CN107880822A - 一种导热胶粘剂及其制作的无基材高导热性双面胶 - Google Patents
一种导热胶粘剂及其制作的无基材高导热性双面胶 Download PDFInfo
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Abstract
本发明涉及胶粘剂技术领域，具体是一种导热胶粘剂及其制作的无基材高导热性双面胶，由下述重量份数组份的原料制备而成：丙烯酸酯树脂：80‑120份；导热分散液：20～50份；异氰酸酯交联剂：1～5份；其中丙烯酸酯树脂包括丙烯酸酯单体、引发剂、溶剂、松香季戊四醇酯和松香山梨醇酯，丙烯酸酯单体包括丙烯酸丁酯、丙烯酸二乙基已酯、丙烯酸羟乙酯、甲基丙烯酸甲酯和丙烯酸磷酸酯，溶剂为乙酸乙酯，引发剂为偶氮二异丁腈或过氧化二异丙苯。无基材高导热性双面胶包括上述导热胶粘剂以及分别设置在导热胶粘剂两面的第一离型膜和第二离型膜。本发明导热胶粘剂在加入导热填料后，粘性高，且高温下粘接牢靠，而且，在加入同样比例导热填料下，具有更高的导热系数。
Description
技术领域
本发明涉及胶粘剂技术领域，具体是一种导热胶粘剂及其制作的无基材高导热性双面胶。
背景技术
随着集成电路的密集化、微型化程度越来越高，电子组件变得更小而且更高速运作，散热要求也越来越高，为了尽快将热从发热源散发出去，我们通过利用高导热的散热材料将热量传递至空气或其它物质中，从而达到散热的效果。目前，灯源由白炽灯逐渐转变为LED节能灯，LED是一种固态的半导体组件，不同种类的LED能够发出从红外线到蓝光之间、与紫光到紫外线之间等不同波长的光线，LED灯在使用过程中产生大量热量，对于大功率LED产品尤为突出，芯片温度对LED的发光效率和稳定性影响极大，有资料表明，温度每升高20℃，LED发光效率下降15～20％，当温度高于其额定工作温度8℃，工作寿命将降低50％。LED日光灯，它包括灯管，灯管中安装灯板、灯珠、电源，会使用很多胶带进行固定，因此研发高性能导热胶带对于促进LED产业的快速可持续发展具有重要的意义。
现有技术中，用于LED的双面胶带主要有棉纸双面胶带、PET双面胶带、无基材双面胶带，用于LED灯双面胶带的胶粘剂类型有环氧树脂胶粘剂、聚氨酯胶粘剂、丙烯酸酯胶粘剂、有机硅树脂胶粘剂，用于双面胶的导热填料有以下几种：①无机填料，比如氮化鹏、氧化铝、氮化硅等；②石墨类填料，比如导热石墨、碳钠米管、导热石墨粉、石墨片；③金属填料，比如银、铝、铜等金属粉末，还有液态金属。
但现有技术中采用的胶粘剂，存在以下问题：①导热系数不高，散热效果不佳，微米级导热填料比表面积不够大，而又要保证胶带粘性，不能加入过量的导热填料，此情况下不会形成良好的导热通道，另外，而纳米级导热填料易团聚，分散不均匀，同样不能保证有良好的导热通道；②加入导热填料会大幅降低胶带粘性，在高温下粘性更低，会有脱胶风险，胶粘剂中要达到较好的导热效果，需要加入较高比例的导热填料，填料将稀释胶粘剂比例，且导热填料大部分是极性物质，会与胶粘剂极性官能团结合，提供粘性的极性官能团失效，大幅度降低胶粘剂的粘接性能。高温下，胶粘剂的流动性增加，粘性会进一步降低，会有粘接不牢的风险。
发明内容
为了克服以上现有技术的不足，本发明的任务是提供一种导热胶粘剂及其制作及其制作的无基材高导热性双面胶，该导热胶粘剂在加入导热填料后，粘性高，且高温下粘接牢靠，而且，在加入同样比例导热填料下，具有更高的导热系数。
本发明任务一种导热胶粘剂通过下述技术方案实现：
一种导热胶粘剂，包括丙烯酸酯树脂、异氰酸酯交联剂和导热分散液，按如下重量份数组份组成：
优选，所述丙烯酸酯树脂包括丙烯酸酯单体、引发剂、溶剂、松香季戊四醇酯和松香山梨醇酯，所述丙烯酸酯单体包括丙烯酸丁酯、丙烯酸二乙基已酯、丙烯酸羟乙酯、甲基丙烯酸甲酯和丙烯酸磷酸酯，所述溶剂为乙酸乙酯，所述引发剂为偶氮二异丁腈或过氧化二异丙苯，按如下重量份数组份组成：
