CN107908084A - A kind of new-type inorganic environmental protection moves back film liquid - Google Patents
A kind of new-type inorganic environmental protection moves back film liquid Download PDFInfo
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- CN107908084A CN107908084A CN201711165820.6A CN201711165820A CN107908084A CN 107908084 A CN107908084 A CN 107908084A CN 201711165820 A CN201711165820 A CN 201711165820A CN 107908084 A CN107908084 A CN 107908084A
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- back film
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- environmental protection
- moves back
- film liquid
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- 239000007788 liquid Substances 0.000 title claims abstract description 89
- 230000007613 environmental effect Effects 0.000 title claims abstract description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000002699 waste material Substances 0.000 claims abstract description 17
- 239000003513 alkali Substances 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229940123973 Oxygen scavenger Drugs 0.000 claims abstract description 11
- 150000003851 azoles Chemical class 0.000 claims abstract description 11
- 230000000536 complexating effect Effects 0.000 claims abstract description 11
- 238000007747 plating Methods 0.000 claims abstract description 11
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical compound [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229940125904 compound 1 Drugs 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 5
- 239000012964 benzotriazole Substances 0.000 claims description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical class NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000012752 auxiliary agent Substances 0.000 claims description 3
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims description 3
- 150000002484 inorganic compounds Chemical class 0.000 claims description 3
- 229910010272 inorganic material Inorganic materials 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 3
- 159000000000 sodium salts Chemical class 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical class OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 claims description 2
- 229940125782 compound 2 Drugs 0.000 claims description 2
- -1 compounds ammonium hydroxide Chemical class 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- 229940043237 diethanolamine Drugs 0.000 claims description 2
- 230000005611 electricity Effects 0.000 claims description 2
- KAJZYANLDWUIES-UHFFFAOYSA-N heptadecan-1-amine Chemical class CCCCCCCCCCCCCCCCCN KAJZYANLDWUIES-UHFFFAOYSA-N 0.000 claims description 2
- 150000002460 imidazoles Chemical class 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical class [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims 2
- 239000001488 sodium phosphate Substances 0.000 claims 1
- 229910000162 sodium phosphate Inorganic materials 0.000 claims 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052802 copper Inorganic materials 0.000 abstract description 9
- 239000010949 copper Substances 0.000 abstract description 9
- 238000005530 etching Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 20
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000011895 specific detection Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000006197 hydroboration reaction Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical class [H]C([H])([H])* 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Paints Or Removers (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of new-type inorganic environmental protection to move back film liquid, it includes the material of following parts by weight；Inorganic alkali compound 1% 10%, azole compounds 0.01% 5%, shield tin oxygen scavenger 1% 5%, move back 0.05% 1% excess water of film accelerator.Pass through above-mentioned material proportion, the new-type inorganic environmental protection of the present invention moves back that film liquid can quickly peel off the resist layer dry film after graphic plating on circuit board and the etching to copper, tin is extremely low, it is low that the COD value of caused waste liquid and complexing power after film liquid moves back film use are moved back through the new-type inorganic environmental protection, the intractability of waste liquid can be thus effectively reduced, and reaches the disposable standard easily discharged.
Description
Technical field
The present invention relates to the liquid decorporated in printed circuit board fabrication line road used in dry film, more particularly to one kind to be applied to figure
New-type inorganic environmental protection in shape electroplating technology printed circuit board (PCB) processing procedure moves back film liquid.
Background technology
In the manufacturing process of graphic plating technique printed circuit board (PCB), circuit board needs coating dry film after by preceding processing
（Resist layer）, layer pattern against corrosion is then formed by exposure imaging process, then form tin guarantor in copper wire by process
Sheath, and upper tin will not then be crossed on the copper of dry film covering by having, and then expose unwanted copper by moving back film liquid and dry film being peeled off,
Unwanted copper is etched away by alkaline etching liquid, finally the protective layer used tin stripping liquid of tin is decorporated to form required circuit.
It should further be noted that the film liquid of moving back used in traditional outer layer SES techniques is that organic type moves back film liquid, organic type
Film liquid is moved back to the aggressive extremely low of tin protective layer, but the waste liquid COD higher of its generation, metal complexing capability is extremely strong, thus can
Increase the intractability to waste liquid and increase corresponding processing cost.
