CN108000057A - The manufacture method of target material assembly - Google Patents

Abstract

The invention discloses a manufacturing method of a target assembly, comprising: preparing corresponding back plate powder raw materials according to the material requirements of the back plate; preparing a target slab to be welded, the target slab including a sputtering surface and a welding surface; The backplane powder raw material and the target slab are loaded into the mold in sequence, and the welding surface of the backplane powder raw material and the target slab is in contact; the mold containing the backplane powder raw material and the target slab is put into a vacuum hot-pressing sintering furnace , simultaneously carry out hot-pressing sintering molding of the back plate, and diffusion welding of the target slab and the back plate material to obtain the target component green body; perform shape machining on the obtained target component green body to obtain the target component. The surface of the target component produced by the invention has high flatness, small bending deformation, high welding rate, high density of the back plate, and high component welding yield.

Description

Manufacturing method of target assembly

technical field

The invention relates to a material processing technology, in particular to a manufacturing method of a target component.

Background technique

In the magnetron sputtering process, the target assembly generally consists of a target slab that meets the sputtering requirements and a back plate with a certain strength. Backplane materials usually include Al alloys, Cu alloys, Ti alloys, stainless steel, and Mo alloys. Under the existing magnetron sputtering process conditions, the sputtering surface of the target is bombarded by high-energy particles, the temperature is high, and it is in an ultra-high vacuum of 10 ^-5 ; while the side of the back plate needs to be cooled by a certain pressure of cooling water. , so there is a huge temperature difference and pressure difference on both sides of the target component, and the working conditions of the component are extremely harsh. Therefore, on the one hand, the target and the back plate are required to have high welding quality so that the components have good thermal and electrical conductivity during sputtering; on the other hand, the target components are required to have a certain strength to avoid cracking of the target during sputtering , falling off, affecting the film quality.

The current manufacturing method of the target assembly is as follows: the back plate profile and the target blank to be welded are prepared in advance, the target blank is welded to the back plate by brazing or diffusion welding, and then the target assembly is obtained by machining. The brazing method is limited by the low melting point of solders such as indium and tin, so it is only suitable for low-power sputtering requirements. Diffusion welding can ensure high-strength welding of target components and is suitable for high-power magnetron sputtering. However, due to the different materials and thermal expansion coefficients of the target material and the back plate, the bending deformation of the target component after diffusion welding is large, and the welding yield is low. .

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for manufacturing target components. The manufactured target components have high surface flatness, small bending deformation, high welding rate, high density of the back plate, and high component welding yield.

The technical solution is as follows:

A method of manufacturing a target assembly, comprising:

Prepare the corresponding backplane powder raw materials according to the material requirements of the backplane;

Prepare the target slab to be welded, the target slab includes a sputtering surface and a welding surface;

Put the back plate powder raw material and the target slab into the mold in sequence, and the back plate powder raw material and the welding surface of the target slab are in contact;

Put the mold containing the back plate powder raw material and the target slab into the vacuum hot-pressing sintering furnace, carry out the back plate hot-pressing sintering forming simultaneously, and the target slab and the back plate material diffusion welding to obtain the target component blank;

The target component is obtained by performing shape machining on the obtained target component blank.

Further: the raw material of the backplane powder is Al powder or Cu powder, and the particle size is less than 100 μm.

Further: before the target slab is loaded into the mold, the welding surface of the target slab is pre-sandblasted or machined to improve the roughness of the welding surface.

Further: after the mold is put into the vacuum hot-pressing sintering furnace, it is pre-compacted before sintering and forming, and the compacting pressure is 0.1-5 MPa.

Further: the hot pressing sintering temperature is 500-800° C., the pressure is 20-30 MPa, and the temperature is kept for 2-3 hours.

Compared with the prior art, the technical effects of the present invention include:

(1) The technological process is simplified and the production efficiency is high.

The method of the present invention puts the back plate powder raw material and the target slab to be welded into a vacuum hot-press sintering furnace. Material thermal diffusion welding is carried out simultaneously. Compared with the prior art, the manufacturing process flow of the target component is simplified, and the component manufacturing efficiency is improved.

(2) High welding strength and high welding rate.

