CN107818961B - A kind of intelligent power module for track vehicle - Google Patents

Abstract

The present invention provides an intelligent power module for rail vehicles. The intelligent power module includes a radiator, which has a cooling liquid inlet and a cooling liquid outlet communicated with the inner cavity of the radiator; a housing assembly, The housing assembly and one side surface of the heat sink form an accommodating cavity; a liner unit arranged in the accommodating cavity, the liner unit has a liner and a power semiconductor chip fixedly arranged on the liner , wherein the lining plate is arranged on the surface of the radiator in a contact manner, and by directly setting the lining plate on one side surface of the radiator, the thermal resistance between the power semiconductor chip and the radiator is reduced, and the thermal resistance between the power semiconductor chip and the radiator is improved. The heat dissipation efficiency of the power module also helps to reduce the size and weight of the power module.

Description

An intelligent power module for rail vehicles

technical field

The invention relates to the technical field of power electronics, in particular to an intelligent power module for rail vehicles.

Background technique

Power semiconductor devices are widely used in the field of rail transit, but standard packaged power semiconductor devices only have the function of switching tubes, and the integration is not high. The converter module, one of the core components of the converter, is composed of standard packaged power semiconductor devices, heat sinks, low-inductance busbars, gate drivers and structural components. , there are still many imperfections in power density, intelligence and convenient applications.

SUMMARY OF THE INVENTION

Aiming at some or all of the above technical problems existing in the prior art, the present invention proposes an intelligent power module for rail vehicles. The intelligent power module has high integration and good heat dissipation effect.

According to an aspect of the present invention, an intelligent power module for rail vehicles is proposed, comprising:

a radiator having a coolant inlet and a coolant outlet communicating with the inner cavity of the radiator,

a housing assembly, the housing assembly and a side surface of the radiator form an accommodating cavity,

a backing plate unit arranged in the accommodating cavity, the backing plate unit having a backing plate and a power semiconductor chip fixedly arranged on the backing plate,

Wherein, the backing plate is arranged on the surface of the heat sink in a contact manner.

In one embodiment, it further includes a low-inductance busbar disposed in the accommodating cavity and located outside the backing plate unit, and the low-inductance busbar includes an alternating current layer, a direct current positive layer and a direct current negative layer distributed in a stacked manner.

In one embodiment, the low-inductance busbar is configured as a frame-shaped structure, and is electrically connected to the conductive layer of the backing plate unit through a bonding wire.

In one embodiment, a DC positive connector located outside the first end of the accommodating cavity is arranged on the DC positive layer, and a DC positive connector located between the first ends of the accommodating cavity is arranged on the DC negative layer an external DC negative connector, the AC layer is provided with an AC connector located outside the second end of the accommodating cavity, wherein the DC positive connector and the DC negative connector are formed to be plugged Pull-out connector.

In one embodiment, both the DC positive connector and the DC negative connector include at least two oppositely spaced elastic pieces.

In one embodiment, a partition is arranged in the accommodating cavity to divide the accommodating cavity into a first accommodating cavity and a second accommodating cavity, a control circuit board is arranged in the first accommodating cavity, and the lining board unit The low-inductance busbar is arranged in the second accommodating cavity, and the control circuit board is configured to be able to be signally connected to the backing board unit.

In one embodiment, pins are provided on the conductive layer of the backing board, and the pins pass through the spacer to be signally connected to the control circuit board.

In one embodiment, an AC connector located outside the second end of the accommodating cavity is provided on the AC layer, a current sensor is provided on the AC connector, and the current sensor is signally connected to the control circuit board.

In one embodiment, guide pins are provided on the first end face of the heat sink.

In one embodiment, at least two threaded holes are provided on the second end face of the heat sink.

In one embodiment, a temperature sensor signally connected to the control circuit board is further included, and the temperature sensor can be arranged on the backing board unit.

