CN108055812A - A kind of cooling system of on-board power device - Google Patents
A kind of cooling system of on-board power device Download PDFInfo
- Publication number
- CN108055812A CN108055812A CN201711438827.0A CN201711438827A CN108055812A CN 108055812 A CN108055812 A CN 108055812A CN 201711438827 A CN201711438827 A CN 201711438827A CN 108055812 A CN108055812 A CN 108055812A
- Authority
- CN
- China
- Prior art keywords
- power device
- cold plate
- heat
- pcb printed
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 7
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims abstract description 11
- 238000009434 installation Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention proposes a kind of cooling system of on-board power device, including radiator, cold plate, housing, wind turbine；Power device is additionally arranged at the bottom heat conductive insulating pad, and passes through cold plate and be installed in PCB printed boards, and cold plate is connected with housing when mounted, forms heat exchange pattern heat dissipation；The PCB printed boards are single side pad, prevent cold plate from short circuit phenomenon occurs with pad；It installs radiator at the top of power device additional, forms heat radiation mode and radiate；Wind turbine provides the air-supply that forces perpendicular to PCB printed board installation directions, forms thermal convection heat dissipation.The method that the present invention is combined using conduction, convection current, radiation realizes the good heat radiating of on-board power device, and system is made to have many advantages, such as that good thermal diffusivity, work efficiency are high, reliability is high and life cycle is long.
Description
Technical field
The invention belongs to component technical field of heat dissipation, it is related to the cooling system of on-board power device.
Background technology
At present, with the increase of power device power, the contradiction between power and heat dissipation has become power electronic member device
Part assembles important technological problems.It is, in general, that the electric energy that power device consumes when working has quite a few and is converted into heat.
The operating temperature of power device is allowed to be maintained in rational scope, except ensureing the operating ambient temperature of power device reasonable
Within the scope of, it is necessary to radiating treatment is carried out to it.In the cooling system of component, general heat transfer uses three kinds of sides
Formula：Conduction, convection current, radiation.Power device uses more be directly mounted on radiator at present to ensure good thermal diffusivity,
Caloric value when radiator works according to device is designed.But in some design occasions, due to power device volume itself compared with
It is small, if being directly mounted at heat sink, cause small product size big, weight weight.
The content of the invention
In order to improve the heat dissipation effect of power device, which kind of radiating mode no matter is taken, will how efficiently be solved first
Ground by heat from heat source be quickly transferred in heat radiator body the problem of, for this purpose, the present invention proposes a kind of dissipating for on-board power device
Hot systems realize the good heat radiating of onboard device in a manner that conduction, convection current, radiation are combined.
The technical scheme is that：
A kind of cooling system of the on-board power device, it is characterised in that：Including radiator, cold plate, housing, wind turbine；
Power device is additionally arranged at the bottom heat conductive insulating pad, and passes through cold plate and be installed in PCB printed boards, and when mounted
Cold plate with housing is connected, forms heat exchange pattern heat dissipation；The PCB printed boards are single side pad, prevent cold plate and pad
Generation short circuit phenomenon；
It installs radiator at the top of power device additional, forms heat radiation mode and radiate；
Wind turbine provides the air-supply that forces perpendicular to PCB printed board installation directions, forms thermal convection heat dissipation.
When power device works, heat constantly comes out, on the one hand by power device top heat sink with heat
Radiation mode radiates, and on the other hand by the cold plate that is in close contact with power device in thermo-conducting manner, conducts heat to
Housing carries out forced ventilation finally by wind turbine and sees heat off.So by three kinds of conduction, convection current, radiation thermaltransmission mode knots
Altogether, entire radiation processes include 4 links：First is power device, i.e. heat source producer；Second is radiator, cold plate,
That is hot conduction person；3rd is wind turbine, that is, increases heat transfer and be directed toward the medium of heat transfer；4th be air, i.e. heat exchange
It eventually flows to.
Advantageous effect
The beneficial effects of the present invention are：The method being combined using conduction, convection current, radiation realizes on-board power device
Good heat radiating makes system have many advantages, such as that good thermal diffusivity, work efficiency are high, reliability is high and life cycle is long.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains substantially or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is to realize on-board power device heat dissipation schematic diagram.Wherein, 1 --- radiator；2 --- power tube；3 --- it is cold
Plate；4 --- printed board；5 --- housing.
Specific embodiment
The embodiment of the present invention is described below in detail, the embodiment is exemplary, it is intended to for explaining the present invention, and
It is not considered as limiting the invention.
Attached drawing 1 describes a kind of heat dissipation schematic diagram of on-board power device.System includes power tube, radiator, cold plate, shell
Body, wind turbine etc..
Power tube is entirely additionally arranged at the bottom to heat conductive insulating pad first, and passes through cold plate and is installed in PCB printed boards, here
During the making sheet of PCB printed boards, pcb board is made as single side pad, prevents cold plate from short circuit phenomenon occurs with pad.The top of power tube
Portion installs radiator, increasing heat radiation area additional, and cold plate is finally connected with the housing of product when mounted.Finally by wind turbine by heat
Amount is seen off.So three kinds of heat transfer, heat radiation and convection current thermaltransmission modes are combined.