The method of the invention makes the back plate contact with the target slab to be welded in powder form, the contact area of the two is large, a diffusion layer is easily formed at the interface, and the welding quality is improved. At the same time, in the process of process implementation, external pressure always exists, and the flow rate of backplane powder is fast, achieving high-strength and high-reliability diffusion welding. The back plate manufactured by the method of the invention has high density and high component welding yield.

(3) The utilization rate of raw materials is high, and the finished product rate of component welding is high. The method of the invention can realize the molding of the backboard material in a near-net size, with less subsequent machining and cutting, and high utilization rate of raw materials. After welding, the component surface has high flatness, small bending deformation, and high welding yield.

Description of drawings

Fig. 1 is a flow chart of the manufacturing method of the target assembly in the present invention.

Detailed ways

The technical solutions of the present invention will be described in detail below with reference to exemplary implementations. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.

As shown in FIG. 1 , it is a flow chart of the manufacturing method of the target assembly in the present invention.

The manufacturing method of the target assembly, the specific steps are as follows:

Step 1: Prepare the corresponding backplane powder raw materials according to the requirements of the backplane material;

The raw material of the backplane powder is Al powder or Cu powder, and the particle size is less than 100 μm.

Step 2: Prepare the target slab to be welded, the target slab includes a sputtering surface and a welding surface;

The welding surface of the target slab to be welded is pre-sand blasted or machined to improve the roughness of the welding surface.

Step 3: Put the backplane powder raw material and the target slab into the mold in sequence, and the backplane powder raw material and the welding surface of the target slab are in contact;

Step 4: Put the mold containing the back plate powder raw material and the target slab into the vacuum hot pressing sintering furnace, carry out the hot pressing sintering of the back plate simultaneously, and diffusion welding the target slab and the back plate material to obtain the target component Body;

After the mold is put into the vacuum hot-pressing sintering furnace, pre-compacting is carried out in advance, and the compacting pressure is 0.1-5 MPa. The hot pressing sintering temperature is 500-800°C, the pressure is 20-30MPa, and the heat preservation and pressure are held for 2-3 hours.

Step 5: Perform shape machining on the obtained target component body to obtain a target component.

Example 1:

The production of a target assembly in which the target material is Cr and the back plate material is Cu includes the following steps:

(1) Material preparation: prepare the Cr target slab and Cu powder to be welded, wherein the particle size of the Cu powder is 75 μm;

(2) Slab treatment: sandblasting the welding surface of the Cr target slab to improve the roughness of the welding surface;

(3) Mold loading: put the Cr target slab and Cu powder into the mold in turn, so that the Cu powder and the welding surface of the Cr target slab are in contact;

(4) Hot pressing sintering, diffusion welding: put the mold with Cr target slab and Cu powder into the vacuum hot pressing sintering furnace, and align the upper and lower pressing heads of the hot pressing furnace with the upper and lower pressing heads of the mould. Carry out pre-compression, and the compaction pressure is 0.5MPa. Close the furnace door and start vacuuming. When the vacuum degree in the hot-press furnace is higher than 1×10 ^-2 Pa, start to heat up. The temperature rises to 800°C, and the pressure is increased to 25MPa. The thermal diffusion welding of the Cr target slab and the Cu back plate material is carried out at the same time as pressing and sintering. Cooling with the furnace to obtain the target component green body with the target material being Cr and the back plate material being Cu;

(5) Machining: machining the shape of the target component body to obtain a target component whose target material is Cr and the back plate material is Cu.

The surface of the target assembly obtained by the above process has high flatness, small bending deformation, and the relative density of the Cu back plate reaches 98.3%. The tensile strength of the component reaches 55MPa, and the welding rate of the component reaches 99.5% as detected by C-Scan.

Example 2:

The production of a target assembly in which the target material is W-Ti alloy and the back plate material is Al includes the following steps:

(1) Material preparation: prepare the W-Ti alloy target slab and Al powder to be welded, wherein the W-Ti alloy composition is W-10wt.% Ti, and the Al powder particle size is 80 μm;

(2) Slab treatment: Machining the welding surface of the W-Ti alloy target slab to improve the roughness of the welding surface;

(3) Mold loading: the W-Ti alloy target slab and the Al powder are loaded into the mold in sequence, so that the welding surface of the Al powder and the W-Ti alloy target slab is in contact;

