CN107906424A - A kind of LED spotlights - Google Patents

Abstract

The invention discloses an LED spotlight, which comprises a heat dissipation component with a through hole, a connection plate and a light emitting module; Conducted to the heat dissipation component; wherein, the outer surface of the heat dissipation component is serrated. The heat generated by the light-emitting module in the LED spotlight can be transmitted to the heat dissipation part through the connection plate first, and then the heat is dissipated by the heat dissipation part, and the heat dissipation part is laid on the surface of the connection plate. The outer surface of the component is serrated, which is convenient for air circulation, and can increase the heat dissipation area between the light-emitting module and the air. Compared with the traditional light-emitting module that directly installs multiple heat sinks vertically in the LED spotlight, the heat dissipation effect is better. Improved cooling efficiency.

Description

An LED spotlight

technical field

The invention relates to the technical field of semiconductor lighting, in particular to an LED spotlight.

Background technique

Light-emitting diode (LED), as a new solid-state lighting source in the 21st century, occupies a large market share due to its advantages of high photoelectric conversion efficiency, environmental protection and pollution-free, high reliability, fast response time, high radiation efficiency, and long life. Semiconductor lighting technology Realize the rapid development of the third generation lighting. Spotlights are widely used in large-scale performances, sports events, various exhibitions and indoor and outdoor commercial activities. At the same time, because of its narrow light exposure, high light intensity, and easy concentration in a specific area, it is still the most used light for photography. Traditional incandescent lamps and halogen lamps have basically been replaced by LED spotlights due to their high energy consumption, high heat generation, and short lifespan.

The main function of the LED spotlight is to achieve the convergence of light and to ensure sufficient brightness, which requires sufficient power for the spotlight drive power supply. The LED light source is a cold light source, and the working temperature cannot be too high. Therefore, heat dissipation design is an essential part of LED light source. Even the currently used LED flip chips can enhance heat dissipation and improve light efficiency. However, the heat dissipation effect of the LED spotlight is still not good, because the irrationality of the heat dissipation structure and the singleness of the choice of composite materials lead to heat accumulation and cause the spotlight to increase the speed of light decay during operation, so choose a composite material with high thermal conductivity And it is particularly important to explore a reasonable heat dissipation structure. Existing heat dissipation solutions include fans, heat sinks, heat pipes, etc. Taking heat sinks as an example, the traditional way is to install multiple heat sinks vertically in the LED spotlight. For light-emitting modules, these methods have low heat dissipation efficiency, and may lead to reduced stability and increased complexity of lamps, thereby affecting light efficiency.

It can be seen that how to overcome the problem of increasing light decay speed caused by the low heat dissipation efficiency of traditional LED spotlights during the working process is a problem to be solved urgently by those skilled in the art.

Contents of the invention

An embodiment of the present application provides an LED spotlight to solve the problem of increasing light decay speed caused by low heat dissipation efficiency in the conventional LED spotlight in the prior art during operation.

In order to solve the above technical problems, the present invention provides an LED spotlight, comprising:

A heat dissipation component with through holes, a connecting plate and a light emitting module;

The heat dissipation component is laid flat on the surface of the connection board, and the other surface of the connection plate is connected to the light emitting module to conduct the heat generated by the light emitting module to the heat dissipation component;

Wherein, the outer surface of the heat dissipation component is serrated.

Preferably, the width from the tooth root to the tooth top of each tooth piece on the outer surface of the heat dissipation component gradually decreases.

Preferably, the light emitting module includes:

A plurality of LED flip chips, a composite substrate and a first thermally conductive adhesive layer, the composite substrate is located between the first thermally conductive adhesive layer and each of the LED flip chips, and the first thermally conductive layer is bonded to the connecting plate.

Preferably, the composite substrate includes:

An AlN ceramic layer, a pyrolytic graphite layer and a metal copper layer, the pyrolytic graphite layer is located between the AlN ceramic layer and the metallic copper layer, and the AlN ceramic layer is bonded to each of the LED flip chips.

Preferably, it also includes:

A second thermally conductive adhesive layer located between each LED flip chip and the composite substrate.

Preferably, it also includes:

A light-blocking component with a plurality of light through holes connected to the light-emitting module and the light-emitting module in the LED spotlight, the light-blocking component is used to converge the light emitted by each of the LED flip chips, so The light through hole corresponds to each of the LED flip chips so that the light emitted by each of the LED flip chips is transmitted to the light output module through the light through hole.

