CN107172818B - Full-automatic etching device and control method thereof - Google Patents

Abstract

The invention discloses a fully automatic etching device, which belongs to the field of etching devices. The fully automatic etching device includes an etching box, and a spraying mechanism is arranged on the top of the etching box. The spraying mechanism includes a first swing cylinder. A spray chamber is fixed on the output shaft, two guide rails are arranged under the spray mechanism, and a manipulator is arranged between the two guide rails. The manipulator includes a base and a lifting cylinder on the base. The output shaft of the lifting cylinder passes through the fixing piece It is connected with the second swing cylinder, the output shaft of the second swing cylinder is connected with the telescopic cylinder through the fixing piece, and the output shaft of the telescopic cylinder is connected with the air claw through the fixing piece. The present invention also discloses a control method for the above-mentioned fully automatic etching device. The fully automatic etching device disclosed in the present invention can realize that the etching liquid covers all areas that need to be etched, and at the same time can remove the surface area of the circuit board. Remove the remaining etching solution so that the circuit board is in contact with the new etching solution.

Description

A fully automatic etching device and its control method

technical field

The invention relates to the field of etching devices, in particular to a fully automatic etching device and a control method for the fully automatic etching device.

Background technique

In the prior art, the nozzle for spraying the etching solution on the circuit board is usually a linear nozzle containing multiple nozzles. The gaps between adjacent nozzles are the same, and the spraying angle of the nozzles is fixed, which easily causes the etching solution to fail. Covering all areas that need to be etched makes the etching of the circuit board uneven, and after spraying the etching solution for a period of time, the etching solution will remain on the surface of the circuit board, making it difficult for the circuit board to contact with the new etching solution, affecting the etching effect. In addition, the automation degree of the existing etching device is not high, and manual assistance is often required to reduce production efficiency.

Contents of the invention

In order to overcome the defects of the prior art, the technical problem to be solved by the present invention is to propose a fully automatic etching device, which can realize that the etching liquid covers all the areas that need to be etched, so that the etching of the circuit board can be uniform, and at the same time, it can remove the surface area of the circuit board. The etching solution, so that the circuit board is in contact with the new etching solution.

For reaching this purpose, the present invention adopts following technical scheme:

The invention provides a fully automatic etching device, comprising an etching box, a spraying mechanism for spraying etching liquid is arranged on the top of the etching box, the spraying mechanism includes a first swing cylinder, and the first swing A spray chamber is fixed on the output shaft of the cylinder, and the spray chamber includes a first spray area and a second spray area, the second spray area is arranged around the first spray area, and the first spray area is arranged around the first spray area. The density of nozzles in the spraying area is greater than that of the nozzles in the second spraying area. Two guide rails are arranged below the spraying mechanism, and a loading platform moving along the guide rails is arranged on the guide rails. The table is driven by a servo motor, and a manipulator for grabbing and flipping circuit boards is set between the two guide rails. The manipulator includes a base, and a lift cylinder on the base. The output shaft of the lift cylinder It is connected with the second swing cylinder through the fixing piece, the output shaft of the second swing cylinder is connected with the telescopic cylinder through the fixing piece, the output shaft of the telescopic cylinder is connected with the claw through the fixing piece, the first swing cylinder, the The servo motor, the lift cylinder, the second swing cylinder, the telescopic cylinder and the air claw are all electrically connected to the controller.

In a preferred embodiment of the present invention, the second spray area includes four sub-spray areas, and the four sub-spray areas are all in communication with the second infusion pipe.

In a preferred embodiment of the present invention, the four sub-spray areas are separated by four baffles.

In a preferred embodiment of the present invention, the first spray area is in communication with the first infusion pipe, and both the first infusion pipe and the second infusion pipe are in communication with the main infusion pipe. A heater and a temperature sensor located downstream of the heater are provided, and the heater and the temperature sensor are electrically coupled with the controller.

In a preferred embodiment of the present invention, the first infusion tube is provided with a first electric valve, the second infusion pipe is provided with a second electric valve, the first electric valve, the second electric valve The valves are each electrically coupled to the controller.