With continuous improvement of the society to environmental requirement, inorganic type moves back film liquid and gradually selects to use by producer；It is however, inorganic
Type moves back film liquid, and to move back film liquid than organic type to the aggressiveness of tin protective layer high, and film liquid is moved back to tin for inorganic type in anti-retaining membrane process
Excessive attack corrosion and cause defect and scrap, in graphic plating technique, common practices is to thicken tin protective layer, still
Production cost can so be increased.
With accelerating development for circuit printing industry, in the market is badly in need of a kind of COD extremely low to tin protective layer aggressiveness, low
Value, low metal complexing power move back film liquid.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art and a kind of new-type inorganic environmental protection is provided and moves back film liquid, this is new
Formula inorganic environmental protection, which moves back film liquid, can quickly peel off resist layer dry film after graphic plating on circuit board and to the etching pole of copper, tin
It is low, move back after film liquid moves back film use that the COD value of caused waste liquid and complexing power are low through the new-type inorganic environmental protection, thus may be used
To be effectively reduced the intractability of waste liquid, and reach the disposable standard easily discharged.
To reach above-mentioned purpose, the present invention is achieved through the following technical solutions.
A kind of new-type inorganic environmental protection moves back film liquid, includes the material of following parts by weight, specifically：
Inorganic alkali compound 1%-10%；
Azole compounds 0.01%-5%；
Protect tin oxygen scavenger 1%-5%；
Move back film accelerator 0.05%-1%；
Excess water；
The new-type inorganic environmental protection moves back film liquid and moves back film liquid for alkalescence, and inorganic alkali compound moves back film liquid as the new-type inorganic environmental protection
The source of alkaline environment and the stripper as resist layer dry film, inorganic alkali compound is that its aqueous solution is alkali in inorganic compound
The sylvite or sodium salt of property；
Azole compounds are that the uncorroded compound of tin layers is protected under alkaline environment；
Tin oxygen scavenger is protected to protect the phosphate or boride of the not oxidized attack of tin layers under alkaline environment；
It is to accelerate resist layer dry film peeling rate under alkaline environment and reduce to move back film liquid to tin layers attack time to move back film accelerator
Auxiliary agent；
The new-type inorganic environmental protection moves back film liquid and uses method used below, specifically：First by the electricity after graphic plating process
Road plate moves back film liquid, circuit board by the way of immersion or spray under 50 DEG C of temperature conditionss by the new-type inorganic environmental protection
Cleaned up again with water after moving back film process, then carrying out drying and processing, finally using the circuit board after drying
X-Ray detectors detect the degree that fixed position tin layers are corroded, while detect the COD value and complexing energy using rear waste liquid
Power.
Further, a kind of new-type inorganic environmental protection moves back film liquid, includes the material of following parts by weight, specifically：
Inorganic alkali compound 2%-8%；
Azole compounds 0.05%-3%；
Protect tin oxygen scavenger 2%-5%；
Move back film accelerator 0.05%-0.5%；
Excess water.
Wherein, the inorganic alkali compound is sodium hydroxide, potassium hydroxide, sodium carbonate, sodium acid carbonate, potassium carbonate, phosphoric acid
One or more kinds of mixing in sodium.
Wherein, the azole compounds are one kind in benzotriazole, imidazoles, benzimidazole, methyl benzotriazazole
Or two or more mixing.
Wherein, the shield tin oxygen scavenger is ammonium di-hydrogen phosphate, sodium hypophosphite, sodium borohydride, dimethylamine borane, hydroboration
One or more kinds of mixing in potassium, ammonium borohydride.
Wherein, the film accelerator that moves back is aminated compounds ammonium hydroxide, monoethanolamine, diethanol amine, triethanolamine, tetramethyl
One or more kinds of mixing in ammonium hydroxide, heptadecyl-amine.
