CN107408870A - Motor - Google Patents

Abstract

Improve the thermal diffusivity in amplifier portion.Motor (1) has：Motor section (2), it has stator and rotor；And amplifier portion (4), it has the substrate (5a~5e) for being configured to axle center AX direction of the face direction along motor section (2) and has used at least one substrate in substrate (5a~5e) and to the main circuit portion (500) of motor section (2) supply electric power.And, amplifier portion (4) has the framework (6) for housing substrate (5a~5e), main circuit portion (500) has power substrate (5a) of the configuration near the inner surface of framework (6), and amplifier portion (4) have：Switch element (SW), it is configured on power substrate (5a) left surface (51), is generated heat when being powered；And thermally conductive sheet (9a), it is configured between the inner surface of power substrate (5a) and framework (6), the region at least corresponding with switch element (SW) in the right surface (52) of contact power substrate (5a).

Description

motor

technical field

The disclosed embodiments relate to electric machines.

Background technique

Patent Document 1 describes a servo motor with a built-in drive circuit in which a motor drive board and a sensor circuit board are arranged side by side in a sensor cover.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2004-274834

Contents of the invention

The problem to be solved by the invention

In the prior art described above, the motor drive substrate and the sensor circuit substrate are arranged side by side such that the surface direction of the substrate is perpendicular to the rotation axis direction of the motor. Therefore, the heat of the sensor circuit substrate arranged inside tends to stay in the sensor cover, and there is a problem of low heat dissipation.

The present invention has been made in view of such a problem, and an object of the present invention is to provide a motor capable of improving the heat dissipation of the amplifier unit.

means to solve the problem

In order to solve the above-mentioned problems, according to an aspect of the present invention, a motor having: a motor part having a stator and a rotor; and an amplifier part having a rotating shaft arranged along the motor part in a plane direction A plurality of substrates in a direction, and a main circuit unit configured to supply power to the motor unit using at least one of the plurality of substrates.

And, according to another aspect of the present invention, a motor having: a motor part having a stator and a rotor; and an amplifier part having a plurality of substrates and using at least one of the plurality of substrates is applied. The substrate is configured as a main circuit part that supplies power to the motor part, the amplifier part has a frame that accommodates the plurality of substrates, the main circuit part has a first substrate disposed near the inner surface of the frame, The amplifier unit includes an electronic component that is disposed on the first surface of the first substrate opposite to the inner surface of the frame and generates heat when energized, and transmits heat of the electronic component through the The first substrate conducts to the frame unit.

Invention effect

According to the motor of the present invention, the heat dissipation of the amplifier unit can be improved.

Description of drawings

1 is a schematic plan view of an upper surface portion of a see-through frame showing a schematic configuration of a motor according to an embodiment and an example of a configuration of an amplifier unit.

FIG. 2 is a schematic exploded perspective view showing an example of the configuration of an amplifier unit.

Fig. 3 is a schematic left side view of a see-through radiator plate section showing an example of the configuration of the amplifier section.

FIG. 4 is a schematic rear view of a see-through frame wall portion showing an example of the structure of the amplifier portion.

5 is a schematic diagram showing a specific example of a substrate and an example of a connection relationship between the substrate and the rear plate.

FIG. 6 is a schematic diagram showing a specific example of a structure for improving heat dissipation of a power substrate.

Fig. 7 is a schematic plan view showing an example of the structure of a unitized rear plate.

Fig. 8A is a schematic plan view showing an example of the structure of the rear plate of the power system.

8B is a schematic plan view showing an example of the structure of the rear panel of the control system.

FIG. 9 is a process diagram illustrating an example of a method of manufacturing a motor.

FIG. 10 is a schematic diagram showing the structure of a comparative example.

FIG. 11 is a schematic view showing a specific example of a structure for improving heat dissipation of a power substrate in a modified example in which heat is conducted through protrusions on the inner surface of the frame.

12 is a schematic rear view of a see-through frame wall showing an example of the structure of a guide member of a modified example in which a substrate is fitted to a step of the guide member.

FIG. 13 is a schematic diagram illustrating an example of a connection relationship between a substrate and a rear plate in a modified example in which the substrates are directly electrically connected to each other through a connector.

detailed description

Hereinafter, one embodiment will be described with reference to the drawings. In addition, in this specification and the drawings, structural elements having substantially the same functions are denoted by the same reference numerals in principle, and repeated description of these structural elements is appropriately omitted. In addition, the directions of "front", "rear", "left", "right", "upper" and "down" marked in the drawings correspond to the directions described as "front", "rear", "left", "right" and "right" in the description of this specification, respectively. Up" and "Down" directions. However, the positional relationship of each structural element such as a motor is not limited to the concepts of "front", "rear", "left", "right", "upper" and "lower".

<1. Example of schematic structure of motor>

First, an example of a schematic configuration of a motor according to this embodiment will be described with reference to FIG. 1 .

As shown in FIG. 1 , the motor 1 is an amplifier-integrated motor with an encoder including a motor unit 2 , an encoder unit 3 , and an amplifier unit 4 .

The motor part 2 is a rotary type motor part which has a stator and a rotor (both are not shown), and the rotor rotates with respect to a stator. The motor unit 2 outputs a rotational force by rotating a shaft SH around an axis AX (corresponding to an example of a "rotation shaft"). In this example, the axis AX direction becomes the front-back direction. In this specification, the rotational force output side of the motor unit 2, that is, the side where the shaft SH protrudes from the motor unit 2 (the front side in this example) is referred to as the "load side", and the opposite side (in this example) is referred to as the "load side". In the example, the rear side) is called the "anti-load side".

In addition, the motor part 2 may be a linear type motor part which has a fixed part and a movable part, and the movable part moves linearly with respect to a fixed part.

The encoder unit 3 is connected to the opposite load side (rear side) of the motor unit 2 . The encoder unit 3 detects the position of the motor unit 2 (also referred to as “rotation position” or “rotation angle”), and outputs position data indicating the position.

In addition, the encoder unit 3 may be connected to the opposite-load side of the motor unit 2 via other components such as a speed reducer, a brake, and a rotation direction converter. In addition, the encoder unit 3 may be connected to the load side of the motor unit 2 . Furthermore, in addition to the position of the motor unit 2, the encoder unit 3 may also detect the speed (also referred to as “rotational speed” or “angular velocity”) and acceleration (also referred to as “rotational acceleration” or At least one of “angular acceleration”, etc.), or the encoder unit 3 detects the speed (also referred to as “rotational speed” or “angular velocity”, etc.) and acceleration (also referred to as “rotational acceleration” or “angular Acceleration, etc.) to replace the position of the motor part 2.

The amplifier unit 4 is connected to the opposite load side (rear side) of the encoder unit 3 . The amplifier unit 4 supplies electric power to the motor unit 2 . At this time, the amplifier unit 4 acquires the position data from the encoder unit 3 , and controls the current or voltage applied to the motor unit 2 based on the position data, thereby controlling the operation of the motor unit 2 . In addition, the amplifier unit 4 may acquire a host control signal from a host control device (not shown), and control the operation of the motor unit 2 so that the slave shaft SH outputs a rotational force capable of realizing a position indicated by the host control signal. .

In addition, the amplifier unit 4 may be connected to the opposite-load side of the encoder unit 3 via other components. Furthermore, the amplifier unit 4 may be arranged on the opposite load side of the motor unit 2 and on the load side of the encoder unit 3 , that is, between the motor unit 2 and the encoder unit 3 . Furthermore, the amplifier unit 4 may be connected to the load side of the motor unit 2 . Furthermore, the amplifier unit 4 may be configured to supply electric power to the motor unit 2 , and does not necessarily have to be configured to control the motor unit 2 so as to follow a target value such as a position.

In addition, the structure of the motor 1 demonstrated above is just an example, and the structure of the motor 1 is not limited to the said structure. For example, the encoder unit 3 may be attached by a device different from the motor 1 .

<2. Example of the structure of the amplifier section>

Next, an example of the configuration of the amplifier unit 4 will be described with reference to FIGS. 1 to 8A and 8B. Moreover, an example of the structure of the motor part 2 and the encoder part 3 is demonstrated suitably as needed. In addition, in each figure, the illustration of the structural element of the amplifier part 4 is abbreviate|omitted suitably.

As shown in FIG. 2 , the amplifier unit 4 is fixed to the outer surface on the opposite load side (rear side) of the encoder cover 30 included in the encoder unit 3 with, for example, four screws S1 .

