CN107816907A - A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange - Google Patents
A kind of micro-nano compound structure surface is heat sink and its method for enhanced heat exchange Download PDFInfo
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
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Abstract
本发明公开了一种微纳复合结构表面热沉及其强化换热的方法，用于大功率电子集成器件换热领域，解决高热流密度的散热问题。本发明的微纳复合结构表面热沉包括微槽群热沉和纳米涂层，在所述微槽群热沉的表面生成所述纳米涂层，所述微槽群热沉的表面材料是半导体、玻璃、陶瓷或金属及其合金，所述微槽群热沉的微槽道横截面是矩形、梯形或三角形，所述纳米涂层材料是金属、金属氧化物、金属氟化物、半导体材料或有机高聚物涂料。本发明通过所述纳米涂层强化微槽群热沉表面的换热性能，同时利用微槽群结构的表面扩展和毛细作用力因素，提升热沉的相变换热能力。
The invention discloses a surface heat sink with a micro-nano composite structure and a method for enhancing heat transfer thereof, which are used in the field of heat transfer of high-power electronic integrated devices and solve the heat dissipation problem of high heat flux density. The micro-nano composite structure surface heat sink of the present invention comprises a micro-groove group heat sink and a nano-coating, the nano-coating is generated on the surface of the micro-groove group heat sink, and the surface material of the micro-groove group heat sink is a semiconductor , glass, ceramics or metals and alloys thereof, the microchannel cross-section of the microgroove group heat sink is rectangular, trapezoidal or triangular, and the nano-coating material is metal, metal oxide, metal fluoride, semiconductor material or Organic polymer coatings. The invention strengthens the heat exchange performance of the micro-groove group heat sink surface through the nano-coating, and at the same time utilizes the surface expansion and capillary force factors of the micro-groove group structure to improve the phase-change heat capacity of the heat sink.
Description
技术领域technical field
本发明涉及热能工程技术领域，特别涉及一种大功率电子集成器件热沉及其强化换热的方法。The invention relates to the technical field of thermal energy engineering, in particular to a heat sink of a high-power electronic integrated device and a method for enhancing heat exchange thereof.
背景技术Background technique
随着高新技术的发展，包括各种计算处理芯片、激光器件、大功率LED灯片等在内的大功率电子集成器件运行功率越来越大。其中，这些耗能元件在发挥有效功率的同时，有相当一部分电功率转化为热量，热量的产生必将伴随着这些高功率电子器件温度的升高。但是，高温对这些大功率电子器件的运行是非常不利的，例如，大功率LED灯若不加任何散热器，在通电工作几秒钟后即会烧毁；计算机或服务器的中央处理器(CPU)，在大功率运行时运行效率会明显下降。目前对于这些高耗能设备及器件，尤其是对于大型的耗能设备机组，比较有效的制冷方案是采用大功率制冷空调机组进行冷却，制冷空调的使用带来的是大量电能的耗费。使用制冷空调的方案中，发热器件本身的耗电中有相当大一部分电能转化为无用热能，空调机组又耗费大量电能来完成制冷效果。在这一过程中，基础建设、运行、维护成本大大增加，故障率相应地会提高。单从散热角度上来说，制冷空调冷却的是发热设备机组所在空间内部的空气，再间接地利用冷空气对发热设备机组进行冷却，未能直接对发热源进行冷却，另有发热机组往往结构复杂，冷却空气往往形成流动“死区”，“死区”内的空气流动不畅，往往会存在较大温度梯度，热量难以快速散掉，这对散热是极其不利的。同时，发热设备机组所在空间，往往存在严重的冷量泄露，这又对能量造成浪费。而电子电气设备大功率化、集成化的发展趋势必然造成散热热流密度增加，因此，开发设计出更加高效的散热器对于从根本上解决这些大功率发热器件散热降温问题势在必行。With the development of high technology, the operating power of high-power electronic integrated devices including various computing processing chips, laser devices, high-power LED lamps, etc. is increasing. Among them, while these energy-consuming components exert effective power, a considerable part of the electric power is converted into heat, and the generation of heat will be accompanied by the temperature rise of these high-power electronic devices. However, high temperature is very detrimental to the operation of these high-power electronic devices. For example, if a high-power LED lamp does not add any heat sink, it will burn out after being powered on for a few seconds; the central processing unit (CPU) of a computer or server , the operating efficiency will drop significantly when running at high power. At present, for these high-energy-consuming equipment and devices, especially for large-scale energy-consuming equipment units, a more effective cooling solution is to use high-power refrigeration and air-conditioning units for cooling. The use of refrigeration and air-conditioning brings a lot of power consumption. In the scheme of using refrigeration and air conditioning, a considerable part of the power consumption of the heating device itself is converted into useless heat energy, and the air conditioning unit consumes a large amount of power to complete the cooling effect. In