Beneficial effects of the present invention are：A kind of new-type inorganic environmental protection of the present invention moves back film liquid, it includes following
The material of parts by weight；Inorganic alkali compound 1%-10%, azole compounds 0.01%-5%, protect tin oxygen scavenger 1%-5%, move back film accelerator
0.05%-1% excess waters；The new-type inorganic environmental protection moves back film liquid and moves back film liquid for alkalescence, and inorganic alkali compound is new-type inorganic as this
Environment-friendly type moves back the source of film liquid alkaline environment and the stripper as resist layer dry film, and inorganic alkali compound is in inorganic compound
Its aqueous solution is alkaline sylvite or sodium salt；Azole compounds are that the uncorroded compound of tin layers is protected under alkaline environment；
Tin oxygen scavenger is protected to protect the phosphate or boride of the not oxidized attack of tin layers under alkaline environment；Move back film accelerator be
Accelerate resist layer dry film peeling rate under alkaline environment and reduce to move back auxiliary agent of the film liquid to tin layers attack time.Pass through above-mentioned material
Proportioning, new-type inorganic environmental protection of the invention move back film liquid can quickly peel off resist layer dry film after graphic plating on circuit board and
Etching to copper, tin is extremely low, and the COD value of caused waste liquid and complexing after film liquid moves back film use are moved back through the new-type inorganic environmental protection
Ability is low, can thus be effectively reduced the intractability of waste liquid, and reaches the disposable standard easily discharged.
Embodiment
With reference to specific embodiment, the present invention will be described.
Embodiment one, a kind of new-type inorganic environmental protection move back film liquid, include the material of following parts by weight, specifically：
Sodium hydroxide 3%；
Benzotriazole 0.5%；
Sodium hypophosphite 2%；
Excess water.
For the new-type inorganic environmental protection of the present embodiment one moves back film liquid, carrying out moving back film use and to circuit using it
Plate is carried out during moving back film process, and the circuit board after graphic plating process is first used leaching under 50 DEG C of temperature conditionss
The mode of bubble or spray moves back film liquid by the new-type inorganic environmental protection of the present embodiment one, and circuit board is used again after moving back film process
Water is cleaned up, and is then carrying out drying and processing, is finally detected the circuit board after drying using X-Ray detectors solid
The degree that tin layers are corroded is put in positioning, while detects the COD value and complexing power using rear waste liquid.
By above-mentioned material proportion, the new-type inorganic environmental protection of the present embodiment one, which moves back film liquid, can quickly peel off graphic plating
Resist layer dry film on the circuit board and etching to copper, tin is extremely low afterwards, is moved back after film liquid moves back film use through the new-type inorganic environmental protection
The COD value and complexing power of caused waste liquid are low, can thus be effectively reduced the intractability of waste liquid, and reach easy place
Manage the standard easily discharged.
Embodiment two, a kind of new-type inorganic environmental protection move back film liquid, include the material of following parts by weight, specifically：
Potassium hydroxide 4%；
Benzotriazole 1%；
Sodium borohydride 1%；
Excess water.
Wherein, the new-type inorganic environmental protection of the present embodiment two moves back the application method of film liquid and the new-type inorganic ring of embodiment one
The application method that guarantor's type moves back film liquid is identical.
By above-mentioned material proportion, the new-type inorganic environmental protection of the present embodiment two, which moves back film liquid, can quickly peel off graphic plating
Resist layer dry film on the circuit board and etching to copper, tin is extremely low afterwards, is moved back after film liquid moves back film use through the new-type inorganic environmental protection
The COD value and complexing power of caused waste liquid are low, can thus be effectively reduced the intractability of waste liquid, and reach easy place
Manage the standard easily discharged.
Embodiment three, a kind of new-type inorganic environmental protection move back film liquid, include the material of following parts by weight, specifically：
Sodium hydroxide 5%；
Methyl benzotriazazole（TTA） 0.5%；
Benzotriazole 0.5%；
Dimethylamine borane 1%；
Excess water.
Wherein, the new-type inorganic environmental protection of the present embodiment three moves back the application method of film liquid and the new-type inorganic ring of embodiment one
The application method that guarantor's type moves back film liquid is identical.
