CN107801310A - Circuit board manufacturing method and circuit board - Google Patents

Abstract

This invention provides a method for manufacturing a circuit board and a circuit board manufactured using this method. The method includes: providing a copper-clad substrate board, the copper-clad substrate board including a first copper layer, a second copper layer, and an insulating substrate; drilling blind vias on the copper-clad substrate board using a laser; forming a conductive carbon layer on the wall of the blind vias; covering the surface of the first copper layer with a dry film, removing part of the dry film to expose the areas to be electroplated; electroplating a third copper layer on the exposed areas to metallize the blind vias, thus obtaining metallized blind vias; removing the remaining dry film to expose the first copper layer; and removing the exposed first copper layer by rapid etching to form circuitry, thereby obtaining a circuit board. This invention, by using laser drilling to create blind vias, followed by in-hole electroplating to create metallized blind vias, and then rapidly etching to obtain circuitry, can meet the requirements for manufacturing metallized blind vias and circuitry for circuit boards with linewidths less than 25μm, and has the advantages of a short process and low cost.

Description

Circuit board manufacturing method and circuit board

【Technical field】

The invention relates to the field of circuit board production, in particular to a circuit board production method and a circuit board produced by applying the method.

【Background technique】

With the advent of the mobile Internet era, the number of electronic products continues to rise. With the development of current electronic products in the direction of "short", "small", "light" and "thin", the conventional manufacturing process of circuit boards in electronic equipment can no longer meet the needs.

Double-sided panels need to rely on via holes to connect the two sides of the double-sided panel. When the line spacing is less than 25 μm, there is no space to design conventional via holes. Conventional production methods cannot be produced. At the same time, the existing technology uses etching to produce Circuits with a line pitch of less than 25 μm have a long process and high cost.

Therefore, it is necessary to provide a new circuit board manufacturing method to solve the above problems.

【Content of invention】

The technical problem that the present invention solves is to provide a kind of circuit board manufacturing method, comprises the following steps:

S1. Material selection, providing a copper-clad substrate board, the copper-clad substrate board comprising a first copper layer, a second copper layer, and an insulating substrate sandwiched between the first copper layer and the second copper layer ;

S2. Laser blind holes, using a laser to drill blind holes on the copper-clad substrate, the blind holes pass through the first copper layer and the insulating substrate and abut against the second copper layer;

S3, black hole, forming a conductive carbon layer on the hole wall of the blind hole;

S4. Pattern transfer, covering the surface of the first copper layer with a dry film, removing part of the dry film, and opening a window to expose the position to be electroplated;

S5. Hole filling electroplating, electroplating a third copper layer on the exposed position of the window on the copper-clad substrate, and metallizing the blind hole to obtain a metallized blind hole;

S6, removing the film, removing the remaining dry film on the copper-clad substrate board to expose the first copper layer;

S7. Rapid etching. The exposed first copper layer is removed by rapid etching, and a circuit is formed on the insulating substrate to obtain a circuit board.

Preferably, the S4 step includes the following steps:

S41, coating, covering a layer of the dry film on the surface of the first copper layer;

S42, exposing, performing partial exposure on the dry film;

S43. Developing, developing the dry film, removing the unexposed part of the dry film, and opening a window to expose the position to be electroplated.

The present invention also provides a circuit board. The circuit board is manufactured by using the circuit board manufacturing method. The circuit board includes the second copper layer, the circuit, and is sandwiched between the circuit and the circuit board. The insulating substrate between the second copper layer and the metallized blind hole connecting the circuit and the second copper layer.

Compared with the related technology, the circuit board manufacturing method and the circuit board provided by the present invention drill blind holes by laser, then complete the production of the metallized blind holes by hole filling and electroplating, and then obtain the circuit by rapid etching, It can meet the production requirements of metallized blind holes and circuits of circuit boards with a line width of less than 25 μm, and has the advantages of short process and low cost.

【Description of drawings】

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative work, wherein:

Fig. 1 is the schematic flow chart of circuit board manufacturing method of the present invention;

Fig. 2 is the structural representation of the copper-clad substrate board after the laser blind hole of the present invention;

Fig. 3 is the structural representation of the copper-clad substrate board after the black hole of the present invention;

Fig. 4 is the structural representation of the copper-clad substrate board after pattern transfer of the present invention;

Fig. 5 is the schematic flow chart of step S4 of the present invention;

6 is a schematic structural view of the copper-clad base plate after hole-filling and electroplating of the present invention;

Fig. 7 is a schematic structural view of the copper-clad base plate after the film is removed in the present invention;

Fig. 8 is a schematic structural diagram of the circuit board of the present invention.

