CN107946900B - Semiconductor laser module - Google Patents

Abstract

The embodiment of the invention provides a novel semiconductor laser module, which comprises: at least one semiconductor laser unit, each semiconductor laser unit including a plurality of semiconductor lasers, a plug connector, and a heat sink that dissipates heat for the plurality of semiconductor lasers; the semiconductor laser comprises a heat sink, a plurality of semiconductor lasers, a plurality of light source modules and a plurality of light source modules, wherein the heat sink is provided with a plurality of open slots on the inner wall; the plug connector is used for fixing the semiconductor laser and the heat sink by being inserted into the open slot. The semiconductor laser module provided by the invention can effectively improve the positioning precision, is simple to assemble and is easy to operate.

Description

A semiconductor laser module

Technical field

The present invention relates to the field of semiconductor lasers, and in particular to a new type of semiconductor laser module that can be used in pumping and other fields.

Background technique

Semiconductor lasers have the advantages of small size, light weight, high reliability, and long service life. They have been widely used in various fields of the national economy, such as being used as pump sources for pumping solid lasers. In the application of semiconductor lasers as side pump sources, existing side pump modules often use semiconductor lasers distributed around the crystal rod in the form of regular triangles, regular pentagons, regular heptagons, etc., and use heat sinks to dissipate heat for the semiconductor lasers and crystal rods. .

At present, the refrigeration solutions for the above modules mostly use multiple sets of water channels on the main body of the heat sink, and the cooling medium is passed into the water channels to cool the modules, as shown in Figure 1. However, there are some disadvantages in this method, such as: the design of the water channel introduces too many sealing rings, which makes the assembly complicated; each laser on each ring module is fixed by external screws, resulting in a large number of external screws of the ring module, and the screws The protruding parts affect the overall appearance; the connecting electrodes and the lead-out electrodes need to be wrapped with insulating tape to prevent short circuits, resulting in the introduction of too much insulating tape; when assembling multiple rings, the water channels on each ring module need to be aligned one by one, and the positioning requirements are relatively high. high.

Contents of the invention

In view of the above technical problems, one of the main purposes of the embodiments of the present invention is to provide a new type of semiconductor laser module, which can realize at least three functions of each semiconductor laser, connecting electrode and heat sink by designing a new type of connector. The limit between the modules is fixed, and the refrigeration part of the module is set outside the semiconductor laser unit, which solves the problem of difficulty in precise positioning of the traditional solution. It is simple to assemble and easy to operate, and has great application prospects and market prospects.

The technical solution of the present invention is implemented as follows:

Embodiments of the present invention provide a semiconductor laser module, the module including: at least one semiconductor laser unit, each semiconductor laser unit including a plurality of semiconductor lasers, connectors, and a heat sink for dissipating heat for the plurality of semiconductor lasers; Wherein, a plurality of opening grooves are provided on the inner wall of the heat sink, and a plurality of semiconductor lasers are respectively bonded to the inner wall of the heat sink between adjacent opening grooves; the plug-in connector is used to realize the operation by inserting into the opening grooves. Fixation between semiconductor laser and heat sink.

In the above scheme, the plug connector is made of elastic material that is fully insulated or partially insulated; wherein, when the plug connector is partially insulated, a conductive part is provided on the surface or inside of the plug connector for communicating with the phase. Adjacent semiconductor lasers are in contact to realize electrical connection between adjacent semiconductor lasers; when the plug connector is fully insulated, the module also includes a connection electrode with a through hole for connecting with the adjacent semiconductor lasers. Contact to achieve electrical connection between adjacent semiconductor lasers.

In the above solution, the plug-in connector includes: a planar part and a plug-in part; the plug-in part includes: at least one hook-shaped plug connector extending from the lower surface of the planar part.

In the above solution, the opening groove on the inner wall of the heat sink includes: an opening part and a base part; wherein, the inner diameter of the base part is larger than the inner diameter of the opening part, and the plug connector is inserted into the through hole on the connecting electrode. The base portion of the open slot.

In the above solution, the outer diameter of the plug connector is larger than the inner diameter of the opening portion of the opening slot, so that the hook-shaped plug connector snaps into the side wall of the base portion of the opening slot to achieve snap-fitting fixation between the plug connector and the heat sink.