Preferably, the light output module includes:

A light output mirror, a lampshade and a lens, the lens is arranged at the light inlet of the lampshade, and the light outlet mirror is arranged at the light outlet of the lampshade.

Preferably, it is characterized in that it also includes:

A high temperature resistant strong adhesive layer, the light blocking component is connected to the light output module through the high temperature resistant strong adhesive layer.

Preferably, it also includes:

The metallic silver layer and/or the two-dimensional photonic crystal layer coated on the inner wall of the lampshade.

Preferably, the lens is specifically a planar convex lens.

Compared with the prior art, the LED spotlight provided by the present invention includes a heat dissipation component with a through hole, a connection plate and a light emitting module; connected to conduct the heat generated by the light emitting module to the heat dissipation component; wherein, the outer surface of the heat dissipation component is serrated. The heat generated by the light-emitting module in the LED spotlight can be conducted to the heat dissipation part through the connection plate first, and then the heat transmitted by the connection plate can be dissipated by the heat dissipation part, so that the final light intensity emitted by the LED spotlight can be higher. In the LED spotlight There are through holes on the heat dissipation part, the outer surface of the heat dissipation part is jagged, and the heat dissipation part is laid flat on the surface of the connecting plate, which is convenient for air circulation and can increase the heat dissipation area between the light emitting module and the air. Compared with the light-emitting module in which the heat sink is vertically installed in the LED spotlight, the heat dissipation effect is better, thereby improving the heat dissipation efficiency and reducing the light decay speed of the LED spotlight.

Description of drawings

Fig. 1 is a schematic structural diagram of an LED spotlight provided by an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of a composite substrate in an LED spotlight provided by an embodiment of the present invention;

3 is a top view of a heat dissipation component in an LED spotlight provided by an embodiment of the present invention;

Fig. 4 is a schematic diagram of the overall structure of an LED spotlight provided by an embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

The core of the present invention is to provide an LED spotlight, which can solve the problem of increasing light decay speed caused by low heat dissipation efficiency of traditional LED spotlights in the working process.

In order to enable those skilled in the art to better understand the solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Fig. 1 is a schematic structural diagram of an LED spotlight provided by an embodiment of the present invention, as shown in Fig. 1 , including: a heat dissipation component 101 with through holes, a connection plate 102 and a light emitting module 103; the heat dissipation component 101 is tiled on the connection plate 102 The other surface of the connection plate 102 is connected to the light emitting module 103 to conduct the heat generated by the light emitting module 103 to the heat dissipation component 101; wherein, the outer surface of the heat dissipation component 101 is in a sawtooth shape.

In the LED spotlight provided in this example, the heat dissipation component 101 is tiled on the surface of the connecting plate 102, and the other surface of the connecting plate 102 is connected with the light-emitting module 103, so that the heat generated by the light-emitting module 103 can be directly conducted through the connecting plate 102 to Heat dissipation component 101, and there is a through hole on the heat dissipation component 101, and the outer surface of the heat dissipation component 101 is serrated at the same time. The special structure of the heat dissipation component itself can improve the heat dissipation efficiency. In Fig. 1, the through hole is covered by the connecting plate 102, so the through hole It is not shown in Fig. 1, setting the through hole on the heat dissipation part 101 can not only dissipate the heat generated by the light emitting module 103 in time, but also place the driving power of the LED lamp in the through hole, reducing the size of the LED spotlight. The volume of the through hole can be set at the center of the heat dissipation component 101, or slightly off the center. The number of the through hole can be one or more, depending on the actual situation, and there is no rigid regulation. . As a preferred embodiment, the width from the dedendum to the tooth top of each tooth piece on the outer surface of the heat dissipation component 101 gradually decreases, that is, the width of the tooth root of each tooth piece on the outer surface of the heat dissipation component 11 is greater than the width of the tooth top, and the tooth pieces are arranged in this way The heat dissipation effect of the structure is better.