According to another aspect of the present invention, it also includes an intelligent power module for rail vehicles, comprising:

a radiator having a coolant inlet and a coolant outlet communicating with the inner cavity of the radiator,

a housing assembly, the housing assembly and a side surface of the radiator form an accommodating cavity,

a backing plate unit arranged in the accommodating cavity, the backing plate unit having a backing plate and a power semiconductor chip fixedly arranged on the backing plate,

Wherein, the liner is arranged on the surface of the heat sink in a contact manner,

a low-inductance busbar arranged in the accommodating cavity and located on the outside of the liner unit, the low-inductance busbar includes a stacked AC layer, a DC positive layer and a DC negative layer, the low-inductance busbar It is constructed as a frame-shaped structure, and is electrically connected with the conductive layer of the liner unit through a bonding wire,

A DC positive connector located outside the first end of the accommodating cavity is arranged on the DC positive layer, and a DC negative connector located outside the first end of the accommodating cavity is arranged on the DC negative layer , an AC connector located outside the second end of the accommodating cavity is arranged on the AC layer, wherein the DC positive connector and the DC negative connector are formed as plug-in connectors, wherein, Both the DC positive connector and the DC negative connector include at least two oppositely spaced elastic pieces,

A partition is arranged in the accommodating cavity to divide the accommodating cavity into a first accommodating cavity and a second accommodating cavity, a control circuit board is arranged in the first accommodating cavity, and the liner unit and the low-inductance mother The row is disposed in the second receiving cavity, and the control circuit board is configured to be able to be signally connected to the backing plate unit,

An AC connector located outside the second end of the accommodating cavity is arranged on the AC layer, a current sensor is arranged on the AC connector, and the current sensor is signally connected to the control circuit board,

It also includes a temperature sensor signally connected to the control circuit board, and the temperature sensor can be provided on the backing plate unit.

Compared with the prior art, the present invention has the advantage that the thermal resistance between the power semiconductor chip and the radiator is reduced by arranging the lining plate on one side surface of the radiator, and the heat dissipation of the intelligent power module is improved. efficiency. At the same time, it is helpful to reduce the volume and weight of the power module by arranging the backing plate on one side surface of the heat sink.

Description of drawings

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, in which:

Figure 1 shows an exploded view of an intelligent power module according to the present invention;

Figure 2 shows a front view of a low-inductance busbar according to the present invention;

3 shows a cross-sectional view of an intelligent power module according to the present invention;

In the drawings, identical parts are given the same reference numerals, which are not drawn to actual scale.

Detailed ways

The present invention will be further described below with reference to the accompanying drawings.

FIG. 1 shows an exploded view of an intelligent power module 100 according to the present invention. As shown in FIG. 1 , the intelligent power module 100 includes a heat sink 1 , a housing assembly 7 and a liner unit 2 . The housing assembly 7 is disposed on one side of the radiator 1 and forms an accommodating cavity 71 with the radiator 1 . The backing plate unit 2 is arranged in the accommodating cavity 71 , and the backing plate unit 2 has a backing plate 21 and a power semiconductor chip 22 fixedly arranged on the backing plate 21 . And the backing plate 21 of the backing plate unit 2 is directly disposed on the side surface of the radiator 1 .

The backing plate 21 of the intelligent power module 100 is directly disposed on the heat sink 1, and the use of a standard substrate for packaging power semiconductor devices is avoided. This arrangement helps to reduce thermal resistance, and at the same time, this arrangement makes the structure of the intelligent power module 100 more compact, which helps to reduce the volume and weight of the intelligent power module 100 . It should be noted that, in this application, the lining plate 21 shown in FIG. 1 is set on the upper surface of the heat sink 1 as an example for description, and for the convenience of expression, the surface on which the lining plate 21 is arranged is also shown in FIG. 1 . The upper surface of the heat sink 1 is referred to as the "first side".

Preferably, the backing plate 21 can be directly fixed on the first side surface of the heat sink 1 by welding. And the power semiconductor chip 22 can also be disposed on the backing plate 21 by welding. This connection structure is simple, and can better transfer the heat generated by the power semiconductor chip 22 to the heat sink 1 . The heat sink 1 can be formed in a square shape. However, the heat sink 1 is not limited to a square shape, for example, it can be designed in any other shape according to specific space requirements.

Preferably, the lining plate units 2 are distributed on the radiator 1 in a matrix. In this way, the lining plate units 2 are closely arranged, the structure of the intelligent power module 100 is optimized, and the volume of the intelligent power module 100 is reduced and the power density thereof is improved.

