法 |
-
1999
- 1999-08-18 CN CN99116606A patent/CN1081128C/zh not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047049A (zh) * | 1989-05-05 | 1990-11-21 | 古尔德有限公司 | 有保护的导电箔以及在后继加工期间保护电镀层金属箔的过程 |
| CN1102804A (zh) * | 1993-02-10 | 1995-05-24 | 塞达尔公司 | 用于制造印刷电路的塑料绝缘层的方法 |
| CN1106813A (zh) * | 1993-07-05 | 1995-08-16 | 杜法尔国际研究公司 | 具有5-ht1a-拮抗活性的2,3-二氢-1,4-苯并二噁英-5-基-哌嗪衍生物 |
| CN1129423A (zh) * | 1993-08-23 | 1996-08-21 | 帕利克斯公司 | 多层印刷电路板及其制备方法 |
| CN1113071A (zh) * | 1994-03-30 | 1995-12-06 | 三井金属矿业株式会社 | 镀铜膜层叠板用铜箔 |
| CN1115329A (zh) * | 1994-03-30 | 1996-01-24 | 古尔德电子有限公司 | 环氧粘合剂及使用它们的铜箔和层板 |
| CN1129171A (zh) * | 1994-09-21 | 1996-08-21 | 山内株式会社 | 压型机用缓冲材料 |
| CN1141574A (zh) * | 1995-05-01 | 1997-01-29 | 三井金属矿业株式会社 | 多层印刷电路板及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1241488A (zh) | 2000-01-19 |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: HUASHUO SCIENCE CO., LTD. Free format text: FORMER NAME: HUBEI PROV. CHEMICAL RESEARCH INST. |
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| CP01 | Change in the name or title of a patent holder |
Address after: No. 30 Guan Shan Road, Hongshan District, Hubei, Wuhan Patentee after: Huashuo Technology Co., Ltd. Address before: No. 30 Guan Shan Road, Hongshan District, Hubei, Wuhan Patentee before: Hubei Research Institute of Chemistry |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacture of metal sheet coated with polymer film specially for soft printed circuit Effective date of registration: 20100907 Granted publication date: 20020320 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20151106 Granted publication date: 20020320 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
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| PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20151106 Registration number: 2010990000869 Pledgee after: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgee before: Bank of Hankou, Limited by Share Ltd, Optics Valley branch |
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