An LED spotlight provided by the present invention includes a heat dissipation component with a through hole, a connecting plate and a light emitting module; The heat is conducted to the heat dissipation component; wherein, the outer surface of the heat dissipation component is serrated. The heat generated by the light-emitting module in the LED spotlight can be conducted to the heat dissipation part through the connection plate first, and then the heat transmitted by the connection plate can be dissipated by the heat dissipation part, so that the final light intensity emitted by the LED spotlight can be higher. In the LED spotlight There are through holes on the heat dissipation part, the outer surface of the heat dissipation part is jagged, and the heat dissipation part is flat on the surface of the connecting plate, which is convenient for air circulation and can increase the heat dissipation area between the light emitting module and the air, which is different from the traditional direct multiple Compared with the light-emitting module in which the heat sink is vertically installed in the LED spotlight, the heat dissipation effect is better, thereby improving the heat dissipation efficiency and reducing the light decay speed of the LED spotlight.

On the basis of the above embodiments, as a preferred implementation manner, the light emitting module 103 includes:

A plurality of LED flip-chips, a composite substrate and a first heat-conducting adhesive layer, the composite substrate is located between the first heat-conducting adhesive layer and each LED flip-chip, and the first heat-conducting layer is attached to the connecting plate 102 .

The light-emitting module mainly includes a plurality of LED flip chips, a composite substrate and a first heat-conducting adhesive layer, and each LED flip chip is evenly spaced on the surface of the composite substrate. Composite substrate connection, one side of the first thermally conductive adhesive layer is attached to the other surface of the composite substrate, and the other surface of the first thermally conductive adhesive layer is close to the connecting plate 102, the heat generated by the LED flip chip can pass through the first thermally conductive adhesive layer Transmission to the connection board 102 , the first heat conduction adhesive layer has high heat conduction efficiency. In the embodiment of this application, the LED flip-chip is adopted, which has stronger light efficiency and is easy to achieve high power. Compared with the traditional LED front-mounted chip, the LED flip-chip does not need to be wired, and the LED flip-chip uses silver to replace the ITO of the front-mounted chip. With P electrode, the current spread is significantly improved. The traditional LED front-mounted chip dissipates heat through sapphire, and the LED flip-chip sapphire is on it, which avoids the disadvantage of poor heat dissipation of sapphire.

Fig. 2 is a schematic structural diagram of a composite substrate in an LED spotlight provided by an embodiment of the present invention. As shown in Fig. 2, on the basis of the above embodiments, as a preferred implementation mode, the composite substrate includes:

AIN ceramic layer 21 , pyrolytic graphite layer 22 and metal copper layer 23 , pyrolytic graphite layer 22 is located between the AIN ceramic layer 21 and metal copper layer 23 , and the AIN ceramic layer 21 is attached to each LED flip chip 6 .

Compared with the traditional composite substrate, the composite substrate used in the embodiment of the present application adds a layer of pyrolytic graphite layer 22 between the original AIN ceramic layer 21 and the metal copper layer 23. In practical applications, various The pyrolytic graphite layer 22, the AIN ceramic layer 21 and the metal copper layer 23 are bonded together by welding, and this structure of the composite substrate can improve heat dissipation efficiency.

As shown in Figure 2, preferably also include the second thermally conductive adhesive layer 24 on the lower surface of each LED flip chip 6, and also coat a layer of metal copper layer 25 on the upper surface of the AIN ceramic layer 21, realize LED flip chip 6 Wireless packaging, that is, the direct copper-clad method, is specifically formed by eutectic sintering of ceramic substrates and copper foils at high temperatures (about 1065°C), and is mainly realized through the chemical bonding reaction between Cu-O eutectic liquid phase and alumina. The thickness of the metal copper layer 25 on the upper surface of the AIN ceramic layer 21 is generally about 200um, which can ensure high current conduction.

The production of the pyrolytic graphite layer 22 is mainly divided into two processes. First, graphite is deposited on the substrate through the pyrolysis of hydrocarbons. The local structure of the deposited pyrolytic graphite thin layer is disordered, and it needs to be annealed above 3000 degrees Celsius. In order to form completely dense, highly ordered pyrolytic graphite.

It can be understood that the first thermally conductive adhesive layer and the second thermally conductive adhesive layer 24 are named according to habits and preferences, and have no other special meanings. Of course, the naming method of the thermally conductive adhesive layer will not affect the implementation of the embodiment of the present application .

On the basis of the foregoing embodiments, as a preferred implementation manner, it also includes:

A light-shielding component with a plurality of light through holes connected to the light-emitting module 103 and the light-emitting module in the LED spotlight respectively. The mounting chip 6 is corresponding so that the light emitted by each LED flip chip 6 is transmitted to the light output module through the light through hole.