In a preferred embodiment of the present invention, the side walls at both ends of the etching box are provided with an inlet and an outlet, the inlet is located above the stage, and the outlet and the stage are located at the same height, A proximity switch is arranged above the inlet, and the proximity switch is electrically coupled with the controller.

In a preferred embodiment of the present invention, a first roller, a second roller at the same height as the first roller, a third roller located obliquely below the second roller are arranged in the etching box. roller and the fourth roller at the same height as the third roller, the upper surface of the first roller, the upper surface of the second roller and the inlet are at the same height, the third roller The roller is located on the side farther away from the entrance of the second roller, and the lower surface of the third roller is higher than the upper surface of the loading table, and the conveyor belt passes through the first roller in turn , the second roller, the third roller and the fourth roller, the conveyor belt is driven by a transmission motor, and the transmission motor is electrically connected to the controller.

In a preferred embodiment of the present invention, a guide plate is provided on the upper surface of the object stage.

In a preferred embodiment of the present invention, a photoelectric switch is arranged on the guide rail, and the photoelectric switch is located directly below the edge of the spray chamber near the outlet.

The present invention also provides a control method for the above-mentioned fully automatic etching device, so that the etching solution can cover all areas that need to be etched, so that the etching of the circuit board can be uniform, and at the same time, the etching solution remaining on the surface of the circuit board can be removed. In order for the circuit board to be in contact with new etching solution, automatic control of the circuit board etching process is realized. Include the following steps:

S1, the controller controls the servo motor to drive the stage to move to the entrance of the etching box, so that the stage receives the circuit board;

S2, the controller controls the servo motor to drive the stage to transport the circuit board directly under the spray mechanism;

S3, the controller controls the first oscillating cylinder, the first spray area and the second spray area spray the etching liquid on the circuit board to reach the set spray time, and the first spray end of process;

S4, the controller controls the air gripper to grip the circuit board, the controller controls the second swing cylinder to swing at a predetermined angle, and after swinging a predetermined number of times, the controller controls the second swing cylinder to The circuit board is placed on the stage, the controller controls the air gripper to release the circuit board, and the first turning process ends;

S5, repeating steps S3 and S4, until the desired etching effect is achieved;

S6, the controller controls the servo motor to drive the stage to transport the circuit board to the exit of the etching box.

The beneficial effects of the present invention are:

A fully automatic etching device provided by the present invention, the spray chamber is set on the first swing cylinder, so that the etching liquid can cover all the areas that need to be etched; The swing cylinder is connected to realize the flipping of the circuit board, which is convenient to remove the etching solution accumulated on the circuit board, so that the circuit board is in contact with the new etching solution; the guide rail and the stage are set to facilitate the transportation of the circuit board; the first swing cylinder, The servo motor, lift cylinder, second swing cylinder, telescopic cylinder and air claws are all electrically connected with the controller to realize automatic control of circuit board etching.

Description of drawings

Fig. 1 is a front view of a fully automatic etching device provided in Embodiment 1 of the present invention;

Fig. 2 is a top view of the spray chamber provided by Embodiment 1 of the present invention.

In the picture:

100, etching box; 101, import; 102, export; 103, proximity switch; 104, first roller; 105, second roller; 106, third roller; 107, fourth roller; 200, spray Mechanism; 210, the first swing cylinder; 220, the spray chamber; 230, the first spray area; 231, the first infusion tube; 232, the first electric valve; 240, the second spray area; 241, the second infusion Tube; 242, baffle; 243, total infusion tube; 244, heater; 245, temperature sensor; 246, second electric valve; 310, guide rail; 311, photoelectric switch; 320, stage; 321, servo motor; 322, guide plate; 400, manipulator; 410, base; 420, lift cylinder; 430, second swing cylinder; 440, telescopic cylinder; 450, air gripper; 500, controller.

