CN107567209A - A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method - Google Patents
A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method Download PDFInfo
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- CN107567209A CN107567209A CN201710940381.5A CN201710940381A CN107567209A CN 107567209 A CN107567209 A CN 107567209A CN 201710940381 A CN201710940381 A CN 201710940381A CN 107567209 A CN107567209 A CN 107567209A
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- Prior art keywords
- plate
- frequency microwave
- copper
- microwave composite
- layer board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000002131 composite material Substances 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000012360 testing method Methods 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims description 15
- 239000002994 raw material Substances 0.000 claims description 15
- 230000003064 anti-oxidating effect Effects 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 4
- 238000011161 development Methods 0.000 claims description 4
- 238000011056 performance test Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 3
- 238000005553 drilling Methods 0.000 abstract description 2
- 238000007689 inspection Methods 0.000 abstract description 2
- 238000004381 surface treatment Methods 0.000 abstract description 2
- 230000009977 dual effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Landscapes
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method, comprises the following steps：(1) inspection, the packaging present invention provide a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method and have that high yield rate, production cost are low, rapidly and efficiently a little eventually for pressure, (10) shaping, (11) surface treatment, (12) test, (13) soon for sawing sheet, (2) drilling, (3) plasma, (4) sink copper plate electric, (5) outer graphics, (6) acid etching, (7) welding resistance, (8) character, (9), the more common fast efficiency high of pressure regulation speed of this method；The quality of production meets the requirements of the customers, PIM values are between 250 270, reach the standard of the 260+ of client/20, it is in the prior art 150 180min as pressing time length, and the application only needs 30min, operating efficiency is greatly improved, has saved production cost, there is great economic value and social value.
Description
Technical field
The present invention relates to two-sided high-frequency microwave product processing technique field, and in particular to a kind of high efficiency high-frequency microwave is compound
Method for producing multi-layer board.
Background technology
It is highly developed to produce two-sided high-frequency microwave product technology now, the material often used such as AD255, AD300, GF300,
RO3000 series, Tai Kangli, the prosperous spirit in Taizhou, China and Britain etc.；This portion of material needs when being processed as dual platen in PCB production processes
To be that can reach the intermodulation value (PIM values) of customer demand by the good parameter of technology Authority Contro1, client is when in use using more
PCS (block) PCB is combined into required thickness, then carries out frequency modulation, and operating process is complicated, and combination precision is uncontrolled.Such product
The limitation of production process, straight fold can not carry out PIM adjustment when being overlapped into multi-layer sheet by traditional method, so as to cause product
Failure.
The Making programme of usual two-sided high-frequency microwave antenna product：
Sawing sheet (conventional plate shearing machine is cut out by sawing sheet size) → drilling (is drilled) using big nation's rig by common FR4 parameters
→ plasma (hole handles (using Australia's treasured plasma processing de-smear formula)) → sink copper plate electric (passes through whole hole, after activation
Sinking last layer 0.5um or so copper in hole wall makes to be powered in hole, then passes through to electroplate and thickeies.) → outer graphics are (dry by pasting
Film, exposure, development protection plate face need to stay the figure of copper position) → acid etching (copper for exposing plate face etches clean) → resistance
Weldering (all positions that weldment is not needed by graphics request protection plate face) → character (identifies) → shaping in solder mask character silk printing
(by finished product delivery gauge that big plate gong is first into delivery order) → surface treatment (is done anti-oxidation in the electric connecting point copper face of production board
Processing) → test (tested with flying needle machine open-short circuit, PIM values and the performance test such as weldment) → whole inspection → packed (at surface
Reason can be variant because of customer requirement flow tandem with shaping).
But this method client needs to fix two pieces of dual platens using physical method when in use, it is low Aligning degree to be present, though
Right prior art is also improved, but the scheme people after improving has the problem of more, such as：Multi-layer sheet after compound is set
The PIM values of meter be 260 ± 20, survey dual platen when it is qualified, PIM value changes are unstable after being combined into multi-layer sheet, 170-280 it
Between fluctuate, influence the transmission of signal, therefore need further to be improved.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of high yield rate, life for above-mentioned the deficiencies in the prior art
Production cost is low, high-frequency microwave composite multi-layer board manufacturing method rapidly and efficiently.