Heat is represented according to fundamental formular Q=K × A of heat transfer × △ T/ △ L, wherein Q, K is the heat transfer system of material
Number, △ T represent the temperature difference at both ends, and △ L are then the distances at both ends.Therefore, from formula it can be found that the size of heat transfer is same
The coefficient of heat conduction, hot heat transfer area are directly proportional, and same distance is inversely proportional.So the material for selecting the coefficient of heat conduction high, increase heat pass
It passs area, shorten transmission range, the energy of heat transfer will be higher, also more easily takes away heat.
According to propagation formula Q=E × S × F × △ (Ta-Tb) of heat radiation, wherein Q represents the energy that heat radiation is exchanged
Power, E are the heat emissivity coefficients of body surface.In practice, in the case that object is metal and any surface finish, heat emissivity coefficient
It is smaller, and metal surface carry out anodization and after black, surface emissivity value will be promoted.S is object
Surface area, F are then the angle of radiant heat exchange and the functional relation on surface, and △ (Ta-Tb) is then the temperature of surface a with surface b
Between temperature difference.Therefore all there are proportional relations between the size and temperature of heat emissivity coefficient, body surface area.
The method that the present invention is combined using conduction, convection current, radiation realizes the good heat radiating of on-board power device, makes system
Have many advantages, such as that good thermal diffusivity, work efficiency are high, reliability is high and life cycle is long.
Although the embodiment of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art are not departing from the principle of the present invention and objective
In the case of above-described embodiment can be changed within the scope of the invention, change, replace and modification.
Claims (1)
1. a kind of cooling system of on-board power device, it is characterised in that：Including radiator, cold plate, housing, wind turbine；
Power device is additionally arranged at the bottom heat conductive insulating pad, and passes through cold plate and be installed in PCB printed boards, and when mounted will be cold
Plate is connected with housing, forms heat exchange pattern heat dissipation；The PCB printed boards are single side pad, prevent cold plate from occurring with pad
Short circuit phenomenon；
It installs radiator at the top of power device additional, forms heat radiation mode and radiate；
Wind turbine provides the air-supply that forces perpendicular to PCB printed board installation directions, forms thermal convection heat dissipation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711438827.0A CN108055812B (en) | 2017-12-27 | 2017-12-27 | Heat radiation system of board-mounted power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711438827.0A CN108055812B (en) | 2017-12-27 | 2017-12-27 | Heat radiation system of board-mounted power device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108055812A true CN108055812A (en) | 2018-05-18 |
| CN108055812B CN108055812B (en) | 2019-12-17 |
Family
ID=62128152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711438827.0A Active CN108055812B (en) | 2017-12-27 | 2017-12-27 | Heat radiation system of board-mounted power device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108055812B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2884809Y (en) * | 2006-01-17 | 2007-03-28 | 斯比泰电子（深圳）有限公司 | Radiator of power element |
| CN201894041U (en) * | 2010-12-02 | 2011-07-06 | 保定市金源科技有限公司 | Heat dissipation structure for multi-power device |
| CN202652802U (en) * | 2012-05-11 | 2013-01-02 | 中国电子科技集团公司第十四研究所 | A closed air-cooled chassis |
| CN103021877A (en) * | 2012-12-22 | 2013-04-03 | 中国船舶重工集团公司第七0九研究所 | High-density chip radiating method by dual-path heat transfer |
| CN103687450A (en) * | 2013-12-13 | 2014-03-26 | 陕西宝成航空仪表有限责任公司 | Circuit board heat conduction optimization design structure for onboard aviation product |
| CN106298758A (en) * | 2016-08-26 | 2017-01-04 | 王文杰 | A kind of SMD power device Integrated Solution being applied to electric automobile electric control product |
-
2017
- 2017-12-27 CN CN201711438827.0A patent/CN108055812B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2884809Y (en) * | 2006-01-17 | 2007-03-28 | 斯比泰电子（深圳）有限公司 | Radiator of power element |
| CN201894041U (en) * | 2010-12-02 | 2011-07-06 | 保定市金源科技有限公司 | Heat dissipation structure for multi-power device |
| CN202652802U (en) * | 2012-05-11 | 2013-01-02 | 中国电子科技集团公司第十四研究所 | A closed air-cooled chassis |
| CN103021877A (en) * | 2012-12-22 | 2013-04-03 | 中国船舶重工集团公司第七0九研究所 | High-density chip radiating method by dual-path heat transfer |
| CN103687450A (en) * | 2013-12-13 | 2014-03-26 | 陕西宝成航空仪表有限责任公司 | Circuit board heat conduction optimization design structure for onboard aviation product |
| CN106298758A (en) * | 2016-08-26 | 2017-01-04 | 王文杰 | A kind of SMD power device Integrated Solution being applied to electric automobile electric control product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108055812B (en) | 2019-12-17 |
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