this process, the cost of infrastructure construction, operation and maintenance will increase greatly, and the failure rate will increase accordingly. From the perspective of heat dissipation alone, the refrigeration and air conditioner cools the air inside the space where the heating equipment unit is located, and then indirectly uses the cold air to cool the heating equipment unit, failing to directly cool the heat source, and the heating unit often has a complex structure , Cooling air often forms a flowing "dead zone". The air flow in the "dead zone" is not smooth, and there is often a large temperature gradient, which makes it difficult for the heat to dissipate quickly, which is extremely unfavorable for heat dissipation. At the same time, there is often a serious leakage of cooling capacity in the space where the heating equipment unit is located, which in turn causes a waste of energy. The development trend of high power and integration of electronic and electrical equipment will inevitably lead to an increase in heat dissipation heat flux. Therefore, it is imperative to develop and design more efficient radiators to fundamentally solve the problem of heat dissipation and cooling of these high-power heating devices.
相变换热热沉在大功率电子集成器件换热方面得到广泛应用。然而目前相变换热热沉大多采用普通平面，或者附有较大尺度肋片等扩展面的优化换热面热沉，少数产品采用了微尺度加工的表面优化设计技术(包括普通平面上加工微槽道、微柱体、微肋体等微尺度表面优化技术)。实验研究中，对相变换热的研究也停留在微尺度下相变换热的研究阶段。现有技术所采用的相变换热取热热沉，未能充分发挥出换热表面的取热能力，难以解决高热流密度的散热问题。Phase-change heat sinks are widely used in heat transfer of high-power electronic integrated devices. However, at present, most phase change heat sinks use ordinary planes or optimized heat transfer surface heat sinks with extended surfaces such as larger-scale fins. Micro-scale surface optimization technologies such as micro-channels, micro-pillars, and micro-ribs). In the experimental research, the research on the phase change heat also stays at the research stage of the phase change heat at the micro scale. The phase-change heat extraction heat sink adopted in the prior art cannot fully utilize the heat extraction capacity of the heat exchange surface, and it is difficult to solve the heat dissipation problem of high heat flux.
发明内容Contents of the invention
(一)要解决的技术问题(1) Technical problems to be solved
针对现有技术中的上述缺点，本发明提供了一种微纳复合结构表面热沉及其强化换热的方法，基于微纳尺度下相变换热的基本原理，提高热沉的换热能力，使转化为热量的那一部分电能以液体工质相变的形式迅速从高温热源处取走，并最终散失到空气及其他介质当中，大幅度减小从热源到散热最终介质(主要是空气)中去的中间热阻，从根本上解决了发热功能元件运行温度过高的问题。In view of the above-mentioned shortcomings in the prior art, the present invention provides a surface heat sink with a micro-nano composite structure and a method for enhancing heat transfer. Based on the basic principle of phase transformation heat at the micro-nano scale, the heat transfer capacity of the heat sink is improved. , so that the part of the electric energy converted into heat is quickly taken away from the high-temperature heat source in the form of liquid working fluid phase change, and finally lost to air and other media, greatly reducing the final medium (mainly air) from heat source to heat dissipation The intermediate thermal resistance is removed, which fundamentally solves the problem of high operating temperature of heating functional components.
(二)技术方案(2) Technical solution
本发明的技术方案如下：Technical scheme of the present invention is as follows:
本发明提出了一种微纳复合结构表面热沉，包括微槽群热沉，还包括纳米涂层，所述纳米涂层在所述微槽群热沉的表面生成：所述微槽群热沉的表面材料是半导体、玻璃、陶瓷或金属及其合金；所述微槽群热沉的微槽道横截面是矩形、梯形或三角形；所述纳米涂层材料是金属、金属氧化物、金属氟化物、半导体材料或有机高聚物涂料。The present invention proposes a surface heat sink with a micro-nano composite structure, which includes a micro-groove group heat sink, and also includes a nano-coating, and the nano-coating is formed on the surface of the micro-groove group heat sink: the micro-groove group heat sink The surface material of sinking is semiconductor, glass, pottery or metal and alloy thereof; The microchannel cross-section of described microgroove group heat sink is rectangular, trapezoidal or triangular; Described nano-coating material is metal, metal oxide, metal Fluoride, semiconductor material or organic high polymer coating.