优选，所述丙烯酸酯树脂的制备工艺为：将所述丙烯酸酯单体、溶剂和引发剂在温度为60-100℃、搅拌速度为200-400r/min下合成5-30小时，然后加入松香季戊四醇酯和松香山梨醇酯，并搅拌均匀。
优选，所述导热分散液包括导热填料、溶剂、偶联剂和表面活性剂，其中导热填料为纳米高导热石墨和纳米陶瓷粉末，偶联剂为KH560、KH550和KH570，溶剂为乙酸乙酯，表面活性剂为甜菜碱型表面活性剂和聚氧乙烯醚表面活性剂，按如下重量份数组份组成：
优选，所述导热分散液的制备工艺为：将导热填料、偶联剂、溶剂和表面活性剂放在一起在搅拌速度1000-3000R/min下进行搅拌分散，然后再通过高压均质机，进一步分散导热填料。
本发明还提供了一种使用前述的导热胶粘剂制作的无基材高导热性双面胶，包括前述的导热胶粘剂，以及分别设置在导热胶粘剂两面的第一离型膜和第二离型膜，所述第一离型膜的厚度为25-50um，第二离型膜的厚度为50-75um，导热胶粘剂的厚度为10-50um。
本发明还提供了一种基于前述无基材高导热性双面胶的制备方法，包括以下步骤：
A、将所述胶粘剂以500～2000r/min的速度搅拌30～60min；
B、将步骤A中搅拌均匀的胶粘剂涂布在所述第二离型膜面上，涂布速度为5-30m/min，并在50-100℃的环境下干燥；
C、将所述第一离型膜贴合在步骤B中干燥好的膨胀胶粘剂上；
D、将步骤C中贴合好的胶粘带进行收卷；
E、将步骤D中收卷好的胶粘带在30-50℃的温度下进行熟化2-4天，即制得所述无基材高导热性双面胶。
与现有技术相比，本发明的导热胶粘剂的有益效果是：①合成丙烯酸酯树脂中，加入丙烯酸磷酸酯单体，能提高胶粘剂粘性；②丙烯酸酯树脂合成后，加入松香季戊四醇酯和松香山梨醇酯，能进一步提高胶粘剂的剥离强度；③导热分散液分散过程中，加入甜菜碱型表面活性剂、聚氧乙烯醚表面活性剂和偶联剂，能将纳米级分散液均匀分散于丙烯酸树脂中；④分散液在高压均质机分散，进一步提高导热粒子的比表面积，提高导热系数，并分散更加均匀。
附图说明
图1是实施例2中无基材高导热性双面胶的结构示意图；
图2是实施例2中无基材高导热性双面胶的生产工序图；
其中，100-导热胶粘剂层，200-第一离型膜，300-第二离型膜，1-胶料配置区，2-涂布机，3-待涂布第二离型膜放卷区，4-烘箱，5-待贴合第一离型膜放卷区，6-贴合辊区，7-半成品收卷区，8-熟化区。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图和实施例，对本发明进行进一步详细说明。应当理解，此处说描述的具体实施例仅仅用于解释本发明，并不用于限定本发明。
实施例1：
一种导热胶粘剂，包括丙烯酸酯树脂、异氰酸酯交联剂和导热分散液，按如下重量份数组份组成：
其中丙烯酸酯树脂包括丙烯酸酯单体、引发剂、溶剂、松香季戊四醇酯和松香山梨醇酯，所述丙烯酸酯单体包括丙烯酸丁酯、丙烯酸二乙基已酯、丙烯
丙烯酸酯树脂的制备工艺为：将所述丙烯酸酯单体、溶剂和引发剂在温度为60-100℃、搅拌速度为200-400r/min下合成5-30小时，然后加入松香季戊四醇酯和松香山梨醇酯，并搅拌均匀。
其中导热分散液包括导热填料、溶剂、偶联剂和表面活性剂，其中导热填料为纳米高导热石墨和纳米陶瓷粉末，偶联剂为KH560、KH550和KH570，溶剂为乙酸乙酯，表面活性剂为甜菜碱型表面活性剂和聚氧乙烯醚表面活性剂，按如下重量份数组份组成：
导热分散液的制备工艺为：将导热填料、偶联剂、溶剂和表面活性剂放在一起在搅拌速度1000-3000R/min下进行搅拌分散，然后再通过高压均质机，进一步分散导热填料。
实施例2：
如图1所示，一种无基材高导热性双面胶，包括前述的导热胶粘剂层100，以及分别设置在导热胶粘剂层100两面的第一离型膜200和第二离型膜300，第一离型膜200为轻离型膜，第二离型膜300为重离型膜，所述第一离型膜200的厚度为25-50um，离型力为1-20g/25mm；第二离型膜300的厚度为50-75um，离型力为20-50g/25mm；导热胶粘剂层100的厚度为10-50um，剥离强度为1000-2500g/25mm。