In the above solution, the outer diameter of the planar part of the plug connector is larger than the inner diameter of the through hole of the connecting electrode, which is used to realize the position-limiting fixation between the plug connector, the semiconductor laser and the connecting electrode.

In the above solution, the module further includes: at least two refrigeration blocks arranged outside the semiconductor laser unit; wherein, the inner surface of the refrigeration block is provided with a slot that matches the shape of the heat sink for realizing the connection between the heat sink and the heat sink. Fixing between refrigeration blocks; a plurality of liquid holes are provided on the main body of the refrigeration block, and the positions of the liquid holes correspond to the positions of each semiconductor laser.

In the above solution, the refrigeration block also has screw holes for fixing each refrigeration block and each semiconductor laser unit through screws.

In the above solution, the heat sink includes: an annular heat sink or a polygonal heat sink, and the laser beams emitted by the plurality of semiconductor lasers are converged at the center of the annular heat sink or the polygonal heat sink.

In the above solution, the module further includes a lead-out electrode, which is disposed inside the semiconductor laser unit and used to lead the electrode of the semiconductor laser unit to the outside.

The beneficial technical effects of the technical solution of the present invention are as follows:

1. The design of connectors and related structures enables the fixed connection of at least three semiconductor lasers, connecting electrodes and heat sinks within the semiconductor laser unit. The fixing effect is better, and assembly is more convenient. It has Higher operability.

2. The refrigeration waterway is set on the refrigeration block outside each semiconductor laser unit, making each semiconductor laser unit independent of each other and not interfering with each other. It can be directly clamped and assembled during assembly, which completely solves the problem of the refrigeration waterway being located on the heat sink in the traditional solution. When assembling each ring, problems such as too many sealing rings and difficulty in positioning and aligning each water channel are introduced.

3. The extraction electrode is directly extracted from the inside of the semiconductor laser unit without positioning. It solves the positioning problem caused by the external connection block of the extraction electrode in the traditional solution and the problem of introducing too much insulating tape. It is simple and convenient, and has higher practicability.

Description of the drawings

Figure 1 is a schematic structural diagram of a semiconductor laser module in the prior art;

Figure 2 is a schematic three-dimensional structural diagram of the refrigeration block of the present invention;

Figure 3 is a schematic three-dimensional structural diagram of the semiconductor laser module of the present invention;

Figure 4 is a partial structural schematic diagram of the semiconductor laser unit of the present invention;

Figure 5 is a schematic structural diagram of the connector and heat sink limit fixation of the present invention;

Figure 6 is another partial structural diagram of the semiconductor laser unit of the present invention.

Explanation of reference numbers: 1 is a semiconductor laser unit, 11 is a semiconductor laser, 111 is a semiconductor laser chip, 112 is a substrate, 12 is a connector, 121 is a plane part, 122 is a connector part, 13 is a heat sink, 131 It is the installation platform, 14 is the opening slot, 141 is the opening part, 142 is the base part, 15 is the connecting electrode, 151 is the through hole, 16 is the cooling block, and 161 is the liquid hole.

Detailed ways

The following embodiments of the present invention provide a new type of semiconductor laser module. The main idea is: by designing a new type of plug connector, the semiconductor laser unit, the connection electrode, the heat sink, etc. are realized within the semiconductor laser unit. The limit is fixed, and the refrigeration water path is set on the refrigeration block outside the semiconductor laser unit. The refrigeration efficiency is high and the assembly is simple.

The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

In the embodiment of the present invention, each semiconductor laser module may include at least one semiconductor laser unit 1. FIG. 4 is a partial structural diagram of the semiconductor laser unit of the present invention. As shown in FIG. 4 , each semiconductor laser unit may include: a plurality of semiconductor lasers 11 , a plug connector 12 , and a heat sink 13 for dissipating heat from the plurality of semiconductor lasers.