所述纳米涂层厚度为0～1000nm。所述矩形微槽道的微槽道宽度在0.05～2mm范围内，微槽道深度在0.05～2mm范围内，相邻微槽道间距在0.05～5mm范围内。所述梯形微槽道的梯形上底边长度为0.05～2mm，下底边长度为0.07～4mm，微槽道深度为0.05～8mm，相邻微槽道间距为0.05～5mm。所述三角形微槽道的槽底顶角为5°～120°，微槽道深度为0.05～8mm，相邻微槽道间距为0.05～5mm。The thickness of the nano-coating is 0-1000nm. The width of the micro-channel of the rectangular micro-channel is in the range of 0.05-2 mm, the depth of the micro-channel is in the range of 0.05-2 mm, and the distance between adjacent micro-channels is in the range of 0.05-5 mm. The length of the upper base of the trapezoidal microchannel is 0.05-2 mm, the length of the lower base is 0.07-4 mm, the depth of the micro-channel is 0.05-8 mm, and the distance between adjacent micro-channels is 0.05-5 mm. The apex angle of the groove bottom of the triangular micro-channel is 5°-120°, the depth of the micro-channel is 0.05-8 mm , and the distance between adjacent micro-channels is 0.05-5 mm .
本发明还提出了一种微纳复合结构表面热沉强化换热的方法，在微槽群热沉的表面增加纳米涂层：所述微槽群热沉的表面材料是半导体、玻璃、陶瓷或金属及其合金；所述微槽群热沉的微槽道横截面是矩形、梯形或三角形；所述纳米涂层材料是金属、金属氧化物、金属氟化物、半导体材料或有机高聚物涂料。The present invention also proposes a method for enhancing heat transfer on the surface heat sink of a micro-nano composite structure, adding a nano-coating on the surface of the heat sink of the micro-groove group: the surface material of the heat sink of the micro-groove group is semiconductor, glass, ceramic or Metals and their alloys; the cross-section of the micro-channels of the micro-groove group heat sink is rectangular, trapezoidal or triangular; the nano-coating material is metal, metal oxide, metal fluoride, semiconductor material or organic polymer coating .
所述纳米涂层厚度为0～1000nm。所述矩形微槽道的微槽道宽度在0.05～2mm范围内，微槽道深度在0.05～2mm范围内，相邻微槽道间距在0.05～5mm范围内。所述梯形微槽道的梯形上底边长度为0.05～2mm，下底边长度为0.07～4mm，微槽道深度为0.05～8mm，相邻微槽道间距为0.05～5mm。所述三角形微槽道的槽底顶角为5°～120°，微槽道深度为0.05～8mm，相邻微槽道间距为0.05～5mm。The thickness of the nano-coating is 0-1000nm. The width of the micro-channel of the rectangular micro-channel is in the range of 0.05-2 mm, the depth of the micro-channel is in the range of 0.05-2 mm, and the distance between adjacent micro-channels is in the range of 0.05-5 mm. The length of the upper base of the trapezoidal microchannel is 0.05-2 mm, the length of the lower base is 0.07-4 mm, the depth of the micro-channel is 0.05-8 mm, and the distance between adjacent micro-channels is 0.05-5 mm. The apex angle of the groove bottom of the triangular micro-channel is 5°-120°, the depth of the micro-channel is 0.05-8 mm , and the distance between adjacent micro-channels is 0.05-5 mm .
(三)有益效果(3) Beneficial effects
1、本发明中的微纳复合结构表面热沉，明显增强了微槽群热沉表面的相变换热能力。1. The micro-nano composite structure surface heat sink in the present invention obviously enhances the phase-change heat capacity of the micro-groove group heat sink surface.
2、本发明中的微纳复合结构表面热沉，使热源所产生的无用且有害热量以表面液体工质为载体，通过相变迅速脱离热源，满足了降低发热元件表面温度的要求。2. The micro-nano composite structure surface heat sink in the present invention enables the useless and harmful heat generated by the heat source to use the surface liquid working fluid as a carrier, and quickly separate from the heat source through phase change, which meets the requirement of reducing the surface temperature of the heating element.