在其中一个具体实施例中，如图2所示，一种无基材高导热性双面胶的制备方法，无基材高导热性双面胶在涂胶机上生产，按照生产工序可将生产区域分为：胶料配置区1、涂布机2(转移式刮刀)、待涂布第二离型膜放卷区3、烘箱4、待贴合第一离型膜放卷区5、贴合辊区6、半成品收卷区7、熟化区8。生产工艺包括以下步骤：
A、将胶粘剂在高速搅拌机下以500～2000r/min的速度搅拌30～60min以上；
B、将涂布机2的烘箱4温度设置在50-100℃，将搅拌均匀的胶粘剂用涂布机2涂布在第二离型膜300面上，涂布速度为5-30m/min，经过烘箱4进行干燥；
C、将干燥好的膨胀性胶粘剂在涂布机2的贴合辊区6处贴合至第一离型膜200；
D、将贴合好的胶粘带进行收卷；
E、将收卷好的胶粘带在30-50℃的温度下进行熟化2-4天，即制得所述无基材高导热性双面胶。
该无基材高导热性双面胶的效益包括：
1、经济效益：此产品能给客户解决LED散热问题，并具有很强的粘性，降低高温下粘接不牢的风险，随着客户对此胶带的认可，产品能给公司带来可观的经济效益，也有助于社会推动光源由白炽灯转变为LED节能灯，为节能环保做出一定贡献。
2、研发能力：此产品的研发能提升公司的研发能力，在导热方面和增加胶带粘性上有很大提升，此项研发项目提高公司核心竞争力，也能为行业技术提升贡献力量。
3、产品推广：此产品还可用于其它领域的粘接，比如芯片，CPU，屏幕等粘接。
以上描述仅为本申请的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。
Claims (7)
1.一种导热胶粘剂，其特征在于，包括丙烯酸酯树脂、异氰酸酯交联剂和导热分散液，按如下重量份数组份组成：
2.根据权利要求1所述导热胶粘剂，其特征在于，所述丙烯酸酯树脂包括丙烯酸酯单体、引发剂、溶剂、松香季戊四醇酯和松香山梨醇酯，所述丙烯酸酯单体包括丙烯酸丁酯、丙烯酸二乙基已酯、丙烯酸羟乙酯、甲基丙烯酸甲酯和丙烯酸磷酸酯，所述溶剂为乙酸乙酯，所述引发剂为偶氮二异丁腈或过氧化二异丙苯，按如下重量份数组份组成：
3.根据权利要求2所述导热胶粘剂，其特征在于，所述丙烯酸酯树脂的制备工艺为：将所述丙烯酸酯单体、溶剂和引发剂在温度为60-100℃、搅拌速度为200-400r/min下合成5-30小时，然后加入松香季戊四醇酯和松香山梨醇酯，并搅拌均匀。
4.根据权利要求1所述导热胶粘剂，其特征在于，所述导热分散液包括导热填料、溶剂、偶联剂和表面活性剂，其中导热填料为纳米高导热石墨和纳米陶瓷粉末，偶联剂为KH560、KH550和KH570，溶剂为乙酸乙酯，表面活性剂为甜菜碱型表面活性剂和聚氧乙烯醚表面活性剂，按如下重量份数组份组成：
5.根据权利要求4所述导热胶粘剂，其特征在于，所述导热分散液的制备工艺为：将导热填料、偶联剂、溶剂和表面活性剂放在一起在搅拌速度1000-3000R/min下进行搅拌分散，然后再通过高压均质机，进一步分散导热填料。
6.一种无基材高导热性双面胶，其特征在于，包括如权利要求1-5任一所述的导热胶粘剂，以及分别设置在导热胶粘剂两面的第一离型膜和第二离型膜，所述第一离型膜的厚度为25-50um，第二离型膜的厚度为50-75um，导热胶粘剂的厚度为10-50um。
7.一种基于权利要求6所述无基材高导热性双面胶的制备方法，其特征在于，包括以下步骤：
A、将所述胶粘剂以500～2000r/min的速度搅拌30～60min；
B、将步骤A中搅拌均匀的胶粘剂涂布在所述第二离型膜面上，涂布速度为5-30m/min，并在50-100℃的环境下干燥；
C、将所述第一离型膜贴合在步骤B中干燥好的膨胀胶粘剂上；
D、将步骤C中贴合好的胶粘带进行收卷；
E、将步骤D中收卷好的胶粘带在30-50℃的温度下进行熟化2-4天，即制得所述无基材高导热性双面胶。
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