CN107907055A - Pattern projection module, three-dimensional information obtain system, processing unit and measuring method - Google Patents
Pattern projection module, three-dimensional information obtain system, processing unit and measuring method Download PDFInfo
- Publication number
- CN107907055A CN107907055A CN201711338694.XA CN201711338694A CN107907055A CN 107907055 A CN107907055 A CN 107907055A CN 201711338694 A CN201711338694 A CN 201711338694A CN 107907055 A CN107907055 A CN 107907055A
- Authority
- CN
- China
- Prior art keywords
- pattern
- intersection point
- measurement
- lines
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000005259 measurement Methods 0.000 claims abstract description 170
- 230000003287 optical effect Effects 0.000 claims abstract description 11
- 230000001427 coherent effect Effects 0.000 claims abstract description 10
- 238000005286 illumination Methods 0.000 claims abstract description 8
- 230000010365 information processing Effects 0.000 claims abstract description 4
- 238000003384 imaging method Methods 0.000 claims description 40
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 238000012856 packing Methods 0.000 claims 1
- 230000000644 propagated effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000037237 body shape Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003238 somatosensory effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0608—Height gauges
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
This application discloses a kind of pattern projection module for being used to measure dimension of object, it includes coherent source and pattern maker, the pattern maker includes diffraction optical element and is arranged in the light path for the illumination light propagated from the coherent source to object, for the measurement pattern that be projected onto based on the illumination photogenerated on object, measurement pattern includes at least two lines bar, and the lines are in measurement with being crossed to form at least one central intersection point in pattern.System is obtained disclosed herein as well is the three-dimensional information including the pattern projection module and carries out the method for three-dimensional measurement and three-dimensional information processing unit of dimensional measurement to approximately parallelepiped body object with pattern based on the measurement.According to the present invention, contribute to realize quick, the high-precision dimensional measurement to approximately parallelepiped body object based on the measurement pattern, and allow measuring device portability, reduce manufacture cost.
Description
Technical field
The present invention generally relates to the method for three-dimensional measurement and device of dimension of object measurement, and in particular to for measuring
The pattern projection module of dimension of object, the three-dimensional information of the size for measuring approximately parallelepiped body object obtain system, three-dimensional letter
Cease processing unit and the method for three-dimensional measurement for measuring approximately parallelepiped body dimension of object.
Background technology
Logistic industry develops rapidly in recent years, needs logistics parcel (usually to use in storage, transport and all too many levels of charging
Packed in cases) three-dimensional dimension.Traditional hand dipping and record obviously cannot be met the requirements.There are some storehouses to employ industry
Three-dimensional scanning device.Industrial three-dimensional scanning device uses line-structured light scanning technique mostly, and precision is high, but needs fixed peace
Dress and measuring environment, require during scanning testee position immovable, and price is high.
Occur some Kinect somatosensory sensings for people's Three-dimensional Sensor used in everyday, such as Microsoft on the market
Device.These equipment use infrared pattern light or TOF (time of flight) technology mostly, it is so structured that portable
, but measurement error is larger, is about 2~10% scope, it is impossible to three-dimensional dimension is wrapped up in accurate, stably measurement, and
Cost is still higher.
The content of the invention
The object of the present invention is to provide a kind of new three-dimensional measurement scheme, generally rectangular shape is particularly suitable for
The three-dimensional measurement scheme of object (such as logistics parcel) dimensional measurement, it is solved on existing in the prior art at least in part
State problem.
According to an aspect of the invention, there is provided a kind of pattern projection module for being used to measure dimension of object, it includes：
Coherent source；And pattern maker, the pattern maker include diffraction optical element and are arranged on from the coherent light
In the light path for the illumination light that source is propagated to object, for the measurement figure that be projected onto based on the illumination photogenerated on object
Case, measurement pattern include at least two lines bar, and the lines are handed in measurement with least one center is crossed to form in pattern
Point.
According to another aspect of the present invention, there is provided a kind of three-dimensional letter for the size for being used to measure approximately parallelepiped body object
Acquisition system is ceased, the system comprises：Pattern projection module as described above, for being projected to the object in target area
The measurement pattern；And imaging unit, the imaging unit include at least one camera, have the measurement for obtaining projection
With the image of pattern, described object, the pattern projection module and the imaging unit have definite position relative to each other
Put.
According to a further aspect of the invention, there is provided a kind of three-dimensional measurement for being used to measure approximately parallelepiped body dimension of object
Method, this method include：Measurement pattern is projected to the object using pattern projection module, which is included at least with pattern
Two lines bar, the lines in the measurement with being crossed to form at least one central intersection point in pattern, and the projection so that
The center intersection point is projected on the top surface of the object, and causes the lines to be projected the top surface and adjacent with top surface
On the first and second side surfaces connect, the edge of the lines and the top surface is crossed to form top edge intersection point, and with described the
One and second at least one of side surface the lower edge intersection point that is crossed to form of lower edge；Using relative to the pattern projection
Module has the imaging unit of definite relative position, and obtaining projection thereon has the image of object of the measurement pattern, institute
State the top surface and the first side surface and the second side surface of object described in image display；Determine the central intersection point, top
The position of edge intersection point and lower edge intersection point in described image；It is based at least partially on the central intersection point and top edge intersection point meter
Calculate the length and width of the object；And it is based at least partially on the height of object described in the lower edge intersection point calculation.
According to a further aspect of the invention, there is provided a kind of three-dimensional information processing unit, the device include：Processor and
The memory of storage program instruction, wherein when described program instruction is performed by the processor so that the processor performs
Following operation：The image of object is received, wherein the object substantially rectangular shape, has been projected measurement pattern thereon,
Measurement pattern includes at least two lines bar, and the lines are in measurement with being crossed to form at least one central intersection point in pattern；
The central intersection point and the lines in the measurement pattern and institute that processing described image is projected on object top surface with detecting
The edge for stating top surface is crossed to form top edge intersection point and intersects with the lower edge of at least one of the first and second side surfaces
The lower edge intersection point of formation, wherein, first and second side surface is adjacent and adjacent to each other with top surface for the object
Two side surfaces；It is based at least partially on the length and width of object described in the central intersection point and top edge intersection point calculation；With
And it is based at least partially on the height of object described in the lower edge intersection point calculation.