Detailed ways

The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

Embodiment one

As shown in Figures 1 and 2, a fully automatic etching device provided in this embodiment includes an etching box 100, a spray mechanism 200, a guide rail 310, a manipulator 400, and a controller 500, and the spray mechanism 200 is arranged on the etching On the top of the box 100, the spray mechanism 200 includes a first swing cylinder 210, the output shaft of the first swing cylinder 210 is provided with a spray chamber 200, and the spray chamber 200 includes a first spray area 230, a second spray area 240 , the second spray area 240 is arranged around the first spray area 230, the density of the nozzles in the first spray area 230 is greater than the density of the nozzles in the second spray area 240, two guide rails 310 are arranged below the spray chamber 200, and the guide rails 310 is provided with a stage 320 that moves along the guide rails 310. The stage 320 is driven by a servo motor 321. The manipulator 400 is arranged between the two guide rails 310. The manipulator 400 includes a base 410 and a lifting mechanism located on the base 410. Cylinder 420, the output shaft of lifting cylinder 420 is connected with the second swing cylinder 430 through the fixing piece, the output shaft of the second swing cylinder 430 is connected with the telescopic cylinder 440 through the fixing piece, the output shaft of the telescopic cylinder 440 is connected with the air cylinder through the fixing piece Claw 450 is connected, the output shaft of lift cylinder 420, the output shaft of second swing cylinder 430 and the output shaft of telescopic cylinder 440 are perpendicular to each other, the first swing cylinder 210, servo motor 321, lift cylinder 420, second swing cylinder 430 , telescopic cylinder 440, air claw 450 are all electrically connected with controller 500. The spray chamber 220 is arranged on the first swing cylinder 210, so that the etching solution covers all areas to be etched. The hand claw 450 is provided for clamping the circuit board, and the second swing cylinder 430 is provided for flipping the circuit board, removing the etching solution accumulated on the circuit board, and making the circuit board contact with new etching solution. The first spraying area 230 is convenient for spraying more etching solution to the central area of the circuit board, which is conducive to accelerating the renewal of the etching solution in the central area of the circuit board, and setting the second spraying area 240 is convenient for spraying less etching on the edge area of the circuit board Liquid, which is beneficial to prevent excessive etching of the edge area of the circuit board and make the etching of the circuit board more uniform. The guide rail 310 and the stage 320 are provided to facilitate the transportation of the circuit board.

The controller 500 controls the actions of the first swing cylinder 210, the servo motor 321, the lift cylinder 420, the second swing cylinder 430, the telescopic cylinder 440 and the air gripper 450, so as to realize the automatic control of the circuit board etching. The specific control process is as follows: the controller 500 controls the servo motor 321, drives the stage 320 to drive the circuit board to reach the bottom of the spray chamber 200, the controller 500 controls the servo motor 321 to stop, the controller 500 controls the first swing cylinder 210, the first spray The spraying area 230 and the second spraying area 240 spray the circuit board, so that the area to be etched on the circuit board is completely covered by the etching solution. When the set spraying time is reached, the controller 500 controls the lifting cylinder to rise to a certain height, so that the air claw The central axis of 450 is at the same height as the stage 320, which is convenient for the air gripper 450 to pick up the circuit board. The claw 450 clamps the circuit board, the controller 500 controls the telescopic cylinder 440 to retract a certain distance, the controller 500 controls the second swing cylinder 430 to swing, and the circuit board is turned over to make the etching solution accumulated on the circuit board is cleared, the preset number of flips is reached, the controller 500 controls the telescopic cylinder 440 to extend, the controller 500 controls the second swing cylinder 430 to place the circuit board on the stage 320, the controller 500 controls the air claw 450 to release, repeat During the process of spraying, clamping, flipping, and loosening the circuit board until the preset total etching time is reached, the controller 500 controls the lifting cylinder to descend for a certain distance, and the controller 500 controls the servo motor 321 to drive the stage 320 to carry the circuit board To the outlet 102 of the etch box 100.

In order to ensure the uniformity of the spray amount in the second spray area 240, further, a fully automatic etching device includes four sub-spray areas, the four sub-spray areas form the second spray area 240, and the four sub-spray areas It is connected with the second infusion pipe 241, and each of the four sub-spray areas has a sub-infusion pipe connected with the second infusion pipe, so as to ensure that the spray flow rate of each sub-spray area is uniform.

In order to avoid mutual influence between the four sub-spray areas, further, a fully automatic etching device and its control method include four baffles 242, and four baffles 242 are set to separate the four sub-spray areas to prevent the four sub-spray areas The spray effect in the spray area affects each other to avoid excessive spraying on the edge of the circuit board.

