CN107979420B - CXP optical module and optical communication device - Google Patents

Abstract

The invention provides a CXP optical module and an optical communication device, wherein the CXP optical module at least comprises a microcontroller, a laser driving chip, a VCSEL (vertical cavity surface emitting laser) laser, a detector driving chip and a PIN photodetector, the host is connected with the laser driving chip, and the laser driving chip is connected with the VCSEL; the PIN photodetector is connected with the detector driving chip, and the detector driving chip is connected with the host; the host is further connected with the microcontroller through the I2C interface, and the microcontroller is respectively connected with the laser driving chip and the detector driving chip and is used for acquiring working information of the CXP optical module, and the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information. The CXP optical module can avoid signal flocculation and has high transmission rate.

Description

CXP optical modules and optical communication devices

Technical Field

The present invention relates to the field of optical fiber transmission technology, and in particular to a CXP optical module and an optical communication device.

Background technique

Optical modules in the prior art generally include multiple optical fiber channels, and each optical fiber channel is equipped with an independent optical fiber receiver and transmitter. However, the side-by-side arrangement of multiple channels (for example, the side-by-side arrangement of receiving channels and transmitting channels) can easily cause interference with optical fiber signals between different channels, thereby causing signal confusion.

Contents of the invention

The invention provides a CXP optical module and an optical communication device, which can avoid signal confusion and have a high transmission rate.

One aspect of the present invention provides a CXP optical module, which is connected to a host. The CXP optical module at least includes a microcontroller, a laser driver chip, a VCSEL laser, a detector driver chip and a PIN optical detector. The host is connected to the host. The laser driver chip is connected, and the laser driver chip is connected to the VCSEL laser. When the laser driver chip obtains a first electrical signal from the host, the laser driver chip generates a drive signal according to the first electrical signal. , the driving signal is used to drive the VCSEL laser to generate the first optical signal; the PIN light detector is connected to the detector driving chip, and the detector driving chip is connected to the host. When the PIN light detector The detector receives the second optical signal and generates a current according to the second optical signal. The detector driver chip amplifies the current and sends the amplified current to the host; the host further passes the I2C interface Connected to the microcontroller, the microcontroller is connected to the laser driver chip and the detector driver chip respectively, and is used to obtain the working information of the CXP optical module. The host passes the The microcontroller controls the laser driver chip and the detector driver chip.

Wherein, the CXP includes a first PCB board and a second PCB board, the microcontroller, the laser driver chip and the VCSEL laser are arranged on the first PCB board, the detector driver chip and the The PIN photodetector is arranged on the second PCB board.

Wherein, the microcontroller, the laser driving chip and the VCSEL laser are arranged on the first PCB board with an accuracy of ±2 μm, and the detector driving chip and the PIN photodetector are arranged on the second PCB board. The accuracy of the PCB board is ±2μm.

Wherein, the laser driver chip includes a cascaded input buffer circuit, a differential amplifier circuit, a source follower stage circuit and a current switch stage circuit. The input buffer circuit is used for impedance matching and biasing the first electrical signal.

The detector driving chip includes a cascaded transimpedance amplifier and a linear amplifier, the transimpedance amplifier is used to amplify the current, and the linear amplifier converts the amplified current into a differential signal and sends it to the host.

Another aspect of the present invention provides an optical communication device, which includes a host and a CXP optical module. The CXP optical module is connected to the host. The CXP optical module at least includes a microcontroller, a laser driver chip, a VCSEL laser, and a detector. Driving chip and PIN light detector, the host is connected to the laser driving chip, the laser driving chip is connected to the VCSEL laser, when the laser driving chip obtains the first electrical signal from the host, the The laser driving chip generates a driving signal according to the first electrical signal, and the driving signal is used to drive the VCSEL laser to generate a first optical signal; the PIN light detector is connected to the detector driving chip, and the detector The driver chip is connected to the host. When the PIN light detector receives the second optical signal and generates a current according to the second optical signal, the detector driver chip amplifies the current and generates the amplified current. Sent to the host; the host is further connected to the microcontroller through an I2C interface, and the microcontroller is connected to the laser driver chip and the detector driver chip respectively for obtaining the CXP optical module The host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information.

Wherein, the CXP includes a first PCB board and a second PCB board, the microcontroller, the laser driver chip and the VCSEL laser are arranged on the first PCB board, the detector driver chip and the The PIN photodetector is arranged on the second PCB board.