By using the measurement pattern that at least one central intersection point is crossed to form including at least two lines bar and lines, root
Contribute to realize that particularly approximately parallelepiped body shaped objects is fast to object according to the module of the present invention, system, method and apparatus
Speed, high-precision dimensional measurement.In addition, the three-dimensional measuring apparatus based on above-mentioned measurement pattern can realize portability, and make
Cause low.
Brief description of the drawings
By reading the detailed description to non-limiting example made with reference to the following drawings, other spies of the invention
Sign, objects and advantages will become more apparent upon：
Fig. 1 is the schematic block diagram that system is obtained according to the three-dimensional information of the embodiment of the present invention；
Fig. 2 is according to the schematic diagram of the pattern projection module of the embodiment of the present invention, shows two kinds of different structures
Make mode；
Fig. 3, which schematically shows three-dimensional information according to embodiments of the present invention and obtains system and be embodied as hand-held measurement, to be set
It is standby；
Fig. 4 A and Fig. 4 B respectively illustrate pattern projection module in three-dimensional information acquisition system according to embodiments of the present invention
With two kinds of arrangements of imaging unit；
Fig. 5 schematically shows the application examples that three-dimensional information according to embodiments of the present invention obtains system；
Fig. 6 shows the indicative flowchart of method for three-dimensional measurement according to embodiments of the present invention；
Fig. 7 shows an example of the measurement pattern that pattern projection module according to embodiments of the present invention projects；
Fig. 8, which schematically shows projection thereon, the object of measurement pattern shown in Fig. 7；
Fig. 9 A, Fig. 9 B and Fig. 9 C respectively illustrate the different modifications of measurement pattern shown in Fig. 7；
Figure 10 shows that another of the measurement pattern that pattern projection module according to embodiments of the present invention projects shows
Example；
Figure 11, which schematically shows projection thereon, the object of measurement pattern shown in Figure 10；
Figure 12 is schematic diagram, wherein denoting the object top corner part for calculating object space orientation by image procossing and being utilized
Point；
Figure 13 shows a kind of modification of measurement pattern shown in Figure 10；
Figure 14, which schematically shows projection thereon, the object of measurement pattern shown in Figure 13；
Figure 15 and Figure 16 respectively illustrates the measurement pattern available for method for three-dimensional measurement according to embodiments of the present invention
Two other example.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining related invention, rather than the restriction to the invention.It also should be noted that in order to
It illustrate only easy to describe, in attached drawing with inventing relevant part.
It should be noted that in the case where there is no conflict, the feature in embodiment and embodiment in the application can phase
Mutually combination.Below with reference to the accompanying drawings and the present invention will be described in detail in conjunction with the embodiments.
First, introduce three-dimensional information according to embodiments of the present invention referring to figs. 1 to Fig. 5 and obtain system 10.Fig. 1 believes to be three-dimensional
Cease the schematic block diagram of acquisition system 10.
As shown in Figure 1, three-dimensional information, which obtains system 10, includes pattern projection module 11 and imaging unit 12, wherein pattern is thrown
Penetrate module 11 to be used to project measurement pattern to the object in target area, imaging unit 12 includes at least one camera
(not shown), the subject image of measurement pattern has been projected for obtaining in the target area.Imaging unit 12 relative to
Pattern projection module 11 has definite position relationship, this is introduced in further detail hereinafter with reference to Fig. 4 A and Fig. 4 B.
Fig. 2 schematically shows the construction of pattern projection module 11, as shown in the figure, pattern projection module 11 includes being concerned with
Light source 11a and pattern maker 11b.Coherent source 11a can be laser, such as red laser.Pattern maker 11b is excellent
Choosing includes diffraction optical element (DOE), and pattern maker 11b is arranged on illumination light from coherent source 11a to object that propagated from
In light path, for the measurement pattern that be projected onto based on illumination photogenerated on object.According to embodiments of the present invention three
To tie up in Information Acquisition System, the measurement that the pattern maker of pattern projection module is generated includes at least two lines bar with pattern,
The lines are in measurement with least one central intersection point is crossed to form in pattern, this is hereinafter with reference to such as Fig. 7, Fig. 9, figure
10th, Figure 15 and Figure 16 are introduced in further detail.In the application, measurement pattern be by pattern projection module 11 it is projecting,
The pattern obtained in the plane of illuminating light propagation light path.
A kind of representative configuration of pattern projection module 11 is shown in (a) of Fig. 2, wherein as coherent source 11a's
Laser is vertical cavity surface emitting laser (VCSEL), and the laser emitting surface of laser 11a faces pattern maker 11b (examples
Such as diffraction optical element) arrangement；Another representative configuration is shown in (b) of Fig. 2, wherein, as coherent source 11a's
Laser is edge emitter laser, in order to which the laser guide pattern maker 11b from edge emitter laser, pattern are thrown
Optical path-deflecting element 11c, such as speculum or reflecting prism etc. can also be included by penetrating module 11.
As shown in figure 3, three-dimensional information acquisition system 10 according to embodiments of the present invention can be implemented as hand-held measurement and set
It is standby, for measuring the three-dimensional dimension of approximately parallelepiped body shaped objects OB.In use, hand-held measurement device 10 is remained with one
The fixed angle of depression is against object OB so that pattern projection module 10 is by measurement pattern projection in the top surface P1 of object OB and first
On side surface P2 and the second side surface P3, the first side surface P2 and the second side surface P3 are adjacent and adjacent to each other with top surface P1
Two side surfaces (referring to Fig. 8, Figure 11 and Figure 14).At the same time, operator can control (such as passing through button) imaging single
Member 12, shooting projection have the image of the object OB of the measurement pattern.The image can be used for subsequent treatment, to extract the thing
The three-dimensional information of body OB.