In order to realize the temperature control of the etching solution, further, a fully automatic etching device includes a first infusion tube 231, a main infusion tube 243, a heater 244, a temperature sensor 245, and a controller 500. The first infusion tube 231 is connected to the second A spray area 230, the first infusion pipe 231, the second infusion pipe 241 are all communicated with the total infusion pipe 243, the heater 244 is arranged on the total infusion pipe 243, the temperature sensor 245 is arranged at the downstream position of the heater 244, the heater 244. The temperature sensor 245 is electrically connected to the controller 500. The controller 500 receives the temperature signal transmitted from the temperature sensor 245, controls the heater 244 to heat the etching solution on the main infusion tube 243, and makes the etching solution reach the set temperature, and the heated etching solution passes through the main infusion tube 243 and flows separately. Through the first infusion tube 231 and the second infusion tube 241 , it reaches the first spray area 230 and the second spray area 240 to spray the circuit board. The etchant is heated centrally on the main infusion pipe 243, which saves energy and is easy to control.

In order to realize the control of the times of circuit board spraying, further, a fully automatic etching device includes a first electric valve 232, a second electric valve 246, and a controller 500, and the first electric valve 232 is arranged on the first infusion tube 231 Above, the second electric valve 246 is arranged on the second infusion tube 241 , and both the first electric valve 232 and the second electric valve 246 are electrically connected with the controller 500 . By setting the first electric valve 232 and the second electric valve 246 to control the spraying conditions of the first spraying area 230 and the second spraying area 240 respectively, the spraying conditions of the central area and the edge area of the circuit board are separately controlled, and the control The device 500 controls the opening and closing of the first electric valve 232 and the second electric valve 246 to control the number of times of spraying etching solution on the circuit board, and the first electric valve 232 can be reasonably set according to the distribution and complexity of the circuit diagram on the circuit board. 1. The number of opening and closing times of the second electric valve 246 makes the etching of the circuit board more uniform and the width of the circuit board is more uniform.

In order to automatically control the stage 320 to receive the circuit board, further, a fully automatic etching device includes an inlet 101, an outlet 102, a proximity switch 103, and a controller 500, and the inlet 101 and the outlet 102 are respectively arranged at two ends of the etching box 100. On the side wall, the inlet 101 is located above the stage 320 , the outlet 102 is located at the same height as the stage 320 , the proximity switch 103 is arranged above the inlet 101 , and the proximity switch 103 is electrically connected to the controller 500 . The inlet 101 and the outlet 102 are provided to facilitate the circuit board entering and leaving the etching box 100 . When the proximity switch 103 senses a signal, it notifies the controller 500 to control the servo motor 321, thereby driving the stage 320 to move toward the entrance 101 of the etching box 100, so that the stage 320 Receiving the circuit boards from the conveyor belt realizes the automatic receiving of the circuit boards by the loading platform 320 .

In order to facilitate the stage 320 to receive the circuit board smoothly, further, a fully automatic etching device includes a first roller 104, a second roller 105, a third roller 106, a fourth roller 107, and a controller 500, The second roller 105 is arranged at the same height as the first roller 104, the third roller 106 is arranged obliquely below the second roller 105, and is located on the side of the second roller 105 farther away from the inlet 101, the third roller 106 The four rollers 107 are arranged at the same height as the third roller 106, the lower surface of the third roller 106 is higher than the upper surface of the loading table 320, the upper surface of the first roller 104, the upper surface of the second roller 105 The surface and the entrance 101 are located at the same height, and the conveyor belt passes through the upper surface of the first roller 104, the second roller 105, the third roller 106 and the fourth roller 107 in sequence, and the conveyor belt is driven by a transmission motor, and the transmission motor and the controller 500 electrical connection. By providing a conveyor belt and four rollers for driving the conveyor belt to move, it is convenient to transport the circuit board to the loading table 320 smoothly.

In order to prevent the circuit board from deviating from the upper surface of the object stage 320 during transportation, further, a fully automatic etching device includes a guide plate 322, which is relatively arranged on the upper surface of the object stage 320, and the guide plate 322 is set to facilitate The circuit board is guided onto the stage 320 to prevent the circuit board from being tilted during transportation and affecting the etching effect.