Screw holes 31 for fastening the above-mentioned screws S1 are formed at, for example, four corners of the rear surface portion of the encoder cover 30 . Further, an insertion hole 32 is formed through, for example, near the lower right corner of the rear surface portion of the encoder cover 30 , and a cable EC1 (see FIG. 1 etc.) to be described later is inserted through the insertion hole 32 . Furthermore, a concave portion 33 into which a head of a screw S2 described later is inserted is formed, for example, near the upper right corner of the rear surface portion of the encoder cover 30 . Furthermore, an insertion hole 34 into which components such as a connector C76 (see FIG. 7 and the like to be described later) and the like to be described later is inserted is formed penetratingly, for example, in the vicinity of the central portion of the rear surface portion of the encoder cover 30 .

As shown in FIGS. 1 to 4 , the amplifier unit 4 has a plurality (five in this example) of substrates 5a, 5b, 5c, 5d, and 5e, a rear plate 7 (corresponding to an example of a "relay substrate"), Frame 6, 2 guide parts 8a, 8b. In addition, illustration of the guide members 8a, 8b is abbreviate|omitted in FIG.1 and FIG.2.

(2-1. Example of structure of base plate and rear plate)

As shown in FIGS. 1 to 4 , the substrates 5 a to 5 e are accommodated in the frame 6 . The substrates 5 a to 5 e are arranged side by side so that their plane directions are along the axis AX direction (for example, parallel to the axis AX direction).

The board|substrate 5a (corresponding to an example of a "1st board|substrate") is arrange|positioned at one end of board|substrates 5a-5e, ie, the right end part. The substrate 5e (corresponding to an example of the "second substrate") is disposed at the other end of the substrates 5a to 5e, that is, at the left end portion on the side opposite to the substrate 5a. In addition, the board|substrates 5a and 5e correspond to an example of "a board|substrate arrange|positioned at the edge part of several board|substrates." The board|substrate 5b is arrange|positioned adjacent to the left side of the board|substrate 5a among the board|substrates 5a-5e. The board|substrate 5c is arrange|positioned adjacent to the left side of the board|substrate 5b among the board|substrates 5a-5e. The board|substrate 5d is arrange|positioned adjacent to the left side of the board|substrate 5c among the board|substrates 5a-5e, and the right side of the board|substrate 5e. In addition, the board|substrates 5c and 5d among the board|substrates 5b-5d arrange|positioned in the middle position other than the left and right ends among the board|substrates 5a-5e correspond to an example of a "3rd board|substrate".

In addition, the number of substrates 5 is not limited to five, and may be other numbers.

The rear plate 7 is disposed on the motor unit 2 side of the frame 6 , that is, on the front side so that the plane direction is perpendicular to the axis AX direction. The rear plate 7 electrically connects the above-mentioned substrates 5b to 5e to form a data bus.

(2-1-1. Specific examples of substrates and examples of connections between substrates and rear panels)

Next, specific examples of the substrates 5 a to 5 e and an example of the connection relationship between the substrates 5 a to 5 e and the rear plate 7 will be described with reference to FIG. 5 .

As shown in FIG. 5 , the amplifier unit 4 converts DC power input from a main power supply (not shown) into AC power (three-phase AC power in this example), and supplies it to the motor unit 2 .

The substrate 5d is a DC input substrate having components constituting the DC input circuit 50d. Hereinafter, the substrate 5d is appropriately referred to as "DC input substrate 5d". Two connectors Cd1 and Cd2 are provided on the DC input board 5d (also refer to FIG. 1 , FIG. 2 and FIG. 4 ). The DC input circuit 50d receives DC power from the main power supply.

The substrate 5a is a power substrate having components constituting an inverter circuit 50a (corresponding to an example of a "power conversion circuit") and including a plurality of switching elements SW that generate heat when energized (corresponding to "a circuit that generates heat when energized"). An example of "electronic component". Only one is shown in FIG. 5). Hereinafter, the substrate 5a is appropriately referred to as "power substrate 5a". A plurality of pin terminals P are provided on the power board 5a (see FIGS. 1 and 4 ). Furthermore, the power board 5a is connected to the DC input board 5d via the cable EC2, and is connected to the motor unit 2 via the cable EC1 (also refer to FIGS. 1 and 4 ). The inverter circuit 50a converts the DC power input from the DC input circuit 50d through the cable EC2 into three-phase AC power through the switching element SW and the like, and supplies it to the motor unit 2 through the cable EC1.

The substrate 5b is a gate substrate having components constituting the gate circuit 50b. Hereinafter, the board|substrate 5b is suitably called "the door board|substrate 5b." A connector Cb is provided on the door substrate 5b (also refer to FIGS. 1 and 4 ). The gate circuit 50b controls the switching element SW of the inverter circuit 50a.

The power board 5 a and its inverter circuit 50 a , the gate board 5 b and its gate circuit 50 b , and the DC input board 5 d and its DC input circuit 50 d constitute a main circuit unit 500 that supplies three-phase AC power to the motor unit 2 .

The substrate 5e is a control substrate having components constituting the control circuit 50e. Hereinafter, the substrate 5e is appropriately referred to as a "control substrate 5e". A connector Ce is provided on the control board 5e (also refer to FIGS. 1 to 4 ). The control circuit 50 e controls the main circuit unit 500 . Furthermore, the control circuit 50 e receives position data from the encoder unit 3 .

The substrate 5c is a power supply substrate having components constituting the power supply circuit 50c. Hereinafter, the substrate 5c is appropriately referred to as "power supply substrate 5c". A connector Cc is provided on the power supply substrate 5c (also refer to FIGS. 1 and 4 ). The power supply circuit 50c supplies power for control to the gate circuit 50b, the control circuit 50e, and the like.

A plurality of connectors including connectors C71 , C72 , C73 , C74 , and C75 are provided on the rear plate 7 (also refer to FIGS. 1 to 3 ).

Furthermore, the aforementioned pin terminals P of the power board 5a are mounted on the door board 5b (see FIGS. 1 and 4 ). Thus, the power substrate 5 a and the gate substrate 5 b are mechanically and electrically connected via the pin terminals P. As shown in FIG.

Furthermore, the connector Cb of the door board 5b is connected to the connector C71 of the rear board 7, the connector Cc of the power board 5c is connected to the connector C72 of the rear board 7, and the connectors Cd1 and Cd2 of the DC input board 5d are respectively It is connected to the connectors C73 and C74 of the rear board 7, and the above-mentioned connector Ce of the control board 5e is connected to the connector C75 of the rear board 7 (also refer to FIGS. 1-4). Thus, the door substrate 5b and the power substrate 5c, the door substrate 5b and the control substrate 5e, the power substrate 5c and the control substrate 5e, the DC input substrate 5d and the main power supply, and the DC input substrate 5d and the control substrate 5e are electrically connected via the rear panel 7, respectively. .

In addition, the types of substrates 5a to 5e described above and the connection relationship between substrates 5a to 5e/rear plate 7 are just examples, and the types of substrates 5a to 5e and the connection relationship between substrates 5a to 5e/rear plate 7 may also be as described above. other than content.

(Example of structure of 2-2. frame)

As shown in FIGS. 1 to 4 , the frame 6 has, for example, a substantially rectangular parallelepiped frame housing portion 60, and two substantially rectangular plate-shaped heat dissipation plate portions 61a, 61b (hereinafter collectively referred to as “radiation plate portions” as appropriate). 61"), a substantially T-shaped heat dissipation frame cover portion 63 (corresponding to an example of a "radiation member" and a "substrate fixing member") when viewed from the vertical direction.

The above-mentioned substrates 5 a to 5 e are accommodated in a parallel state in the frame case portion 60 . Openings 601 , 602 , 603 , and 604 are formed on the front, rear, left, and right sides of the frame case 60 , respectively. Further, insertion holes 605 are formed through the four corners of the frame case portion 60 when viewed from the front-rear direction, for example, and the screws S1 are inserted through the insertion holes 605 . Furthermore, an insertion hole 606 into which a connector C77 described later is inserted is formed penetratingly in the vicinity of, for example, the rear end portion of the upper surface portion of the frame case portion 60 .