In the embodiment of the present application, the light blocking part is generally a circular frustum or a conical structure. The light blocking part can be selected from light and opaque materials such as plastic with strong plasticity, and the light through holes are opened according to the distribution of the LED flip chip 6 to ensure that it is close to the LED. The diameter of the light through hole of the flip chip 6 is small, and the diameter of the light through hole away from the LED flip chip 6 (near the light output module) is large, and the angle is controlled between 15 degrees and 20 degrees. Moreover, the LED spotlight provided by this embodiment is also coated with a metal silver layer or a two-dimensional photonic crystal layer inside the light through hole, which can converge the light emitted by each LED flip chip 6 , that is, can concentrate light.

On the basis of the above embodiments, as a preferred implementation manner, the light output module includes:

The light output mirror, the lampshade and the lens, the lens is arranged at the light inlet of the lampshade, and the light outlet mirror is arranged at the light outlet of the lampshade.

The lens is arranged at the light entrance of the lampshade, and the lens is preferably a planar convex lens, which can converge the light emitted by the light emitting module 103 and reduce light reflection. A light exit mirror is arranged at the light exit of the lampshade, and the light exit mirror The perspective rate of the LED spotlight is high, which can increase the intensity of the light source emitted by the LED spotlight. The surface of the lens and the light emitting module 103 is a frosted surface, which can reduce the reflection of light. As a preferred embodiment, it also includes: a high temperature resistant super glue layer, a shield The optical component is connected to the optical module through a high temperature resistant super glue layer. Using high-temperature resistant super glue to cure the light-blocking part and the light-emitting module together can increase the firmness of the connection between the light-blocking part and the light-emitting module. The light-shielding component and the light-emitting module can be set in a mold, and how to set it can be determined according to the actual situation, and the present invention is not limited. Preferably, the LED spotlight also includes: a metal silver layer coated on the inner wall of the lampshade and /or the two-dimensional photonic crystal layer, that is, the inner wall of the lampshade has a high reflective layer, which is made of the same material as the high reflective layer on the inner wall of the light through hole, so that double convergence of light can be realized.

In order for those skilled in the art to better understand this solution, the various structures of the LED spotlight are described in detail below. Figure 3 is a top view of a heat dissipation component in an LED spotlight provided by an embodiment of the present invention. A schematic diagram of the overall structure of an LED spotlight provided in the embodiment. The LED spotlight provided in the embodiment of FIG. 4 is the optimal implementation, as shown in FIG. 5. Light blocking component 4, LED flip chip 6, fixing component 7, composite substrate 8, first heat conduction layer 9, connecting plate 102, heat dissipation component 101, through hole 10 on the heat dissipation component 101, and driving power supply 11.

In order to prevent the mutual influence of different LED flip-chips 6 when they emit light and make the lights more convergent, the light-emitting module 103 (ED flip-chip 6, composite substrate 8, first heat-conducting layer 9) and the light-emitting module (light-emitting mirror 1, lampshade 2 , The light blocking component 4 is arranged between the lenses 3). According to the distribution of each LED flip chip 6 , a reflective cup-shaped light through hole 5 is opened in the light blocking member 4 . The diameter of the light through hole 5 close to the LED flip chip 6 is small, and the diameter of the light through hole 5 away from the light through hole 5 of the LED flip chip 6 (near the lens 3) is large, and the angle is controlled between 15 degrees and 20 degrees. .

In order to fixedly connect the light-shielding component 4 with the light-emitting module 103, there is a fixing assembly 7 between the light-shielding component 4 and the light-emitting module 103. The thickness of the fixing component 7 is controlled within 3mm, and it is fixed to the rear-end heat dissipation component 101 of the LED spotlight. Together. The light emitted by the LED flip chip 6 gathers the light to the front end of the lens 3 through the independent light through hole 5. The lens 3 adopts a planar convex lens, and the plane of the light-incoming surface of the lens 3 adopts a frosted mirror surface, which can reduce light reflection.

The lampshade 2 tightly covers the lens 3. The lampshade 2 adopts a hemispherical structure, and the inner surface is coated with a highly reflective material, which can further converge the part of the divergent light converged by the lens 3 again. The light can be converged twice to form a The small-angle light beam first shot improves the utilization rate of light, that is, increases the light intensity and reduces light pollution at the same time. A light-emitting mirror 1 is arranged on the outermost side of the lampshade 2, and the light-emitting mirror 1 is made of glass with high transmittance, which can increase the light intensity and protect the function of the internal structure at the same time.