附图说明Description of drawings
图1是根据本发明的一种微纳复合结构表面热沉的实施例立体图；Fig. 1 is a perspective view of an embodiment of a micro-nano composite structure surface heat sink according to the present invention;
图2是根据本发明实施例的一种微纳复合结构表面热沉的矩形微槽道微观结构图；2 is a microstructure diagram of a rectangular microchannel of a surface heat sink with a micro-nano composite structure according to an embodiment of the present invention;
图3是根据本发明实施例的一种微纳复合结构表面热沉的梯形微槽道微观结构图；3 is a microstructure diagram of a trapezoidal microchannel of a surface heat sink with a micro-nano composite structure according to an embodiment of the present invention;
图4是根据本发明实施例的一种微纳复合结构表面热沉的三角形微槽道微观结构图；4 is a microstructure diagram of a triangular microchannel of a surface heat sink with a micro-nano composite structure according to an embodiment of the present invention;
图5是根据本发明实施例的一种微纳复合结构表面热沉水平放置的实际工作效果图。Fig. 5 is an actual working effect diagram of a heat sink placed horizontally on the surface of a micro-nano composite structure according to an embodiment of the present invention.
图6是根据本发明实施例的一种微纳复合结构表面热沉竖直放置的实际工作效果图。Fig. 6 is an actual working effect diagram of a vertically placed heat sink on the surface of a micro-nano composite structure according to an embodiment of the present invention.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚明白，以下结合具体实施例，并参照附图，对本发明作进一步的详细说明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
为解决以上问题，本发明在已有的表面热沉相变换热实验研究基础上，从表面优化的角度上对微槽群热沉表面进行进一步的强化换热设计。在微槽群热沉表面应用纳米尺度材料加工技术生成纳米涂层，应用了纳米材料的尺寸效应、表面效应等特殊性质，改变了热沉表面粗糙度、润湿性、表面能等物理特性，利用纳米涂层与液体工质之间的亲和能力以及纳米涂层对相变换热中汽泡生成的强化作用，提高了热沉的相变换热能力。同时，利用微槽群热沉的微槽结构中弯月形液膜上所发生的多区域复合相变换热特性，使热沉具备高强度的微细尺度蒸发和沸腾复合相变换热能力。在这种微纳复合结构表面上，液体工质发生相变生成汽泡时，汽泡产生频率加快，脱离、爆裂尺寸减小。这就意味着在相变发生表面，汽泡生成处的干涸区域面积减小，周围液体工质由于与纳米涂层表面的亲和作用可以更加迅速地填充到产生汽泡的干涸处，即“液体工质取热——液体工质相变，产生汽泡——汽泡脱离或爆裂——新的液体重新填充到汽泡生成的干涸处”整个周期大大缩短，使得热源所产生的无用且有害热量以表面液体工质为载体，通过相变迅速脱离热源，满足了降低发热元件表面温度的要求。In order to solve the above problems, on the basis of the existing experimental research on surface heat sink phase change heat, the present invention further enhances the heat transfer design on the surface of the microgroove group heat sink from the perspective of surface optimization. Nano-scale material processing technology is applied to the surface of micro-groove heat sink to generate nano-coating. The special properties of nano-materials such as size effect and surface effect are applied, and the physical properties such as surface roughness, wettability, and surface energy of heat sink are changed. The phase-change heat capacity of the heat sink is improved by utilizing the affinity between the nano-coating and the liquid working medium and the strengthening effect of the nano-coating on the generation of bubbles in the phase-change heat. At the same time, the heat sink has high-strength micro-scale evaporation and boiling composite phase-change heat capacity by utilizing the multi-region composite phase-change heat characteristics that occur on the meniscus-shaped liquid film in the micro-groove structure of the micro-groove group heat sink. On the surface of this micro-nano composite structure, when the liquid working medium undergoes a phase change to generate bubbles, the frequency of bubble generation is accelerated, and the size of detachment and burst is reduced. This means that on the surface where the phase transition occurs, the area of the dry area where the bubbles are generated is reduced, and the surrounding liquid working fluid can be filled into the dry area where the bubbles are generated more quickly due to the affinity with the surface of the nano-coating, that is, " The liquid working medium takes heat——the phase change of the liquid working medium produces bubbles——the bubbles detach or burst——the new liquid refills the dry place where the bubbles are formed.” The whole cycle is greatly shortened, making the useless and Harmful heat takes the surface liquid working medium as the carrier, and quickly escapes from the heat source through phase change, which meets the requirement of reducing the surface temperature of the heating element.