The heat dissipation plate portion 61a (corresponding to an example of the “first heat dissipation plate material”) is detachably attached to the outer surface of the right portion of the frame case portion 60 by, for example, screws, and constitutes the right wall portion of the frame 6 . A convex fitting portion 66 a, for example, which fits into the opening 604 of the frame case portion 60 is formed on the inner surface of the heat dissipation plate portion 61 a. In addition, the above-mentioned power substrate 5a is disposed on the inner surface of the heat dissipation plate portion 61a, specifically, near the front end surface 67a of the fitting portion 66a, and the heat dissipation plate portion 61a dissipates the heat of the power substrate 5a conducted (details will be described later). ).

The heat dissipation plate portion 61b (corresponding to an example of the “second heat dissipation plate material”) is detachably attached to the outer surface of the left portion of the frame case portion 60 by, for example, screws, and constitutes the left wall portion of the frame 6 . A convex fitting part 66b, for example, which fits into the opening 603 of the frame case part 60 is formed on the inner surface of the heat sink part 61b. In addition, the above-mentioned control board 5e is arranged on the inner surface of the heat sink portion 61b, specifically, near the front end surface 67b of the fitting portion 66b, and the heat sink portion 61b dissipates the heat of the control board 5e conducted (details will be described later). ).

The frame cover portion 63 is mounted on the outer surface of the rear surface portion of the frame case portion 60 on the side opposite to the motor portion 2 . The frame cover portion 63 has, for example, a substantially rectangular plate-shaped frame wall portion 64 and an extended portion 65 .

Insertion holes 641 are formed through, for example, four corners of the frame wall portion 64 , and the screws S1 are inserted through the insertion holes 641 . Each screw S1 is inserted into the insertion hole 641 of the frame wall portion 64 and the insertion hole 605 of the frame case portion 60 from the outer surface side of the frame wall portion 64 , and is fastened to the threaded hole 31 of the encoder cover 30 . . Thus, the frame housing portion 60 is fixed on the outer surface of the rear surface portion of the encoder cover 30, and the frame wall portion 64 is fixed on the outer surface of the rear surface portion of the frame housing portion 60, constituting the outer surface of the rear side of the frame 6. wall.

The extension portion 65 extends from the inner surface of the frame wall portion 64 along the axis AX direction (for example, parallel to the axis AX direction) in the frame case portion 60 . The aforementioned substrates 5 a to 5 e are fixed to the extended portion 65 in a state of being arranged in parallel. Specifically, between the power board 5a and the door board 5b, between the door board 5b and the power board 5c, between the power board 5c and the DC input board 5d, and between the DC input board 5d and the control board 5e are arranged as The pads are, for example, resin-made pads Pa1, Pa2, Pa3, and Pa4. In addition, illustration of backing plates Pa1-Pa4 is abbreviate|omitted in FIG.1, FIG.3, and FIG.4. And the board|substrates 5a-5e are fixed to the extension part 65 in the state laminated|stacked via backing board Pa1-Pa4. The power board 5c and the DC input board 5d are disposed near the extended portion 65, and the frame cover 63 dissipates the heat of the power board 5c and the DC input board 5d that is conducted (details will be described later).

In addition, the heat radiation plate parts 61a, 61b and the frame cover part 63 correspond to an example of "the unit which uses at least two facing board|substrate heat radiation of a frame."

In addition, the structure of the frame 6 demonstrated above is just an example, As long as the frame 6 is a structure which can accommodate the board|substrates 5a-5e, the structure other than the above-mentioned may be sufficient. For example, one or both of the heat dissipation plate parts 61a and 61b may be made incapable of detachment from the frame case part 60 (including the case of being integrated with the frame case part 60). In addition, the frame 6 may have only one of the heat dissipation plate portions 61a, 61b. Alternatively, the frame 6 may not have both of the heat dissipation plate portions 61a, 61b. Furthermore, the substrate 5 for dissipating heat from the frame cover portion 63 is not limited to both the substrates 5c and 5d, and may be only the substrate 5c or only the substrate 5d. In addition, the frame cover portion 63 may also dissipate the heat of the substrate 5b in addition to the substrates 5c and 5d, or the frame cover portion 63 may dissipate the heat of the substrate 5b instead of dissipating the heat of the substrates 5c and 5d. . Furthermore, the frame cover portion 63 may have a plurality of extended portions for fixing the substrate 5 .

(2-3. Example of structure of guide member)

As shown in FIGS. 3 and 4 , the guide members 8 a, 8 b are fixed inside the above-mentioned frame case portion 60 . Specifically, the guide members 8a and 8b are respectively fixed at corresponding positions on the inner surface of the upper surface portion and the inner surface of the lower surface portion of the frame case portion 60 . Grooves 81 , 82 , 83 , and 84 are formed along the axis AX direction (for example, parallel to the axis AX direction) at a plurality of (four in this example) positions on the opposing surfaces of the guide members 8 a and 8 b. (corresponding to an example of "recess").

The groove 81 is formed in the right end portion of the facing surface of the guide members 8a, 8b. The groove 82 is formed at the left side of the groove 81 in the facing surfaces of the guide members 8a, 8b at a predetermined distance. The groove 83 is formed on the left side of the groove 82 in the facing surfaces of the guide members 8a, 8b at a predetermined distance. The groove 84 is formed at the left side of the groove 83 in the facing surface of the guide members 8a, 8b at a predetermined distance, that is, at the left end portion of the facing surface of the guide members 8a, 8b. The upper and lower ends of the door substrate 5b, the upper and lower ends of the power supply substrate 5c, The upper and lower ends of the DC input board 5d and the upper and lower ends of the control board 5e. Thus, by fixing the door board 5b, the power board 5c, the DC input board 5d, and the control board 5e, it can fix without using a screw.

The configurations of the guide members 8a and 8b described above are merely examples, and other configurations may be used as long as the guide members have a configuration in which a recess for fitting the substrate 5 is formed along the axis AX direction. For example, the recess formed on the guide member into which the substrate 5 fits is not limited to a groove (slit), and may be a recess of another shape (for example, a step). Furthermore, the number/shape of the guide members is not limited to the number/shape described above, and may be other numbers/shape. And, it is also possible to fix a plurality of substrates 5 in the frame 6 without using a guide member. At this time, a plurality of recesses (such as grooves or steps) may be formed on the inner surface of the frame 6 along the axis AX direction, A plurality of substrates 5 are fitted into the plurality of recesses.

(2-4. Example of Structure for Improving Heat Dissipation of Substrate)

As shown in FIGS. 1 and 4 , the pin terminals P of the power board 5 a disposed near the front end surface 67 a of the heat sink portion 61 a are mounted on the door board 5 b. On the left surface 51 (corresponding to an example of the "first surface") of the power board 5a opposite to the front end surface 67a, the plurality of switching elements SW, which are electronic components that generate a large amount of heat, are arranged. Between the front end surface 67a of the heat dissipation plate portion 61a and the right surface 52 (corresponding to an example of the "second surface") of the power substrate 5a on the front end surface 67a side, a thermally conductive heat conduction sheet 9a (corresponding to the "second surface") is arranged. An example of "thermally conductive parts"). In addition, illustration of the heat conduction sheet 9a is abbreviate|omitted in FIG.2 and FIG.3. The power board 5a is in contact with the front end surface 67a of the heat sink portion 61a via the heat conduction sheet 9a, and the heat sink portion 61a dissipates the heat of the power board 5a conducted through the heat conduction sheet 9a.

(2-4-1. Specific example of structure for improving heat dissipation of power board)

Next, a specific example of the structure for improving the heat dissipation of the power substrate 5 a will be described with reference to FIG. 6 .

As shown in FIG. 6 , the power substrate 5 a is a double-sided substrate, and components are arranged on the left surface 51 and the right surface 52 , respectively.

On the left surface 51 of the power substrate 5a, a switch substrate 53 on which the switching element SW is mounted, and a component 10a2 having a large thickness in the thickness direction of the power substrate 5a (hereinafter appropriately referred to as "thick component 10a2") are arranged. That is, the power substrate 5 a and the heat sink portion 61 a are arranged on the same direction side (right side) with respect to the switching element SW.

The switching element SW is directly mounted on the power substrate 5 a without an IC chip being enclosed in a package. That is, the switching element SW is mounted on the power substrate 5 a as a bare chip. The switch substrate 53 is made of, for example, a material with high thermal conductivity such as ceramics. A bonding wire W for supplying electric power to the switching element SW is provided on the switch substrate 53 .