Wherein, the microcontroller, the laser driving chip and the VCSEL laser are arranged on the first PCB board with an accuracy of ±2 μm, and the detector driving chip and the PIN photodetector are arranged on the second PCB board. The accuracy of the PCB board is ±2μm.

Wherein, the laser driver chip includes a cascaded input buffer circuit, a differential amplifier circuit, a source follower stage circuit and a current switch stage circuit. The input buffer circuit is used for impedance matching and biasing the first electrical signal.

Wherein, the detector driving chip includes a cascaded transimpedance amplifier and a linear amplifier. The transimpedance amplifier is used to amplify the current. The linear amplifier converts the amplified current into a differential signal and sends it to the host.

Through the above scheme, the beneficial effect of the present invention is: different from the prior art, the CXP optical module of the present invention is provided with a microcontroller, a laser driver chip, a VCSEL laser, a detector driver chip and a PIN optical detector, generates a first optical signal through the laser driver chip and the VCSEL laser, and receives a second optical signal through the detector driver chip and the PIN optical detector, which can avoid signal confusion and has a fast transmission rate.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without exerting creative efforts. in:

Figure 1 is a schematic structural diagram of a CXP optical module according to the first embodiment of the present invention;

Figure 2 is a schematic structural diagram of a CXP optical module according to the second embodiment of the present invention;

Figure 3 is a schematic structural diagram of the laser driver chip in the CXP optical module according to the third embodiment of the present invention;

Figure 4 is a schematic structural diagram of the detector driver chip in the CXP optical module according to the third embodiment of the present invention;

Figure 5 is a schematic structural diagram of an optical communication device according to the first embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without any creative efforts fall within the scope of protection of the present invention.

Please refer to Figure 1, which is a schematic structural diagram of a CXP optical module according to the first embodiment of the present invention. The CXP optical module 10 disclosed in this embodiment is connected to the host 20. The CXP optical module 10 at least includes a microcontroller 11, a laser driver chip 12, a VCSEL (Vertical Cavity Surface Emitting Laser, vertical cavity surface emitting laser) laser 13, and a detector. Driver chip 14 and PIN light detector 15.

As shown in FIG. 1 , the CXP optical module 10 further includes a first interface 16, a second interface 17 and a fiber optic interface 31. The CXP optical module 10 is connected to the host 20 via the first interface 16 and the second interface 17. The CXP optical module 10 is connected to the optical fiber 30 via the fiber optic interface 31, which is a multi-channel parallel fiber optic interface.

The host 20 is connected to the laser driver chip 12, and the laser driver chip 12 is connected to the VCSEL laser 13, that is, the host 20 is connected to the laser driver chip 12 through the first interface 16, and the VCSEL laser 13 is connected to the optical fiber 30 through the optical fiber interface 31. The PIN optical detector 15 is connected to the detector driver chip 14, and the detector driver chip 14 is connected to the host 20, that is, the PIN optical detector 15 is connected to the optical fiber 30 through the optical fiber interface 31, and the detector driver chip 14 is connected to the host 20 through the second interface 17.

When the CXP optical module 10 emits the first optical signal to the optical fiber 30 , that is, when the laser driver chip 12 obtains the first electrical signal from the host 20 through the first interface 16 , the laser driver chip 12 generates a driving signal according to the first electrical signal. The driving signal It is used to drive the VCSEL laser 13 to generate a first optical signal, and the first optical signal is transmitted to the optical fiber 30 through the optical fiber interface 31 .

When the CXP optical module 10 receives the second optical signal from the optical fiber 30 , that is, when the PIN optical detector 15 receives the second optical signal from the optical fiber 30 through the optical fiber interface 31 , the PIN optical detector 15 generates a current according to the second optical signal, and the detector The driver chip 14 is used to amplify the current and send the amplified current to the host 30 .

Among them, the host 20 is further connected to the microcontroller 11 through the I2C interface 21, and the microcontroller 11 is connected to the laser driver chip 12 and the detector driver chip 14 respectively. The microcontroller 11 is used to obtain the working information of the CXP optical module 10 , that is, the microcontroller 11 is used to obtain the working status of the laser driving chip 12 and the working status of the detector driving chip 14 . The host 20 controls the laser driver chip 12 and the detector driver chip 14 through the microcontroller 11 according to the working information.