本发明纳米涂层材料是金属、金属氧化物、金属氟化物、半导体材料或有机高聚物涂料等，如金、银、镍、二氧化钛、ITO薄膜等。纳米涂层厚度为0～1000nm。微槽群热沉的表面材料是半导体(硅、锗、砷化镓)、玻璃、陶瓷、金属及其合金等。The nano-coating material of the present invention is metal, metal oxide, metal fluoride, semiconductor material or organic high polymer coating, such as gold, silver, nickel, titanium dioxide, ITO film and the like. The thickness of the nano-coating is 0-1000nm. The surface materials of microgroove heat sinks are semiconductors (silicon, germanium, gallium arsenide), glass, ceramics, metals and their alloys.
图1是根据本发明的一种微纳复合结构表面热沉的实施例立体图。本实施例中，在微槽的表面采用磁控溅射技术镀以钛纳米涂层薄膜，从而形成微纳复合结构表面热沉。微槽的表面材料为硅硼玻璃。纳米涂层厚度为0～1000nm。Fig. 1 is a perspective view of an embodiment of a surface heat sink with a micro-nano composite structure according to the present invention. In this embodiment, the surface of the micro-groove is plated with a titanium nano-coating film by magnetron sputtering technology, thereby forming a surface heat sink of a micro-nano composite structure. The surface material of the microgroove is borosilicate glass. The thickness of the nano-coating is 0-1000nm.
图2是根据本发明实施例的一种微纳复合结构表面热沉的矩形微槽道微观结构图。热沉表面微槽道横截面为矩形，微槽道宽度在0.05～2mm范围内，微槽道深度在0.05～2mm范围内，相邻微槽道间距在0.05～5mm范围内。Fig. 2 is a microstructure diagram of a rectangular micro-channel of a surface heat sink with a micro-nano composite structure according to an embodiment of the present invention. The cross-section of the micro-channels on the surface of the heat sink is rectangular, the width of the micro-channels is in the range of 0.05-2 mm, the depth of the micro-channels is in the range of 0.05-2 mm, and the distance between adjacent micro-channels is in the range of 0.05-5 mm.
图3是根据本发明实施例的一种微纳复合结构表面热沉的梯形微槽道微观结构图。热沉表面微槽道横截面为梯形，梯形的上底边长度为0.05～2mm，下底边长度为0.07～4mm，微槽道深度为0.05～8mm，相邻微槽道间距为0.05～5mm。Fig. 3 is a microstructure diagram of trapezoidal microchannels of a surface heat sink with a micro-nano composite structure according to an embodiment of the present invention. The cross-section of the micro-channels on the surface of the heat sink is trapezoidal, the length of the upper base of the trapezoid is 0.05-2 mm, the length of the lower base is 0.07-4 mm, the depth of the micro-channels is 0.05-8 mm, and the distance between adjacent micro-channels is 0.05-5 mm. mm .
图4是根据本发明实施例的一种微纳复合结构表面热沉的三角形微槽道微观结构图。热沉表面微槽道横截面为三角形，三角形的槽底顶角为5°～120°，微槽道深度为0.05～8mm，相邻微槽道间距为0.05～5mm。Fig. 4 is a microstructure diagram of a triangular micro-channel of a surface heat sink with a micro-nano composite structure according to an embodiment of the present invention. The cross-section of the micro-channels on the surface of the heat sink is triangular, the bottom and apex angles of the triangles are 5°-120°, the depth of the micro-channels is 0.05-8 mm, and the distance between adjacent micro-channels is 0.05-5 mm.