The switch substrate 53 , the switch element SW, the bonding wire W, the thick member 10 a 2 , and the like arranged on the left surface 51 side of the power substrate 5 a are sealed with a resin 59 .

On the right surface 52 of the power substrate 5a, a component 10a1 (hereinafter appropriately referred to as "thin component 10a1") having a smaller dimension in the thickness direction of the power substrate 5a, specifically, smaller than the heat conduction sheet 9a is arranged. The thin member 10a1 is arranged on the right surface 52 of the power substrate 5a in a region other than the region corresponding to the switch substrate 53, and is covered with the heat conduction sheet 9a.

A plurality of thermal vias 54 are formed in a region of the power substrate 5 a corresponding to the switch substrate 53 . The thermal vias 54 are formed by filling the through holes 55 formed on the power substrate 5 a with a thermally conductive material 56 such as copper (see a partially enlarged view in FIG. 6 ). The thermal resistance of the power substrate 5 a in the thickness direction of the power substrate 5 a is smaller in the portion where the thermal via 54 is formed than in other portions.

The above-mentioned heat conduction sheet 9a is between the front end surface 67a of the heat dissipation plate portion 61a and the right surface 52 of the power substrate 5a so as to contact at least the area of the right surface 52 corresponding to the switch substrate 53 (in this example, approximately the area of the right surface 52). The entire area) is configured. Therefore, the heat of the switching element SW is conducted to the radiator plate portion 61a via the switch substrate 53, the power substrate 5a, and the thermally conductive sheet 9a, and is dissipated by the radiator plate portion 61a. Specifically, the thermally conductive sheet 9a is a resin sheet having anisotropic thermal conductivity. In this example, by adjusting the orientation of the added filler, the thermally conductive sheet 9 a has anisotropy in which the thermal conductivity in the plane direction is higher than the thermal conductivity in the thickness direction. By using such a heat conduction sheet 9a, the heat of the switching element SW is diffused in the surface direction from the corresponding region of the switch substrate 53 (see the thick line arrow shown in the partial enlarged view in FIG. plate portion 61a. Furthermore, for example, when improving the heat dissipation of the heat dissipation plate portion 61a, etc., fins or the like may be provided on the outer surface of the heat dissipation plate portion 61a.

In addition, the thermal vias 54 and the heat conduction sheet 9 a correspond to an example of "means for conducting heat of an electronic component to a frame via a 1st board|substrate".

In addition, the above-described structure for enhancing the heat dissipation of the power substrate 5 a is merely an example, and the power substrate 5 a may ensure heat dissipation by structures other than the above. For example, in addition to forming the cooling holes 54 on the power substrate 5a, the power substrate 5a may also be made of a material with high thermal conductivity such as ceramics, or a metal plate (metal core) or paste may be placed inside the power substrate 5a. Alternatively, instead of forming heat dissipation holes 54 on the power substrate 5a, the power substrate 5a is made of a material with high thermal conductivity such as ceramics or a metal plate (metal core) is placed inside the power substrate 5a. ) or laminated metal plate (metal base), etc. In addition, as the thermally conductive sheet 9a, a sheet made of resin or non-resin that does not have anisotropy in thermal conductivity may be used.

In addition, the above is the IC chip on which the switching element SW is mounted as a bare chip, but the IC chip of the switching element SW may be a surface mount package such as a QFN product, for example. Furthermore, the package of the IC chip constituting the switching element SW may be configured so that the heat radiation surface and the terminal surface are in the same direction. In this case, the size of the package can be reduced.

As shown in FIG. 1, FIG. 3 and FIG. 4, the upper and lower end portions of the control board 5e are fitted into the grooves 84, 84 of the guide members 8a, 8b, and the control board 5e is arranged on the front end surface 67b of the heat dissipation plate portion 61b. near. On the left surface of the control board 5e on the side of the front end surface 67b, for example, a plurality of electronic components 10e having a heat generation value smaller than that of the switching element SW are arranged. Between the front end surface 67b of the heat sink part 61b and the left surface of the control board 5e, the heat conduction sheet 9d (corresponding to an example of a "heat conduction member") which has heat conduction property is arrange|positioned. In addition, illustration of the heat conduction sheet 9d is abbreviate|omitted in FIG.2 and FIG.3. The thermally conductive sheet 9 d is a resin sheet having anisotropic thermal conductivity, similarly to the above-mentioned thermally conductive sheet 9 a. The electronic component 10e of the control board 5e is in contact with the front end surface 67b of the heat dissipation plate portion 61b via the heat conduction sheet 9d, and the heat dissipation plate portion 61b dissipates the heat of the electronic component 10e conducted through the heat conduction sheet 9d.

The door substrate 5b is fixed to the power substrate 5a via the pin terminals P, and its upper and lower ends fit into the grooves 81, 81 of the guide members 8a, 8b, and is arranged near the power substrate 5a. On the left surface of the door substrate 5b on the side opposite to the power substrate 5a, for example, an electronic component 10b with a small heat generation is disposed. The electronic components 10b and the like of the door substrate 5b are sealed with a resin (not shown).

The upper and lower ends of the power board 5c are fitted into the grooves 82, 82 of the guide members 8a, 8b, and the power board 5c is disposed near the right surface of the extended portion 65 of the frame cover 63. On the left surface of the power supply board 5c located on the right surface side of the extending portion 65, for example, an electronic component 10c that generates less heat than the switching element SW is arranged. A thermally conductive heat transfer sheet 9b (corresponding to an example of a "heat transfer member") is arranged between the right surface of the extended portion 65 and the left surface of the power supply substrate 5c. In addition, illustration of the heat conduction sheet 9b is omitted in FIG. 2 . The thermally conductive sheet 9b is a resin sheet having anisotropic thermal conductivity, similarly to the aforementioned thermally conductive sheet 9a. The electronic component 10c of the power board 5c is in contact with the right surface of the extended portion 65 via the heat conduction sheet 9b.

The upper and lower end portions of the DC input board 5d are fitted into the grooves 83, 83 of the guide members 8a, 8b, and the DC input board 5d is disposed near the left surface of the extended portion 65 of the frame cover portion 63. On the right surface of the DC input board 5d on the left surface side of the extending portion 65 or on the left surface opposite to it, for example, electronic components 10d that generate heat less than the switching element SW are arranged. A thermally conductive heat transfer sheet 9c (corresponding to an example of a "heat transfer member") is disposed between the left surface of the extended portion 65 and the right surface of the DC input board 5d. In addition, illustration of the heat conduction sheet 9c is omitted in FIG. 2 . The thermally conductive sheet 9c is a resin sheet having anisotropic thermal conductivity, similarly to the above-mentioned thermally conductive sheet 9a. The electronic component 10d on the right surface side of the DC input board 5d is in contact with the left surface of the extension portion 65 via the heat conduction sheet 9c.

Therefore, the heat of the electronic components 10c and 10d of the power supply substrate 5c and the DC input substrate 5d is conducted to the extension portion 65 via the thermally conductive sheets 9b and 9c. The frame cover portion 63 (frame wall portion 64 ) dissipates the heat of the electronic components 10 c and 10 d conducted via the thermally conductive sheets 9 b and 9 c.

In addition, the above-described structure for improving the heat dissipation of the substrates 5 a to 5 e is merely an example, and the substrates 5 a to 5 e may ensure heat dissipation by structures other than the above. For example, another heat conduction member may be used instead of a part or all of the heat conduction sheets 9 a to 9 d. In addition, the amplifier unit 4 does not need to have some or all of the thermally conductive sheets 9 a to 9 d.

(2-5. Example of the structure of the rear plate)

As shown in Fig. 2, Fig. 7 and Fig. 8A, Fig. 8B, it is realized by integrally sealing a plurality of (in this example, two) rear plates 7a, 7b (corresponding to an example of "relay substrate") with resin 321 Unitized, the rear plate 7 is configured as a substrate unit 70 . In addition, in FIG. 1 and FIGS. 3 to 5 , the substrate unit 70 is not shown, but the rear plate 7 in the form of a single substrate is schematically shown.

The substrate unit 70 is installed in the opening portion 601 of the above-mentioned frame case portion 60 and fixed to the front surface portion of the frame case portion 60 by, for example, one screw S2. In the substrate unit 70, the rear plates 7a and 7b are arranged side by side in the axis AX direction so that the rear plate 7a is on the rear side and the rear plate 7b is on the front side.