By above-mentioned material proportion, the new-type inorganic environmental protection of the present embodiment three, which moves back film liquid, can quickly peel off graphic plating
Resist layer dry film on the circuit board and etching to copper, tin is extremely low afterwards, is moved back after film liquid moves back film use through the new-type inorganic environmental protection
The COD value and complexing power of caused waste liquid are low, can thus be effectively reduced the intractability of waste liquid, and reach easy place
Manage the standard easily discharged.
Now by above-described embodiment one, embodiment two, embodiment three new-type inorganic environmental protection move back film liquid with the prior art
Common inorganic type moves back film liquid, organic type moves back film liquid and compares and analyzes.Wherein, common inorganic type moves back film liquid and uses following weight
The material of part：Sodium hydroxide 5%, excess water；Common inorganic type moves back the application method of film liquid and the new-type inorganic environment-friendly of embodiment one
The application method that type moves back film liquid is identical（Specific detection data are with reference to control embodiment one）.Common organic type move back film liquid use with
The material of lower parts by weight：Monoethanolamine 5%, ethylenediamine 3%, excess water；Common organic type moves back the application method and embodiment of film liquid
The application method that one new-type inorganic environmental protection moves back film liquid is identical（Specific detection data are with reference to control embodiment two）.
Implement one, two, three and control embodiment one, two the results detailed in following table.
| Tin planar condition | COD value（PPM） | Sting tin speed (um/min) | Move back the film time | |
| Embodiment one | Minimum corrosion tin colourless is temporary | 19500.2 | 0.0064 | 71 |
| Embodiment two | Minimum corrosion tin colourless is temporary | 18782.1 | 0.0061 | 71 |
| Embodiment three | Minimum corrosion tin colourless is temporary | 19882.2 | 0.0057 | 72 |
| Compare embodiment one | Heavy corrosion tin face blacks | 20048.4 | 0.1159 | 75 |
| Compare embodiment two | Corrosion-free tin colourless is temporary | 28856808 | 0.0018 | 74 |
Above content is only presently preferred embodiments of the present invention, for those of ordinary skill in the art, according to the present invention's
Thought, there will be changes, this specification content should not be construed as to the present invention in specific embodiments and applications
Limitation.
Claims (6)
1. a kind of new-type inorganic environmental protection moves back film liquid, it is characterised in that includes the material of following parts by weight, specifically：
Inorganic alkali compound 1%-10%；
Azole compounds 0.01%-5%；
Protect tin oxygen scavenger 1%-5%；
Move back film accelerator 0.05%-1%；
Excess water；
The new-type inorganic environmental protection moves back film liquid and moves back film liquid for alkalescence, and inorganic alkali compound moves back film liquid as the new-type inorganic environmental protection
The source of alkaline environment and the stripper as resist layer dry film, inorganic alkali compound is that its aqueous solution is alkali in inorganic compound
The sylvite or sodium salt of property；
Azole compounds are that the uncorroded compound of tin layers is protected under alkaline environment；
Tin oxygen scavenger is protected to protect the phosphate or boride of the not oxidized attack of tin layers under alkaline environment；
It is to accelerate resist layer dry film peeling rate under alkaline environment and reduce to move back film liquid to tin layers attack time to move back film accelerator
Auxiliary agent；
The new-type inorganic environmental protection moves back film liquid and uses method used below, specifically：First by the electricity after graphic plating process
Road plate moves back film liquid, circuit board by the way of immersion or spray under 50 DEG C of temperature conditionss by the new-type inorganic environmental protection
Cleaned up again with water after moving back film process, then carrying out drying and processing, finally using the circuit board after drying
X-Ray detectors detect the degree that fixed position tin layers are corroded, while detect the COD value and complexing energy using rear waste liquid
Power.
2. a kind of new-type inorganic environmental protection according to claim 1 moves back film liquid, it is characterised in that includes following parts by weight
Material, specifically：
Inorganic alkali compound 2%-8%；
Azole compounds 0.05%-3%；
Protect tin oxygen scavenger 2%-5%；
Move back film accelerator 0.05%-0.5%；
Excess water.
3. a kind of new-type inorganic environmental protection according to claim 2 moves back film liquid, it is characterised in that：The inorganic alkali compound
For one or more kinds of mixing in sodium hydroxide, potassium hydroxide, sodium carbonate, sodium acid carbonate, potassium carbonate, sodium phosphate.
