CN1073938C - Method for quickly bonding orifice sheets of an inkjet head - Google Patents

Abstract

The invention relates to a method for quickly bonding a nozzle plate of an ink-jet head, wherein the ink-jet head comprises a plurality of ink tanks for containing ink; a plurality of ink jet holes corresponding to the plurality of ink tanks are formed on the jet hole sheet and used for jetting the ink; a chip for controlling the ejection of the ink, comprising the steps of: a) coating an adhesive layer with photoresist characteristic on a wafer, wherein the wafer comprises a plurality of chips; b) forming a plurality of ink tanks on the adhesive layer; c) placing a flat plate on the plurality of ink tanks at an angle parallel to the wafer, wherein the flat plate comprises the plurality of nozzle plates and the plurality of ink jet holes are aligned with the plurality of ink tanks; and d) heating the adhesive layer to bond the wafer and the plate.

Description

Method for quickly bonding orifice sheets of an inkjet head

The invention relates to a method for adhering an orifice sheet of an inkjet head of an inkjet printer, in particular to a method for rapidly adhering an orifice sheet of an inkjet head of an inkjet printer.

Inkjet printers have always occupied a place in the printing market. With their increasing clarity and ease of use in color printing, inkjet printers have not been eliminated due to the emergence of laser printers. For inkjet printers, the inkjet head is a very important part, because it is closely related to the printing quality. Please refer to Figure 1, which shows a typical inkjet head. The main body of the inkjet head is a chip 1, which contains a circuit for receiving software control to perform inkjet actions. There is a hollow in the middle that is the ink storage place. 2. It is used to store all the ink 21. There are many ink tanks 3 around the ink storage place 2, which can be communicated with the ink storage place 2, so that the ink 21 can flow in. Cover the ink tank 3 with a lot of ink tanks. In the orifice plate 4 of the ink hole 41, each ink tank 3 corresponds to an ink ejection hole 41, which serves as an outlet for ejecting ink. Please refer to Fig. 2, it is the schematic diagram of the method for the orifice plate of known bonding ink-jet head, comprises dozens of wafers 1 in the wafer 5, and these wafers 1 have gone through many processing steps, as steps such as deposition, etching, And including due circuit, ink storage place 2 and ink tank 3 etc., the next step is exactly to be bonded with orifice sheet 4 and each chip 1. The known method is to dispense glue on a suitable position of a wafer, and then place an orifice sheet 4 on this wafer 1 with a suction nozzle; then dispense glue on another wafer 1, and then place another orifice sheet 4. Place it on the wafer 1; the same dispensing and placement steps are repeated dozens of times until all the wafers 1 on the wafer 5 have been covered with an orifice sheet 4. Then, the wafer 5 and all the orifice plates 4 are heated under pressure to complete the bonding step. The step of placing the orifice sheet 4 on the wafer 1 needs to be carried out in a precise alignment manner, so that each ink ejection hole 41 can correspond to each ink tank 3, so as not to cause the outlet of the ink 21 to be blocked, so a single alignment The step takes a short while. In this way, the disadvantages of the known method are very obvious. It takes a long time to repeat the same steps. Generally, more than a hundred times of precise alignment gluing steps are required for a wafer 5, which is not only time-consuming, but also difficult to accurately control the amount of glue dispensed. , the scrap rate cannot be reduced.

The purpose of the present invention is to provide a method for quickly bonding the orifice sheet of the inkjet head, and achieve the effect of saving bonding time with fewer steps.

The object of the present invention is achieved like this, a kind of method for fast bonding the orifice sheet of ink-jet head, and this ink-jet head comprises a plurality of ink grooves, in order to contain ink; A plurality of inkjet holes in the water tank are used to eject the ink; a wafer is used to control the ejection of the ink, and the steps include: a) coating an adhesive layer on a wafer, wherein the wafer includes a plurality of the ink. wafer; b) forming the plurality of ink slots on the adhesive layer; c) placing a flat plate on the plurality of ink slots at an angle parallel to the wafer, wherein the flat plate includes the plurality of orifice sheets, and The plurality of ink ejection holes are aligned with the plurality of ink slots; and d) heating the adhesive layer, so that the adhesive layer adheres the wafer and the plate.

According to the above-mentioned technical solution, the cutting step e) in the method of quickly bonding the orifice sheet of the inkjet head can be implemented by a diamond cutting method, a laser cutting method or a rotary blade sawing method.

According to the above technical solution, in the method for fast bonding the orifice sheet of the inkjet head, the adhesive layer is a photoresist layer.

According to the above technical solution, the material of the photoresist layer in the method of fast bonding the orifice sheet of the inkjet head is a dry photoresist, and the thickness of the photoresist layer is preferably 50 μm to 1000 μm.

