CN107703657A - Array base palte defect mending method - Google Patents
Array base palte defect mending method Download PDFInfo
- Publication number
- CN107703657A CN107703657A CN201711183998.3A CN201711183998A CN107703657A CN 107703657 A CN107703657 A CN 107703657A CN 201711183998 A CN201711183998 A CN 201711183998A CN 107703657 A CN107703657 A CN 107703657A
- Authority
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- China
- Prior art keywords
- defect
- sub
- pixels
- pixel
- base palte
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005520 cutting process Methods 0.000 claims abstract description 27
- 230000011218 segmentation Effects 0.000 claims description 5
- 238000005229 chemical vapour deposition Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- NZZMVMMUNRNSMC-UHFFFAOYSA-N 1-[3-(5,6-dihydrobenzo[b][1]benzazepin-11-yl)propyl]-4-piperidin-1-ylpiperidine-4-carboxamide;dihydrochloride Chemical compound Cl.Cl.C1CN(CCCN2C3=CC=CC=C3CCC3=CC=CC=C32)CCC1(C(=O)N)N1CCCCC1 NZZMVMMUNRNSMC-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 27
- 238000010586 diagram Methods 0.000 description 8
- 238000002161 passivation Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000007792 gaseous phase Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
Abstract
The invention discloses the invention provides a kind of array base palte defect mending method, comprise the following steps:Defect part in defect sub-pixels is rejected;The defect sub-pixels are cut;The defects of by after cutting, sub-pixel was connected with adjacent normal sub-pixel.The present invention is compared with prior art, by being punched to defect part in defect sub-pixels, being cut, the effect of repairing of being finally reached being connected with adjacent normal sub-pixel, and because the repairing in the present invention is the film layer where repairing defect part, therefore its repairing difficulty is low, improves the success rate of repairing.
Description
Technical field
The present invention relates to a kind of display panel technology, particularly a kind of array base palte defect mending method.
Background technology
Liquid crystal display panel of thin film transistor has been become increasingly popular to all trades and professions, and in TFT (Thin Film
Transisto, thin film transistor (TFT)) in array base palte, sub-pixel defect occurs often, and sub-pixel defect not only influences film crystal
The quality of pipe display panel, and production cost can be greatly added, at present also without a kind of preferable antithetical phrase in industry
The method that picture element flaw is repaired,.
The content of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of array base palte defect mending method, so as to improve repairing
Success rate and the difficulty for reducing repairing.
The invention provides a kind of array base palte defect mending method, comprise the following steps:
Defect part in defect sub-pixels is rejected;
The defect sub-pixels are cut;
The defects of by after cutting, sub-pixel was connected with adjacent normal sub-pixel.
Further, it is described to be rejected defective part in defect sub-pixels defect part in defect sub-pixels specially
Film layer where point is punched.
Further, the described pair of defect sub-pixels, which carry out cutting, includes defect sub-pixels being divided into two halves.
Further, it is described that defect sub-pixels are divided into two halves specially by film where defect part in defect sub-pixels
Layer is divided into two halves.
Further, it is described by after cutting the defects of sub-pixel to be connected with adjacent normal sub-pixel be specially by defect
The defects of after splitting in sub-pixel, partly place film layer was connected with corresponding to film layer in adjacent normal sub-pixel.
Further, it is described by after cutting the defects of sub-pixel be connected with adjacent normal sub-pixel and use chemical gaseous phase
The mode of deposition is carried out.
Further, the segmentation uses is cut along the diagonal of defect sub-pixels or the midpoint line of opposite sides
Cut.
Further, it is described by before defect part is punched in defect sub-pixels, array substrate per together
Processing procedure is monitored.
Further, when there are defect sub-pixels in wherein one of processing procedure, shut down and defect sub-pixels are repaired.
The present invention compared with prior art, by being punched, being cut to defect part in defect sub-pixels, with it is adjacent
Normal sub-pixel connection is finally reached the effect of repairing, and because the repairing in the present invention is where repairing defect part
Film layer, therefore its repairing difficulty is low, improves the success rate of repairing.
Brief description of the drawings
Fig. 1 is the flow chart of method for repairing and mending of the present invention;
Fig. 2 is the schematic diagram of defect part in defect sub-pixels of the present invention;
Fig. 3 is the schematic diagram that the present invention rejects defect part;
Fig. 4 is the schematic diagram that the present invention is cut to defect sub-pixels;
Fig. 5 is the schematic diagram that the defects of present invention is by after cutting sub-pixel is connected with adjacent normal sub-pixel;
Fig. 6 be connected to after brightness schematic diagram;
Fig. 7 is the schematic diagram of the first cutting position of the present invention;
Fig. 8 is the schematic diagram of second of cutting position of the present invention;
Fig. 9 is the schematic diagram of the third cutting position of the present invention.
Embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.
As shown in figure 1, the invention provides a kind of array base palte defect mending method, comprise the following steps:
Step S01, as shown in figure 3, defect part in defect sub-pixels to be rejected to (filled black part is scarce in figure
Part is fallen into, that is, is indicated 11);In this step, the surrounding of defect sub-pixels may be respectively provided with normal sub-pixel (Fig. 2 institute
Show), it is also possible to there is a normal sub-pixel at least both sides of defect sub-pixels;Specifically, will be lacked in defect sub-pixels
Sunken part, which is rejected, is specially punched film layer where defect part in defect sub-pixels, and punching here can use now
There is used repairing board during defect mending in technology to punch defect part;But, can be with the invention is not restricted to this
Punched using by defect part correspondence position in defect sub-pixels, i.e., by film layer where defect part and defect part pair
Remaining film layer answered is rejected.The hole of the punching is rectangular opening, circular hole etc..
Step S02, as shown in figure 4, being cut to the defect sub-pixels;Specifically, the described pair of defect sub-pixels are entered
Row cutting includes defect sub-pixels being divided into two halves;It is specially by defect that defect sub-pixels are divided into two halves in the present invention
Film layer where defect part is divided into two halves in sub-pixel;But the invention is not restricted to this, segmentation can also be by defect sub-pixels
Overall segmentation is into two.
Step S03, the defects of as shown in figure 5, by after cutting, sub-pixel was connected with adjacent normal sub-pixel;Specifically,
The defects of by after cutting sub-pixel be connected with adjacent normal sub-pixel be specially will in defect sub-pixels split after the defects of
Film layer where part is connected with corresponding to film layer in adjacent normal sub-pixel, in Figure 5, defect sub-pixels and upper and lower two sub- pictures
Element is connected, and being connected here can be electric connection or general connection;(such as public affairs if film layer where defect part is conductive film layer
Common electrode, pixel electrode etc.) electric connection is then connected to, if film layer where defect part is general film layer (such as passivation layer, flat
Layer etc.) then it is connected to general connection;But the invention is not restricted to this, can also use when defect sub-pixels are integrally split into two
When, the part film layer being cut in defect sub-pixels is connected with the corresponding film layer in adjacent normal sub-pixel, such as is cut
The public electrode of the public electrode of the defects of cutting sub-pixel and adjacent normal sub-pixel is electrically connected with;The defects of being cut
The flatness layer of pixel is connected with the flatness layer of adjacent normal sub-pixel;Be cut the defects of sub-pixel passivation layer with it is adjacent
Normal sub-pixel passivation layer connection;The pixel electrode of the defects of being cut sub-pixel and adjacent normal sub-pixel
Pixel electrode electric connection etc..
So that the voltage of cut pixel electrode is consistent with the voltage of normal sub-pixel.
Sub-pixel is connected with adjacent normal sub-pixel in the step S03, the defects of by after cutting uses chemical gaseous phase
The mode of deposition is carried out, and the film layer where defect part is repaired greatly using chemical vapor deposition, if such as defect part
It is pixel electrode, then film material for electric connection is deposited by chemical vapor deposition to the pixel electrode after cutting,
Certainly, the selection of material can for film layer identical material.
, can be with array substrate per system together before step S01 in the method for repairing and mending of the array base palte of the present invention
Journey is monitored, and monitoring here is after the preparation of source-drain electrode.When there are defect sub-pixels in wherein one of processing procedure, stop
Machine is simultaneously repaired to defect sub-pixels;But terminate the invention is not restricted to this or in all processing procedures of array base palte laggard
Row monitors and defect sub-pixels is repaired.
The method for repairing and mending of the present invention is directed to film layer more than source-drain electrode, that is, includes flatness layer, public electrode, passivation
Layer and/or pixel electrode etc..
It is in order to avoid defect sub-pixels 1 and adjacent one normal son that defect sub-pixels are cut into two halves by the present invention
Pixel 2,3 can be caused more significantly to distinguish when being integrally attached to the brightness of display, therefore defect sub-pixels are cut into two halves
111st, 112, and be each connected with adjacent normal sub-pixel 2,3, then the brightness of the defect sub-pixels is just to be two neighboring
The average value brightness (as shown in Figure 6) of normal sub-pixel luminence, so defect sub-pixels would not be with normal sub-pixel
There is obvious difference.