The above-mentioned connector C73 is provided on the rear surface of the rear plate 7a. Furthermore, a connector C77 connected to the above-mentioned main power supply is provided on, for example, the front surface of the rear plate 7a. That is, the power lines of the high-voltage system are disposed on the rear panel 7a, and the rear panel 7a constitutes the rear panel of the power system.

The above-mentioned connectors C71, C72, C74, C75 are provided on the rear surface of the rear plate 7b. Furthermore, a connector C76 connected to the encoder unit 3 is provided on the front surface of the rear plate 7b. That is, the signal lines of the low-voltage system are arranged on the rear board 7b, and the rear board 7b constitutes the rear board of the control system.

Further, the rear plate 7a is provided with a fixing piece portion 72 having an insertion hole 73 through which the above-mentioned screw S2 is inserted. The screws S2 are inserted through the insertion holes 73 of the rear plate 7 a from the front side of the substrate unit 70 , and are fastened to the front surface portion of the frame case portion 60 . As a result, the board unit 70 is mounted in the opening 601 of the frame case 60 and fixed to the front surface of the frame case 60 . At this time, the connector C77 is inserted into the insertion hole 606 of the frame case portion 60 . And, when the amplifier part 4 is mounted on the outer surface of the rear surface part of the above-mentioned encoder cover 30, parts such as the above-mentioned connector C76 and the head of the above-mentioned screw S2 are respectively inserted into the insertion hole 34 and the concave part of the above-mentioned encoder cover 30. 33 in.

The structure of the rear plate 7 described above is merely an example, and the rear plate 7 may have a structure other than the above as long as it has a structure capable of electrically connecting at least one of the substrates 5a to 5e. For example, the rear plate 7 is constituted by a plurality of rear plates, however, it does not have to be a structure in which the plurality of rear plates are integrally sealed with the resin 71 . In addition, the rear plate 7 may be constituted by a single rear plate. In addition, the substrates 5 a to 5 e may be electrically connected without using the rear plate 7 (for example, via a cable or a connector).

<3. Example of motor manufacturing method>

Next, an example of a method of manufacturing the motor 1 will be described with reference to FIG. 9 .

As shown in FIG. 9, in the manufacturing process (assembly process) of the motor 1 based on the manufacturing method of the motor 1, before performing the main process (or in parallel with the main process), a connecting process of the power substrate 5a and the door substrate 5b is performed. , and the manufacturing process of the substrate unit 70 .

In the step of connecting the power substrate 5 a and the gate substrate 5 b , the switch substrate 53 , the switching element SW, the bonding wire W, the thick member 10 a 2 , etc. of the power substrate 5 a are sealed with a resin 59 . And the electronic component 10b etc. of the door board|substrate 5b are sealed with resin. Then, in a state where the spacer Pa1 is inserted between the resin-sealed power board 5a and the resin-sealed door board 5b, the pin terminals P of the power board 5a are mounted on the door board 5b, and connected (joined) by soldering or the like, for example. . Thus, the combination of the power substrate 5a and the gate substrate 5b is completed.

In addition, in the manufacturing process of the substrate unit 70 , after the rear plates 7 a and 7 b are connected (joined) by, for example, solder, they are integrally sealed with the resin 71 . Thus, the substrate unit 70 is completed.

In addition, in the main process, the power supply substrate 5c is attached to the extended portion 65 of the frame cover portion 63 via the heat conduction sheet 9b. Further, the DC input board 5d is attached to the extended portion 65 of the frame cover portion 63 via the thermally conductive sheet 9c and the backing plate Pa3. Then, the control board 5e is mounted on the side of the DC input board 5d in the extended portion 65 of the frame cover 63 to which the power board 5c and the DC input board 5d are fixed via the spacer Pa4. Then, the combination of the power board 5a and the door board 5b is mounted on the side of the power board 5c on the side of the power board 5c in the extended portion 65 of the frame cover 63 where the power board 5c, the DC input board 5d, and the control board 5e are fixed, via the spacer Pa2. The door substrate 5b side in the middle. As mentioned above, the board|substrates 5a-5e are fixed to the extended part 65 of the frame cover part 63 in the state arrange|positioned in parallel.

Then, the extended portion 65 of the frame cover portion 63 and the substrates 5 a to 5 e fixed to the extended portion 65 are inserted into the frame case portion 60 from the opening portion 602 along the axis AX direction. At this time, the upper and lower end portions of the door substrate 5b, the power supply substrate 5c, the DC input substrate 5d, and the control substrate 5e are respectively fitted into the grooves 81-84 of the guide members 8a, 8b in the frame case part 60, The extended portion 65 and the respective substrates 5a to 5e are inserted.

Then, the substrate unit 70 is mounted on the rear panel 7a, 7b in such a manner that the respective connectors of the rear panels 7a, 7b are connected to the corresponding connectors of the door substrate 5b, the power supply substrate 5c, the DC input substrate 5d, and the control substrate 5e in the frame housing part 60. into the opening 601 of the frame housing part 60 .

Then, the heat dissipation plate portion 61a is attached to the outer surface (opening portion) of the right side portion of the frame case portion 60 such that the front end surface 67a of the fitting portion 66a is in contact with the power substrate 5a in the frame case portion 60 via the heat conduction sheet 9a. 604) on. Further, the heat dissipation plate portion 61b is attached to the outside of the left side surface of the frame case portion 60 such that the front end surface 67b of the fitting portion 66b is in contact with the electronic component 10e of the control board 5e in the frame case portion 60 via the heat conduction sheet 9d. surface (opening 603). Thus, the amplifier unit 4 is completed.

Then, the amplifier section 4 is mounted on the outer surface of the encoder cover 30 of the encoder section 3 on the opposite load side. Thus, the motor 1 having the motor unit 2 , the encoder unit 3 and the amplifier unit 4 is completed.

Each process of the manufacturing method based on the electric motor 1 demonstrated above is automatically performed by one or more manufacturing apparatuses. However, a part of each of these steps may be performed manually.

In addition, the manufacturing process of the motor 1 based on the manufacturing method of the motor 1 described above is merely an example, and the manufacturing process of the motor 1 does not necessarily have to be performed in time series except for the steps performed in time series along the order described above. Contains processes that are performed in parallel or independently. Moreover, even if it is a process performed in time series, the order can be changed suitably according to a case. In addition, in the above, the power substrate 5a is inserted into the frame case portion 60 in a state where it is fixed to the extended portion 65 of the frame cover portion 63, but it may also be mounted on the heat radiation board via the heat conduction sheet 9a. The frame case portion 60 is inserted into the frame case portion 60 in a state of being on the plate portion 61a.

<4. Examples of effects of the present embodiment>

As described above, the motor 1 of the present embodiment is an amplifier-integrated motor including the motor unit 2 and the amplifier unit 4 .

In such a motor 1 , even when the substrates 5 a to 5 e of the amplifier unit 4 are arranged such that their surface directions are perpendicular to the axis AX direction, the substrate 5 arranged at the end portion opposite to the motor unit 2 The heat dissipation of the substrate 5 is also good, but the heat dissipation of the other substrate 5 arranged inside is lowered, and heat tends to accumulate in the amplifier unit 4 . In addition, when the motor 1 is downsized in the radial direction, the heat dissipation area is greatly affected, and therefore, there is a possibility that miniaturization may be restricted in terms of heat dissipation.

In this embodiment, the board|substrates 5a-5e of the amplifier part 4 are arrange|positioned so that these plane directions may be along the axial center AX direction. That is, when the motor 1 is assembled, the boards 5 a to 5 e of the amplifier unit 4 are inserted into the frame case unit 60 along the axis AX direction, and thus, in the amplifier unit 4 of the assembled motor 1 , the board 5 a ˜5e are arranged in parallel so that their surface direction is along the axis AX direction. As a result, at least the substrates 5 a and 5 e disposed at both ends can have good heat dissipation, so that the heat dissipation of the amplifier unit 4 can be improved. In addition, since the influence on the heat radiation area can be reduced when the motor 1 is downsized in the radial direction, further downsizing can be achieved.

Furthermore, in the present embodiment, the frame 6 has, in particular, a radiator plate portion 61a for dissipating heat from the power substrate 5a and a radiator plate portion 61b for dissipating heat from the control substrate 5e. Thereby, the heat of the board|substrate 5a, 5e can be conducted to the frame 6 (the heat dissipation plate part 61a, 61b) and can dissipate heat efficiently, Therefore The heat dissipation of the amplifier part 4 can be improved.