LED flip chip 6 can achieve high power, and the stability of wireless bonding is better. At the same time, the LED flip chip 6 has a high light output rate, which meets the requirement of high brightness of the spotlight, and the LED flip chip 6 is directly connected to the composite substrate 8 for better heat dissipation.

Utilizing the special structure of the heat dissipation component 101 itself, the heat dissipation rate can be improved, and the use of a heat dissipation fan can be avoided at the same time, energy consumption can be reduced, and use stability can be improved. Both the heat dissipation component 101 and the connecting plate 102 are made of a composite material of double-layer metal mixed with pyrolytic graphite, and the heat dissipation effect will be better. The connecting board 102 and the heat dissipation component 101 are connected by welding the packaging substrate, which ensures a small thermal resistance and enhances the heat dissipation capability. There is a through hole 10 inside the heat dissipation part 101. Such a structure can be more conducive to heat dissipation, and the driving power supply 11 can be fixed in the through hole 10, which can reduce the overall lamp volume of the LED spotlight. The heat dissipation part 101 and the through hole on the heat dissipation part 101 The positional relationship between the hole 10 and the driving power source 11 can be referred to FIG. 4 . The heat dissipation component 101 shown in FIG. 4 is a top view of the heat dissipation component 101 shown in FIG. 1 .

The LED spotlight provided by the present invention has been introduced in detail above. In this paper, several examples are used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; meanwhile, for those of ordinary skill in the art, according to the present invention There will be changes in the specific implementation and scope of application. In summary, the content of this specification should not be understood as a limitation of the present invention. The modifications, equivalent replacements, improvements, etc. made shall be included in this application.

It should also be noted that in this specification, relative terms such as first and second are only used to distinguish one operation from another, and do not necessarily require or imply that there is a relationship between these entities or operations. Any such actual relationship or sequence. Moreover, the term "comprising" and similar words, such that a unit, device or system comprising a series of elements includes not only those elements, but also other elements not expressly listed, or includes the elements designed for such a unit, device or system. inherent elements.

Claims (10)

1. A LED spotlight, characterized in that, comprising: A heat dissipation component with through holes, a connecting plate and a light emitting module; The heat dissipation component is laid flat on the surface of the connection board, and the other surface of the connection plate is connected to the light emitting module to conduct the heat generated by the light emitting module to the heat dissipation component; Wherein, the outer surface of the heat dissipation component is serrated. 2 . The LED spotlight according to claim 1 , wherein the width from the tooth root to the tooth top of each tooth piece on the outer surface of the heat dissipation component gradually decreases. 3 . 3. The LED spotlight according to claim 1, wherein the light emitting module comprises: A plurality of LED flip chips, a composite substrate and a first thermally conductive adhesive layer, the composite substrate is located between the first thermally conductive adhesive layer and each of the LED flip chips, and the first thermally conductive layer is bonded to the connecting plate. 4. The LED spotlight according to claim 3, wherein the composite substrate comprises: An AlN ceramic layer, a pyrolytic graphite layer and a metal copper layer, the pyrolytic graphite layer is located between the AlN ceramic layer and the metallic copper layer, and the AlN ceramic layer is bonded to each of the LED flip chips. 5. The LED spotlight according to claim 3, further comprising: A second thermally conductive adhesive layer located between each LED flip chip and the composite substrate. 6. The LED spotlight according to claim 3, further comprising: A light-blocking component with a plurality of light through holes connected to the light-emitting module and the light-emitting module in the LED spotlight, the light-blocking component is used to converge the light emitted by each of the LED flip chips, so The light through hole corresponds to each of the LED flip chips so that the light emitted by each of the LED flip chips is transmitted to the light output module through the light through hole. 7. The LED spotlight according to claim 6, wherein the light emitting module comprises: A light output mirror, a lampshade and a lens, the lens is arranged at the light inlet of the lampshade, and the light outlet mirror is arranged at the light outlet of the lampshade. 8. The LED spotlight according to claim 6, further comprising: A high temperature resistant strong adhesive layer, the light blocking component is connected to the light output module through the high temperature resistant strong adhesive layer. 9. The LED spotlight according to claim 7, further comprising: The metallic silver layer and/or the two-dimensional photonic crystal layer coated on the inner wall of the lampshade. 10. The LED spotlight according to claim 7, wherein the lens is specifically a planar convex lens.