Fig. 4 A and Fig. 4 B respectively illustrate three-dimensional information according to embodiments of the present invention and obtain pattern projection mould in system 10
Group 11 and two kinds of arrangements of imaging unit 12.In arrangement shown in Fig. 4 A, the center of projection axis CA of pattern projection module 11
It is parallel to each other with the optical axis OA of imaging unit 12, and be separated by a certain distance (should be away from for pattern projection module 11 and imaging unit 12
From also known as parallax range).In arrangement shown in Fig. 4 B, pattern projection module 11 is still separated by a certain distance with imaging unit 12
(distance is also known as parallax range), but the optical axis OA of the center of projection axis CA of pattern projection module 11 and imaging unit 12 is each other
It is not parallel.
It should be appreciated by those skilled in the art that any arrangement of the above no matter is taken, according in measurement pattern
Throw position and pattern of position, this feature point of one characteristic point in the pattern in the image acquired in imaging unit 12
The definite position relationship penetrated between module 11 and imaging unit 12 (includes the angle and figure of center of projection axis CA and optical axis OA
Case projects the spacing of module 11 and imaging unit 12), the space bit of launching position of this feature point on object can be calculated
Put (locus is for the camera coordinates system of imaging unit 12 here).
Relative position relation between pattern projection module 11 and imaging unit 12, can set in installation process,
It can be determined after mounting by calibration process, the present invention is unrestricted in this aspect.
Fig. 5 schematically shows the application examples that three-dimensional information obtains system 10, and wherein imaging unit 12 is by integrating
Camera 12a in the mancarried device such as mobile phone, PDA or tablet computer is formed, and pattern projection module 11 passes through a peace
Dress stent 14 is installed to the mancarried device, so as to be removably installed fixation relative to imaging unit 12.Mounting bracket 14
Such as with two opposite elastic clip gripping arms, for being fixed to mancarried device.Pattern projection module 11 can be detachable
Ground is installed in the mounting bracket 14, can also be integrated with mounting bracket 14.In certain embodiments, pattern projection mould
Group 11 can include integrated laser light source 11a and installation in a portable device or the figure being integrated in mounting bracket 14
Pattern generator 11b.
It should be understood that although with reference to as described in Fig. 3 and Fig. 5, three-dimensional information according to embodiments of the present invention obtains system
System 10 is adapted for carrying out as portable equipment/portable set, but it can also be embodied as being installed on fixed position and at this
The equipment used in fixed environment, such as the detection device being fixedly mounted in storehouse or materials-sorting system.
Method for three-dimensional measurement according to embodiments of the present invention is introduced below in conjunction with Fig. 6 to Figure 16 and available for this method
Measurement projective patterns.
Fig. 6 shows the indicative flowchart of method for three-dimensional measurement 100 according to embodiments of the present invention.Method for three-dimensional measurement
100 are suitable for measuring the three-dimensional dimension of the object of approximately parallelepiped body shape, it includes following processing：
S110：Measurement pattern is projected to the object using pattern projection module, which includes at least two with pattern
Bar lines, the lines are in the measurement with being crossed to form at least one central intersection point in pattern, and the projection is so that institute
State central intersection point to be projected on the top surface of the object, and the lines is projected the top surface and is abutted with top surface
The first and second side surfaces on, the edge of the lines and the top surface is crossed to form top edge intersection point, and with described first
The lower edge intersection point being crossed to form with the lower edge of at least one of the second side surface；
S120：Using the imaging unit relative to the pattern projection module with definite relative position, obtain thereon
Projection has the image of the object of the measurement pattern, and described image shows the top surface and the first side surface of the object
With the second side surface；
S130：Determine the position of the central intersection point, top edge intersection point and lower edge intersection point in described image；
S140：It is based at least partially on the length and width of object described in the central intersection point and top edge intersection point calculation；
And
S150：It is based at least partially on the height of object described in the lower edge intersection point calculation.
Referring back to Fig. 1, as shown in the figure, three-dimensional information according to embodiments of the present invention, which obtains system 10, can also include place
Unit 13 is managed, processing unit 13 receives the described image from imaging unit 12, and is configured to the image and performs above-mentioned three
Tie up processing S130~S150 in measuring method 100.Processing unit 13 can be deposited including what processor 13a and storage program were instructed
Reservoir 13b, described program instruction are performed by processor 13a, so that the processor 13a performs processing S130~S150.
In certain embodiments, processing unit 13 can also be separately formed three-dimensional information processing unit.
In certain embodiments, processing unit 13 can be integrated in together with pattern projection module 11 and/or imaging unit 12
In one hardware device, such as shown in figure 5, it can be integrated in imaging unit 12 in mobile phone.In further embodiments, handle
Unit 13 can also provide be connected with pattern projection module 11 and/or imaging unit 12 in a manner of wiredly and/or wirelessly it is logical
In the discrete equipment of letter, such as cloud server.
The first embodiment of method for three-dimensional measurement 100 is introduced below with reference to Fig. 7 and Fig. 8 and available for first reality
Apply the measurement pattern of mode.
Fig. 7 shows the measurement pattern P A10 available for the first embodiment of method for three-dimensional measurement 100.Such as Fig. 7 institutes
Show, pattern P A10 bags four lines L11, L12, L21, L22 are used in measurement, and wherein lines L11, L12 is parallel to each other, are formed one group and are put down
Line, lines L21, L22 are parallel to each other, form another group of parallel lines, lines L11, L12 and lines L21, L22 and scheme in measurement
Four central intersection point a1, a2, a3, a4 are formed in case.
Fig. 8, which schematically shows projection thereon, the object of measurement pattern P A10.According to method for three-dimensional measurement 100,
Handle in S110, measurement pattern is projected to the object using pattern projection module.In preferred exemplary shown in Fig. 8, locating
Managing in S110, project measurement pattern P A10 so that central intersection point a1, a2, a3, a4 are projected on the top surface P1 of object OB,
And lines L11, L12 are projected on top surface P1 and the first side surface P2, lines L21, L22 are projected top surface P1 and the
On two side surface P3, so as to be crossed to form top edge intersection point b1~b8 with the edge of top surface P1, with the first and second side surface P2,
The lower edge of P3 is crossed to form lower edge intersection point c1~c4.