The present invention provides a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method, comprises the following steps：
(1) sawing sheet
Processing is cut out by sawing sheet size to raw material plate using plate shearing machine；
(2) drill
Raw material plate by cutting out is drilled using big nation's rig by PTFE parameters, forms through hole；
(3) plasma
Removing glue Slag treatment is carried out using plasma processing to the through hole in step (2)；
(4) sink copper plate electric
Copper-coating is carried out to treated through hole in step (3), sunk after activation on through-hole wall have one layer 0.1~
2um copper, makes through hole be powered, and is then thickeied by electroplating；
(5) outer graphics
To the raw material plate Jing Guo copper-coating by pasting dry film, exposure, development treatment, copper position is stayed for protecting plate face to need
The figure put；
(6) acid etching
The copper that treated raw material plate exposes in step (5) is etched clean；
(7) welding resistance
All positions of weldment are not needed by graphics request protection plate face；
(8) character
Identified in solder mask character silk printing；
(9) fast pressure
The fast pressure of raw material plate for being handled two by above-mentioned steps using the pure glue of individual AD is combined into multilayer high-frequency microwave and answered
Plywood,
(10) it is molded
Multilayer high-frequency microwave composite plate in step (9) is handed over by finished product delivery gauge gong into multilayer high-frequency microwave composite plate
Manifest member, obtains production board；
(11) it is surface-treated
Anti-oxidation processing is done to the electric connecting point copper face of the production board；
(12) test
To performance tests such as the flying needle machine open-short circuit of the production board Jing Guo anti-oxidation processing, the test of PIM values and weldments；
(13) examine eventually, packaging
Qualified production board will be detected and carry out packing processes.
Further, the production board includes the first high-frequency microwave plate, AD glue-lines and the second high-frequency microwave plate, the AD glue
Layer is between the first high-frequency microwave plate and the second high-frequency microwave plate.
Further, the AD glue-lines are 0.1~50um.
The beneficial effects of the present invention are：
The present invention, which provides a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method, has high yield rate, production cost
It is low, rapidly and efficiently a little, the more common fast efficiency high of pressure regulation speed of this method；The quality of production meets the requirements of the customers, PIM
Value reaches the standard of the 260+ of client/- 20, is in the prior art 150-180min as pressing time length between 250-270, and
The application only needs 30min, greatly improves operating efficiency, has saved production cost, has great economic value and society
It can be worth.
Brief description of the drawings
Fig. 1 is a kind of production board structure chart of high efficiency high-frequency microwave composite multi-layer board manufacturing method.
Embodiment
Embodiments of the present invention are specifically illustrated with reference to embodiment and accompanying drawing, accompanying drawing is only for reference and explanation uses,
The limitation to scope of patent protection of the present invention is not formed.
The present embodiment provides a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method, comprises the following steps：
(1) sawing sheet
Processing is cut out by sawing sheet size to raw material plate using plate shearing machine；
(2) drill
Raw material plate by cutting out is drilled using big nation's rig by PTFE parameters, forms through hole；
(3) plasma
Removing glue Slag treatment is carried out using plasma processing to the through hole in step (2)；
(4) sink copper plate electric
Copper-coating is carried out to treated through hole in step (3), being sunk after activation on through-hole wall has one layer of 0.5um's
Copper, through hole is powered, then thickeied by electroplating；
(5) outer graphics
To the raw material plate Jing Guo copper-coating by pasting dry film, exposure, development treatment, copper position is stayed for protecting plate face to need
The figure put；
(6) acid etching
The copper that treated raw material plate exposes in step (5) is etched clean；
(7) welding resistance
All positions of weldment are not needed by graphics request protection plate face；
(8) character
Identified in solder mask character silk printing；
(9) fast pressure
The fast pressure of raw material plate for being handled two by above-mentioned steps using the pure glue of individual AD is combined into multilayer high-frequency microwave and answered
Plywood,
(10) it is molded
Multilayer high-frequency microwave composite plate in step (9) is handed over by finished product delivery gauge gong into multilayer high-frequency microwave composite plate
Manifest member, obtains production board；
(11) it is surface-treated
Anti-oxidation processing is done to the electric connecting point copper face of the production board；
(12) test
To performance tests such as the flying needle machine open-short circuit of the production board Jing Guo anti-oxidation processing, the test of PIM values and weldments；
(13) examine eventually, packaging
Qualified production board will be detected and carry out packing processes.