Here, the heat sink 13 may include but is not limited to: a circular heat sink or a polygonal heat sink. The circular ring is not necessarily a perfect circle, and may also be a non-perfect circle; the polygon may include a triangle, a quadrilateral, or a polygonal heat sink. Pentagon and so on. Preferably, the heat sink 13 is a regular annular heat sink or a regular polygonal heat sink. The plurality of semiconductor lasers can be specifically bonded to the inner wall of the annular heat sink or the polygonal heat sink, and the laser beams emitted by them are converged at the center of the annular heat sink or the polygonal heat sink. Figures of the present invention The specific embodiment is described by taking the heat sink 13 as a perfect circular annular heat sink as an example. Based on the above, we can know that one of the main applications of the semiconductor laser module of the present invention can be used as a side pump source of a fixed laser. The gain medium (such as a crystal rod) of a solid laser can be arranged in a circular heat sink or a polygon. The center of the heat sink.

The semiconductor laser 11 may at least include but is not limited to: a laser chip and a substrate; the laser chip may be an edge-emitting semiconductor laser chip, and in some embodiments, it may also be a vertical cavity surface-emitting semiconductor laser chip. ; The laser chip is bonded to the substrate, and the substrate has a thermal expansion coefficient that matches the laser chip.

Specifically, a plurality of opening slots 14 can be provided on the inner wall of the heat sink, and a plurality of semiconductor lasers 11 are respectively bonded to the inner wall of the heat sink between adjacent opening slots; the plug connector 12 is used to insert the In the opening groove 14, the semiconductor laser 11 and the heat sink 13 are fixed.

In the above solution, the plug connector 12 is made of insulating or partially insulating elastic material, such as PEEK (polyetheretherketone). When the plug connector is partially insulated, a conductive part is provided on the surface or inside of the plug connector for contacting adjacent semiconductor lasers to achieve electrical connection between adjacent semiconductor lasers; partially insulated The main consideration of the plug-in connector is that when the plug-in connector realizes the function of fixing the position, it can also be used as a connecting electrode at the same time, so that the electrical connection between the semiconductor lasers can be achieved without introducing a connecting electrode. The conductive function of the plug connector 12 can be realized by selectively coating a conductive layer on the surface of the plug connector, or by providing a conductive channel inside, or other methods.

Specifically, the plug connector 12 may include a planar part 121 and a plug-in part 122; here, the consideration of selecting an elastic material for the plug connector 12 is that the elastic material can produce a certain elastic deformation. When inserted into the open slot 14, it can be inserted with a certain amount of deformation (shrinkage), and the deformation amount can be restored to a certain extent after insertion, for example, restored to the original state. The recovery of the deformation amount can be the plug connector. Fixed stops in open slots provide assurance.

In the above solution, the plug portion 122 may include: at least one hook-shaped plug connector extending from the lower surface of the planar portion 121 . In the embodiment of the present invention, the number of the plug connectors is two. The plug connector 12 may be an integral injection molded part, or the flat part 121 and the plug part 122 may be separately formed and then fixed together using mechanical fixing or chemical bonding.

Further, when the plug connector is made of all insulated elastic materials, the module may also include: a connecting electrode 15 with a through hole, the connecting electrode 15 is used to contact the adjacent semiconductor laser to achieve mutual communication. As for the electrical connection between the adjacent semiconductor lasers 11, the embodiment of the present invention takes as an example that the plug connector is made of a fully insulated elastic material.

FIG. 5 is a schematic structural diagram of the connector and the heat sink limiting and fixing of the present invention. FIG. 6 is another partial structural schematic diagram of the semiconductor laser unit of the present invention. As shown in Figures 5 and 6, in the above solution, the opening groove 14 opened on the inner wall of the heat sink 13 may have an opening part 141 and a base part 142, and the inner diameter of the base part 142 is larger than the inner diameter of the opening part 141, The inner diameters of the base portion 142 and the opening portion 141 here refer to the lengths of the two in the same direction.

The plug connector can be inserted into the base portion 142 of the opening slot 14 through the through hole 151 on the connecting electrode 15. Since the plug portion 122 is a hook-shaped plug connector, the hook-shaped plug connector can It is clamped on the side wall of the base part 142 to realize the clamping and fixation of the plug-in part 12 and the heat sink 13 .

Specifically, in order to ensure that the plug portion 122 is firmly plugged into the base portion 142, in practical applications, the outer diameter of the plug connector should be larger than the inner diameter of the opening portion 141. Here, the outer diameter of the plug connector is Refers to: the overall length of all the plug connectors of the plug connector in a certain direction; the inner diameter of the opening portion 141 refers to: the length of the opening portion 141 in the same direction.

