CN107231762A - A kind of SMT system of processing and its technique - Google Patents
A kind of SMT system of processing and its technique Download PDFInfo
- Publication number
- CN107231762A CN107231762A CN201710407236.0A CN201710407236A CN107231762A CN 107231762 A CN107231762 A CN 107231762A CN 201710407236 A CN201710407236 A CN 201710407236A CN 107231762 A CN107231762 A CN 107231762A
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- China
- Prior art keywords
- automatic
- pcb
- aoi
- spi
- smt
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- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 32
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 238000003466 welding Methods 0.000 claims abstract description 28
- 239000006071 cream Substances 0.000 claims abstract description 23
- 238000012360 testing method Methods 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 claims description 18
- 230000007547 defect Effects 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000012423 maintenance Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 230000005856 abnormality Effects 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 230000003134 recirculating effect Effects 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000005457 optimization Methods 0.000 abstract description 4
- 238000004904 shortening Methods 0.000 abstract description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- 206010044565 Tremor Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to the system of processing of SMT a kind of and its technique, its system enters trigger, tin cream automatic press, SPI automatic detecting machines, automatic placement machine, AOI including PCB and checks equipment and element fluid welding system automatically, described PCB enters trigger and is connected with tin cream automatic press automatically, tin cream automatic press is connected with SPI automatic detecting machines, described SPI automatic detecting machines are connected with automatic placement machine, automatic placement machine is connected with element fluid welding system, and described element fluid welding system checks that equipment is connected with AOI.The present invention is used in combination by SPI with AOI, by that to SMT production lines Real-time Feedback and optimization, the quality of production can be made more to flatten out surely, and in the unstable test manufacture stage being subjected to when significantly shortening new product introduction, corresponding cost loss is more saved.
Description
Technical field
The present invention relates to the system of processing of SMT a kind of and its technique, belong to SMT processing technique field.
Background technology
With SMT（Surface mount）The zero device precision more and more higher volume mounted is less and less, the visual inspection capability of people
It is far from enough to realize that SMT process capabilities are collected and detected at any time to measurement data, it is necessary to by powerful equipment,
Automatic decision, automatic production report.Simultaneously difficult in current recruitment, labor cost rises, the nothing after paste solder printing in SMT processing procedures
Method monitors printing quality and print tin ability, is manually visually inspected after element dressing, the defect such as artificial visual inspection after fluid welding.
The content of the invention
It is an object of the invention to：For the defect of prior art, it is proposed that a kind of SMT processing technology, it can pass through
To SMT production lines Real-time Feedback and optimization, the quality of production can be made more to flatten out surely, be subjected to when significantly shortening new product introduction
The unstable test manufacture stage, corresponding cost loss more saves.
The technical solution adopted in the present invention is：A kind of SMT system of processing, including to enter trigger, tin cream automatically automatic by PCB
Printing machine, SPI automatic detecting machines, automatic placement machine, AOI check equipment and element fluid welding system, and described PCB enters trigger automatically
Be connected with tin cream automatic press, tin cream automatic press is connected with SPI automatic detecting machines, described SPI automatic detecting machines with
Automatic placement machine is connected, and automatic placement machine is connected with element fluid welding system, and described element fluid welding system checks equipment phase with AOI
Even.
In the present invention：Described SPI automatic detecting machines are located at station after tin cream automatic press, so as to detect that tin cream prints
Brush quality；Described AOI checks that equipment is located at station after automatic placement machine, the quality of final detection SMT processing procedure products.
In the present invention：AOI also is provided between described automatic placement machine and element fluid welding system and checks equipment, is automatic
Optical detection apparatus, for detecting whether the attachment of electronic component is correct, after fluid welding, whether element, which has, connects tin, shifts, sets up a monument
Deng abnormal.
A kind of processing technology in SMT, it is characterised in that：Comprise the following steps：
（1）, automatic charging：Pcb board immigration is detected whether by optical sensor, by conveyer belt by PCB if detecting
Plate is sent to automatic printing tin machine；
（2）, SMT print tin：By optical registration point, printed solder paste onto with the mode of screen printing on PCB pads；
（3）、3D SPI：Refer to tin cream detecting system, main function is exactly to detect the quality of paste solder printing, including volume, face
Product, height, XY skews, shape, bridge joint etc.；
（4）, element puts and takes：Required component is attached on PCB pads by automatic placement machine；
（5）, element take postpone AOI inspection：By camera automatically scanning PCB, gather image, the component data of test with it is qualified
Parameter be compared, by image procossing, check that element takes the defect put on PCB, and pass through display or Automatic Logos
Defect is shown/marked, is repaired for maintenance personal；
（6）, element fluid welding（Reflow）：When PCB enters preheating zone, moisture content, gas evaporation in soldering paste, scaling powder moistening member
Part pin and pad, soldering paste start to soften and cover pad, component pin and pad is isolated with oxygen；PCB enters recirculating zone
When, temperature rises rapidly, and soldering paste reaches molten state, to the component pin on PCB and pad moistening, diffusion, backflow, Zhi Houleng
But soldering joint is formed, so as to complete Reflow Soldering；
（7）, AOI is detected after element fluid welding：By camera automatically scanning PCB, gather in image, the solder joint and database of test
Qualified parameter be compared, by image procossing, check the defect after PCB fluid weldings, and pass through display or automatic mark
Will shows defect/mark, and is repaired for maintenance personal；
（8）, remote management and debugging：The data such as 3D SPI, AOI, Reflow Soldering curve are monitored on distance host, noting abnormalities can
Give a warning in time, realize remote management.