As shown in fig. 7, in the first cutting method of the present invention, carried out along the midpoint line of defect sub-pixels opposite sides
Cutting.Specifically, the midpoint line for left and right sides in figure is cut, and defect sub-pixels is divided into upper and lower two
Half,, can also be with left and right phase to be connected with neighbouring two normal sub-pixels so when carrying out step S03
Two adjacent normal sub-pixels are connected.
As shown in figure 8, in second of cutting method of the present invention, carried out along the midpoint line of defect sub-pixels opposite sides
Cutting.Specifically, for the midpoint line of two sides is cut up and down in figure, defect sub-pixels are so made to be divided into left and right two
Half, so when carrying out step S03, it is connected for two adjacent with left and right normal sub-pixels, can also be with phase up and down
Two adjacent normal sub-pixels are connected.
As shown in figure 9, in the third cutting method of the present invention, cut along the diagonal of defect sub-pixels.Specifically
Ground, the diagonal for the lower left corner in figure and the upper right corner are cut, and defect sub-pixels is divided into left and right two halves, so
When carrying out step S03, it is connected for two adjacent with left and right normal sub-pixels, can also be with neighbouring two
Normal sub-pixel is connected.
The cutting method of the present invention is not limited to three kinds of above-mentioned cutting modes, can also be according to actual conditions and defect part
Position specifically adjusted.
Below with defect part shown position in Fig. 1, the present invention will be described;
As shown in Fig. 2 when it is defect sub-pixels to monitor the sub-pixel among position, using following method for repairing and mending:
Step S01, as shown in Figures 2 and 3, defect part 11 in defect sub-pixels 1 is rejected;Specifically, will lack
Defect part 11, which is rejected, in sunken sub-pixel 1 is specially punched the place film layer of defect part in defect sub-pixels 1 11,
Make the rectangular opening 12 that defect part 11 is changed into figure, punching here can use used during defect mending in the prior art repair
Assisting vehicle platform punches to defect part;But the invention is not restricted to this, can also use defect part pair in defect sub-pixels
Answer position to be punched, i.e., rejected remaining film layer corresponding to film layer where defect part and defect part.It is described
The hole of punching is rectangular opening, circular hole etc..
Step S02, as shown in figure 4, being cut to midpoint line of the defect sub-pixels along left and right sides;Here
It is cut into and defect sub-pixels is carried out to overall segmentation;At this moment, the first half of the rectangular opening 12 positioned at the defects of being cut sub-pixel
Divide in 111.
Step S03, the defects of as shown in figure 5, by after cutting, sub-pixel was connected with adjacent normal sub-pixel;In Figure 5,
The top half 111 and the latter half 112 and upper and lower two normal sub-pixels 2,3 of the defects of being cut sub-pixel be connected to by
The part film layer being cut in defect sub-pixels 1 connects with the corresponding film layer in adjacent normal sub-pixel.
The present invention by part the defects of defect sub-pixels by being rejected, being cut and carried out with adjacent normal sub-pixel
It is connected, so that the defects of being cut sub-pixel synthesizes a new normal sub-pixel with adjacent normal sub-pixel group, from
And reach the purpose of repairing defect.
Although the present invention has shown and described with reference to specific embodiment, it should be appreciated by those skilled in the art that:
In the case where not departing from the spirit and scope of the present invention limited by claim and its equivalent, can carry out herein form and
Various change in details.
Claims (9)
- A kind of 1. array base palte defect mending method, it is characterised in that:Comprise the following steps:Defect part in defect sub-pixels is rejected;The defect sub-pixels are cut;The defects of by after cutting, sub-pixel was connected with adjacent normal sub-pixel.
- 2. array base palte defect mending method according to claim 1, it is characterised in that:It is described to be lacked in defect sub-pixels Sunken part, which is rejected, is specially punched film layer where defect part in defect sub-pixels.
- 3. array base palte defect mending method according to claim 1, it is characterised in that:The described pair of defect sub-pixels are entered Row cutting includes defect sub-pixels being divided into two halves.
- 4. array base palte defect mending method according to claim 3, it is characterised in that:It is described to split defect sub-pixels It is specially that film layer where defect part in defect sub-pixels is divided into two halves for two halves.
- 5. array base palte defect mending method according to claim 1, it is characterised in that:It is described will cutting after the defects of son Pixel is connected with adjacent normal sub-pixel the defects of being specially after splitting in defect sub-pixels film layer and phase where part Film layer is corresponded in adjacent normal sub-pixel to be connected.