According to the above technical solution, the material of the photoresist layer in the method of fast bonding the orifice sheet of the inkjet head is a one-liquid photoresist, and the thickness of the photoresist layer is preferably 0.1 μm to 50 μm.

According to the technical solution described above, the forming step b) in the method for quickly bonding the orifice sheets of the inkjet head is carried out by lithography.

According to the above-mentioned technical solution, the preferred temperature range of the heating step d) in the method of quickly bonding the orifice sheet of the inkjet head is 100° C. to 250° C., and the parallel heating plate is heated for 1 minute to 10 hours.

According to the above technical solution, the orifice sheet is a metal sheet.

Due to the adoption of the above-mentioned technical solution, the method of the present invention to quickly bond the orifice sheet of the inkjet head thus improves the bonding speed by hundreds of times, and can greatly increase the efficiency. At the same time, because the present invention replaces the traditional dot Glue method, the failure rate of para-gluing can be greatly reduced. At the same time, as long as the only gluing is carried out properly, this bonding step will not cause failure rate, which improves the inkjet head manufacturing process of inkjet printers. And progress is extremely important.

In the following, the present invention will be deeply understood through illustrations and detailed descriptions of preferred embodiments.

Figure 1 is a schematic diagram of a typical inkjet head;

Fig. 2 is the schematic diagram of the method for the orifice plate of known bonding ink-jet head;

Fig. 3 is the schematic diagram of the method for bonding the orifice plate of ink-jet head of the present invention;

FIG. 4 is a schematic diagram of a partial structural bonding procedure in the embodiment of FIG. 3 .

Please refer to Fig. 3, it is the schematic diagram of the preferred embodiment of the method for the orifice plate of bonding ink-jet head of the present invention, comprises dozens of wafers 1 in the wafer 5, and these wafers 1 pass through many processing steps equally, as Deposition, etching and other steps, and include the applied circuit, ink storage place 2 and ink tank 3, etc., then properly coat an adhesive layer 31 on the wafer, and use the suction nozzle to contain many orifice sheets 4 The flat plate 6 is placed on the wafer 5 at an angle parallel to the wafer 5. Of course, this step must also be carried out in a precise alignment manner, so that each ink ejection hole 41 on the ejection hole sheet 4 can correspond to each ink tank 3 ; Then pressurize and heat the wafer 5 and the flat plate 6 to complete the bonding step, and finally divide the components to obtain a single inkjet printer inkjet head.

As for the method of dividing the components, traditional cutting methods can be used, such as diamond cutting with a diamond knife, laser cutting with laser irradiation, or sawing with a rotating blade.

The difference between this embodiment and the known method is that the flat plate containing many orifice sheets is placed on the wafer in a precise alignment manner, and only one gluing is required to bond hundreds of orifice sheets. The step time can be shortened by more than one percent. However, this method of placing all the orifice sheets on the wafer at one time should be combined with the improvement of the adhesive coating technology, otherwise there will be problems such as the ejection of the orifice sheets, ink leakage, or blockage of the ink ejection holes. The following orifices The sheet bonding procedure is particularly suitable for this method.

Please refer to FIG. 4, which is a schematic diagram of a part of the structural bonding procedure in the embodiment of FIG. 3. Please refer to FIG. Sensitive materials can be used, as long as the thickness of the required photoresist layer 31 is used to determine whether to use a liquid photoresist or a dry photoresist. The liquid photoresist contains more solvent components and is suitable for forming a thinner photoresist layer with a thickness of about 0.1 μm to 50 μm; and the dry photoresist has less solvent content, which is suitable for forming a thicker photoresist layer, with a thickness of about 50 μm to 1000 μm. The current inkjet head mostly uses dry photoresist, which can accommodate more ink. In addition, as long as the resin component in the photoresist material can have a good adhesion effect, there is no need for special requirements; the coating method is to utilize the spin coating method, so the method can evenly coat the photoresist layer 31 on the wafer 1 superior.

Please refer to Fig. 4B, and then implement a lithography step, after soft baking, exposure and display in sequence, the unnecessary parts are washed away to form circular hole-shaped grooves one by one, and the grooves are used to hold the ink 21 the ink tank 3. By the known manufacturing method, hard baking is followed after the lithography step, to evaporate the solvent in the photoresist layer 31 and increase the adhesion of the photoresist layer 31 to the wafer 1, but after the photoresist layer 31 is dry, it can no longer be applied Other items are glued. Please refer to FIG. 4C , first suspend the known hard-baking step, drill the ink channel before the photoresist layer 31 loses its viscosity, and then use the precision alignment device to place the orifice sheet 4 on the correct position of the wafer 1 , so that the upper ink ejection holes 41 of the orifice sheet 4 are aligned with each corresponding ink tank 3 .