(4) Hot pressing sintering and diffusion welding: Put the mold with W-Ti alloy target slab and Al powder into the vacuum hot pressing sintering furnace, and align the upper and lower pressure heads of the hot pressing furnace with the upper and lower heads of the mold. The lower pressure head is pre-compressed, and the compaction pressure is 0.1MPa. Close the furnace door and start vacuuming. When the vacuum degree in the hot-press furnace is higher than 1×10 ^-2 Pa, start to heat up. The temperature rises to 500°C, and the pressure is increased to 30MPa. The thermal diffusion welding of the W-Ti alloy target slab and the Al back plate material is carried out while pressing and sintering. Cooling with the furnace to obtain a target component body in which the target material is W-Ti alloy and the back plate material is Al;

(5) Machining: machining the shape of the target assembly body to obtain a target assembly in which the target material is W-Ti alloy and the back plate material is Al.

The surface of the target assembly obtained by the above process has high flatness, small bending deformation, and the relative density of the Al back plate reaches 99.1%. The tensile strength of the component reaches 58MPa, and the welding rate of the component reaches 99.2% as detected by C-Scan.

Example 3:

Making a target assembly whose target material is Co and the back plate material is Al, specifically includes the following steps:

(1) Material preparation: prepare the Co target slab and Al powder to be welded, wherein the particle size of the Al powder is 75 μm;

(2) Slab treatment: Machining the welding surface of the Co target slab to improve the roughness of the welding surface;

(3) mold loading: the Co target slab and the Al powder are sequentially loaded into the mold, so that the Al powder and the welding surface of the Co target slab are in contact;

(4) Hot pressing sintering, diffusion welding: put the mold with Co target slab and Al powder into the vacuum hot pressing sintering furnace, and align the upper and lower pressure heads of the hot pressing furnace with the upper and lower pressure heads of the mold Carry out pre-compression, compaction pressure 5MPa. Close the furnace door and start vacuuming. When the vacuum degree in the hot-press furnace is higher than 1×10 ^-2 Pa, start to heat up. The temperature rises to 500°C, and the pressure is increased to 20MPa. The thermal diffusion welding of the Co target slab and the Al back plate material is carried out while pressing and sintering. Cooling with the furnace to obtain a target component green body whose target material is Co and the back plate material is Al;

(5) Machining: machining the shape of the target component body to obtain a target component whose target material is Co and the back plate material is Al.

The surface of the target assembly obtained by the above process has high flatness, small bending deformation, and the relative density of the Al back plate reaches 98.9%. The tensile strength of the component reaches 53MPa, and the welding rate of the component reaches 99.3% as detected by C-Scan.

The terms used herein are terms of description and illustration, rather than limitation. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above-described embodiments are not limited to any of the foregoing details, but should be construed broadly within the spirit and scope of the appended claims. , all changes and modifications falling within the scope of the claims or their equivalents shall be covered by the appended claims.

Claims (5)

1. a kind of manufacture method of target material assembly, including：

Required to prepare corresponding backboard powder raw material according to backboard material；

Prepare target slab to be welded, target slab includes sputter face and welding surface；

Backboard powder raw material and target slab are sequentially loaded into mould, the welding surface of backboard powder raw material and target slab connects Touch；

Mould equipped with backboard powder raw material and target slab is put into vacuum sintering funace, it is synchronous to carry out backboard hot pressed sintering Shaping, and target slab and back veneer material Diffusion Welding, obtain target material assembly base substrate；

Shape mechanical process is carried out to obtained target material assembly base substrate and obtains target material assembly.

2. the manufacture method of target material assembly as claimed in claim 1, it is characterised in that：Backboard powder raw material is Al powder or Cu powder, Granularity is less than 100 μm.

3. the manufacture method of target material assembly as claimed in claim 1, it is characterised in that：Before target slab loads mould, by target The welding surface of slab carries out sandblasting or mechanical process in advance, improves the roughness of welding surface.

4. the manufacture method of target material assembly as claimed in claim 1, it is characterised in that：After mould is put into vacuum sintering funace, Pre-pressing is first carried out before sinter molding, compaction pressure is 0.1~5MPa.

5. the manufacture method of target material assembly as claimed in claim 1, it is characterised in that：500-800 DEG C of hot pressed sintering temperature, pressure 20~30MPa, when heat-insulation pressure keeping 2~3 is small.