Due to combining with reference to Fig. 3, it can be seen that since pattern projection module 11 is surveyed to projecting on object with certain angle of depression
Amount pattern, and measurement pattern be by pattern projection module 11 it is projecting, in the plane perpendicular to illuminating light propagation light path
The pattern of upper acquisition, so projecting the angle of the lines in the pattern on object top surface can change.For the ease of lines
L11, L12 can intersect with lines L21, L22 with four edges of object top surface P1, in some preferred embodiments, lines
The non-obtuse angle α that L11, L12 and lines L21, L22 are formed meets 30 °≤α≤90 °, preferably 50 °≤α≤70 °, more preferably α
=60 °.
In addition, in order to make lines L11, L12 and lines L21, L22 be projected onto top surface and the first and second sides of object
The lower edge on surface, the pattern maker 11b in pattern projection module 11 according to embodiments of the present invention, such as diffraction optics member
Part, is configured on the length direction along lines not less than 20 °, preferably to be used with the subtended angle projection measurement not less than 30 °
Pattern.If the projection subtended angle is too small, the lines projected be likely to be difficult to covering/across the edge of object top surface and
The lower edge of first and second side surfaces, so as to cannot be formed in method for three-dimensional measurement according to embodiments of the present invention
Edge intersection point and lower edge intersection point.
While measurement pattern is projected, obtaining projection thereon using imaging unit 12 has the thing of measurement pattern P A10
The image (processing S120) of body OB.Described image shows top surface and the first side surface and the second side surface of object.
In the described image that processing S130, processing imaging unit 12 are obtained, central intersection point a1, a2, a3 in detection image,
A4, top edge intersection point b1~b8 and lower edge intersection point c1~c4, determine the position of each intersection point in the picture.
In certain embodiments, can be handed over by being extracted in described image corresponding to top edge intersection point and/or lower edge
The characteristic point of point determines the position of top edge intersection point and/or lower edge intersection point in described image.
In further embodiments, the lines that can detect measurement pattern project formation on two adjacent surfaces
Straight line, and calculate the intersection point of two straight lines, be crossed to form as the edge that the lines and the two described surfaces share
Top edge intersection point or lower edge intersection point.For example, in Fig. 8 example showns, for example, can detect lines L12 on top surface P1
Project the straight line formed and project the straight line of formation on the first side surface P2, and calculate the intersection point of this two straight lines, as
The intersection point at the shared edge of lines L12 and top surface P1 and the first side surface P2, top edge intersection point b1.The detection of this edge intersection point
Mode for the edge of object have fillet, defect or deform and cause measurement pattern in lines and the edge from
Formed especially advantageous in the case of the clear or accurate intersection point in position, it helps avoid the measurement error under the above situation, carries
High measurement accuracy.
In certain embodiments, pattern projection module 11 can intermittently project measurement pattern in a manner of stroboscopic, and
And the projection that imaging unit 12 is controlled to obtain object respectively has measurement with the image of pattern and does not project measurement pattern
Image.In this way, in image processing process, there is measurement with the image of pattern by comparing projection and do not project and measure pattern
Image, more can detect quickly and/or more accurately the measurement pattern being incident upon on object, so as to detect
Central intersection point, top edge intersection point and lower edge intersection point.
In Fig. 8 example showns, in S140 is handled, following handle can be carried out：
Based in position of at least three in central intersection point a1, a2, a3, a4 in described image, described at least three
Entreat the definite position between position and pattern projection module 11 and imaging unit 12 of the intersection point in measurement pattern
Relation, using triangulation, the locus of described at least three central intersection points of calculating；
Locus based on described at least three central intersection points determines that (true for the locus of the top surface P1 of object OB at 3 points
A fixed plane)；And
The position of locus and top edge intersection point b1~b8 in the picture based on top surface P1, calculates the length of the top surface
Degree and width.
Wherein, in certain embodiments, locus and top edge intersection point b1~b8 based on top surface P1 are in the picture
Position, can calculate the locus of top edge intersection point first.
In Fig. 8 example showns, due to same group of parallel lines, lines L11, L12 or lines L21, L22, with top surface P1's
Two top edge intersection points that same edge is crossed to form, it is possible to go out described same one side based on the two top edge intersection point calculations
The position of edge (2 points determine straight line).
In certain embodiments, four of top surface can based on the position at four edges of the top surface P1 of object, be calculated
The position on vertex, so as to calculate the length and width of top surface.
In Fig. 8 example showns, in S150 is handled, following handle can be carried out：
Locus based on top surface P1, first and second side surface P2, P3 and the orthogonal position relationship of top surface, with
And the position at edge that top surface P1 and first and second side surface P2, P3 are shared, calculate the sky of first and second side surface P2, P3
Between position；
Based on lower edge intersection point c1~c4, the position of the lower edge of first and second side surface P2, P3 of calculating；And
The position of locus and their lower edge based on first and second side surface P2, P3, calculates object OB
Height.
In certain embodiments, first can be calculated based on the position of the lower edge of first and second side surface P2, P3
With the intersection point of the lower edge of the second side surface, so as to calculate the height of object.
The first embodiment of method for three-dimensional measurement 100 is described above in association with Fig. 7 and Fig. 8, and available for the implementation
One example of the measurement pattern of mode.However, the first embodiment of method for three-dimensional measurement 100 is not limited to use Fig. 7
Shown measurement pattern P A10.Fig. 9 A, Fig. 9 B and Fig. 9 C respectively illustrate the different modifications of measurement pattern P A10.
With in pattern P A11, lines can include several separated line segment parts, such as shape for measurement shown in Fig. 9 A
As the lines of " dotted line " form.The central intersection point and/or up/down edge intersection point that such lines are formed can pass through
The intersection point for calculating two straight lines determines.