4. a kind of new-type inorganic environmental protection according to claim 3 moves back film liquid, it is characterised in that：The azole compounds are
One or more kinds of mixing in benzotriazole, imidazoles, benzimidazole, methyl benzotriazazole.
5. a kind of new-type inorganic environmental protection according to claim 4 moves back film liquid, it is characterised in that：It is described shield tin oxygen scavenger be
In ammonium di-hydrogen phosphate, sodium hypophosphite, sodium borohydride, dimethylamine borane, potassium borohydride, ammonium borohydride it is one or two kinds of with
On mixing.
6. a kind of new-type inorganic environmental protection according to claim 5 moves back film liquid, it is characterised in that：The film accelerator that moves back is
One kind in aminated compounds ammonium hydroxide, monoethanolamine, diethanol amine, triethanolamine, tetramethylammonium hydroxide, heptadecyl-amine or two
The mixing of the kind above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165820.6A CN107908084A (en) | 2017-11-21 | 2017-11-21 | A kind of new-type inorganic environmental protection moves back film liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711165820.6A CN107908084A (en) | 2017-11-21 | 2017-11-21 | A kind of new-type inorganic environmental protection moves back film liquid |
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| Publication Number | Publication Date |
|---|---|
| CN107908084A true CN107908084A (en) | 2018-04-13 |
Family
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|---|---|---|---|
| CN201711165820.6A Pending CN107908084A (en) | 2017-11-21 | 2017-11-21 | A kind of new-type inorganic environmental protection moves back film liquid |
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Cited By (7)
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| CN110093639A (en) * | 2019-04-22 | 2019-08-06 | 深圳市泓达环境科技有限公司 | A kind of shield tin additive and etching solution |
| CN110113872A (en) * | 2019-04-29 | 2019-08-09 | 武汉利之达科技股份有限公司 | A kind of PCB moves back membrane process, manufacturing method and system |
| CN110597026A (en) * | 2019-09-26 | 2019-12-20 | 上海富柏化工有限公司 | Dry film removing process for flexible circuit board |
| CN111118501A (en) * | 2020-01-07 | 2020-05-08 | 深圳市星扬高新科技有限公司 | Tin surface protective agent and preparation method thereof |
| CN113755851A (en) * | 2021-09-10 | 2021-12-07 | 珠海市板明科技有限公司 | Tin surface protective agent and film stripping liquid for circuit board production |
| CN114276712A (en) * | 2022-01-21 | 2022-04-05 | 深圳市松柏实业发展有限公司 | Ink stripping liquid and stripping process of circuit board ink |
| CN120035052A (en) * | 2025-04-22 | 2025-05-23 | 深圳市大正瑞地科技有限公司 | Method for removing dehumidifying film in printed circuit board selection process and printed circuit board |
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| CN110093639A (en) * | 2019-04-22 | 2019-08-06 | 深圳市泓达环境科技有限公司 | A kind of shield tin additive and etching solution |
| CN110113872A (en) * | 2019-04-29 | 2019-08-09 | 武汉利之达科技股份有限公司 | A kind of PCB moves back membrane process, manufacturing method and system |
| CN110597026A (en) * | 2019-09-26 | 2019-12-20 | 上海富柏化工有限公司 | Dry film removing process for flexible circuit board |
| CN111118501A (en) * | 2020-01-07 | 2020-05-08 | 深圳市星扬高新科技有限公司 | Tin surface protective agent and preparation method thereof |
| CN113755851A (en) * | 2021-09-10 | 2021-12-07 | 珠海市板明科技有限公司 | Tin surface protective agent and film stripping liquid for circuit board production |
| CN114276712A (en) * | 2022-01-21 | 2022-04-05 | 深圳市松柏实业发展有限公司 | Ink stripping liquid and stripping process of circuit board ink |
| CN120035052A (en) * | 2025-04-22 | 2025-05-23 | 深圳市大正瑞地科技有限公司 | Method for removing dehumidifying film in printed circuit board selection process and printed circuit board |
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Application publication date: 20180413 |