In addition, in this embodiment, the following effects can be obtained particularly. That is, a plurality of electronic components are mounted on the component surfaces of the substrates 5a, 5e. At this time, unevenness occurs on the component surfaces of the substrates 5 a and 5 e due to the difference in height between the electronic components. Therefore, by providing heat conduction sheets 9a, 9d between the power substrate 5a and the heat dissipation plate portion 61a, and between the control substrate 5e and the heat dissipation plate portion 61b, the unevenness caused by the above-mentioned electronic components can be absorbed, and the electron density of the substrates 5a, 5e can be increased. The thermal contact area between the component and the radiator plate portions 61a, 61b. Therefore, the heat dissipation of the substrates 5a and 5e can be improved. Furthermore, as in the present embodiment, by using the thermally anisotropic thermally conductive sheets 9a, 9d as the thermally conductive member, the thermal conductivity from the substrates 5a, 5e to the heat dissipation plate portions 61a, 61b can be increased, and heat dissipation can be further improved.

In addition, in this embodiment, the following effects can be obtained particularly. That is, even in the case where the radiator plate portions 61a, 61b and the frame case portion 60 are integrally structured, since the substrates 5a, 5e are inserted and removed from the frame 6 in the axis AX direction, it is necessary to connect the power substrate 5a with the frame case 60. The provision of gaps between the radiator plate portions 61a and between the control substrate 5e and the radiator plate portion 61b may reduce the thermal contact area between the substrates 5a, 5e and the radiator plate portions 61a, 61b. In the present embodiment, since the radiator plate parts 61a and 61b are detachable from the frame case part 60, after housing the substrates 5a and 5e in the frame case part 60, the radiator plate parts 61 a , 61 b are mounted on the frame housing portion 60 . Thereby, the thermal contact area of the board|substrate 5a, 5e and the heat dissipation plate part 61a, 61b can be ensured, and heat dissipation can be improved.

Moreover, in this embodiment, the frame cover part 63 dissipates heat of the board|substrate 5c, 5d especially. In the case of three or more substrates 5 , the heat from the substrates 5 c and 5 d disposed at intermediate positions other than both ends is difficult to dissipate, and tends to stay in the amplifier unit 4 . In the present embodiment, the heat of the substrates 5 c and 5 d can be dissipated to the side opposite to the motor unit 2 via the frame cover unit 63 , so that the heat dissipation of the amplifier unit 4 can be further improved.

Moreover, in this embodiment, especially, the board|substrates 5a-5e are fixed to the frame cover part 63 in the state arrange|positioned in parallel. Thereby, the fixing structure of the board|substrates 5a-5e can be made firm. In addition, when assembling the motor 1, by assembling the frame cover 63 on the amplifier unit 4 from the side opposite to the motor unit 2, the substrates 5a to 5e can be mounted at one time, so that the assembly of the motor 1 can be made easier. Homework made easy. In addition, when the substrates 5a to 5e are fixed to the frame cover portion 63, the substrates 5a to 5e are laminated via resin spacers Pa1 to Pa4, etc., so that a necessary distance between the substrates (insulation distance) can be ensured. Furthermore, when fixing the board|substrates 5a-5e to the frame cover part 63, by performing necessary connector connection etc. between board|substrates in advance, the subsequent assembly work can be made easy.

In addition, in this embodiment, the frame cover portion 63 has, in particular, a frame wall portion 64 constituting a wall portion of the frame 6 on the side opposite to the motor portion 2; 60 extends from the frame wall portion 64 along the axis AX direction and fixes the substrates 5 a to 5 e. Thereby, the frame wall part 64 which is a part of the frame 6 can be used as a heat dissipation member and a fixing member of the board|substrate 5c, 5d. Therefore, the heat dissipation of the amplifier unit 4 can be improved, and the reduction of components and the miniaturization of the motor 1 can be realized.

Moreover, in this embodiment, especially, the connection between the board|substrates 5b-5e is performed using the back plate 7. As shown in FIG. Thus, wiring in the amplifier unit 4 can be simplified.

In addition, in the present embodiment, particularly, the rear plate 7 is configured to integrally seal the rear plates 7 a and 7 b arranged side by side in the axis AX direction with the resin 71 . In this way, the rear panel 7 can be separated into the rear panel of the power system and the rear panel of the control system. As a result, it is possible to prevent the power lines of the high-voltage system and the signal lines of the low-voltage system from intermingling on one rear plate, thereby improving reliability against insulation, noise, and the like. In addition, by integrally sealing the rear plates 7a and 7b with resin, unitization can be achieved, and assembly workability can be improved.

Furthermore, in this embodiment, particularly, the amplifier unit 4 has guide members 8a, 8b arranged inside the frame case unit 60, and the guide members 8a, 8b are formed along the axis AX direction into which the substrates 5b to 5e fit. Combined grooves 81-84. The grooves 81 to 84 of the guide members 8a and 8b guide the substrates 5b to 5e in the axis AX direction when the substrates 5a to 5e are inserted and removed from the frame housing portion 60, so that the insertion and removal operations of the substrates 5a to 5e easy. In addition, since the distance between the substrates 5b to 5e can be fixed (positioned) by the grooves 81 to 84 of the guide members 8a and 8b, a necessary distance between the substrates (insulation distance) can be ensured.

Furthermore, in the present embodiment, particularly, the substrates 5 a to 5 e include the power substrate 5 a arranged at the ends of the substrates 5 a to 5 e and having the switching element SW constituting the inverter circuit 50 a. Accordingly, it is possible to ensure heat dissipation of the power substrate 5a having a relatively large amount of heat generated.

Furthermore, in the present embodiment, particularly, the substrates 5 a to 5 e include a control substrate 5 e having a control circuit 50 e disposed at an end portion of the substrates 5 a to 5 e opposite to the power substrate 5 a. Accordingly, the influence of noise can be reduced by keeping the control board 5e away from the power board 5a. In addition, heat dissipation of the control board 5e (the heat of the CPU, ASIC, etc.) can be ensured.

In addition, in this embodiment, the following effects can be obtained particularly.

Next, FIG. 10 shows the structure of a comparative example. In the comparative example shown in FIG. 10 , switch substrate 53 on which switching element SW is mounted is mounted on heat sink 100 (corresponding to "radiation plate portion 61a of this embodiment") via thermally conductive base B. The IC chip of the switching element SW is enclosed in a package 57 . Furthermore, the switch substrate 53 is connected to the power substrate 5 a on the side opposite to the heat sink 100 through the pin terminal 58 .

In the present embodiment, the power board 5 a and the heat sink portion 61 a are arranged on the side in the same direction with respect to the switching element SW. Accordingly, as in the present embodiment, it is possible to implement bare chip mounting in which the IC chip of the switching element SW is directly mounted on the power substrate 5 a without enclosing it in a package. Therefore, the size of the switching element SW can be reduced. Furthermore, in the case of the configuration of the above-mentioned comparative example, a useless space equal to the height of the switching element SW is required between the heat sink 100 and the power substrate 5 a. In this embodiment, since the heat conduction sheet 9a is arranged between the heat sink portion 61a and the power substrate 5a, and the switching element SW is not arranged, the above-mentioned useless space can be reduced. Accordingly, it is possible to reduce the size of the amplifier unit 4 .

In addition, in this embodiment, the heat conduction sheet 9a is arranged between the power substrate 5a and the front end surface 67a of the heat dissipation plate portion 61a, and the heat conduction sheet 9a contacts at least the region corresponding to the switching element SW of the right surface 52 of the power substrate 5a, Therefore, the heat of the switching element SW can be efficiently conducted from the power substrate 5 a to the heat sink portion 61 a. Therefore, heat dissipation of the amplifier unit 4 can be ensured.

Furthermore, in the present embodiment, in particular, the heat dissipation via 54 in which the through hole 55 is filled with the heat conductive material 56 is formed in the region corresponding to the switching element SW of the power substrate 5 a. Thereby, the thermal resistance in the thickness direction of the power substrate 5 a can be reduced in the portion where the thermal via 54 is formed, so that the heat of the switching element SW can be efficiently conducted to the thermally conductive sheet 9 a. Therefore, the heat dissipation of the amplifier unit 4 can be improved.