After adopting the above technical scheme, beneficial effects of the present invention are：Present system is simple, reasonable in design, makes product
Quality, yield have great lifting, and operation quality has breakthrough improvement；It is used in combination by SPI with AOI, by SMT
Production line Real-time Feedback and optimization, can be such that the quality of production more flattens out surely, the shakiness being subjected to when significantly shortening new product introduction
Surely test-manufacture the stage, corresponding cost loss is more saved.
Brief description of the drawings
Fig. 1 is the system schematic in the present invention；
Fig. 2 is the flow process chart in the present invention.
In figure：1.PCB enters trigger automatically；2. tin cream automatic press；3.SPI automatic checkout equipments；4. automatic placement machine；
5. AOI checks equipment one；6. element fluid welding system；7. AOI checks equipment two；8. remote management and commissioning device.
Embodiment
Below in conjunction with accompanying drawing, the present invention is further illustrated.
As seen from Figure 1, a kind of SMT system of processing, including PCB enter trigger 1, tin cream automatic press 2, SPI certainly automatically
Dynamic detection machine 3, automatic placement machine 4, AOI check that equipment 1, AOI check equipment 27 and element fluid welding system 6, described PCB
Automatically enter trigger 1 with tin cream automatic press 2 to be connected, tin cream automatic press 2 is connected with SPI automatic detecting machines 3, described
SPI automatic detecting machines 3 are connected with automatic placement machine 4, and automatic placement machine 4 checks equipment 1 and element fluid welding system 6 by AOI
It is connected, described element fluid welding system 6 checks that equipment 27 is connected with AOI；It is automatic that described SPI automatic detecting machines 3 are located at tin cream
Station after printing machine 2, so as to detect paste solder printing quality；Described AOI checks that equipment 27 is located at work after element fluid welding system 6
Position, the quality of final detection SMT processing procedure products.Detect to print bad, the tin cream automatic printing of tin by SPI automatic checkout equipments 3
The flame that brush machine 2 can be detected according to SPI adjustment in time finds bad, drop in printing link as early as possible from action correction
Low maintenance cost, implementation process control；Check that the management of equipment utilization remote engineering and commissioning device 8 can be remotely complete by AOI
Into the optimization of a plurality of production line, it is no longer necessary to which board is stopped into debugging routine lifting operating efficiency.
As shown in Figure 2, a kind of processing technology in SMT, it is characterised in that：Comprise the following steps：
（1）, automatic charging：Pcb board immigration has been detected whether by optical sensor, plate is entered by PCB automatically if detecting
Pcb board is sent to tin cream automatic press by the conveyer belt of machine；
（2）, SMT print tin：By the optical registration point of tin cream automatic press, printed solder paste onto with the mode of screen printing
On PCB pads；
（3）、3D SPI：Refer to tin cream detecting system, main function is exactly to detect paste solder printing using SPI automatic checkout equipments
Quality, including volume, area, height, XY skews, shape, bridge joint etc.；
（4）, element puts and takes：Required component is attached on PCB pads by automatic placement machine；
（5）, element take postpone AOI inspection：The camera automatically scanning PCB of equipment one is checked by AOI, image, test is gathered
Component data be compared with qualified parameter, by image procossing, check that element takes the defect put on PCB, and pass through
Display or Automatic Logos show defect/mark, and are repaired for maintenance personal；
（6）, element fluid welding（Reflow）：When PCB enters preheating zone, moisture content, gas evaporation in soldering paste, scaling powder moistening member
Part pin and pad, soldering paste start to soften and cover pad, component pin and pad is isolated with oxygen；PCB enters recirculating zone
When, temperature rises rapidly, and soldering paste reaches molten state, to the component pin on PCB and pad moistening, diffusion, backflow, Zhi Houleng
But soldering joint is formed, so as to complete Reflow Soldering；
（7）, AOI is detected after element fluid welding：The camera automatically scanning PCB of equipment two is checked by AOI, image, test is gathered
Solder joint and database in qualified parameter be compared, by image procossing, check the defect after PCB fluid weldings, and lead to
Cross display or Automatic Logos defect is shown/marked, repaired for maintenance personal；
（8）, remote management and debugging：The data such as 3D SPI, AOI, Reflow Soldering curve are monitored on distance host, noting abnormalities can
Give a warning in time, realize remote management.