The CXP optical module 10 in this embodiment is provided with a microcontroller 11, a laser driver chip 12, a VCSEL laser 13, a detector driver chip 14 and a PIN photodetector 15, and generates a first optical signal through the laser driver chip 12 and the VCSEL laser 13. By receiving the second optical signal through the detector driving chip 14 and the PIN light detector 15, signal confusion can be avoided. In addition, the CXP optical module 10 of this embodiment can simultaneously receive or transmit 12 signals, and the transmission rate of each signal can be 10Gbps, which is a fast transmission rate. In addition, the CXP optical module 10 of this embodiment adopts integrated chip technology, which can simplify circuit complexity and save space.

The present invention further provides a CXP optical module of a second embodiment, which is described based on the CXP optical module 10 of the first embodiment. As shown in Figure 2, the CXP optical module 10 of this embodiment further includes a first PCB board 18 and a second PCB board 19, where the microcontroller 11, the laser driver chip 12 and the VCSEL laser 13 are arranged on the first PCB board 18 , the detector driving chip 14 and the PIN light detector 15 are arranged on the second PCB board 19, and the detector driving chip 14 is connected to the microcontroller 11 through the flexible circuit board FPC.

When the microcontroller 11, the laser driver chip 12 and the VCSEL laser 13 are arranged on the first PCB board 18, the laser driver chip 12 and the VCSEL laser 13 are arranged on the first PCB board 18 with an accuracy of ±2 μm; when the detector driver chip When 14 and PIN light detector 15 are set on the second PCB board 19, the detector driving chip 14 and PIN light detector 15 are set on the second PCB board 19 with an accuracy of ±2 μm, thereby improving the performance of the CXP optical module 10 and saving money. PCB area and reduce costs.

The present invention further provides a CXP optical module of a third embodiment, which is described based on the CXP optical module 10 of the first embodiment. As shown in Figure 3, the laser driver chip 12 includes a cascaded input buffer circuit 121, a differential amplifier circuit 122, a source follower stage circuit 123 and a current switching stage circuit 124, where the input buffer circuit 121 is used for impedance matching and biasing. An electrical signal, that is, the input buffer circuit 121 biases the DC level of the first electrical signal input by the host 20 . The impedance matching of the input buffer circuit 121 is used to reduce the reflection caused by the first electrical signal reaching the laser driver chip 12, and the input buffer circuit 121 further adjusts the first electrical signal to a preset operating range. The differential amplification circuit 122 may be a triode or a CMOS differential amplification circuit, and is used to amplify the first electrical signal and print common mode interference. The source follower circuit 123 is used to change the output impedance. Since the output impedance of the source follower circuit 123 is very small, it has extremely strong load capacity. The current switching stage circuit 124 may be a symmetrical differential circuit, used to provide differential modulation current for the VCSEL laser 13 .

As shown in Figure 4, the detector driver chip 14 includes a cascaded transimpedance amplifier 141 and a linear amplifier 142. The transimpedance amplifier 141 is used to amplify the current, so that the amplified current can drive the linear amplifier 142; the linear amplifier 142 will amplify the current. The resulting current is converted into a differential signal and sent to the host 20.

The present invention further provides an optical communication device 50. As shown in Figure 5, the optical communication device 50 includes a host 51, a CXP optical module 52 and an optical fiber 53. The host 51 is connected to the optical fiber 53 through the CXP optical module 52. The CXP optical module 52 represents the CXP optical module 10 disclosed in the above embodiment, which will not be described again.

In summary, the CXP optical module of the present invention is provided with a microcontroller, a laser driver chip, a VCSEL laser, a detector driver chip and a PIN optical detector, and generates a first optical signal through the laser driver chip and the VCSEL laser, and receives a second optical signal through the detector driver chip and the PIN optical detector, which can avoid signal confusion. In addition, the CXP optical module of the present invention can simultaneously realize 12 channels of receiving or transmitting signals, and the transmission rate of each signal can be 10Gbps, and the transmission rate is fast. In addition, the CXP optical module of the present invention adopts integrated chip technology, which can simplify the complexity of the circuit and save space.

The above are only examples of the present invention, and do not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the description and drawings of the present invention, or directly or indirectly applied to other related technologies fields are equally included in the scope of patent protection of the present invention.