The present embodiment provides, and the production board includes the first high-frequency microwave plate, AD glue-lines and the second high-frequency microwave plate, described
AD glue-lines are between the first high-frequency microwave plate and the second high-frequency microwave plate.
The present embodiment provides, and the AD glue-lines are 25um.
The present invention, which provides a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method, has high yield rate, production cost
It is low, rapidly and efficiently a little, the more common fast efficiency high of pressure regulation speed of this method；The quality of production meets the requirements of the customers, PIM
Value reaches the standard of the 260+ of client/- 20, is in the prior art 150-180min as pressing time length between 250-270, and
The application only needs 30min, greatly improves operating efficiency, has saved production cost, has great economic value and society
It can be worth.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (3)
1. a kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method, it is characterised in that comprise the following steps：
(1) sawing sheet
Processing is cut out by sawing sheet size to raw material plate using plate shearing machine；
(2) drill
Raw material plate by cutting out is drilled using big nation's rig by PTFE parameters, forms through hole；
(3) plasma
Removing glue Slag treatment is carried out using plasma processing to the through hole in step (2)；
(4) sink copper plate electric
Copper-coating is carried out to treated through hole in step (3), being sunk after activation on through-hole wall has one layer of 0.1~2um's
Copper, through hole is powered, then thickeied by electroplating；
(5) outer graphics
To the raw material plate Jing Guo copper-coating by pasting dry film, exposure, development treatment, copper position is stayed for protecting plate face to need
Figure；
(6) acid etching
The copper that treated raw material plate exposes in step (5) is etched clean；
(7) welding resistance
All positions of weldment are not needed by graphics request protection plate face；
(8) character
Identified in solder mask character silk printing；
(9) fast pressure
Pressure is combined into multilayer high-frequency microwave composite plate to the raw material plate for being handled two by above-mentioned steps using the pure glue of individual AD soon,
(10) it is molded
Multilayer high-frequency microwave composite plate in step (9) is pressed into finished product delivery gauge gong into multilayer high-frequency microwave composite plate delivery order
Member, obtain production board；
(11) it is surface-treated
Anti-oxidation processing is done to the electric connecting point copper face of the production board；
(12) test
To performance tests such as the flying needle machine open-short circuit of the production board Jing Guo anti-oxidation processing, the test of PIM values and weldments；
(13) examine eventually, packaging
Qualified production board will be detected and carry out packing processes.
A kind of 2. high efficiency high-frequency microwave composite multi-layer board manufacturing method as claimed in claim 1, it is characterised in that：It is described into
Product plate includes the first high-frequency microwave plate, AD glue-lines and the second high-frequency microwave plate, and the AD glue-lines are located at first high-frequency microwave
Between plate and the second high-frequency microwave plate.