Then the whole element is hard-baked to reduce the residual solvent content in the photoresist layer 31, so that the photoresist layer 31 can be properly adhered to the wafer 1 and the orifice sheet 4. When hard-baking, it is heated by traditional heat conduction. Both sides of the wafer 1 and the orifice plate 4 are heated by parallel heating plates. The heating temperature and time are carefully selected according to the characteristics of the photoresist material. Generally speaking, it is heated at 100°C to 250°C for 1 minute to 10 hours. If the heating temperature is too low, it will take a long time to evaporate the solvent; if the heating temperature is too high, the element will be heated unevenly, and the surface part of the photoresist layer 31 will harden first, so the internal solvent will not be able to evaporate, which will affect the light. The adhesion of the resist layer 31, what’s more, the adhesion of the photoresist layer 31 will be reduced due to the accumulation of too much stretching stress; if the heating time is too short, the residual solvent in the photoresist layer 31 will be too much The wafer 1 and the orifice plate 4 cannot be properly bonded; and if the heating time is too long, the adhesiveness will be reduced due to the brittleness of the photoresist, and the heating cost will be wasted. In addition, during the heating process, a pressure of about 0.01kg/cm ² to 1kg/cm ² can be applied to the orifice plate 4 to accelerate the bonding efficiency.

The method for the orifice sheet of the fast bonding ink-jet head of the present invention is particularly suitable for this kind of bonding procedure, because saves the dispensing step, needn't worry because the bonding agent coating time is too long, perhaps adhesiveness is not coated completely yet, Placement of the slab on top of the wafer for bonding where the adhesive applied earlier has dried hard will result in improper bonding of the areas where the adhesive was applied earlier. The method of the present invention to quickly bond the orifice sheet of the inkjet head thus increases the bonding speed by hundreds of times and can greatly increase the efficiency. At the same time, because the present invention replaces the traditional dispensing method with precision lithography, the alignment glue is unqualified The rate can be greatly reduced, and as long as the only gluing is carried out properly, this gluing step will not cause a defective rate. It is beyond doubt that it improves and progresses the inkjet head manufacturing process of an inkjet printer.

Claims (10)

1. A method for quickly bonding the orifice sheet of an inkjet head, the inkjet head includes a plurality of ink tanks for containing ink; a plurality of ink ejection holes corresponding to the plurality of ink tanks are arranged on an orifice sheet, and are used for to eject the ink; a chip, used to control the ejection of the ink, is characterized in that it includes the following steps: a) coating an adhesive layer on a wafer, wherein the wafer comprises a plurality of the wafers; b) forming the plurality of ink grooves on the adhesive layer; c) placing a flat plate on the plurality of ink slots at an angle parallel to the wafer, wherein the flat plate includes the plurality of orifice sheets, and the plurality of ink ejection holes are aligned with the plurality of ink slots; and d) heating the adhesive layer to make the adhesive layer bond the wafer and the plate. 2. A kind of method for rapidly bonding the orifice plate of ink-jet head according to claim 1, it is characterized in that: after step d), also comprise a step e), the wafer after this bonding and flat plate are cut, with A plurality of the inkjet heads are obtained. 3. A kind of method for quickly bonding the orifice sheet of the inkjet head according to claim 2, characterized in that: the cutting step e) is selected from one of diamond cutting, laser cutting and sawing. as a cutting method. 4. A method for rapidly adhering an orifice sheet of an inkjet head according to claim 1, wherein the adhesive layer is a photoresist layer. 5. A method for quickly bonding an orifice sheet of an inkjet head according to claim 4, wherein the material of the photoresist layer is a dry photoresist, and the thickness of the photoresist layer is 50 μm to 1000 μm . 6. A kind of method for quickly bonding the orifice sheet of the inkjet head according to claim 4, characterized in that: the material of the photoresist layer is a one-liquid photoresist, and the thickness of the photoresist layer is 0.1 μm to 50μm. 7. A method for fast bonding the orifice sheet of an inkjet head according to claim 1, characterized in that: said forming step b) is performed by lithography. 8. The method for quickly bonding the orifice sheet of an inkjet head according to claim 1, wherein the heating step d) is performed with a parallel heating plate, and the temperature range of the heating step is from 100°C to 250° C., the time for this heating step ranges from 1 minute to 10 hours. 9. A method for quickly bonding an orifice sheet of an inkjet head according to claim 1, wherein the flat plate is a metal sheet. 10. A method for quickly bonding an orifice sheet of an inkjet head according to claim 9, wherein the metal sheet is a nickel sheet.

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