In one embodiment, low-inductance busbars 3 are arranged on the outer periphery of the backing plate unit 2 . And the low-inductance busbar 3 is arranged in the accommodating cavity 71 to realize power transmission with the backing plate unit 2 . Preferably, the low-inductance bus bar 3 is a frame-type laminated structure, and is electrically connected to the conductive layer of the backing plate unit 2 through a bonding wire 25 . In order to optimize the connection relationship between the liner unit 2 and the low-inductance busbar 3 and simplify the structure, each liner unit 2 needs to be adjacent to the low-inductance busbar 3, and at most three sides of the liner unit 2 are connected to the low-inductance busbar 3. adjacent. That is, the low-inductance bus bar 3 as shown in FIG. 1 is configured as a frame-shaped structure, and a row of lining plate units 2 is arranged in the frame-shaped structure.

Specifically, the low-inductance busbar 3 includes a DC positive layer (not shown in the figure), a DC negative layer (not shown in the figure) and an AC layer (not shown in the figure), between adjacent layers and at the most An insulating layer (not shown in the figure) is provided on the outer layer. The structural relationship between the DC positive layer, the DC negative layer and the AC layer can be selected according to the actual situation. That is, the present application does not limit the upper and lower positional relationship of the DC positive layer, the DC negative layer and the AC layer. The low-inductance busbar 3 with this structure is helpful to realize the ultra-thin and low-inductance interconnection method, which can not only obtain good low-inductance and insulation performance, but also reduce the height of the low-inductance busbar 3, thereby reducing the intelligent power The volume of the module 100.

The DC positive connector 33 located outside the first end of the accommodating cavity 71 is arranged on the DC positive layer, and the DC negative connector 32 located outside the first end of the accommodating cavity 71 is arranged on the DC negative layer. The DC positive connector 33 and the DC negative connector 32 are formed as plug-in connectors 31 , as shown in FIG. 3 . The "first end" referred to in this application corresponds to the left end shown in FIG. 1 . Preferably, as shown in FIG. 1 , the DC positive connector 33 includes at least two oppositely spaced elastic pieces 39, while the DC negative connector 32 also includes at least two oppositely spaced elastic pieces 39, and the DC The two elastic pieces 39 of the positive electrical connector 33 are disposed correspondingly to the two elastic pieces 39 of the DC negative electrical connector 32 to form the plug-in connector 31 . It should be noted that there is an insulating member 34 with an insulating layer extending between the DC positive connector 33 and the DC negative connector 32 . By setting the plug-in connector 31 in this way, the quick plug-in connection between the intelligent power module 100 and the system can be smoothly realized.

The AC layer extends toward the second end to form the AC interface 35 . The "second end" referred to in this application is the same as the right end shown in Figure 1, that is, opposite to the "first end". Preferably, the AC interface 35 can be configured in the shape of an elastic sheet. Optionally, a current sensor 5 is provided at the AC interface 35 , and the current sensor 5 can be signally connected to the control circuit board 6 . In the case where the current sensor 5 is provided, the connection with the external circuit can be realized by arranging the transfer copper bar 37 connected with the AC interface 35 . The transition copper bar 37 is configured in the shape of a bent plate protruding from the second end of the current sensor 5 .

The DC positive connector 33 and the DC positive layer can be manufactured in an integrated manner, or can be a split structure, and are fixed by welding, riveting, or bolting. Similarly, the DC negative connector 32 and the DC negative layer may be manufactured in one piece, or may be of a split structure, and fixed by welding, riveting or bolting. The AC interface 35 and the AC layer can be manufactured in an integrated manner, or can be a split structure, and are fixed by welding, riveting, or bolting.

The intelligent power module 100 also includes a control circuit board 6 . The control circuit board 6 is signal-connected with the liner unit 2 to realize intelligent control functions such as driving, monitoring, protection and diagnosis of the control circuit board 6 . Preferably, a power interface 61 is provided at the second end of the control circuit board 6 for supplying a low voltage to the control circuit board 6 . An optical fiber interface 62 is provided at the second end of the control circuit board 6 to realize the communication between the control circuit board 6 and the upper control unit. A current sensor interface 63 is also provided at the second end of the control circuit board 6 to realize the connection between the control circuit board 6 and the current sensor 5 . The above-mentioned settings can ensure the normal operation of the control circuit board 6, facilitate signal transmission, and reduce interference. In addition, the above arrangement is helpful to optimize the layout of the intelligent power module 100, and the degree of generalization is high.