Speckle pattern is can be combined with the basis of intersecting line image of the measurement with pattern 10, to help to observe or survey
Deformation of the object relative to rectangular shape is measured, is particularly used to measure the deformation at object edge, to improve dimensional measurement
Precision.For example, the speckle SP1 that the measurement shown in Fig. 9 B is arranged in array with pattern P A12, combining.Preferably, speckle point
Cloth is using four of two groups of parallel lines central intersection points as in the region beyond the diamond-shaped area on vertex.In method for three-dimensional measurement 100
Some preferred embodiments in, this method be additionally may included on the top surface P1 of object set with known dimensions label,
Such as bar code or Quick Response Code etc., when projecting measurement pattern, by the open diamond area that described four central intersection points are vertex
Domain is directed at the label, and in successive image processing and calculating, using the label with known dimensions to dimension measurement result
It is corrected.In addition it is also possible to using measurement pattern P A13 as shown in Figure 9 C, wherein combining the speckle of irregular distribution
SP2.Speckle pattern is preferably array arrangement or the speckle otherwise regularly arranged.
Below with reference to Figure 10 to Figure 12 introduce method for three-dimensional measurement 100 second embodiment and available for this second
The measurement pattern of embodiment.
Figure 10 shows the measurement pattern P A20 available for the second embodiment of method for three-dimensional measurement 100.Such as Figure 10
Shown, measurement includes two lines bar L1, L2 with pattern P A20, they form a center in the range of measurement is with pattern P A20
Intersection point a.
Figure 11, which schematically shows projection thereon, the object of measurement pattern P A20.In Figure 11 example showns, three
In the processing S110 for tieing up measuring method 100, measurement is projected the object to approximately parallelepiped body shape with pattern P A20 so that center
Intersection point a is projected on object top surface P1, and lines L1 is projected on top surface P1 and the first side surface P2, lines L2 quilts
It is incident upon on top surface P1 and the second side surface P3, so that top edge intersection point b1~b4 is crossed to form with the edge of top surface P1, with
One and second the lower edge of side surface P2, P3 be crossed to form lower edge intersection point c1, c2.
Similar to measurement pattern P A10, in some preferred embodiments, lines L1, L2 shape of the measurement in pattern P A20
Into non-obtuse angle α meet 30 °≤α≤90 °, preferably 50 °≤α≤70 °, more preferably α=60 °.
In addition, in order to make lines L1, L2 be projected onto the top surface of object and the lower edge of the first and second side surfaces, root
According to the pattern maker 11b in the pattern projection module 11 of the embodiment of the present invention, such as diffraction optical element, it is configured to along the line
With not less than 20 ° on the length direction of bar, preferably with the subtended angle projection measurement pattern P A20 not less than 30 °.
While measurement pattern is projected, obtaining projection thereon using imaging unit 12 has the thing of measurement pattern P A20
The image (processing S120) of body OB.
In the second embodiment of method for three-dimensional measurement 100, processing S130 can be with the with measurement three-dimensional method 100
One embodiment identical mode carries out, and details are not described herein.
In the second embodiment of method for three-dimensional measurement 100, in S140 is handled, the side of image procossing can be passed through
Method, the characteristic point of extraction objects in images OB, the edge and vertex of reconstruction of objects OB in two dimensional image, particularly Figure 12 are marked
Vertex A, B, C, D and edge AB, edge BC and the edge BD shown, is then based on object top surface P1 and the first and second side surfaces
Position relationship perpendicular to one another between P2, P3, calculates such as top surface P1 relative to the space angle of camera.It is real according to the present invention
Example is applied, top edge intersection point b1~b4 can be as the key feature points in above-mentioned restructuring procedure, such as can require the top of reconstruct
Face edge has to pass through corresponding top edge intersection point b1~b4.In certain embodiments, the locus of central intersection point a is calculated,
And the locus of the space angle based on top surface P1 and central intersection point a, the locus of calculating top surface P1, so as to calculate top
The locus of point A, B, C, so as to calculate the length and width of object (top surface P1).
In certain embodiments, can be based on edge BD relative to the vertical of edge AB and edge BD in S150 is handled
Relation, and the positions of vertex D in the picture, calculate the locus of vertex D, so as to calculate height (the edge BD of object
Length).According to embodiments of the present invention, lower edge intersection point c1, c2 can be used for the position for correcting vertex D, for example, utilizing first
With the lower edge of the second side surface and the parallel relation of top edge.
It should be understood that the description to processing above, the description particularly to the concrete operations for handling S140 and S150
It is merely exemplary, and nonrestrictive, such as wherein used circular and step can have various modifications,
This is that those skilled in the art can just make according to common sense in the field, and the present invention is not limited in this respect.
Figure 13 shows measurement pattern P A21, it is a kind of modification of measurement pattern shown in Figure 10.Measurement pattern
In PA21, it can be considered as formed with interruption part, endpoint of the lines in the discontinuities office on the two lines bar that intersects each other
Characteristic point.As shown in figure 13, measurement pattern P A21 can include center intersection point a1 and four characteristic point a2~a5.
As shown in figure 14, in S110 is handled, measurement pattern P A21 can be projected so that central intersection point a1 and four spies
Sign point a2~a5 is projected on the top surface P1 of object.
According to embodiments of the present invention, when combining using measurement with pattern P A21, method for three-dimensional measurement 100 can be with difference
Mode in its first embodiment and second embodiment is realized.For example, in certain embodiments, center can be based on
Intersection point a1 and four characteristic point a2~a5 are in the measurement position in pattern P A1 and position in the picture, and based on pattern
The definite position relationship of module 11 and imaging unit 12 is projected, calculates center intersection point a1's and four characteristic point a2~a5
Locus, so as to calculate the locus of object top surface P1.In certain embodiments, top edge intersection point and following can be utilized
Edge intersection point and the further feature point extracted in respective edges by image procossing, reconstruct/determine the edge.It is other specific
Processing is that those skilled in the art are easily envisaged that details are not described herein according to above-mentioned introduction and common sense in the field.
Finally, Figure 15 and Figure 16 respectively illustrates the measurement use available for method for three-dimensional measurement according to embodiments of the present invention
Two other example of pattern.