【Detailed ways】

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to Fig. 1, the present invention provides a kind of circuit board manufacturing method, comprises the steps:

S1, material selection, please refer to FIG. 2 together to provide a copper-clad substrate board 10, the copper-clad substrate board 10 includes a first copper layer 1, a second copper layer 2 and a copper-clad substrate sandwiched between the first copper layer 1 and the insulating substrate 3 between the second copper layer 2 .

The first copper layer 1 is thin copper foil.

S2. Laser blind hole, using a laser to drill a blind hole 4 on the copper-clad base plate 10, the blind hole 4 passes through the first copper layer 1 and the insulating substrate 3 and abuts on the first copper layer 1 Two copper layers 2.

S3, black hole, please also refer to FIG. 3 , a conductive carbon layer 5 is formed on the hole wall of the blind hole 4 .

S4, graphic transfer, referring to Fig. 4 and Fig. 5, described graphic transfer includes following sub-steps:

S41 , coating, covering a layer of dry film 6 on the surface of the first copper layer 1 .

S42 , exposing, performing partial exposure on the dry film 6 .

S43, developing, developing the dry film 6, removing the unexposed part of the dry film 6, and opening a window to expose the position to be electroplated.

S5. Hole filling electroplating, please refer to FIG. 6 , electroplating the third copper layer 7 on the exposed position of the window on the copper-clad substrate 10 , and metallizing the blind holes 4 to obtain metallized blind holes 8 .

Obtaining the metallized blind hole 8 through hole filling electroplating can meet the production requirements of the metallized blind hole of a circuit board with a line width less than 25 μm.

The metallized blind hole 8 is manufactured by electroplating, which saves the step of using a metal plug hole after electroplating in the conventional manufacturing method.

S6, stripping, referring to FIG. 7 , removing the remaining dry film 6 on the copper-clad substrate board 10 to expose the first copper layer 1 .

S7. Rapid etching, please refer to FIG. 8 , remove the exposed first copper layer 1 through rapid etching, form lines 9 on the insulating substrate, and obtain a circuit board 100 .

The wiring 9 includes the third copper layer 7 and the unremoved first copper layer 1 .

The circuit 9 can meet the production requirements of circuit board circuits with a line width less than 25 μm.

The first copper layer 1 is made of thin copper foil, which can ensure that the exposed first copper layer 1 is etched away during rapid etching.

The present invention also discloses a circuit board, which is manufactured by the above-mentioned circuit board manufacturing method, wherein the circuit board 100 includes the second copper layer 2, the circuit 9, sandwiched between the The insulating substrate 3 between the circuit 9 and the second copper layer 2 and the metallized blind hole 8 connecting the circuit 9 and the second copper layer 2 .

Compared with the related art, the circuit board manufacturing method provided by the present invention drills the blind hole 4 by laser, completes the manufacture of the metallized blind hole 8 by hole filling and electroplating, and then obtains the circuit 9 by rapid etching, It can meet the production requirements of metallized blind holes and circuits of circuit boards with a line width of less than 25 μm, and has the advantages of short process and low cost.

What has been described above is only the embodiment of the present invention, and it should be pointed out that for those of ordinary skill in the art, improvements can be made without departing from the creative concept of the present invention, but these all belong to the present invention scope of protection.

Claims (3)

1. A circuit board manufacturing method, characterized in that, comprises the steps: S1. Material selection, providing a copper-clad substrate board, the copper-clad substrate board comprising a first copper layer, a second copper layer, and an insulating substrate sandwiched between the first copper layer and the second copper layer ; S2. Laser blind holes, using a laser to drill blind holes on the copper-clad substrate, the blind holes pass through the first copper layer and the insulating substrate and abut against the second copper layer; S3, black hole, forming a conductive carbon layer on the hole wall of the blind hole; S4. Pattern transfer, covering the surface of the first copper layer with a dry film, removing part of the dry film, and opening a window to expose the position to be electroplated; S5. Hole filling electroplating, electroplating a third copper layer on the exposed position of the window on the copper-clad substrate, and metallizing the blind hole to obtain a metallized blind hole; S6, removing the film, removing the remaining dry film on the copper-clad substrate board to expose the first copper layer; S7. Rapid etching. The exposed first copper layer is removed by rapid etching, and a circuit is formed on the insulating substrate to obtain a circuit board. 2. circuit board manufacturing method according to claim 1, is characterized in that, described S4 step comprises the steps: S41, coating, covering a layer of the dry film on the surface of the first copper layer; S42, exposing, performing partial exposure on the dry film; S43. Developing, developing the dry film, removing the unexposed part of the dry film, and opening a window to expose the position to be electroplated. 3. A circuit board, characterized in that, the circuit board is made using the method for manufacturing a circuit board according to claim 1 or 2, and the circuit board comprises the second copper layer, the circuit, an interposed An insulating substrate between the circuit and the second copper layer, and a metallized blind hole connecting the circuit and the second copper layer.