In order to ensure the normal operation of the intelligent power module 100 and avoid the interference between different components, a partition 72 is arranged in the accommodating cavity 71 to divide the accommodating cavity 71 into a first accommodating cavity 73 and a second accommodating cavity 74 . The control circuit board 6 is arranged in the first accommodating cavity. The backing plate unit 2 and the low-inductance busbar 3 are arranged in the second accommodating cavity 74 . The above arrangement facilitates signal isolation between components and reduces mutual interference. At the same time, the overall structure of the intelligent power module 100 is optimized by arranging the housing assembly 7, so that it has the advantages of high integration, small size and light weight. For the convenience of manufacture, the housing assembly 7 may be constructed as a split structure, for example, the housing assembly 7 may include a first shell 75 and a second shell 76 . The first shell 75 is a frame-like structure and is fastened to the heat sink 1 . On the other hand, the partition plate 72 is configured as a box-like structure. The opening of the partition plate 72 of the box-like structure faces the direction of the second shell 76 and is disposed at the upper opening of the first shell 75 to form the second accommodating cavity 74 . On the other hand, the second shell 76 is configured as a plate structure, and is covered at the opening of the partition plate 72 to form the first accommodating cavity 73 . Of course, the second shell 76 can also be configured as a box structure, and the opening is downwardly disposed at the opening of the partition plate 72 to form the first accommodating cavity 73 .

It should be noted that the pins 23 are provided on the conductive layer of the backing plate 21 . The pins 23 are connected to the control circuit board 6 through the partition plate 72 to realize signal transmission between the control circuit board 6 and the backing board unit 2 .

Insulating material is injected into the second accommodating cavity 74 to encapsulate the backing plate unit 2 , the low-inductance busbar 3 , the pins 23 and the like inside. For example, the insulating material may be silica gel, silicone rubber, or epoxy material, or the like. This setting can ensure the stable and normal operation of the intelligent power module 100 and prolong the service life.

In one embodiment, guide pins 11 are provided on the first end face of the heat sink 1 . During the process of installing the intelligent power module 100 , the guide pins 11 are used for guiding and positioning the intelligent power module 100 . During the installation process, the guide pin 11 also plays the role of buffering the impact force. In addition, after the intelligent power module 100 is installed in place, the guide pins 11 also play a role of fixing the intelligent power module 100 . Preferably, two guide pins 11 may be provided on the first end face of the heat sink 1 , and the two guide pins 11 are provided at two corners of the same side of the square heat sink 1 .

The cooling liquid inlet 13 and the cooling liquid outlet 14 of the radiator 1 are both disposed at the second end of the radiator 1 . At the same time, at least two threaded holes are provided on the second end face of the heat sink 1 to facilitate the connection and fixation of the intelligent power module 100 to the outside world.

In order to collect the temperature signal, a temperature sensor may also be provided on the liner unit 2, and its specific installation position is set according to the actual heating condition of the power semiconductor chip 22. Acquisition for intelligent control such as driving, monitoring, protection and diagnosis.

According to actual needs, a current sensor can be selectively provided on the control circuit board 6, and the control circuit board 6 can collect current signals through the above-mentioned current sensor for intelligent control such as driving, monitoring, protection and diagnosis.

In addition, the power semiconductor chip 22 with internal current measurement and temperature measurement can also be selected to realize fast and accurate monitoring at the chip level. Diagnosis and other intelligent control.

