CN107177167B - Heat-dissipating resin composition for LED substrate and preparation method thereof - Google Patents
Heat-dissipating resin composition for LED substrate and preparation method thereof Download PDFInfo
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- CN107177167B CN107177167B CN201710481319.4A CN201710481319A CN107177167B CN 107177167 B CN107177167 B CN 107177167B CN 201710481319 A CN201710481319 A CN 201710481319A CN 107177167 B CN107177167 B CN 107177167B
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- 239000011342 resin composition Substances 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title description 12
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 125000000217 alkyl group Chemical group 0.000 claims description 14
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical group C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 3
- 229940126062 Compound A Drugs 0.000 claims description 2
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 150000002894 organic compounds Chemical class 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 238000007711 solidification Methods 0.000 abstract description 3
- 230000008023 solidification Effects 0.000 abstract description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 description 10
- 150000002118 epoxides Chemical class 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000012621 metal-organic framework Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000013132 MOF-5 Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 5
- 239000013118 MOF-74-type framework Substances 0.000 description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 5
- 239000012153 distilled water Substances 0.000 description 5
- 238000000605 extraction Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 5
- 229910052700 potassium Inorganic materials 0.000 description 5
- 239000011591 potassium Substances 0.000 description 5
- 238000005292 vacuum distillation Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- -1 glycol compound Chemical class 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000013114 Co-MOF-74 Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- FEXBEKLLSUWSIM-UHFFFAOYSA-N 2-Butyl-4-methylphenol Chemical class CCCCC1=CC(C)=CC=C1O FEXBEKLLSUWSIM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- 229920001661 Chitosan Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000002050 diffraction method Methods 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000004446 light reflex Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- AJAZMOFONMJGNP-WMZOPIPTSA-N n-[(2s)-4-methyl-1-oxo-1-[[(2s)-3-oxo-4-(pyridin-2-ylsulfonylamino)butan-2-yl]amino]pentan-2-yl]-1-benzofuran-2-carboxamide Chemical compound O=C([C@H](C)NC(=O)[C@@H](NC(=O)C=1OC2=CC=CC=C2C=1)CC(C)C)CNS(=O)(=O)C1=CC=CC=N1 AJAZMOFONMJGNP-WMZOPIPTSA-N 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5033—Amines aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of heat-dissipating resin composition for LED substrate, including epoxy resin A, metallo-organic compound MOF and curing agent.In the present invention, MOF materials are introduced into the resin for making to be used in the present invention after solidification process, are formed further with the higher order structure of sequence.According to the present invention, it is possible to provide have the heat-dissipating resin composition for being capable of providing the radiator structure with excellent heat dissipation performance.
Description
Technical field
The present invention relates to heat-dissipating resin composition, and in particular, to a kind of heat-conductive characteristic it is excellent be used for LED substrate
Heat-dissipating resin composition and preparation method thereof.
Background technology
Light emitting diode (LightEmittingDiode, abbreviation LED) is born so far, has been realized in true color and highlights
Degreeization, and the white light LEDs produced on the basis of blue/purple LED.LED element due to the small-sized, long-life, save electrically aspect
It is excellent, and it is used as the light sources such as display lamp, oneself is through in automotive lighting, decorative lighting, mobile phone flashlight, big-and-middle size display screen light
Source module is used widely.
It is in surface actual load type LED component, the i.e. metal such as aluminium by the way of mostly when for such light source
The LED element of more than 2 is configured on the basal substrate (the real equipment used substrates of LED) of manufacture and is set around each LED element makes light
Reflex to the reflector of prescribed direction.For existing LED light effect is horizontal, the 70%~80% of inputing power is transformed into
Can not be by the heat of radiation release, and LED chip is small-sized, if heat dissipation is bad, can raise chip temperature, draw
Play uneven thermal stress distribution, the reduction of chip light emitting efficiency, the decline of fluorescent powder lasing efficiency.Technical comparing is ripe currently on the market
For power type LED chip size all between 1mm × 1mm-2.5mm × 2.5mm, size seldom causes its power density very big, heat
Capacity very little, caused temperature rise are obvious.
Existing certain researcher pays close attention to the research and development of LED Heat dissipation compositions in the prior art.Such as：
CN201210308430 discloses a kind of preparation method of the heat radiation coating for LED light, prepares by weight percentage
Following components, 30~60% water-base resin, 20% Versamid, 10~20% carbon nanotubes, 1~5% silicon
The aluminium powder of alkane coupling agent KH 550,5~40%, 10% rare earth oxide, 13% silicon nitride, the third of 15~20%
Ketone, 1~2% curing agent, 2~5% dust-proofing agent and smooth agent mixture and 3~5% phenol.