A kind of 3. high efficiency high-frequency microwave composite multi-layer board manufacturing method as claimed in claim 2, it is characterised in that：The AD
Glue-line is 0.1~50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710940381.5A CN107567209A (en) | 2017-09-30 | 2017-09-30 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710940381.5A CN107567209A (en) | 2017-09-30 | 2017-09-30 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107567209A true CN107567209A (en) | 2018-01-09 |
Family
ID=60984463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710940381.5A Pending CN107567209A (en) | 2017-09-30 | 2017-09-30 | A kind of high efficiency high-frequency microwave composite multi-layer board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107567209A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513458A (en) * | 2018-03-30 | 2018-09-07 | 惠州市金百泽电路科技有限公司 | A kind of super thick 5G antennas PCB module processing methods |
| CN111315118A (en) * | 2020-04-02 | 2020-06-19 | 江西兆信精密电子有限公司 | Electronic contest pen electronic keyboard circuit board and preparation method thereof |
| CN118973157A (en) * | 2024-10-17 | 2024-11-15 | 惠州润众科技股份有限公司 | A high-frequency microwave printed circuit board with high heat dissipation performance and a preparation method thereof |
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| CN200980202Y (en) * | 2006-12-05 | 2007-11-21 | 邵建良 | A copper foil board with metal matrix |
| CN201294680Y (en) * | 2008-11-10 | 2009-08-19 | 顾根山 | Microwave high-frequency multi-layer circuit board |
| CN101808477A (en) * | 2009-02-17 | 2010-08-18 | 欣兴电子股份有限公司 | Manufacturing method of circuit board |
| CN103361690A (en) * | 2012-03-31 | 2013-10-23 | 北大方正集团有限公司 | Blind hole cleaning method of PCB (printed circuit board) |
| CN103392388A (en) * | 2011-02-18 | 2013-11-13 | 富士胶片株式会社 | Method for producing multilayer substrate and desmearing method |
| CN103957665A (en) * | 2014-04-29 | 2014-07-30 | 吉安市华阳电子有限公司 | High-frequency microwave PCB |
| CN104411123A (en) * | 2014-11-29 | 2015-03-11 | 惠州市金百泽电路科技有限公司 | Quick press molding process for multilayer flexible plates |
| CN106376172A (en) * | 2016-11-29 | 2017-02-01 | 中国电子科技集团公司第二十九研究所 | A mixed-pressure metal-based microwave printed board and its design method |
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2017
- 2017-09-30 CN CN201710940381.5A patent/CN107567209A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200980202Y (en) * | 2006-12-05 | 2007-11-21 | 邵建良 | A copper foil board with metal matrix |
| CN201294680Y (en) * | 2008-11-10 | 2009-08-19 | 顾根山 | Microwave high-frequency multi-layer circuit board |
| CN101808477A (en) * | 2009-02-17 | 2010-08-18 | 欣兴电子股份有限公司 | Manufacturing method of circuit board |
| CN103392388A (en) * | 2011-02-18 | 2013-11-13 | 富士胶片株式会社 | Method for producing multilayer substrate and desmearing method |
| CN103361690A (en) * | 2012-03-31 | 2013-10-23 | 北大方正集团有限公司 | Blind hole cleaning method of PCB (printed circuit board) |
| CN103957665A (en) * | 2014-04-29 | 2014-07-30 | 吉安市华阳电子有限公司 | High-frequency microwave PCB |
| CN104411123A (en) * | 2014-11-29 | 2015-03-11 | 惠州市金百泽电路科技有限公司 | Quick press molding process for multilayer flexible plates |
| CN106376172A (en) * | 2016-11-29 | 2017-02-01 | 中国电子科技集团公司第二十九研究所 | A mixed-pressure metal-based microwave printed board and its design method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108513458A (en) * | 2018-03-30 | 2018-09-07 | 惠州市金百泽电路科技有限公司 | A kind of super thick 5G antennas PCB module processing methods |
| CN111315118A (en) * | 2020-04-02 | 2020-06-19 | 江西兆信精密电子有限公司 | Electronic contest pen electronic keyboard circuit board and preparation method thereof |
| CN118973157A (en) * | 2024-10-17 | 2024-11-15 | 惠州润众科技股份有限公司 | A high-frequency microwave printed circuit board with high heat dissipation performance and a preparation method thereof |
| CN118973157B (en) * | 2024-10-17 | 2024-12-10 | 惠州润众科技股份有限公司 | High-frequency microwave printed circuit board with high heat dissipation performance and preparation method thereof |
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| PB01 | Publication | ||
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Application publication date: 20180109 |