The above are only the preferred embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art can easily make changes or changes within the technical scope disclosed by the present invention, and such changes or changes All should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (11)

1. an intelligent power module for rail vehicles, characterized in that, comprising: a radiator having a coolant inlet and a coolant outlet communicating with the inner cavity of the radiator, a housing assembly, the housing assembly and a side surface of the radiator form an accommodating cavity, a backing plate unit arranged in the accommodating cavity, the backing plate unit having a backing plate and a power semiconductor chip fixedly arranged on the backing plate, Wherein, the liner is arranged on the surface of the heat sink in a contact manner, It also includes a low-inductance busbar disposed in the accommodating cavity and located outside the backing plate unit, The low-inductance busbar is configured as a frame-shaped structure, and is electrically connected to the conductive layer of the backing plate unit through a bonding wire. 2 . The power module according to claim 1 , wherein the low-inductance busbar comprises an AC layer, a DC positive layer and a DC negative layer distributed in a stacked manner. 3 . 3 . The power module according to claim 2 , wherein a DC positive connector located outside the first end of the accommodating cavity is arranged on the DC positive layer, and a DC negative connector is arranged on the DC negative layer. 4 . A DC negative connector located outside the first end of the accommodating cavity, an AC connector located outside the second end of the accommodating cavity is provided on the AC layer, wherein the DC positive connector A plug-in connector is formed with the DC negative connector. 4 . The power module according to claim 3 , wherein the DC positive connector and the DC negative connector each comprise at least two elastic pieces disposed oppositely and spaced apart. 5 . 5 . The power module according to claim 2 , wherein a partition is arranged in the accommodating cavity to divide the accommodating cavity into a first accommodating cavity and a second accommodating cavity, and the first accommodating cavity is in the first accommodating cavity. 6 . A control circuit board is provided, the backing board unit and the low-inductance busbar are arranged in the second accommodating cavity, and the control circuit board is configured to be able to be signally connected with the backing board unit. 6 . The power module according to claim 5 , wherein pins are provided on the conductive layer of the backing plate, and the pins pass through the spacer to be signally connected to the control circuit board. 7 . 7 . The power module according to claim 5 , wherein an AC connector located outside the second end of the accommodating cavity is provided on the AC layer, and a current sensor is provided on the AC connector. 8 . , the current sensor is signally connected to the control circuit board. 8 . The power module according to claim 1 , wherein a guide pin is provided on the first end face of the heat sink. 9 . 9 . The power module according to claim 1 , wherein at least two threaded holes are provided on the second end face of the heat sink. 10 . 10 . The power module according to claim 5 , further comprising a temperature sensor signally connected to the control circuit board, and the temperature sensor can be arranged on the backing plate unit. 11 . 11. An intelligent power module for rail vehicles, characterized in that, comprising: a radiator having a coolant inlet and a coolant outlet communicating with the inner cavity of the radiator, a housing assembly, the housing assembly and a side surface of the radiator form an accommodating cavity, a backing plate unit arranged in the accommodating cavity, the backing plate unit having a backing plate and a power semiconductor chip fixedly arranged on the backing plate, Wherein, the liner is arranged on the surface of the heat sink in a contact manner, a low-inductance busbar arranged in the accommodating cavity and located on the outside of the liner unit, the low-inductance busbar includes a stacked AC layer, a DC positive layer and a DC negative layer, the low-inductance busbar It is constructed as a frame-shaped structure, and is electrically connected with the conductive layer of the liner unit through a bonding wire, A DC positive connector located outside the first end of the accommodating cavity is arranged on the DC positive layer, and a DC negative connector located outside the first end of the accommodating cavity is arranged on the DC negative layer , an AC connector located outside the second end of the accommodating cavity is arranged on the AC layer, wherein the DC positive connector and the DC negative connector are formed as plug-in connectors, wherein, Both the DC positive connector and the DC negative connector include at least two oppositely spaced elastic pieces, A partition is arranged in the accommodating cavity to divide the accommodating cavity into a first accommodating cavity and a second accommodating cavity, a control circuit board is arranged in the first accommodating cavity, and the liner unit and the low-inductance mother The row is disposed in the second receiving cavity, and the control circuit board is configured to be able to be signally connected to the backing plate unit, An AC connector located outside the second end of the accommodating cavity is arranged on the AC layer, a current sensor is arranged on the AC connector, and the current sensor is signally connected to the control circuit board, It also includes a temperature sensor signally connected to the control circuit board, and the temperature sensor can be provided on the backing plate unit.