Figure 15 shows measurement pattern P A30, and including three lines L1, L2, L3, they meet at central intersection point respectively
a1、a2、a3.When implementing method for three-dimensional measurement according to embodiments of the present invention with pattern P A30 based on the measurement, can be based on
Central intersection point a1, a2, a3 calculate the locus of object top surface, and the friendship formed using lines L1, L2, L3 and object edge
Point (top edge intersection point or lower edge intersection point) or these intersection points and the group of the further feature point on edge extracted in image
Close, the edge of object is calculated/determine, so as to calculate the length of object, width and height.
Figure 16 shows measurement pattern P A40, and including two groups of parallel lines, every group of parallel lines include three lines.Can be with
See, measurement is capable of providing the central intersection point available for redundancy that is calculating object top surface locus, and energy with pattern P A40
Enough top edge intersection points and/or lower edge intersection point that the redundancy that can be used for determining object edge is provided.This is for such as detected material
For example there is defect or the situation of deformation (this is common for logistics parcel) are especially beneficial for body.For example, minimum can be passed through
Square law, top surface and edge are fitted using the central intersection point or up/down edge intersection point of redundancy quantity, improve dimensional measurement essence
Degree.
It should be understood, however, that if the quantity of central intersection point and up/down edge intersection point is excessive, need to apply one
Fixed structure light coding technology identifies different intersection points, and on the contrary so that measuring speed is slack-off, error rate rises.Therefore, according to
The lines quantity that the embodiment of the present invention, preferably measurement pattern include is no more than 10, and more preferably lines quantity is no more than 6
Bar, the central number of intersections of formation are no more than 9.
Above description is only the preferred embodiment of the application and the explanation to institute's application technology principle.People in the art
Member should be appreciated that invention scope involved in the application, however it is not limited to the technology that the particular combination of above-mentioned technical characteristic forms
Scheme, while should also cover in the case where not departing from the inventive concept, carried out by above-mentioned technical characteristic or its equivalent feature
The other technical solutions for being combined and being formed.Such as features described above has similar work(with (but not limited to) disclosed herein
The technical solution that the technical characteristic of energy is replaced mutually and formed.
Claims (25)
1. a kind of pattern projection module for being used to measure dimension of object, including：
Coherent source；And
Pattern maker, the pattern maker include diffraction optical element and are arranged on from the coherent source to object to pass
In the light path for the illumination light broadcast, for the measurement pattern that be projected onto based on the illumination photogenerated on object, the measurement
Include at least two lines bar with pattern, the lines are in measurement with being crossed to form at least one central intersection point in pattern.
2. pattern projection module as claimed in claim 1, wherein, the diffraction optical element is configured in the length along lines
With not less than 20 ° on direction, the measurement pattern is preferably projected with the subtended angle not less than 30 °.
3. pattern projection module as claimed in claim 1, wherein, the non-obtuse angle α that at least two lines bar is formed is expired
30 °≤α≤90 ° of foot, preferably 50 °≤α≤70 °.
4. pattern projection module as claimed in claim 1, wherein, the measurement is included in the region of measurement pattern with pattern
The interior a plurality of lines for forming at least three central intersection points.
5. pattern projection module as claimed in claim 4, wherein, the measurement includes two groups of parallel lines with pattern, and every group is put down
Line includes two lines bar, and two groups of parallel lines form four central intersection points in measurement pattern.
6. pattern projection module as claimed in claim 5, wherein, the measurement further includes speckle, the speckle point with pattern
Cloth is using described four central intersection points as in the region beyond the diamond-shaped area on vertex.
7. pattern projection module as claimed in claim 1, wherein, the measurement further includes speckle with pattern, and the speckle is excellent
Choosing is arranged in array.
8. the pattern projection module as any one of claim 1-7, wherein, at least one lines bag in the lines
Include several line segment parts spaced apart.
9. a kind of three-dimensional information for the size for being used to measure approximately parallelepiped body object obtains system, the system comprises：
The pattern projection module as any one of claim 1-8, for described in the object projection in target area
Measurement pattern；And
Imaging unit, including at least one camera, have the image of the measurement pattern, described object for obtaining projection,
The pattern projection module and the imaging unit have definite position relative to each other.
10. three-dimensional information as claimed in claim 9 obtains system, processing unit is further included, the processing unit is received and come from
The described image of the imaging unit, and be configured as performing following operation：
Lines in central intersection point and the measurement pattern that processing described image is projected on object top surface with detecting
Top edge intersection point and lower edge with least one of the first and second side surfaces are crossed to form with the edge of the top surface
The lower edge intersection point being crossed to form, wherein, first and second side surface is for the adjacent with top surface of the object and adjacent each other
Two side surfaces connect；
It is based at least partially on the length and width of object described in the central intersection point and top edge intersection point calculation；And
It is based at least partially on the height of object described in the lower edge intersection point calculation.
11. the three-dimensional information as described in claim 9 or 10 obtains system, wherein, the three-dimensional information obtains system and is constructed
For the handheld apparatus for measuring packing case size.
12. three-dimensional information as claimed in claim 11 obtains system, wherein, the pattern projection module passes through a mounting bracket
Fixation is removably installed with the imaging unit.
13. three-dimensional information as claimed in claim 12 obtains system, wherein, the imaging unit and the processing unit integrate
In mobile phone, PDA or tablet computer.
14. the three-dimensional information as described in claim 9 or 10 obtains system, wherein, the pattern projection module is with the side of stroboscopic
Formula intermittently projects the measurement pattern, and the projection that the imaging unit obtains the object has the measurement pattern
Image and do not project it is described measurement pattern image.
15. a kind of method for three-dimensional measurement for being used to measure approximately parallelepiped body dimension of object, including：
Measurement pattern is projected to the object using pattern projection module, which includes at least two lines bar, institute with pattern
Lines are stated in the measurement with being crossed to form at least one central intersection point in pattern, and the projection is so that the central intersection point
Be projected on the top surface of the object, and cause the lines be projected the top surface and with top surface adjoining first and the
On two side surfaces, the edge of the lines and the top surface is crossed to form top edge intersection point, and with first and second side table
The lower edge intersection point that the lower edge at least one of face is crossed to form；
Using the imaging unit relative to the pattern projection module with definite relative position, acquisition projection thereon has described
The image of the object of measurement pattern, described image show the top surface and the first side surface and the second side table of the object
Face；
Determine the position of the central intersection point, top edge intersection point and lower edge intersection point in described image；
It is based at least partially on the length and width of object described in the central intersection point and top edge intersection point calculation；And
It is based at least partially on the height of object described in the lower edge intersection point calculation.