图5是根据本发明实施例的一种微纳复合结构表面热沉水平放置的实际工作效果图。图6是根据本发明实施例的一种微纳复合结构表面热沉竖直放置的实际工作效果图。当微纳复合结构表面热沉水平放置时，利用热沉表面的铺展液层，通过沸腾相变换热对热源件进行散热冷却。当微纳复合结构表面热沉竖直放置时，液体工质在毛细力作用下被吸入到微槽道内，亲水性纳米涂层可增加微槽道内的润湿高度，降低液体工质上升阻力。水平布置和竖直布置这两种应用形式，针对实际工程实践中发热器件的布置条件择优选用，均可以发挥微纳复合结构所具有的强化换热特性，适用于不同场合和条件。在本发明实施例的微纳复合结构热沉的换热应用中，整体散热器也融合进了热管相关技术，微纳复合结构热沉表面相变所形成的气体工质，在靠近冷源的壁面上又迅速冷凝再次成为液体状态，返回到微纳复合结构表面，作为高热流密度热源的取热元件，在整体散热器完整的取热到散热过程中，是减小总热阻的最关键环节，从而可以满足高热流密度的取热及散热要求。在对本发明实施例的微纳复合结构表面的实验验证当中，通过数据分析可发现，在一定的热流密度范围内，取热表面平均温度具有较低的过热度，且具有较好的线性度。相比于微槽表面，在表面的钛纳米涂层达到250nm及以上时，表面相变汽泡明显细化，汽泡成核密度显著增加，从而大大增强了强化换热效果。Fig. 5 is an actual working effect diagram of a heat sink placed horizontally on the surface of a micro-nano composite structure according to an embodiment of the present invention. Fig. 6 is an actual working effect diagram of a vertically placed heat sink on the surface of a micro-nano composite structure according to an embodiment of the present invention. When the heat sink on the surface of the micro-nano composite structure is placed horizontally, the spreading liquid layer on the surface of the heat sink is used to dissipate heat and cool the heat source parts through boiling phase transfer heat. When the heat sink on the surface of the micro-nano composite structure is placed vertically, the liquid working medium is sucked into the micro-channel under the action of capillary force, and the hydrophilic nano-coating can increase the wetting height in the micro-channel and reduce the rising resistance of the liquid working medium . The two application forms of horizontal arrangement and vertical arrangement are selected according to the arrangement conditions of heat-generating devices in actual engineering practice, and both can give full play to the enhanced heat transfer characteristics of the micro-nano composite structure, and are suitable for different occasions and conditions. In the heat exchange application of the micro-nano composite structure heat sink in the embodiment of the present invention, the overall heat sink is also integrated into the heat pipe related technology, and the gas working fluid formed by the phase change on the surface of the micro-nano composite structure The wall quickly condenses and turns into a liquid state again, and returns to the surface of the micro-nano composite structure. As a heat extraction element of a high heat flux heat source, it is the most critical to reduce the total thermal resistance during the complete heat extraction to heat dissipation process of the overall radiator. link, so as to meet the heat extraction and heat dissipation requirements of high heat flux. In the experimental verification of the surface of the micro-nano composite structure of the embodiment of the present invention, it can be found through data analysis that within a certain range of heat flux density, the average temperature of the hot surface has a lower degree of superheat and better linearity. Compared with the microgroove surface, when the titanium nanocoating on the surface reaches 250 nm and above, the surface phase change bubbles are obviously refined, and the nucleation density of the bubbles is significantly increased, thereby greatly enhancing the heat transfer enhancement effect.
以上所述的具体实施例，对本发明的目的、技术方案和有益效果进行了进一步详细说明，应理解的是，以上所述仅为本发明的具体实施例而己，并不用于限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。The specific embodiments described above have further described the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above descriptions are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108011008A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN108696705A (en) * | 2018-03-22 | 2018-10-23 | 江苏蔚联机械股份有限公司 | A kind of television set under-chassis and preparation method thereof with high brightness minute surface |
| CN110267485A (en) * | 2019-05-27 | 2019-09-20 | 西安交通大学 | Combination structure of evaporation-boiling capillary core coupled with liquid replenishment capillary core |
| CN111707116A (en) * | 2020-04-30 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Micro-channel heat exchanger with multi-stage micro-channel and method of making the same |
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| WO2022033289A1 (en) * | 2020-08-10 | 2022-02-17 | 深圳市顺熵科技有限公司 | Flat plate heat pipe and manufacturing method therefor, and heat exchanger |