Moreover, in this embodiment, the resin sheet which has thermal conductivity anisotropy is used especially as the heat conduction sheet 9a. At this time, as in the present embodiment, by using the heat conduction sheet 9a which is an anisotropic resin sheet having a thermal conductivity higher in the plane direction than in the thickness direction, the heat of the switching element SW can be transferred from and to the power substrate 5a. The region corresponding to the switching element SW spreads in the plane direction, and further, conducts efficiently to the heat dissipation plate portion 61a. Therefore, the heat dissipation of the amplifier unit 4 can be further improved. In addition, by using the thermally conductive sheet 9a made of resin, the insulation between the power substrate 5a and the heat dissipation plate portion 61a can be ensured, and the bonding of metals can be reduced, so that the amount of solder used can be reduced.

Furthermore, in this embodiment, particularly, on the right surface 52 of the power board 5a, the thin member 10a1 having a dimension in the thickness direction of the power board 5a smaller than that of the heat conduction sheet 9a is arranged. As a result, the thin member 10a1 arranged on the right surface 52 is covered with the heat conduction sheet 9a, so the thermal contact area between the heat conduction sheet 9a and the front end surface 67a of the heat dissipation plate portion 61a can be increased, and the amplifier portion can be further improved. 4 heat dissipation. Furthermore, on the right surface 52 of the power substrate 5a, a thin member 10a1 with a small size in the thickness direction of the power substrate 5a is arranged, and on the left surface 51, the thick member 10a2 with a large size is arranged together with the switching element SW. Therefore, the power substrate 5a can be arranged close to the front end surface 67a of the heat dissipation plate portion 61a. Therefore, further miniaturization can be achieved.

Furthermore, in the present embodiment, in particular, the switch substrate 53 on which the switching element SW is mounted is arranged on the left surface 51 of the power substrate 5 a. Furthermore, the thermally conductive sheet 9 a is arranged to contact at least a region corresponding to the switch substrate 53 on the right surface 52 of the power substrate 5 a. Thereby, the heat of the switching element SW can be efficiently conducted from the switch substrate 53 to the radiator plate portion 61 a via the power substrate 5 a. Furthermore, as in the present embodiment, by constituting the switch substrate 53 with a material having high thermal conductivity such as ceramics, heat dissipation can be further improved.

In addition, the effect of this embodiment described above and the structure which can acquire this effect are just an example, and the effect of this embodiment and the structure which can acquire this effect are not limited to the said content.

<4. Modifications, etc.>

In addition, embodiment is not limited to the said content, Various deformation|transformation is possible in the range which does not deviate from the summary and technical idea. Next, such a modified example will be described.

(4-1. In the case of conduction of heat through the protrusions on the inner surface of the frame)

Next, an example of the configuration for improving the heat dissipation of the power substrate 5 a according to this modification will be described with reference to FIG. 11 .

As shown in FIG. 11 , the heat dissipation plate portion 61a' (corresponding to an example of the "first heat dissipation plate portion") of this modified example has a convex portion 610 ( Corresponds to an example of "heat conduction part"). Protrusion 610 is arranged between front end surface 67a' of heat sink 61a' and right surface 52 of power substrate 5a in place of heat conduction sheet 9a so as to contact a region of right surface 52 corresponding to switch substrate 53. Therefore, the heat of the switching element SW is conducted to the radiator plate portion 61 a ′ via the switch substrate 53 , the power substrate 5 a , and the protrusion 610 , and is radiated by the radiator plate portion 61 a ′.

In addition, in this modified example, the heat dissipation plate portion 61 a ′, the heat dissipation plate portion 61 b, and the frame cover portion 63 correspond to an example of “units that dissipate heat from the substrate using at least two opposing frames”. . In addition, the thermal vias 54 and the protrusions 610 correspond to an example of "means for conducting the heat of the electronic component to the frame via the first substrate".

Also in this modified example, the same effects as those of the above-described embodiment can be obtained. In addition, in this modified example, the heat of the switching element SW can be efficiently conducted from the power substrate 5 a to the heat dissipation plate portion 61 a ′ by the protrusion 610 protruding from the front end surface 67 a ′ of the heat dissipation plate portion 61 a ′ toward the power substrate 5 a. . In addition, since it is not necessary to additionally provide a heat conduction member, the number of parts can be reduced, and the structure can be simplified.

(4-2. When fitting the substrate on the step of the guide member)

Next, an example of the structure of the guide member of this modified example will be described with reference to FIG. 12 .

As shown in FIG. 12 , in this modified example, guide members 8 c and 8 d are fixed inside the frame case portion 60 . The guide members 8c, 8d are respectively fixed at corresponding positions on the right inner surface and the left inner surface of the frame case portion 60 .

A groove 801 along the axis AX direction is formed in the vicinity of the center in the vertical direction on the right surface of the guide member 8c. The electronic component 10b and the connector Cb arranged on the left surface of the door substrate 5b, the tip of the pin terminal P protruding to the left side of the door substrate 5b, and the like are arranged in the groove 801 . In addition, steps 85, 85 (corresponding to an example of "recesses") are formed along the axis AX direction (for example, parallel to the axis AX direction) at the upper and lower edges of the groove 801 on the right surface of the guide member 8c. . The door substrate 5b is fitted to the steps 85,85.

A groove 802 along the axis AX direction is formed in the vicinity of the center in the vertical direction on the left surface of the guide member 8c. In addition, steps 86 and 86 (corresponding to an example of "recesses") are formed along the axis AX direction (for example, parallel to the axis AX direction) at the upper and lower edges of the groove 801 on the left surface of the guide member 8c. . The power supply board 5c is fitted on the steps 86, 86. As shown in FIG.

A groove 803 along the axis AX direction is formed in the vicinity of the center portion in the vertical direction on the right surface of the guide member 8d. Electronic components 10d and the like arranged on the left surface of the DC input board 5d are arranged in the groove 803 . In addition, steps 87, 87 (corresponding to an example of "recesses") are formed along the axis AX direction (for example, parallel to the axis AX direction) at the upper and lower edges of the groove 803 on the right surface of the guide member 8d. . The DC input board 5d is fitted to the steps 87, 87.

A groove 804 along the axis AX direction is formed in the vicinity of the center portion in the vertical direction on the left surface of the guide member 8d. The connector Ce and the like arranged on the right surface of the control board 5 e are arranged in the groove 804 . In addition, steps 88, 88 (corresponding to an example of "recesses") are formed along the axis AX direction (for example, parallel to the axis AX direction) at the upper and lower edges of the groove 804 on the left surface of the guide member 8d. . The control board 5e is fitted on the steps 88 and 88 .

Also in this modified example, the same effects as those of the above-described embodiment can be obtained. That is, according to this modified example, when the substrates 5a to 5e are inserted and removed from the frame case portion 60, the substrates 5b to 5e are guided in the axis AX direction by the steps 85 to 88 of the guide members 8c and 8d, so that the substrate 5a The plugging and unplugging of ~5e is easy. In addition, since the intervals between the substrates 5b to 5e can be fixed by the steps 85 to 88 of the guide members 8c and 8d, a necessary distance between the substrates can be ensured.

(4-3. When the boards are directly electrically connected to each other through a connector)

Next, an example of the connection relationship between the substrates 5 a to 5 e and the rear plate in this modification will be described with reference to FIG. 13 .

As shown in FIG. 13, in this modified example, three connectors Cd1, Cd2, and Cd3 are provided on the DC input board 5d. The power board 5a is connected to the DC input board 5d via the cable EC2, and is connected to the motor unit 2 via the cable EC1, as in the above-described embodiment. Furthermore, a connector Ca is provided on the power board 5a. Three connectors Cb, Cc2, and Cb3 are provided on the door substrate 5b. A connector Ce is provided on the control board 5e. Three connectors Cc, Cc2, and Cc3 are provided on the power supply board 5c.

Furthermore, a plurality of connectors including connectors C71, C72, C73, C74, and C75 are provided on the rear plate 7' of this modified example.

Furthermore, the power substrate 5 a and the gate substrate 5 b are mechanically and electrically connected via the pin terminals P, as in the above-described embodiment.

The connector Cb of the door board 5b is connected to the connector C71 of the rear board 7', the connector Cc of the power board 5c is connected to the connector C72 of the rear board 7', and the connectors Cd1, Cd2 is connected to the connectors C73 and C74 of the rear board 7', respectively, and the above-mentioned connector Ce of the control board 5e is connected to the connector C75 of the rear board 7'. Furthermore, the encoder unit 3 is electrically connected to the rear plate 7'. Thus, the door substrate 5b and the control substrate 5e, the power supply substrate 5c and the control substrate 5e, the DC input substrate 5d and the main power supply, the DC input substrate 5d and the control substrate 5e, and the encoder unit 3 and the control substrate 5e are respectively connected via the rear panel 7'. electrical connection.