- 6. array base palte defect mending method according to claim 1, it is characterised in that:It is described will cutting after the defects of son Pixel is connected by the way of chemical vapor deposition with adjacent normal sub-pixel to be carried out.
- 7. array base palte defect mending method according to claim 1, it is characterised in that:The segmentation is used along defecton The diagonal of pixel or the midpoint line of opposite sides are cut.
- 8. array base palte defect mending method according to claim 1, it is characterised in that:It is described by defect sub-pixels Before defect part is punched, every one of processing procedure of array substrate is monitored.
- 9. array base palte defect mending method according to claim 8, it is characterised in that:Occur when in wherein one of processing procedure During defect sub-pixels, shut down and defect sub-pixels are repaired.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711183998.3A CN107703657A (en) | 2017-11-23 | 2017-11-23 | Array base palte defect mending method |
| PCT/CN2017/113224 WO2019100411A1 (en) | 2017-11-23 | 2017-11-28 | Array substrate defect repair method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711183998.3A CN107703657A (en) | 2017-11-23 | 2017-11-23 | Array base palte defect mending method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107703657A true CN107703657A (en) | 2018-02-16 |
Family
ID=61185846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711183998.3A Pending CN107703657A (en) | 2017-11-23 | 2017-11-23 | Array base palte defect mending method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107703657A (en) |
| WO (1) | WO2019100411A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108646476A (en) * | 2018-03-22 | 2018-10-12 | 南京中电熊猫液晶显示科技有限公司 | A kind of broken wire repair method of liquid crystal display panel |
| CN111562693A (en) * | 2020-06-02 | 2020-08-21 | 京东方科技集团股份有限公司 | Method for preparing liquid crystal display |
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| CN1567076A (en) * | 2003-06-20 | 2005-01-19 | 友达光电股份有限公司 | How to Repair LCD Display Containing Foreign Objects |
| KR20080056830A (en) * | 2006-12-19 | 2008-06-24 | 엘지디스플레이 주식회사 | LCD and its repair method |
| US20080224991A1 (en) * | 2007-03-12 | 2008-09-18 | Prime View International Co., Ltd. | Repairing Method and Structure of Display Electrode |
| CN101424792A (en) * | 2007-11-02 | 2009-05-06 | 上海广电Nec液晶显示器有限公司 | Point defects repairing method of lcd device |
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| CN101776808A (en) * | 2010-02-10 | 2010-07-14 | 深超光电(深圳)有限公司 | Liquid crystal display array base plate and patching method thereof |
| KR20110101000A (en) * | 2010-03-05 | 2011-09-15 | 엘지디스플레이 주식회사 | Laser repair method of liquid crystal display |
| CN102736341A (en) * | 2012-07-10 | 2012-10-17 | 深圳市华星光电技术有限公司 | Liquid crystal display panel and repairing method of liquid crystal display panel |
| CN102934154A (en) * | 2011-05-26 | 2013-02-13 | 松下电器产业株式会社 | Display panel and manufacturing method thereof |
| CN105759522A (en) * | 2016-05-11 | 2016-07-13 | 深圳市华星光电技术有限公司 | Broken wire restoration method for TFT substrate |
| CN107329296A (en) * | 2017-08-25 | 2017-11-07 | 深圳市华星光电技术有限公司 | Liquid crystal panel dim spot method for repairing and mending and array base-plate structure |
-
2017
- 2017-11-23 CN CN201711183998.3A patent/CN107703657A/en active Pending
- 2017-11-28 WO PCT/CN2017/113224 patent/WO2019100411A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001147649A (en) * | 1999-11-19 | 2001-05-29 | Fujitsu Ltd | Display device and defect repair method thereof |
| CN1567076A (en) * | 2003-06-20 | 2005-01-19 | 友达光电股份有限公司 | How to Repair LCD Display Containing Foreign Objects |
| KR20080056830A (en) * | 2006-12-19 | 2008-06-24 | 엘지디스플레이 주식회사 | LCD and its repair method |
| US20080224991A1 (en) * | 2007-03-12 | 2008-09-18 | Prime View International Co., Ltd. | Repairing Method and Structure of Display Electrode |
| CN101424792A (en) * | 2007-11-02 | 2009-05-06 | 上海广电Nec液晶显示器有限公司 | Point defects repairing method of lcd device |
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| CN101776808A (en) * | 2010-02-10 | 2010-07-14 | 深超光电(深圳)有限公司 | Liquid crystal display array base plate and patching method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| CN111562693A (en) * | 2020-06-02 | 2020-08-21 | 京东方科技集团股份有限公司 | Method for preparing liquid crystal display |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019100411A1 (en) | 2019-05-31 |
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