In order to facilitate the transportation of the circuit board to the right below the spray chamber 220, further, a fully automatic etching device includes a photoelectric switch 311, which is arranged on the guide rail 310 directly below the edge of the spray chamber near the outlet 102 On, the photoelectric switch detects a signal and sends it to the controller 500, the controller 500 drives the servo motor to stop, so that the circuit board is transported to the right below the spray chamber 220, and the circuit board is transported to the spray area of the spray chamber 220 Inside.

A control method for the above-mentioned fully automatic etching device provided in Embodiment 1, a control method of a fully automatic etching device is as follows:

S1, the controller 500 controls the servo motor 321 to drive the stage 320 to move to the entrance 101 of the etching box 100, so that the stage 320 receives the circuit board, so that the subsequent stage 320 can transport the circuit board;

S2, the controller 500 controls the servo motor 321 to drive the stage 320 to transport the circuit board to the right below the spray chamber 220, so that the spray chamber can spray etching solution on the circuit board;

S3, the controller 500 controls the first swing cylinder 210 and the spray chamber 220 to spray the etching solution on the circuit board until the set spraying time is reached, and the first spraying process ends, which facilitates subsequent flipping of the circuit board;

S4, the controller 500 controls the air claws to grip the circuit board, the controller 500 controls the second swing cylinder 430 to swing at a predetermined angle, and after swinging for a predetermined number of times, the controller 500 controls the second swing cylinder 430 to place the circuit board on the carrier. On the object table 320, the controller 500 controls the air gripper 450 to loosen the circuit board, and the first turning process ends;

S5, repeating steps S3 and S4, until the desired etching effect is achieved;

S6 , the controller 500 controls the servo motor 321 to drive the stage 320 to transport the circuit board to the exit 102 of the etching box 100 .

In the process of S1, a proximity switch 103 is provided above the entrance 101 of the etching box 100. When the proximity switch 103 senses a signal, it is transmitted to the controller 500, and the controller 500 controls the servo motor 321 to drive the stage 320 to receive the circuit. plate.

In the process of S2, a photoelectric switch 311 is provided on the guide rail 310. The photoelectric switch 311 is located directly below the edge of the spray chamber 220 near the outlet 102. When the controller 500 receives a signal from the photoelectric switch 311, it controls the servo motor. 321 stops, and the loading platform 320 is transported directly below the spray chamber 220.

In the process of S3, the second spray area 240 includes four sub-spray areas, and the four sub-spray areas are all communicated with the second infusion tube 241, the first spray area 230 is communicated with the first infusion tube 231, and the first infusion tube 231, the second infusion tube 241 is communicated with the total infusion tube 243, the heater 244 is arranged on the total infusion tube 243, the temperature sensor 245 is arranged at the downstream position of the heater 244, the heater 244, the temperature sensor 245 and the controller 500 are electrically connect. The controller 500 receives the temperature signal transmitted from the temperature sensor 245, controls the heater 244 to heat the etching solution on the main infusion tube 243, and makes the etching solution reach the set temperature, and the heated etching solution passes through the main infusion tube 243 and flows separately. Through the first infusion tube 231 and the second infusion tube 241 , it reaches the first spray area 230 and the second spray area 240 to spray the circuit board.

The present invention has been described through preferred embodiments, and those skilled in the art know that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the present invention. The present invention is not limited by the specific embodiments disclosed here, and other embodiments falling within the claims of the present application all belong to the protection scope of the present invention.

Claims (8)

1. A fully automatic etching apparatus, characterized in that:

the etching device comprises an etching box (100), wherein a spraying mechanism (200) for spraying etching liquid is arranged at the top of the etching box (100), the spraying mechanism (200) comprises a first swinging cylinder (210), a spraying bin (220) is fixed on an output shaft of the first swinging cylinder (210), the spraying bin (220) comprises a first spraying region (230) and a second spraying region (240), the second spraying region (240) is arranged around the first spraying region (230), and the density of nozzles of the first spraying region (230) is greater than that of nozzles of the second spraying region (240);

two guide rails (310) are arranged below the spraying bin (200), an objective table (320) moving along the guide rails (310) is arranged on the guide rails (310), and the objective table (320) is driven by a servo motor (321);