16. method for three-dimensional measurement as claimed in claim 15, wherein, the central intersection point and upper of being based at least partially on
The length and width of object includes described in edge intersection point calculation：
Position in the measurement pattern of position, the center intersection point based on central intersection point in described image and described
The definite position relationship between pattern projection module and imaging unit, using triangulation, calculates the center intersection point
Locus；
The locus for being based at least partially on the central intersection point determines the locus of the top surface；
The position of locus and the top edge intersection point in the picture based on the top surface, calculate the top surface length and
Width.
17. the method for three-dimensional measurement as described in claim 15 or 16, wherein it is determined that top edge intersection point and/or lower edge intersection point
Position in described image includes：
Characteristic point of the extraction corresponding to top edge intersection point and/or lower edge intersection point in described image；Or
Calculate lines projected on two adjacent surfaces formation straight line intersection point, as the lines with it is described the two
The top edge intersection point or lower edge intersection point that the edge that surface shares is crossed to form.
18. the method for three-dimensional measurement as described in claim 15 or 16, wherein, in the lines in the measurement pattern
At least one central near intersections be disconnect, formed breakaway poing；And
The locus for being based at least partially on the central intersection point determines that the locus of the top surface includes：Calculate institute
State the locus of breakaway poing；And based on the central locus of intersection point and the locus of breakaway poing, calculate top surface
Locus.
19. method for three-dimensional measurement as claimed in claim 15, wherein, the measurement pattern includes forming at least three centers
The a plurality of lines of intersection point；And
The locus for determining the top surface includes：Described in locus based at least three central intersection points calculates
The locus of top surface.
20. method for three-dimensional measurement as claimed in claim 15, wherein, the measurement includes at least four lines, institute with pattern
Projection is stated so that each edge of at least four lines and object top surface is crossed to form at least two top edge intersection points.
21. method for three-dimensional measurement as claimed in claim 15, wherein, measurement pattern includes two groups of parallel lines, every group
Parallel lines include two lines bar, this two groups of parallel lines form four central intersection points；
It is described projection so that two groups of parallel lines in one group intersect with one group of opposite edge of object top surface and with the first side
The lower edge on surface intersects, and another group intersects and in the lower edge of the second side surface with another group of opposite edge of the top surface
It is intersecting.
22. method for three-dimensional measurement as claimed in claim 21, wherein, it is crossed to form based on each group of parallel lines with same edge
Two top edge intersection points or lower edge intersection point, calculate the position at the same edge.
23. method for three-dimensional measurement as claimed in claim 22, wherein, the position at four edges of the top surface based on the object
Put, calculate the position on four vertex of top surface, so as to calculate the length and width of top surface.
24. method for three-dimensional measurement as claimed in claim 22, wherein, the lower edge based on the first side surface and the second side surface
Position, the intersection point of the lower edge of the first side surface and the second side surface is calculated, so as to calculate the height of object.
25. a kind of three-dimensional information processing unit, including：Processor；The memory instructed with storage program, wherein working as described program
When instruction is performed by the processor so that the processor performs following operation：
The image of object is received, wherein the object substantially rectangular shape, has been projected measurement pattern thereon, the measurement
Include at least two lines bar with pattern, the lines are in measurement with being crossed to form at least one central intersection point in pattern；
Lines in central intersection point and the measurement pattern that processing described image is projected on object top surface with detecting
Top edge intersection point and lower edge with least one of the first and second side surfaces are crossed to form with the edge of the top surface
The lower edge intersection point being crossed to form, wherein, first and second side surface is for the adjacent with top surface of the object and adjacent each other
Two side surfaces connect；
It is based at least partially on the length and width of object described in the central intersection point and top edge intersection point calculation；And
It is based at least partially on the height of object described in the lower edge intersection point calculation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711338694.XA CN107907055B (en) | 2017-12-14 | 2017-12-14 | Pattern projection module, three-dimensional information acquisition system, processing device and measuring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711338694.XA CN107907055B (en) | 2017-12-14 | 2017-12-14 | Pattern projection module, three-dimensional information acquisition system, processing device and measuring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107907055A true CN107907055A (en) | 2018-04-13 |
| CN107907055B CN107907055B (en) | 2024-01-26 |
Family
ID=61868887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711338694.XA Active CN107907055B (en) | 2017-12-14 | 2017-12-14 | Pattern projection module, three-dimensional information acquisition system, processing device and measuring method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107907055B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108895961A (en) * | 2018-05-24 | 2018-11-27 | 南京阿凡达机器人科技有限公司 | A kind of measurement method, measuring device and the adhesive band of cabinet size |
| CN109254476A (en) * | 2018-09-08 | 2019-01-22 | 深圳阜时科技有限公司 | A kind of optical projection method, method for sensing and object dimensional information application method |
| CN109631770A (en) * | 2018-12-26 | 2019-04-16 | 深圳市合尔为科技有限公司 | The measuring device and measuring method of dimension of object |