| CN114383452A (en) * | 2020-10-19 | 2022-04-22 | 南昌欧菲显示科技有限公司 | Vapor chamber and heat dissipation device |
| CN116981221A (en) * | 2023-07-21 | 2023-10-31 | 中国科学院电工研究所 | A boiling heat exchange enhanced structure and a radiator having the same |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005228855A (en) * | 2004-02-12 | 2005-08-25 | Yamagishi Kogyo:Kk | Radiator |
| CN101082468A (en) * | 2007-07-05 | 2007-12-05 | 上海交通大学 | Gravity force type micro-chute flat-plate hot pipe with carbon nano-tube suspending liquid as working substance |
| CN102235615A (en) * | 2010-04-21 | 2011-11-09 | 中国科学院工程热物理研究所 | Cavity-type light emitting diode lamp |
| CN202259261U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Lead frame with a heat sink |
| CN203071055U (en) * | 2012-12-06 | 2013-07-17 | 国网智能电网研究院 | Micro-channel heat exchanger suitable for high heat flow density electric power components with local hot spots |
| CN103940273A (en) * | 2014-05-07 | 2014-07-23 | 浙江大学 | Device and method for cooling partial high heat flow within limited space |
| CN105716467A (en) * | 2016-02-25 | 2016-06-29 | 浙江大学 | Intelligent boiling surface and boiling control method thereof |
| CN206073779U (en) * | 2016-09-13 | 2017-04-05 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink |
-
2016
- 2016-09-13 CN CN201610821637.6A patent/CN107816907A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005228855A (en) * | 2004-02-12 | 2005-08-25 | Yamagishi Kogyo:Kk | Radiator |
| CN101082468A (en) * | 2007-07-05 | 2007-12-05 | 上海交通大学 | Gravity force type micro-chute flat-plate hot pipe with carbon nano-tube suspending liquid as working substance |
| CN102235615A (en) * | 2010-04-21 | 2011-11-09 | 中国科学院工程热物理研究所 | Cavity-type light emitting diode lamp |
| CN202259261U (en) * | 2011-08-29 | 2012-05-30 | 江阴康强电子有限公司 | Lead frame with a heat sink |
| CN203071055U (en) * | 2012-12-06 | 2013-07-17 | 国网智能电网研究院 | Micro-channel heat exchanger suitable for high heat flow density electric power components with local hot spots |
| CN103940273A (en) * | 2014-05-07 | 2014-07-23 | 浙江大学 | Device and method for cooling partial high heat flow within limited space |
| CN105716467A (en) * | 2016-02-25 | 2016-06-29 | 浙江大学 | Intelligent boiling surface and boiling control method thereof |
| CN206073779U (en) * | 2016-09-13 | 2017-04-05 | 中国科学院工程热物理研究所 | A kind of micro-nano compound structure surface is heat sink |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108011008A (en) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | LED encapsulation structure |
| CN108696705A (en) * | 2018-03-22 | 2018-10-23 | 江苏蔚联机械股份有限公司 | A kind of television set under-chassis and preparation method thereof with high brightness minute surface |
| CN110267485A (en) * | 2019-05-27 | 2019-09-20 | 西安交通大学 | Combination structure of evaporation-boiling capillary core coupled with liquid replenishment capillary core |
| CN111707116A (en) * | 2020-04-30 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Micro-channel heat exchanger with multi-stage micro-channel and method of making the same |
| CN111707116B (en) * | 2020-04-30 | 2021-08-31 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Micro-channel heat exchanger with multi-stage micro-channel and method of making the same |
| CN111834309A (en) * | 2020-07-21 | 2020-10-27 | 西安科技大学 | Hybrid wettability micro-nano composite enhanced heat exchange structure and preparation method thereof |
| CN111834309B (en) * | 2020-07-21 | 2021-10-01 | 西安科技大学 | Hybrid wettability micro-nano composite enhanced heat exchange structure and preparation method thereof |
| WO2022033289A1 (en) * | 2020-08-10 | 2022-02-17 | 深圳市顺熵科技有限公司 | Flat plate heat pipe and manufacturing method therefor, and heat exchanger |
| CN112071817A (en) * | 2020-09-25 | 2020-12-11 | 中国科学院苏州纳米技术与纳米仿生研究所 | Immersion cooling heat dissipation structure, radiator, heat dissipation system and manufacturing method thereof |
| CN114383452A (en) * | 2020-10-19 | 2022-04-22 | 南昌欧菲显示科技有限公司 | Vapor chamber and heat dissipation device |
| CN116981221A (en) * | 2023-07-21 | 2023-10-31 | 中国科学院电工研究所 | A boiling heat exchange enhanced structure and a radiator having the same |
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Application publication date: 20180320 |