a manipulator (400) for grabbing and overturning a circuit board is arranged between the two guide rails (310), the manipulator (400) comprises a base (410) and a lifting cylinder (420) arranged on the base (410), an output shaft of the lifting cylinder (420) is connected with a second swinging cylinder (430) through a fixing piece, an output shaft of the second swinging cylinder (430) is connected with a telescopic cylinder (440) through a fixing piece, and an output shaft of the telescopic cylinder (440) is connected with an air claw (450) through a fixing piece;

the first swing cylinder (210), the servo motor (321), the lifting cylinder (420), the second swing cylinder (430), the telescopic cylinder (440) and the air claw (450) are electrically connected with a controller (500);

the second spraying area (240) comprises four sub-spraying areas, and the four sub-spraying areas are communicated with a second infusion tube (241);

the side walls at two ends of the etching box (100) are respectively provided with an inlet (101) and an outlet (102), the inlet (101) is higher than the upper part of the objective table (320), the outlet (102) and the objective table (320) are located at the same height, a proximity switch (103) is arranged above the inlet (101), and the proximity switch (103) is electrically connected with the controller (500).

2. A fully automated etching apparatus according to claim 1, wherein:

the four sub-spray zones are separated by four baffles (242).

3. A fully automated etching apparatus according to claim 1, wherein:

the first spraying area (230) is communicated with a first infusion tube (231), the first infusion tube (231) and the second infusion tube (241) are both communicated with a total infusion tube (243), a heater (244) and a temperature sensor (245) positioned at the downstream of the heater (244) are arranged on the total infusion tube (243), and the heater (244) and the temperature sensor (245) are electrically connected with the controller (500).

4. A fully automated etching apparatus according to claim 3, wherein:

the infusion device is characterized in that a first electric valve (232) is arranged on the first infusion tube (231), a second electric valve (246) is arranged on the second infusion tube (241), and the first electric valve (232) and the second electric valve (246) are electrically connected with the controller (500).

5. A fully automated etching apparatus according to claim 1, wherein:

a first roller (104), a second roller (105) which is at the same height with the first roller (104), a third roller (106) which is positioned obliquely below the second roller (105) and a fourth roller (107) which is at the same height with the third roller (106) are arranged in the etching box (100), the upper surface of the first roller (104), the upper surface of the second roller (105) and the inlet (101) are positioned at the same height,

the third roller (106) is located one side of the second roller (105) which is far away from the inlet (101), the lower surface of the third roller (106) is higher than the upper surface of the objective table (320), a conveyor belt sequentially penetrates through the first roller (104), the second roller (105), the third roller (106) and the fourth roller (107), the conveyor belt is driven by a conveyor motor, and the conveyor motor is electrically connected with the controller (500).

6. The apparatus of claim 1, wherein

The upper surface of the objective table (320) is oppositely provided with a guide plate (322).

7. A fully automated etching apparatus according to claim 1, wherein:

the guide rail (310) is provided with a photoelectric switch (311), and the photoelectric switch (311) is positioned right below the edge position of one side of the spray bin (220) close to the outlet (102).

8. A control method for a fully automatic etching apparatus according to any one of claims 1 to 7, characterized by:

s1, the controller (500) controls a servo motor (321) to drive the objective table (320) to move towards an inlet (101) of the etching box (100), so that the objective table (320) receives a circuit board;

s2, the controller (500) controls the servo motor (321) to drive the objective table (320) to convey the circuit board to the position right below the spraying bin (200);

s3, the controller (500) controls the first swing cylinder (210), the spraying bin (200) sprays etching liquid on the circuit board to reach the set spraying time, and the first spraying process is finished;

s4, the controller (500) controls the air claw (450) to clamp the circuit board, the controller (500) controls the second swing cylinder (430) to swing by a preset angle, and after the second swing cylinder swings for a preset number of times, the controller (500) controls the second swing cylinder (430) to place the circuit board on the object stage

(320) The controller (500) controls the air claw (450) to loosen the circuit board, and the process of turning over for the first time is finished;

s5, repeating the step S3 and the step S4 until the ideal etching effect is achieved;

s6, the controller (500) controls the servo motor (321) to drive the objective table (320) to convey the circuit board to the outlet (102) of the etching box (100).

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