| CN110221309A (en) * | 2019-04-30 | 2019-09-10 | 深圳市光鉴科技有限公司 | 3D imaging device and electronic equipment based on asynchronous ToF discrete point cloud |
| CN111272070A (en) * | 2020-03-05 | 2020-06-12 | 南京华捷艾米软件科技有限公司 | Structured light reference image acquisition device and method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002206919A (en) * | 2001-01-10 | 2002-07-26 | Fuji Xerox Co Ltd | Three-dimensional shape measuring device and method therefor |
| CN1841027A (en) * | 2005-03-28 | 2006-10-04 | 索尼株式会社 | Displacement detection apparatus, displacement measuring apparatus and fixed point detection apparatus |
| CN101221040A (en) * | 2007-01-11 | 2008-07-16 | 宝山钢铁股份有限公司 | Steel bar plate dimensional measurement method and device |
| US20110221891A1 (en) * | 2010-03-10 | 2011-09-15 | Canon Kabushiki Kaisha | Information processing apparatus, processing method therefor, and non-transitory computer-readable storage medium |
| JP2013253799A (en) * | 2012-06-05 | 2013-12-19 | Panasonic Corp | Size measurement device |
| CN104634276A (en) * | 2015-02-12 | 2015-05-20 | 北京唯创视界科技有限公司 | Three-dimensional measuring system, photographing device, photographing method, depth calculation method and depth calculation device |
| CN207600393U (en) * | 2017-12-14 | 2018-07-10 | 北京驭光科技发展有限公司 | Pattern projection module, three-dimensional information obtain system and processing unit |
-
2017
- 2017-12-14 CN CN201711338694.XA patent/CN107907055B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002206919A (en) * | 2001-01-10 | 2002-07-26 | Fuji Xerox Co Ltd | Three-dimensional shape measuring device and method therefor |
| CN1841027A (en) * | 2005-03-28 | 2006-10-04 | 索尼株式会社 | Displacement detection apparatus, displacement measuring apparatus and fixed point detection apparatus |
| CN101221040A (en) * | 2007-01-11 | 2008-07-16 | 宝山钢铁股份有限公司 | Steel bar plate dimensional measurement method and device |
| US20110221891A1 (en) * | 2010-03-10 | 2011-09-15 | Canon Kabushiki Kaisha | Information processing apparatus, processing method therefor, and non-transitory computer-readable storage medium |
| JP2013253799A (en) * | 2012-06-05 | 2013-12-19 | Panasonic Corp | Size measurement device |
| CN104634276A (en) * | 2015-02-12 | 2015-05-20 | 北京唯创视界科技有限公司 | Three-dimensional measuring system, photographing device, photographing method, depth calculation method and depth calculation device |
| CN207600393U (en) * | 2017-12-14 | 2018-07-10 | 北京驭光科技发展有限公司 | Pattern projection module, three-dimensional information obtain system and processing unit |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108895961A (en) * | 2018-05-24 | 2018-11-27 | 南京阿凡达机器人科技有限公司 | A kind of measurement method, measuring device and the adhesive band of cabinet size |
| CN109254476A (en) * | 2018-09-08 | 2019-01-22 | 深圳阜时科技有限公司 | A kind of optical projection method, method for sensing and object dimensional information application method |
| CN109254476B (en) * | 2018-09-08 | 2023-10-24 | 深圳阜时科技有限公司 | Optical projection method, sensing method and object three-dimensional information application method |
| CN109631770A (en) * | 2018-12-26 | 2019-04-16 | 深圳市合尔为科技有限公司 | The measuring device and measuring method of dimension of object |
| CN110221309A (en) * | 2019-04-30 | 2019-09-10 | 深圳市光鉴科技有限公司 | 3D imaging device and electronic equipment based on asynchronous ToF discrete point cloud |
| CN110221309B (en) * | 2019-04-30 | 2021-08-17 | 深圳市光鉴科技有限公司 | 3D imaging device and electronic equipment based on asynchronous ToF discrete point cloud |
| CN111272070A (en) * | 2020-03-05 | 2020-06-12 | 南京华捷艾米软件科技有限公司 | Structured light reference image acquisition device and method |
| CN111272070B (en) * | 2020-03-05 | 2021-10-19 | 南京华捷艾米软件科技有限公司 | A structured light reference image acquisition device and method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107907055B (en) | 2024-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10502557B2 (en) | Method for the three dimensional measurement of a moving objects during a known movement | |
| CN107907055A (en) | Pattern projection module, three-dimensional information obtain system, processing unit and measuring method | |
| US10582188B2 (en) | System and method for adjusting a baseline of an imaging system with microlens array | |
| AU2008296518B2 (en) | System and method for three-dimensional measurement of the shape of material objects | |
| JP6621836B2 (en) | Depth mapping of objects in the volume using intensity variation of light pattern | |
| US9529945B2 (en) | Robot simulation system which simulates takeout process of workpieces | |
| US10152800B2 (en) | Stereoscopic vision three dimensional measurement method and system for calculating laser speckle as texture | |
| US20150070468A1 (en) | Use of a three-dimensional imager's point cloud data to set the scale for photogrammetry | |
| Pinto et al. | Regular mesh measurement of large free form surfaces using stereo vision and fringe projection | |
| Fawzy | Study the accuracy of digital close range photogrammetry technique software as a measuring tool | |
| US20200393246A1 (en) | System and method for measuring a displacement of a mobile platform | |
| CN103890541A (en) | Device, method, and program for measuring diameter of cylindrical object | |
| Zhou et al. | Constructing feature points for calibrating a structured light vision sensor by viewing a plane from unknown orientations | |
| US7046839B1 (en) | Techniques for photogrammetric systems | |
| JP2896539B2 (en) | How to detect unique information such as object position and angle | |
| CN207600393U (en) | Pattern projection module, three-dimensional information obtain system and processing unit | |
| JP2005106491A (en) | System for measuring three-dimensional shape of head part | |
| JP2006329817A (en) | Acquisition method of target coordinate in three-dimensional measurement, and target used therefor | |
| WO2017095259A1 (en) | Method for monitoring linear dimensions of three-dimensional entities | |
| Yasuda et al. | 360 degrees Three-Dimensional measurement using five measuring systems | |
| JP2005121674A (en) | Method for synchronizing coordinates system of a plurality of three-dimensional shape measuring devices | |
| JP2003294433A (en) | Method for synchronizing coordinate systems of plural three dimensional shape measuring devices | |
| Kim et al. | Shape Acquisition System Using an Handheld Line Laser Pointer Without Markers | |
| da Costa Pinto et al. | OPTICAL MEASUREMENT, COMPARISON AND SIGNALING OF LARGE FREE FORM SURFACES | |
| Pinto et al. | Optical measurement and comparison of large free form surfaces through a regular mesh |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |