CN107800970B - A kind of Image Acquisition control system for being conducive to carry out image procossing - Google Patents

Abstract

The invention discloses an image acquisition control system which is beneficial to image processing, comprising an infrared sensing signal processing module and an image acquisition module, the infrared sensing signal processing module includes a chip U3, the model of the chip U3 is BISS0001, and the image acquisition module Including chip U4, chip U6, chip U7, chip U8, chip U9, the model of chip U4 is OV7670, the model of chip U6 is 74HC00, the model of chip U7 is 74HC573, the model of chip U7 is AL422B, and the model of chip U9 is STM32F417 . It has the following advantages: using this control system, the images collected under sufficient light conditions are clear and clear, relatively clear images can also be obtained in insufficient light environments, the frequency of image collection is shortened, the collected images can be uploaded in real time, and interference can be effectively suppressed. High sensitivity is suitable for low light applications.

Description

An Image Acquisition Control System Facilitating Image Processing

technical field

The invention provides an image acquisition control system which is beneficial for image processing, and belongs to the field of electronic technology.

Background technique

Image processing is the technique of analyzing images with computers to achieve the desired results. The 21st century is an era full of information. As the visual basis for human perception of the world, images are an important means for human beings to obtain, express and transmit information. First of all, digital image processing technology can help people understand the world more objectively and accurately. The human visual system can help humans obtain more than 3/4 of information from the outside world, and images and graphics are the carriers of all visual information. The power is very high, and thousands of colors can be recognized, but in many cases, the image is blurred or even invisible to the human eye. Through image enhancement technology, the blurred or even invisible image can be made clear and bright.

Image acquisition is required before image processing, and the current image acquisition system has the following problems:

1. The image collected under sufficient light conditions is not clear enough, which affects the image processing effect;

2. The images collected in the environment with insufficient light are blurred, so that the images collected in the night environment cannot be recognized and processed;

3. After the image is collected, it cannot be uploaded in real time, which will easily cause the collected image to be lost and affect the image processing of the collected image;

4. The anti-interference performance is poor, and the system is not stable and reliable during operation;

5. The sensitivity is low, and the image cannot be captured in time and effectively;

6. The power consumption is high, and the image acquisition process needs to consume more energy.

Contents of the invention

The problem to be solved by the present invention is to provide an image acquisition control system that is conducive to image processing in view of the above deficiencies. Using this control system, the images collected under sufficient illumination conditions are clear and clear, and relatively clear images can also be obtained in insufficient illumination environments. , the frequency of image acquisition is shortened, and the collected images can be uploaded in real time, which can effectively suppress interference, and the high sensitivity is suitable for low-light applications.

In order to solve the above problems, the present invention adopts the following technical solutions

An image acquisition control system that is beneficial to image processing includes an infrared sensing signal processing module and an image acquisition module, the infrared sensing signal processing module includes a chip U3, the model of the chip U3 is BISS0001, and the image acquisition module includes a chip U4, Chip U6, chip U7, chip U8, chip U9, the model of chip U4 is OV7670, the model of chip U6 is 74HC00, the model of chip U7 is 74HC573, the model of chip U7 is AL422B, and the model of chip U9 is STM32F417.

Further, pin 9 of the chip U3 is connected to one end of resistor R2 and one end of photoresistor R3, the other end of resistor R2 is connected to a +5V power supply, the other end of photoresistor R3 is grounded, and pin 10 of chip U3 is connected to one end of resistor R4. The other end of R4 is grounded, the 11 pin of chip U3 is connected to +5V power supply, the 12 pin of chip U3 is connected to one end of resistor R5 and one end of capacitor C2, the other end of resistor R5 is connected to the other end of capacitor C2, and the other end of resistor R5 is connected to one end of resistor R6 , and connected to pin 13 of chip U3, the other end of resistor R6 is connected to one end of capacitor C3, the other end of capacitor C3 is connected to one end of resistor R7, one end of capacitor C4, and connected to pin 16 of chip U3, the other end of resistor R7 is connected to the other end of capacitor C4 , and connected to pin 15 of chip U3, pin 15 of chip U3 is connected to one end of resistor R8, the other end of capacitor R8 is connected to one end of capacitor C5, the other end of capacitor C is grounded, and pin 14 of chip U3 is connected to one end of resistor R1 and one end of capacitor C1 1. The S pin of the infrared sensor IR, the other end of the resistor R1, the other end of the capacitor C1, and the G pin of the infrared sensor IR are grounded.

Further, pin 8 of the chip U3 is connected to a +5V power supply, pin 7 of the chip U3 is grounded, pin 6 of the chip U3 is connected to one end of a resistor R9, the other end of the resistor R9 is connected to one end of a capacitor C7, and the other end of the capacitor C7 is grounded, Pin 5 of chip U3 is connected to capacitor C7, pin 4 of chip U3 is connected to one end of resistor R10 and one end of capacitor C6, the other end of resistor R10 is connected to pin 3 of chip U3, the other end of capacitor C6 is grounded, pin 2 of chip U3 is connected to resistor R11 One end, the other end of the resistor R11 is connected to the base of the triode T1, the collector of the triode T1 is connected to one end of the diode D1 and one end of the relay J1, the other end of the diode D1 and the other end of the relay J1 are connected to +12V, and the emitter of the triode T1 is grounded. Pin 1 of the chip U3 is connected to a switch SW1, and the other two ends of the switch SW1 are respectively grounded and connected to a +5V power supply.

Further, the 3 pins of the chip U4 are connected to the PA7 pins of the chip U9, the 4 pins of the chip U4 are connected to the PA6 pins of the chip U9, the 5 pins of the chip U4 are connected to the PA10 pins of the chip U9, and the 7 pins of the chip U4 are connected to the PA10 pins of the chip U8. 9 pins, 9 pins of chip U4 connect to 14 pins of chip U8, 11 pins of chip U4 connect to 12 pins of chip U8, 13 pins of chip U4 connect to 4 pins of chip U8, 15 pins of chip U4 connect to 2 pins of chip U8 Pin 10 of the chip U4 is connected to pin 13 of the chip U8, pin 12 of the chip U4 is connected to pin 11 of the chip U8, pin 14 of the chip U4 is connected to pin 3 of the chip U8, pin 16 of the chip U4 is connected to pin 1 of the chip U8.

Further, pin 1 of the chip U4 is connected to one end of a capacitor C14 and connected to a D3V3 power supply, the other end of the capacitor C14 is grounded, pin 17 of the chip U4 is connected to one end of a resistor R17, and the other end of the resistor R17 is connected to a D3V3 power supply. Pin 2 and pin 18 are grounded. Pin 8 of chip U4 is connected to pin 3 of chip U5. The type of chip U5 is a 24MHz active crystal oscillator. Pin 2 of chip U5 is grounded. Pin 4 of chip U5 is connected to the D3V3 power supply.

Further, pin 1 of the chip U6 is connected to pin 17 of the chip U7, pin 2 of the chip U6 is connected to pin 6 of the chip U4, pin 3 of the chip U6 is connected to pin 5 of the chip U8, pin 7 of the chip U6 is grounded, and pin 7 of the chip U6 is grounded. The 14-pin is connected to one end of the capacitor C16, which is connected to the D3V3 power supply, and the other end of the capacitor C16 is grounded.

Further, the pin 2 of the chip U7 is connected to the PE1 pin of the chip U9, the pin 3 of the chip U7 is connected to the PE0 pin of the chip U9, the pin 4 of the chip U7 is connected to the PB9 pin of the chip U9, and the pin 5 of the chip U7 is connected to the pin of the chip U9. Pin PB7, pin 6 of chip U7 connects pin PB8 of chip U9, pin 19 of chip U7 connects pin 8 of chip U8, pin 18 of chip U7 connects pin 20 of chip U8, pin 17 of chip U7 connects pin 1 of chip U7 , the 16 pins of the chip U7 are connected to the 21 pins of the chip U8, and the 15 pins of the chip U7 are connected to the 22 pins and 24 pins of the chip U8;

Pins 1, 7, 8, 9 and 10 of the chip U7 are grounded, and pins 11 and 20 of the chip U7 are connected to the D3V3 power supply.

Further, the 28 pins of the chip U8 are connected to the PC0 pins of the chip U9, the 27 pins of the chip U8 are connected to the PC1 pins of the chip U9, the 26 pins of the chip U8 are connected to the PC2 pins of the chip U9, and the 25 pins of the chip U8 are connected to the PC pins of the chip U9. PC3 pin, 18 pins of chip U8 connect to PC4 pin of chip U9, 17 pins of chip U8 connect to PC5 pin of chip U9, 16 pins of chip U8 connect to PC6 pin of chip U9, 15 pins of chip U8 connect to PC7 pin of chip U9 .

Further, pin 10 of the chip U8 is connected to one end of a capacitor C17 and connected to a D3V3 power supply, the other end of the capacitor C17 is grounded, pin 19 of the chip U8 is connected to one end of a capacitor C15 and connected to a D3V3 power supply, and the other end of the capacitor C15 is grounded , 6 pins of the chip U8, 7 pins of the chip U8, and 23 pins of the chip U8 are grounded.

Further, the PA7 pin of the chip U9 is connected to an infrared sensing signal processing module.

An image acquisition control system that is beneficial to image processing according to the present invention has the following beneficial effects:

1. The images collected under sufficient light conditions are clear and clear, which greatly reduces the impact of image clarity on image processing effects;

2. It can also collect sufficiently clear images in low-light environments, which greatly reduces the impact of image clarity on image processing effects;

3. After the image is collected, it can be uploaded in real time, and the collected image can be saved in time, and the collected image will not be lost;

4. It can effectively suppress interference, stable and reliable, and its anti-interference is 10%-25% higher than that of ordinary image acquisition and control systems;

5. The control system has an independent high input impedance operational amplifier, built-in delay time timer and block time timer, with novel structure and wide adjustment range;

6. The control system has high sensitivity, is suitable for low-light applications, and can collect images in a timely and effective manner under insufficient light conditions;

7. The control system consumes low power consumption and energy consumption in the process of image acquisition, and the energy consumption is 20%-40% lower than that of ordinary image acquisition control systems.

The present invention will be further described below in conjunction with drawings and embodiments.

Description of drawings

Fig. 1 is the circuit diagram of the mid-infrared sensing signal processing module of the patent of the present invention;

Fig. 2 is a partial circuit diagram of the image acquisition module in the patent of the present invention;

Fig. 3 is a partial circuit diagram of the image acquisition module in the patent of the present invention.

Detailed ways

Embodiment 1, as shown in FIGS. 1 to 3 , is an image acquisition control system that facilitates image processing, including an infrared sensing signal processing module and an image acquisition module.

The infrared sensing signal processing module uses an infrared sensor to detect the object of image acquisition in the night environment. With the help of the infrared sensing signal processing module, the image acquisition module can collect relatively clear images in the night environment. The image acquisition module Used for image acquisition.

The infrared sensing signal processing module includes a chip U3, the model of the chip U3 is BISS0001, the 9 pins of the chip U3 are connected with one end of a resistor R2 and one end of a photosensitive resistor R3, the other end of the resistor R2 is connected to a +5V power supply, and the other end of the photosensitive resistor R3 Grounding, pin 10 of chip U3 is connected to one end of resistor R4, the other end of resistor R4 is grounded, pin 11 of chip U3 is connected to +5V power supply, pin 12 of chip U3 is connected to one end of resistor R5, one end of capacitor C2, the other end of resistor R5 is connected to the capacitor The other end of C2 is connected, the other end of resistor R5 is connected to one end of resistor R6, and connected to pin 13 of chip U3, the other end of resistor R6 is connected to one end of capacitor C3, the other end of capacitor C3 is connected to one end of resistor R7, one end of capacitor C4, and connected to the chip Pin 16 of U3, the other end of resistor R7 is connected to the other end of capacitor C4, and connected to pin 15 of chip U3, pin 15 of chip U3 is connected to one end of resistor R8, the other end of capacitor R8 is connected to one end of capacitor C5, and the other end of capacitor C is grounded. Pin 14 of the chip U3 is connected with one end of the resistor R1, one end of the capacitor C1, the S pin of the infrared sensor IR, the other end of the resistor R1, the other end of the capacitor C1, and the G pin of the infrared sensor IR are grounded.

Pin 8 of the chip U3 is connected to a +5V power supply, pin 7 of the chip U3 is grounded, pin 6 of the chip U3 is connected to one end of a resistor R9, the other end of the resistor R9 is connected to one end of a capacitor C7, the other end of the capacitor C7 is grounded, and the other end of the chip U3 is connected to the ground. Pin 5 is connected to capacitor C7. Pin 4 of chip U3 is connected to one end of resistor R10 and one end of capacitor C6. The other end of resistor R10 is connected to pin 3 of chip U3. The other end of capacitor C6 is grounded. Pin 2 of chip U3 is connected to one end of resistor R11. The other end of R11 is connected to the base of the triode T1, the collector of the triode T1 is connected to one end of the diode D1 and one end of the relay J1, the other end of the diode D1 and the other end of the relay J1 are connected to +12V, the emitter of the triode T1 is grounded, and the chip U3 Pin 1 is connected with switch SW1, and the other two ends of switch SW1 are grounded and connected to +5V power supply respectively.

R3 is a photoresistor used to detect ambient illuminance. When used as lighting control, if the environment is brighter, the resistance value of R3 will be reduced, so that the input of pin 9 will be kept at a low level, thereby blocking the trigger signal Vs. SW1 is the working mode selection switch. When SW1 is connected to terminal 1, the chip is in the retriggerable working mode; when SW1 is connected to terminal 2, the chip is in the non-retriggerable working mode. The output delay time Tx is adjusted by the size of the external R9 and C7, and the value is Tx≈24576xR9C7; the trigger blockade time Ti is adjusted by the size of the external R10 and C6, and the value is Ti≈24xR10C6.

Described image acquisition module comprises chip U4, chip U6, chip U7, chip U8, chip U9, the model of chip U4 is OV7670, the model of chip U6 is 74HC00, the model of chip U7 is 74HC573, the model of chip U7 is AL422B, chip The model of U9 is STM32F417.

Pin 3 of the chip U4 is connected to pin PA7 of the chip U9, pin 4 of the chip U4 is connected to pin PA6 of the chip U9, pin 5 of the chip U4 is connected to pin PA10 of the chip U9, pin 7 of the chip U4 is connected to pin 9 of the chip U8, Pin 9 of chip U4 is connected to pin 14 of chip U8, pin 11 of chip U4 is connected to pin 12 of chip U8, pin 13 of chip U4 is connected to pin 4 of chip U8, pin 15 of chip U4 is connected to pin 2 of chip U8, chip U4 Pin 10 of chip U8 is connected to pin 13 of chip U8, pin 12 of chip U4 is connected to pin 11 of chip U8, pin 14 of chip U4 is connected to pin 3 of chip U8, pin 16 of chip U4 is connected to pin 1 of chip U8.

Pin 1 of the chip U4 is connected to one end of a capacitor C14 and connected to a D3V3 power supply, the other end of the capacitor C14 is grounded, pin 17 of the chip U4 is connected to one end of a resistor R17, and the other end of the resistor R17 is connected to a D3V3 power supply, pin 2 of the chip U4, The 18 pins are grounded, the 8 pins of the chip U4 are connected to the 3 pins of the chip U5, the model of the chip U5 is a 24MHz active crystal oscillator, the 2 pins of the chip U5 are grounded, and the 4 pins of the chip U5 are connected to the D3V3 power supply.

Pin 1 of the chip U6 is connected to pin 17 of the chip U7, pin 2 of the chip U6 is connected to pin 6 of the chip U4, pin 3 of the chip U6 is connected to pin 5 of the chip U8, pin 7 of the chip U6 is grounded, pin 14 of the chip U6 One end of the capacitor C16 is connected to the D3V3 power supply, and the other end of the capacitor C16 is grounded.

Pin 2 of the chip U7 is connected to pin PE1 of the chip U9, pin 3 of the chip U7 is connected to pin PE0 of the chip U9, pin 4 of the chip U7 is connected to pin PB9 of the chip U9, pin 5 of the chip U7 is connected to pin PB7 of the chip U9, Pin 6 of chip U7 is connected to pin PB8 of chip U9, pin 19 of chip U7 is connected to pin 8 of chip U8, pin 18 of chip U7 is connected to pin 20 of chip U8, pin 17 of chip U7 is connected to pin 1 of chip U7, chip U7 The 16 pins of the chip U8 are connected to the 21 pins of the chip U8, and the 15 pins of the chip U7 are connected to the 22 pins and 24 pins of the chip U8.

Pins 1, 7, 8, 9 and 10 of the chip U7 are grounded, and pins 11 and 20 of the chip U7 are connected to the D3V3 power supply.

The 28 pins of the chip U8 are connected to the PC0 pins of the chip U9, the 27 pins of the chip U8 are connected to the PC1 pins of the chip U9, the 26 pins of the chip U8 are connected to the PC2 pins of the chip U9, and the 25 pins of the chip U8 are connected to the PC3 pins of the chip U9, Pin 18 of the chip U8 is connected to pin PC4 of the chip U9, pin 17 of the chip U8 is connected to pin PC5 of the chip U9, pin 16 of the chip U8 is connected to pin PC6 of the chip U9, pin 15 of the chip U8 is connected to pin PC7 of the chip U9.

Pin 10 of the chip U8 is connected to one end of a capacitor C17 and connected to a D3V3 power supply, the other end of the capacitor C17 is grounded, pin 19 of the chip U8 is connected to one end of a capacitor C15 and connected to a D3V3 power supply, the other end of the capacitor C15 is grounded, and the chip U8 The 6 pins of the chip U8, the 7 pins of the chip U8, and the 23 pins of the chip U8 are grounded.

The PA7 pin of the chip U9 is connected to the infrared sensing signal processing module.

Use the PC0~PC7 ports of STM32F417 to receive the 8-bit image data output by OV7670 after being buffered by AL422B. The SIO_D and SIO_C interfaces of OV7670 are connected to the PA6 and PA7 pins of STM32F417, and the initial configuration of the camera is realized through this interface. PE0, PE1, PB7, and PB8 of STM32F417 respectively control the clock signal, write reset, read reset, and read enable signal of AL422B. The line scan signal output by PB9 and OV7670 realizes the control of the write enable of the frame buffer through the NAND chip, and the PA10 pin of the STM32F417 detects whether the camera outputs a complete image through an interrupt.

OV7670 output synchronous signals include: vertical synchronous signal VSYNC, horizontal synchronous signal HREF, pixel clock PCLK. According to the synchronization signal timing diagram provided by the OV7670 data sheet, the pixel clock PCLK of the OV76 70 camera is connected to the FIFO write clock WCLK, and the data is written into the chip U7 when PCLK is valid. The field synchronization signal VSYNC is the timing for scanning a frame of images. A frame of image scanning is completed between two positive pulses.

When STM32F417 detects the falling edge of VSYNC for the first time, the system generates an interrupt for the first time, indicating that OV7670 starts to output a frame of image, STM32F417 sets FIFO_WEN to high level, when HREF is valid (high level), FIFO_WEN and HREF pass through The NOT gate enables the WCK of the chip U7 to automatically write valid image data into the chip U7.

When the second VSYNC interrupt is generated, it indicates that a complete frame of image has been written into the chip U7, and the system realizes static storage of the image by setting FIFO_WEN low to latch a frame of image data. At this time, STM32F417 sends a rising edge to the read clock RCLK of the chip U7 to read the data from the chip U7 to complete the real-time acquisition and extraction of image data.

The above descriptions are examples of the best implementation modes of the present invention, and the parts not mentioned in detail are common knowledge of those skilled in the art. The protection scope of the present invention is based on the content of the claims, and any equivalent transformation based on the technical inspiration of the present invention is also within the protection scope of the present invention.

Claims (1)

1. a kind of Image Acquisition control system for being conducive to carry out image procossing, including infrared sensing signal processing module and image Acquisition module, it is characterised in that：The infrared sensing signal processing module includes chip U3, the model of chip U3 BISS0001, image capture module include chip U4, chip U6, chip U7, chip U8, chip U9, the model of chip U4 The model AL422B of the model 74HC573 of the model 74HC00 of OV7670, chip U6, chip U7, chip U7, chip The model STM32F417 of U9；

9 feet of the chip U3 are connected with the one end resistance R2, the one end photo resistance R3, resistance R2 other end access+5V power supplys, light 10 feet of quick resistance R3 other ends ground connection, chip U3 are connected with the one end resistance R4, and the resistance R4 other ends are grounded, and the 11 of chip U3 12 feet of foot connection+5V power supplys, chip U3 are connected with the one end resistance R5, the one end capacitance C2, and the resistance R5 other ends and capacitance C2 are another One end connects, and the resistance R5 other ends are connected with the one end resistance R6, and connect 13 feet of chip U3, and the resistance R6 other ends are connected with The one end capacitance C3, the capacitance C3 other ends are connected with the one end resistance R7, the one end capacitance C4, and connect 16 feet of chip U3, resistance R7 The other end connects the capacitance C4 other ends, and connects 15 feet of chip U3, and 15 feet of chip U3 are connected with the one end resistance R8, capacitance The R8 other ends are connected with the one end capacitance C5, capacitance C other ends ground connection, and 14 feet of chip U3 are connected with the one end resistance R1, capacitance C1 One end, infrared sensor IR S feet, the resistance R1 other ends, the capacitance C1 other ends, infrared sensor IR G feet ground connection；

The 8 foot access+5V power supplys of the chip U3, the 7 feet ground connection of chip U3,6 feet of chip U3 are connected with the one end resistance R9, The resistance R9 other ends are connected with the one end capacitance C7, and 5 feet of capacitance C7 other ends ground connection, chip U3 connect capacitance C7, chip U3's 4 feet are connected with the one end resistance R10, the one end capacitance C6, and the resistance R10 other ends connect 3 feet of chip U3, another terminations of capacitance C6 2 feet on ground, chip U3 are connected with the one end resistance R11, and the resistance R11 other ends are connected with the base stage of triode T1, triode T1's Collector is connected with the one end diode D1 and the one end relay J1, and the diode D1 other ends, relay J1 other ends access+ The emitter of 12V, triode T1 is grounded, and 1 foot of chip U3 is connected with switch SW1, the other both ends switch SW1 be grounded respectively with Access+5V power supplys；

The PA7 feet of the 3 feet connection chip U9 of the chip U4, the PA6 feet of the 4 feet connection chip U9 of chip U4, the 5 of chip U4 Foot connects the PA10 feet of chip U9,9 feet of the 7 feet connection chip U8 of chip U4, and 9 feet of chip U4 connect 14 feet of chip U8, 12 feet of the 11 feet connection chip U8 of chip U4,4 feet of the 13 feet connection chip U8 of chip U4,15 feet of chip U4 connect core 2 feet of piece U8,13 feet of the 10 feet connection chip U8 of chip U4,11 feet of the 12 feet connection chip U8 of chip U4, chip U4's 14 feet connect 3 feet of chip U8,1 foot of the 16 feet connection chip U8 of chip U4；

1 foot of the chip U4 is connected with the one end capacitance C14, and accesses D3V3 power supplys, capacitance C14 other ends ground connection, chip U4 17 feet be connected with the one end resistance R17, the resistance R17 other ends connect D3V3 power supplys, 2 feet of chip U4,18 feet ground connection, chip 8 feet of U4 are connected with 3 feet of chip U5, and the model 24MHz of chip U5 has source crystal oscillator, the 2 feet ground connection of chip U5, chip U5 4 feet access D3V3 power supplys；

17 feet of the 1 foot connection chip U7 of the chip U6,6 feet of the 2 feet connection chip U4 of chip U6,3 feet of chip U6 connect 5 feet of chip U8 are connect, the 7 feet ground connection of chip U6,14 feet of chip U6 are connected with the one end capacitance C16, and access D3V3 power supplys, The capacitance C16 other ends are grounded；

The PE1 feet of the 2 feet connection chip U9 of the chip U7, the PE0 feet of the 3 feet connection chip U9 of chip U7, the 4 of chip U7 Foot connects the PB9 feet of chip U9, the PB7 feet of the 5 feet connection chip U9 of chip U7, the PB8 of the 6 feet connection chip U9 of chip U7 Foot, 8 feet of the 19 feet connection chip U8 of chip U7,20 feet of the 18 feet connection chip U8 of chip U7, the 17 feet connection of chip U7 1 foot of chip U7,21 feet of the 16 feet connection chip U8 of chip U7,22 feet and 24 feet of the 15 feet connection chip U8 of chip U7；

1 foot of the chip U7,7 feet, 8 feet, 9 feet, 10 feet ground connection, 11 feet, 20 feet of chip U7 access D3V3 power supplys；

The PC0 feet of the 28 feet connection chip U9 of the chip U8, the PC1 feet of the 27 feet connection chip U9 of chip U8, chip U8's 26 feet connect the PC2 feet of chip U9, the PC3 feet of the 25 feet connection chip U9 of chip U8, and 18 feet of chip U8 connect chip U9's PC4 feet, the PC5 feet of the 17 feet connection chip U9 of chip U8, the PC6 feet of the 16 feet connection chip U9 of chip U8, the 15 of chip U8 Foot connects the PC7 feet of chip U9；

10 feet of the chip U8 are connected with the one end capacitance C17, and access D3V3 power supplys, capacitance C17 other ends ground connection, chip 19 feet of U8 are connected with the one end capacitance C15, and access D3V3 power supplys, capacitance C15 other ends ground connection, 6 feet, the chip of chip U8 7 feet of U8, the 23 feet ground connection of chip U8；

The PA7 feet of the chip U9 connect infrared sensing signal processing module；

Shown R3 is photo resistance, for detecting ambient light illumination, when as Lighting control, and if environment is relatively bright, the resistance of R3 Value can reduce, and the input of 9 feet is made to remain low level, to block trigger signal Vs；SW1 is working mode selection switch, when When SW1 is connected to 1 end, chip is in repeatable triggered mode of operation；When SW1 is connected to 2 ends, chip is then in not reproducible Triggered mode of operation；Output delay time Tx is adjusted by the size of external R9 and C7, is worth for Tx ≈ 24576xR9C7；Triggering envelope It locks time Ti to be adjusted by the size of external R10 and C6, be worth for Ti ≈ 24xR10C6；

OV7670, which is received, using PC0~PC7 mouths of STM32F417 exports the 8 bit image data after AL422B is cached, SIO_D, SIO_C interface of OV7670 is connected with PA6, PA7 pin of STM32F417, is realized to camera by the interface Initial configuration；PE0, PE1, PB7, PB8 of STM32F417 control respectively the clock signal of AL422B, write reset, read reset with And read enable signal；The line scan signals of PB9 and OV7670 outputs with the realization of non-chip by writing frame buffer enabled control System, the PA10 pins of STM32F417 detect whether camera exports the complete image of a frame by way of interruption；

When STM32F417 detects VSYNC failing edges for the first time, system generates interruption for the first time, and it is defeated to show that OV7670 starts Go out a frame image, FIFO_WEN is set high level by STM32F417, and when HREF effectively (high level), FIFO_WEN and HREF is logical The WCK that NAND gate enables chip U7 is crossed, effective image data are automatically write in chip U7；

When second VSYNC, which is interrupted, to be generated, show that the complete image of a frame is written chip U7, system pass through by FIFO_WEN is set low, and is latched a frame image data, is realized the static storage of image；At this point, STM32F417 gives the reading of chip U7 Mono- rising edge of clock RCLK reads out data from chip U7, completes the real-time acquisition and extraction of image data.