The embodiment to the present invention is described above, but the present invention is not limited to above description.For this
For the technical staff in field, any equal modifications and substitutions to the technical program are all within the scope of the invention.Cause
This, the impartial conversion and modification made without departing from the spirit and scope of the invention all should be contained within the scope of the invention.
Claims (4)
1. a kind of SMT system of processing, it is characterised in that：Enter trigger, tin cream automatic press, SPI automatically including PCB to examine automatically
Survey machine, automatic placement machine, AOI check equipment and element fluid welding system, and described PCB enters trigger and tin cream automatic press automatically
It is connected, tin cream automatic press is connected with SPI automatic detecting machines, and described SPI automatic detecting machines are connected with automatic placement machine, from
Dynamic chip mounter is connected with element fluid welding system, and described element fluid welding system checks that equipment is connected with AOI.
2. a kind of SMT according to claim 1 system of processing, it is characterised in that：Described SPI automatic detecting machines are located at
Station after tin cream automatic press, so as to detect paste solder printing quality；Described AOI checks that equipment is located at work after automatic placement machine
Position, the quality of final detection SMT processing procedure products.
3. a kind of SMT according to claim 1 system of processing, it is characterised in that：Described automatic placement machine and element
Also be provided between fluid welding system AOI check equipment, be automatic optical detection device, for detect electronic component attachment whether
Correctly, after fluid welding element whether have even tin, shift, set up a monument etc. it is abnormal.
4. a kind of processing technology in SMT according to claim 1, it is characterised in that：Comprise the following steps：
（1）, automatic charging：Pcb board immigration is detected whether by optical sensor, by conveyer belt by PCB if detecting
Plate is sent to automatic printing tin machine；
（2）, SMT print tin：By optical registration point, printed solder paste onto with the mode of screen printing on PCB pads；
（3）、3D SPI：Refer to tin cream detecting system, main function is exactly to detect the quality of paste solder printing, including volume, face
Product, height, XY skews, shape, bridge joint etc.；
（4）, element puts and takes：Required component is attached on PCB pads by automatic placement machine；
（5）, element take postpone AOI inspection：By camera automatically scanning PCB, gather image, the component data of test with it is qualified
Parameter be compared, by image procossing, check that element takes the defect put on PCB, and pass through display or Automatic Logos
Defect is shown/marked, is repaired for maintenance personal；
（6）, element fluid welding（Reflow）：When PCB enters preheating zone, moisture content, gas evaporation in soldering paste, scaling powder moistening member
Part pin and pad, soldering paste start to soften and cover pad, component pin and pad is isolated with oxygen；PCB enters recirculating zone
When, temperature rises rapidly, and soldering paste reaches molten state, to the component pin on PCB and pad moistening, diffusion, backflow, Zhi Houleng
But soldering joint is formed, so as to complete Reflow Soldering；
（7）, AOI is detected after element fluid welding：By camera automatically scanning PCB, gather in image, the solder joint and database of test
Qualified parameter be compared, by image procossing, check the defect after PCB fluid weldings, and pass through display or automatic mark
Will shows defect/mark, and is repaired for maintenance personal；
（8）, remote management and debugging：The data such as 3D SPI, AOI, Reflow Soldering curve are monitored on distance host, noting abnormalities can
Give a warning in time, realize remote management.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710407236.0A CN107231762A (en) | 2017-06-02 | 2017-06-02 | A kind of SMT system of processing and its technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710407236.0A CN107231762A (en) | 2017-06-02 | 2017-06-02 | A kind of SMT system of processing and its technique |
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| Publication Number | Publication Date |
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| CN107231762A true CN107231762A (en) | 2017-10-03 |
Family
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| CN201710407236.0A Pending CN107231762A (en) | 2017-06-02 | 2017-06-02 | A kind of SMT system of processing and its technique |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055789A (en) * | 2018-01-03 | 2018-05-18 | 苏州维信电子有限公司 | Prevent the production technology of MIC dysfunctions |