Since the plug connector 12 is made of elastic material, when the outer diameter of the plug connector is larger than the inner diameter of the opening 141 , the plug connector can be inserted into the opening groove 14 through the opening 141 with a certain amount of elastic deformation. , this elastic deformation amount will recover to a certain extent after the plug connector is inserted into the opening slot 14, and based on the above, the inner diameter of the base portion 142 is larger than the inner diameter of the opening portion 141, so that the hook-shaped plug connector can snap after being inserted into the base portion 142 on the side wall of the base portion 142 and will not detach from the opening portion 141 , thereby realizing the snap-fitting of the plug connector 12 and the heat sink 13 .

Furthermore, for the plug connector 12, since its plug connector can be inserted into the opening slot 14 through the through hole 151 on the connecting electrode 15, the outer diameter of the planar portion 121 of the plug connector is also It should be larger than the inner diameter of the through hole 151 of the connecting electrode 15 to ensure that the flat part 121 of the plug connector will not separate from the through hole 151 of the connecting electrode and ensure the fixing quality. The outer diameter of the planar portion 121 here refers to the length of the planar portion 121 in a certain direction, and the inner diameter of the through hole 151 refers to the diameter of the through hole in the same direction. In this way, since the plug connector 12 and the connection electrode 15 are both fixed, and the connection electrode 15 is connected to the adjacent semiconductor laser 11, the position limiting fixation between the plug connector 12, the semiconductor laser 11, and the connection electrode 15 can be achieved. .

In addition, a mounting platform 131 is provided on the inner wall of the heat sink 13 in the embodiment of the present invention. The mounting platform 131 is disposed between adjacent open slots. The mounting platform 131 can be used for bonding semiconductor lasers, as shown in Figure 6 , Figure 6 only shows part of the semiconductor laser, connecting electrodes and connectors, and the parts not shown are similar to the parts shown.

Considering how to improve positioning accuracy and facilitate installation, the heat sink 13 included in the above semiconductor laser unit is not provided with a cooling water path, but is provided with a cooling water path outside the semiconductor laser unit.

Furthermore, the above-mentioned semiconductor laser module may also include at least two cooling blocks 16 arranged outside the semiconductor laser unit. Figure 2 is a schematic three-dimensional structural diagram of the refrigeration block of the present invention. Figure 3 is a schematic three-dimensional structural diagram of the semiconductor laser module of the present invention, as shown in Figures 2 and 3. In the embodiment of the present invention, the number of the refrigeration blocks 16 is 2. Note that the inner surface of the refrigeration block 16 is provided with a slot (not shown in the figure) that matches the shape of the heat sink. When multiple semiconductor laser units are assembled, each semiconductor laser unit can be corresponding to the corresponding The card slot is used to fix the heat sink and refrigeration block.

Furthermore, a high thermal conductivity layer, such as an indium film layer, can be provided at the slot of the refrigeration block 16, which is mainly used to realize heat exchange between the heat sink 13 and the refrigeration block 16 to improve the efficiency between the refrigeration block 16 and the semiconductor laser unit. thermal conductivity efficiency.

Specifically, the refrigeration method of the refrigeration block 16 may include: conduction refrigeration type and liquid refrigeration type. When the refrigeration method is the conduction refrigeration type, the refrigeration block is made of high thermal conductivity materials, such as copper and other high-temperature materials. Thermal conductive metal and/or non-metallic materials; when the refrigeration method is a liquid refrigeration type, the main body of the refrigeration block is provided with a plurality of liquid holes; in the embodiment of the present invention, the refrigeration method is a liquid refrigeration type as an example Give examples.

As shown in Figures 2 and 3, a plurality of liquid holes 161 can be provided on the main body of the refrigeration block. Preferably, in order to achieve a more efficient cooling effect, the positions of the liquid holes can be consistent with the positions of each semiconductor laser. Corresponding. The form of the liquid through hole 161 may include but is not limited to: fin shape, micro through hole array and other forms.