Claims (10)

1. A CXP optical module, characterized in that the CXP optical module is connected to a host, the CXP optical module is connected to an optical fiber, and the CXP optical module at least includes a microcontroller, a laser driver chip, a VCSEL laser, and a detector Driving chip and PIN light detector, the host is connected to the laser driving chip, the laser driving chip is connected to the VCSEL laser, when the laser driving chip obtains the first electrical signal from the host, the The laser driving chip generates a driving signal according to the first electrical signal, and the driving signal is used to drive the VCSEL laser to generate a first optical signal; the PIN light detector is connected to the detector driving chip, and the detector The driver chip is connected to the host. When the PIN light detector receives the second optical signal and generates a current according to the second optical signal, the detector driver chip amplifies the current and generates the amplified current. Sent to the host; the host is further connected to the microcontroller through an I2C interface, and the microcontroller is connected to the laser driver chip and the detector driver chip respectively for obtaining the CXP optical module The working information, the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information; The CXP optical module also includes a first interface, a second interface and an optical fiber interface. The CXP optical module is connected to the host through the first interface and the second interface. The CXP optical module passes through the optical fiber. The interface is connected to the optical fiber, and the optical fiber interface is a multi-channel parallel optical fiber interface. 2. The CXP optical module according to claim 1, characterized in that the CXP includes a first PCB board and a second PCB board, and the microcontroller, the laser driver chip and the VCSEL laser are arranged on the On the first PCB board, the detector driving chip and the PIN light detector are arranged on the second PCB board. 3. The CXP optical module according to claim 2 is characterized in that the microcontroller, the laser driver chip and the VCSEL laser are arranged on the first PCB board with an accuracy of ±2μm, and the detector driver chip and the PIN optical detector are arranged on the second PCB board with an accuracy of ±2μm. 4. The CXP optical module according to claim 1, characterized in that the laser driver chip comprises a cascaded input buffer circuit, a differential amplifier circuit, a source follower stage circuit and a current switch stage circuit, and the input buffer circuit is used for impedance matching and biasing the first electrical signal. 5. The CXP optical module according to claim 4, wherein the detector driving chip includes a cascaded transimpedance amplifier and a linear amplifier, the transimpedance amplifier is used to amplify the current, and the linear amplifier The amplified current is converted into a differential signal and sent to the host. 6. An optical communication device, characterized in that the optical communication device includes a host and a CXP optical module. The CXP optical module is connected to the host. The CXP optical module at least includes a microcontroller, a laser driver chip, and a VCSEL laser. , detector driving chip and PIN light detector, the host is connected to the laser driving chip, the laser driving chip is connected to the VCSEL laser, when the laser driving chip obtains the first electrical signal from the host , the laser driving chip generates a driving signal according to the first electrical signal, and the driving signal is used to drive the VCSEL laser to generate a first optical signal; the PIN light detector is connected to the detector driving chip, so The detector driving chip is connected to the host. When the PIN light detector receives a second optical signal and generates a current according to the second optical signal, the detector driving chip amplifies the current and amplifies the current. The resulting current is sent to the host; the host is further connected to the microcontroller through an I2C interface, and the microcontroller is connected to the laser driver chip and the detector driver chip respectively for obtaining the The working information of the CXP optical module, the host controls the laser driving chip and the detector driving chip through the microcontroller according to the working information; The CXP optical module also includes a first interface, a second interface and an optical fiber interface. The CXP optical module is connected to the host through the first interface and the second interface. The CXP optical module passes through the optical fiber. The interface is connected to the optical fiber, and the optical fiber interface is a multi-channel parallel optical fiber interface. 7. The optical communication device according to claim 6, wherein the CXP includes a first PCB board and a second PCB board, and the microcontroller, the laser driver chip and the VCSEL laser are disposed on the On the first PCB board, the detector driving chip and the PIN light detector are arranged on the second PCB board. 8. The optical communication device according to claim 7, wherein the microcontroller, the laser driver chip and the VCSEL laser are arranged on the first PCB with an accuracy of ±2 μm. The detector driving chip and the PIN light detector are arranged on the second PCB board with an accuracy of ±2 μm. 9. The optical communication device according to claim 6, wherein the laser driver chip includes a cascaded input buffer circuit, a differential amplifier circuit, a source follower circuit and a current switch circuit, and the input buffer circuit for impedance matching and biasing the first electrical signal. 10. The optical communication device according to claim 9, wherein the detector driving chip includes a cascaded transimpedance amplifier and a linear amplifier, the transimpedance amplifier is used to amplify the current, and the linear amplifier The amplified current is converted into a differential signal and sent to the host.