Furthermore, the connector Ca of the power board 5a is connected to the connector Cb2 of the door board 5b, the connector Cb3 of the door board 5b is connected to the connector Cc2 of the power board 5c, and the connector Cc3 of the power board 5c is connected to the DC The above-mentioned connector Cd3 of the input board 5d is connected. Thus, the power substrate 5a and the gate substrate 5b, the gate substrate 5b and the power substrate 5c, and the power substrate 5c and the DC input substrate 5d are directly electrically connected through the connectors Ca, Cb2, connectors Cb3, Cc2, and connectors Cc3, Cd3, respectively.

In addition, the connectors Ca, Cb2, Cb3, Cc2, Cc3, and Cd3 correspond to an example of "a connector for electrically connecting a plurality of substrates".

In addition, the connection relationship of the board|substrates 5a-5e/rear plate 7' demonstrated above is just an example, and the connection relationship of board|substrates 5a-5e/rear board 7' may be other than the content mentioned above. For example, in the above, the gate substrate 5b and the control substrate 5e, the power supply substrate 5c and the control substrate 5e, the DC input substrate 5d and the main power supply, the DC input substrate 5d and the control substrate 5e, the encoder unit 3 and the control substrate 5e are respectively connected via The rear board 7' is electrically connected, but a part or all of them may be directly electrically connected through a connector. Also, in the above, the power board 5a and the door board 5b, the door board 5b and the power board 5c, the power board 5c and the DC input board 5d are passed through the connectors Ca, Cb2, connectors Cb3, Cc2, connectors Cc3, Cd3, respectively. direct electrical connection, however, it is also possible to have some or all of them electrically connected via the rear plate.

Also in this modified example, the same effects as those of the above-described embodiment can be obtained. Furthermore, in this modified example, connectors Ca and Cb2 are used for direct connection between substrates 5a and 5b, connectors Cb3 and Cc2 are used for direct connection between substrates 5b and 5c, and connectors Cc3 and Cd3 are used for substrates 5c and 5c. A direct connection between 5d. Thereby, wiring in the amplifier unit 4 can be further simplified.

(4-4. Others)

In the above description, when there are descriptions such as "perpendicular", "parallel", and "plane", the description does not have a strict meaning. That is, these "perpendicular", "parallel", and "plane" allow design and manufacturing tolerances and errors, and mean "substantially perpendicular", "substantially parallel", and "substantially planar".

In addition, in the above description, when there are descriptions such as "same", "equal", and "different" in terms of dimensions and sizes in appearance, the description does not have a strict meaning. That is, these "same", "equal", "different" and the like allow design and manufacturing tolerances and errors, and mean "substantially the same", "substantially equal", and "substantially different".

Furthermore, in addition to the above-mentioned content, it is also possible to use the method of the above-mentioned embodiment and each modified example in combination suitably.

In addition, although not exemplifying one by one, the above-mentioned embodiment and each modified example can be implemented by adding various changes within a range that does not deviate from the gist.

Label description

1: Motor; 2: Motor section; 4: Amplifier section; 5a: Power board (1st board, an example of a board); 5b: Door board; 5c: Power board (3rd board, an example of a board); 5d: DC Input board (an example of a third board, a board); 5e: a control board (a second board, an example of a board); 6: a frame; 7: a rear board (an example of a relay board); 7': a rear board (a relay board) 7a, b: rear plate (an example of relay substrate); 8a, b: guide member; 8c, d: guide member; 9a-d: heat conduction sheet (an example of heat conduction member, resin sheet); 10a1 : thin component (an example of a component); 50a: an inverter circuit (an example of a power conversion circuit); 50e: a control circuit; 51: a left surface (an example of a first surface); 52: a right surface (an example of a second surface) ); 53: switch substrate; 54: heat dissipation hole; 55: through hole; 56: heat conduction material; 63: frame cover (an example of heat dissipation part and substrate fixing part); 64: frame wall; 65: extension setting part; 61a: heat sink part (an example of the first heat sink part); 61a': heat sink part (an example of the first heat sink part); 61b: heat sink part (an example of the second heat sink part); 71: resin; 81-84: Groove (an example of concave part); 85-88: Step (an example of concave part); 500: Main circuit part; 603: Opening part; 604: Opening part; 610: Convex part; Ca: connector; Cb2, Cb3: connector; Cc2, Cc3: connector; Cd3: connector; SW: switching element (an example of an electronic component that generates heat when energized).

Claims (as amended under Article 19 of the Treaty)

1. (after modification) a kind of motor, it is characterized in that, described motor has:

an electric motor section having a stator and a rotor; and

an amplifier unit having a plurality of boards arranged in a planar direction along the direction of the rotation axis of the motor unit, and a main circuit configured to supply power to the motor unit using at least one of the boards department,

The amplifier unit is arranged on the opposite load side of the motor unit.

2. The motor according to claim 1, characterized in that,

The amplifier unit has a frame that accommodates the plurality of substrates,

The main circuit unit has a first substrate disposed near an inner surface of the frame,

The amplifier section has:

an electronic component disposed on the first surface of the first substrate opposite to the inner surface of the frame, and generates heat when energized; and

a heat conduction member disposed between the first substrate and the inner surface of the frame, and in contact with at least one of the second surfaces of the first substrate on the inner surface side of the frame corresponding to the electronic component area.

3. The motor according to claim 2, characterized in that,

The amplifier unit further includes a thermal via formed in a region of the first substrate corresponding to the electronic component, and the through hole is filled with a thermally conductive material.

4. The motor according to claim 2 or 3, characterized in that,

The thermally conductive member is a resin sheet having anisotropic thermal conductivity.

5. The motor according to claim 2 or 3, characterized in that,

The heat conduction member is a protrusion protruding from the inner surface of the frame toward the first substrate.

6. The motor according to any one of claims 2 to 5, characterized in that,

The first substrate is a double-sided substrate, and a member having a smaller dimension in a thickness direction of the first substrate than the heat conduction member is disposed on the second surface.

7. The motor according to any one of claims 2 to 6, characterized in that,

The electronic component is a switching element constituting a power conversion circuit of the main circuit unit,

The amplifier unit further includes a switch substrate on which the switching element is mounted and arranged on the first surface of the first substrate,

The heat conduction member is in contact with at least a region of the second surface of the first substrate corresponding to the switch substrate.

Claims (7)

1. A motor, characterized in that the motor has: an electric motor section having a stator and a rotor; and an amplifier unit having a plurality of boards arranged in a planar direction along the direction of the rotation axis of the motor unit, and a main circuit configured to supply power to the motor unit using at least one of the boards department. 2. The motor according to claim 1, characterized in that, The amplifier unit has a frame that accommodates the plurality of substrates, The main circuit unit has a first substrate disposed near an inner surface of the frame, The amplifier section has: an electronic component disposed on the first surface of the first substrate opposite to the inner surface of the frame, and generates heat when energized; and a heat conduction member disposed between the first substrate and the inner surface of the frame, and in contact with at least one of the second surfaces of the first substrate on the inner surface side of the frame corresponding to the electronic component area. 3. The motor according to claim 2, characterized in that, The amplifier unit further includes a thermal via formed in a region of the first substrate corresponding to the electronic component, and the through hole is filled with a thermally conductive material. 4. The motor according to claim 2 or 3, characterized in that, The thermally conductive member is a resin sheet having anisotropic thermal conductivity. 5. The motor according to claim 2 or 3, characterized in that, The heat conduction member is a protrusion protruding from the inner surface of the frame toward the first substrate. 6. The motor according to any one of claims 2 to 5, characterized in that, The first substrate is a double-sided substrate, and a member having a smaller dimension in a thickness direction of the first substrate than the heat conduction member is arranged on the second surface. 7. The motor according to any one of claims 2 to 6, characterized in that, The electronic component is a switching element constituting a power conversion circuit of the main circuit unit, The amplifier unit further includes a switch substrate on which the switching element is mounted and arranged on the first surface of the first substrate, The heat conduction member is in contact with at least a region of the second surface of the first substrate corresponding to the switch substrate.