In addition, the refrigeration block also has screw holes (not shown in the figure), and each refrigeration block and each semiconductor laser unit can be fixed by screws. As shown in Figure 3, in the embodiment of the present invention, each semiconductor laser unit is located in the central cavity area formed by two refrigeration blocks 16, and the screws can be screwed into the screw holes of the two refrigeration blocks 16, thus achieving To fix the cooling block and each semiconductor laser unit together.

The above-mentioned solution of the present invention arranges the refrigeration waterway outside the heat sink, that is, the refrigeration waterway is designed to be separated from the heat sink. The structural design of the separated refrigeration waterway ensures that there is no water channel structure on the main body of the heat sink of the semiconductor laser unit. In this way, when multiple groups When assembling the semiconductor laser unit, just clamp it directly into the corresponding card slot. Each semiconductor laser unit is independent of each other, has no interference, and is easy to assemble and disassemble. Moreover, since the semiconductor laser units are independent of each other, there can be a certain misalignment between the semiconductor laser units during assembly to achieve an angular arrangement of the semiconductor laser units.

The module also includes a lead-out electrode. The lead-out electrode is arranged inside the semiconductor laser unit and is used to lead the electrode of the semiconductor laser unit to the outside. Specifically, it can be led to the outside through the heat sink, that is, the lead-out electrode is formed by Directly drawn out from inside the semiconductor laser unit. In order to avoid short circuit, a partial insulating layer can be set on the surface of the lead electrode to insulate it from the heat sink in the lead out path. This electrode lead out method does not require positioning, which solves the positioning problems caused by the external connection block in the lead electrode in the traditional solution. It is convenient and practical to introduce the problem of too much insulating tape.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and variations of the present invention may occur to those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims (8)

1. A semiconductor laser module, characterized in that the module comprises at least one semiconductor laser unit, each semiconductor laser unit comprises a plurality of semiconductor lasers, a plug connector and a heat sink for radiating the semiconductor lasers, wherein a plurality of open slots are formed in the inner wall of the heat sink, and the semiconductor lasers are respectively bonded to the inner wall of the heat sink between the adjacent open slots; the plug connector is used for realizing the fixation between the plurality of semiconductor lasers and the heat sink through inserting into the open slot, and is made of elastic materials which are all insulated or partially insulated, wherein when the plug connector is partially insulated, the surface or the inside of the plug connector is provided with a conductive part which is used for being in contact with the adjacent semiconductor lasers to realize the electric connection between the adjacent semiconductor lasers, and when the plug connector is all insulated, the module further comprises a connecting electrode with a through hole which is used for being in contact with the adjacent semiconductor lasers to realize the electric connection between the adjacent semiconductor lasers, and the plug connector comprises: a planar portion and a plug portion including at least one hooked plug extending from a lower surface of the planar portion.

2. The module of claim 1, wherein the open slot on the inner wall of the heat sink comprises: an opening portion, and a base portion; wherein the inner diameter of the base part is larger than that of the opening part, and the plug is inserted into the base part of the opening groove through the through hole on the connecting electrode.

3. The module of claim 2, wherein the plug has an outer diameter greater than an inner diameter of the open portion of the open slot such that the hooked plug engages the sidewall of the base portion of the open slot to effect a snap-fit attachment of the plug to the heat sink.

4. The module according to claim 1, wherein the planar portion of the plug has an outer diameter larger than an inner diameter of the through hole of the connection electrode for achieving a spacing fixation between the plug and the semiconductor laser, the connection electrode.

5. The module of claim 1, wherein the module further comprises: at least two refrigerating blocks arranged outside the semiconductor laser unit; the inner surface of the refrigerating block is provided with a clamping groove matched with the shape of the heat sink, and the clamping groove is used for fixing the heat sink and the refrigerating block; the refrigerating block body is provided with a plurality of liquid through holes, and the positions of the liquid through holes correspond to the positions of the semiconductor lasers.

6. The module of claim 5, wherein the cooling blocks further have screw holes for securing each cooling block to each semiconductor laser unit by screws.

7. The module of any one of claims 1 to 6, wherein the heat sink comprises: and the laser beams emitted by the semiconductor lasers are converged at the center of the annular heat sink or the polygonal heat sink.

8. The module according to claim 7, further comprising an extraction electrode provided inside the semiconductor laser unit for guiding the electrodes of the semiconductor laser unit to the outside.