| CN108617163A (en) * | 2018-07-13 | 2018-10-02 | 苏州市吴通智能电子有限公司 | A kind of shifting apparatus and its control method applied to SMT attachment lines |
| CN108684159A (en) * | 2018-05-28 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of undesirable method for maintaining of solution SPI |
| CN108811365A (en) * | 2018-07-03 | 2018-11-13 | 上海安理创科技有限公司 | A kind of SMT production of intelligent mistake proofing retroactive method and technique |
| CN108834332A (en) * | 2018-07-12 | 2018-11-16 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT welding procedure |
| CN109146181A (en) * | 2018-08-24 | 2019-01-04 | 郑州云海信息技术有限公司 | A kind of SMT press quality optimization system and method |
| CN110143070A (en) * | 2019-06-26 | 2019-08-20 | 广东电网有限责任公司 | A substation multifunctional seal |
| CN111367261A (en) * | 2020-04-03 | 2020-07-03 | 镇江市高等专科学校 | Intelligent module and multifunctional motor controller production process based on intelligent module |
| CN111465312A (en) * | 2020-04-14 | 2020-07-28 | 杭州洛微科技有限公司 | Photoelectric product packaging production method based on periodic array arrangement |
| CN111629529A (en) * | 2020-06-03 | 2020-09-04 | 重庆金茂联合电子有限公司 | SMT surface mounting technology for PCBA mainboard processing |
| CN111655416A (en) * | 2018-02-02 | 2020-09-11 | 浜名湖电装株式会社 | Electrical component manufacturing apparatus and electrical component manufacturing method |
| CN112327790A (en) * | 2020-11-27 | 2021-02-05 | 电信科学技术仪表研究所有限公司 | A kind of SMT intelligent process optimization control method |
| CN112672634A (en) * | 2020-12-31 | 2021-04-16 | 图尔克（天津）科技有限公司 | PCB tin brushing and surface mounting production process method |
| CN113179625A (en) * | 2021-03-12 | 2021-07-27 | 山东英信计算机技术有限公司 | PCB production method and system |
| CN114062391A (en) * | 2020-08-06 | 2022-02-18 | 苏州加贺智能设备有限公司 | Detection method and system of automatic optical detection equipment |
| CN114340207A (en) * | 2021-12-09 | 2022-04-12 | 深圳市盛邦尔科技有限公司 | Light-weighted SMD antenna module |
| CN114340208A (en) * | 2021-12-29 | 2022-04-12 | 无锡鸿睿电子科技有限公司 | Continuous circuit board SMT (surface mount technology) mounting industrial production line process system |
| CN115003147A (en) * | 2022-05-23 | 2022-09-02 | 新华三技术有限公司 | Solder paste adjustment device and SMT automatic processing system |
| CN115151058A (en) * | 2022-06-24 | 2022-10-04 | 新华三技术有限公司 | SMT printing less-tin optimization method |
| TWI783548B (en) * | 2021-06-24 | 2022-11-11 | 英業達股份有限公司 | Printing solder point quality identification and maintenance suggestion system and method thereof |
| CN115988865A (en) * | 2022-10-08 | 2023-04-18 | 东莞市诺正电子有限公司 | Printed circuit board SMT paster production process |
| CN118843270A (en) * | 2024-06-18 | 2024-10-25 | 东莞华瑞众信科技有限公司 | Surface mounting technology of memory groove |
| CN118984544A (en) * | 2024-08-05 | 2024-11-19 | 佛山市奥索兰电子器件有限公司 | A fully automated PCBA production method |
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Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055789A (en) * | 2018-01-03 | 2018-05-18 | 苏州维信电子有限公司 | Prevent the production technology of MIC dysfunctions |
| CN111655416A (en) * | 2018-02-02 | 2020-09-11 | 浜名湖电装株式会社 | Electrical component manufacturing apparatus and electrical component manufacturing method |
| CN111655416B (en) * | 2018-02-02 | 2022-03-25 | 浜名湖电装株式会社 | Electric component manufacturing apparatus and method of manufacturing electric component |
| CN108684159A (en) * | 2018-05-28 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of undesirable method for maintaining of solution SPI |
| CN108811365A (en) * | 2018-07-03 | 2018-11-13 | 上海安理创科技有限公司 | A kind of SMT production of intelligent mistake proofing retroactive method and technique |
| CN108834332A (en) * | 2018-07-12 | 2018-11-16 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT welding procedure |
| CN108617163A (en) * | 2018-07-13 | 2018-10-02 | 苏州市吴通智能电子有限公司 | A kind of shifting apparatus and its control method applied to SMT attachment lines |
| CN109146181A (en) * | 2018-08-24 | 2019-01-04 | 郑州云海信息技术有限公司 | A kind of SMT press quality optimization system and method |
| CN110143070A (en) * | 2019-06-26 | 2019-08-20 | 广东电网有限责任公司 | A substation multifunctional seal |
| CN111367261A (en) * | 2020-04-03 | 2020-07-03 | 镇江市高等专科学校 | Intelligent module and multifunctional motor controller production process based on intelligent module |
| CN111465312A (en) * | 2020-04-14 | 2020-07-28 | 杭州洛微科技有限公司 | Photoelectric product packaging production method based on periodic array arrangement |
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Application publication date: 20171003 |