CN201280023426.8 discloses a kind of curability Heat dissipation composition, it contains：(A) it is esterified (a) polyisocyanic acid
Poly- ammonia with carboxyl obtained by the dihydroxy compounds reaction of compound, (b) polycarbonate glycol compound, (c) with carboxyl
Ester resin；(B) epoxy resin；(C) inorganic filler (wherein, not including barium sulfate and titanium oxide), inorganic filler (C's) contains
Rate is 50~96 mass %.As inorganic filler (C), preferably and with the boron nitride of flat and aluminium oxide, the nitridation of particle shape
Aluminium or boron nitride.
CN201410050688.4 discloses a kind of long oil alkyd LED heat radiation coatings, by the raw material of following parts by weight
It is made：Ludox 20-25, long oil alkyd 50-60, talcum powder 12-15, cobalt naphthenate 5-6, dimethylbenzene 10-15,2,6-
Three-level butyl -4- methylphenols 0.6-1, titanate coupling agent NDZ-101 0.5-0.9, nano-chitosan 6-8, nano-sized carbon 2-5,
α-Al2O3 micro mists 6-9, ethyl acetate 18-22, coalescents 3-4.
CN201480036182.6 discloses a kind of resin combination, it includes：Epoxy monomer；Phenolic resin, it is wrapped
Containing the compound with the construction unit represented by logical formula (I)；And filler；The filler is surveyed using laser diffractometry
In fixed particle diameter distribution, at least with 4 wave crests, and the wave crest be present in 0.01 μm less than 1 μm, more than 1 μm and
In each scope less than 10 μm, more than 10 μm and less than 50 μm and more than 20 μm and less than 100 μm, wherein, be present in 10 μm with
Wave crest in upper and less than 50 μm of scope contains aluminium oxide particles, is present in more than 20 μm and less than 100 μm of scope
Wave crest contains boron nitride particles, leads in formula (I), R1Represent alkyl, aryl or aralkyl；R2And R3Separately represent that hydrogen is former
Son, alkyl, aryl or aralkyl；M represents 0~2 number, and n represents 1~7 number；When m is 2,2 R1 can be identical, can also
It is different.
However, the existing research preparation process on Heat dissipation composition is complicated, radiating efficiency is not high.
The operating temperature of LED chip is more low better.However, in practical applications in order to obtain the LED of high brightness, on the one hand
The input power of chip can be improved, on the other hand can increase packaging density, but both approaches will cause LED chip work
It is obviously improved as temperature, the heat management of LED has become the severe challenge of its development, and there is an urgent need to excellent cooling measure to solve
The heat dissipation problem of LED.
The content of the invention
The present invention is in view of the foregoing, there is provided a kind of heat-dissipating resin composition for LED substrate and preparation method thereof,
The obtained heat-dissipating resin composition thermal conductivity factor for LED substrate is high, can preferably solve LED heat dissipation problems.
The inventors of the present invention by studying, analyse in depth repeatedly it turns out that, pass through the epoxy resin of specific structure and gold
Belong to combination of organic compounds, show excellent heat-conductive characteristic, this should have benefited from the orientation of the epoxy resin of specific structure
Property it is high, and when metallo-organic compound cures it form facilitation caused by well-regulated orderly, higher order structure,
Thus the present invention is completed
That is, the present invention provides following heat-dissipating resin composition for LED substrate and preparation method thereof.
Present invention firstly provides a kind of heat-dissipating resin composition for LED substrate, including the ring with formula (I) structure
Oxygen Resin A, metallo-organic compound MOF and curing agent,
Wherein, R, R being connected with N ' each stands alone as the alkyl of C1-C8, and following structures in compound A come from asphalt mixtures modified by epoxy resin
Fat CYD-128
It is further preferred that metallo-organic compound MOF is MOF-74, MOF-5, such as Mn-MOF-74, Co-MOF-74,
Zn-MOF-5、Ni-MOF-5。
It is further preferred that the containing ratio of metallo-organic compound MOF is 20-50 mass %, preferably 25-40 mass, more
It is preferred that 30 mass %.
It is further preferred that the containing ratio of the epoxy resin is 45 to 70wt%.
It is further preferred that the curing agent is 4,4- diaminodiphenylmethane (methylene dianiline), containing ratio for 5 to
10wt%.
It is further preferred that R, R for being connected with N ' straight chained alkyl of C1-C8 is each stood alone as, such as the straight chain of C2, C4, C6
Alkyl.
It is further preferred that n is 3,5,10,15.
The present invention further provides a kind of preparation method of the heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.1-1.2, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by vacuum distillation
Product is washed with distilled water, and is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, and R, R being connected with N ' each stands alone as the alkane of C1-C8
Base, reacts 2-3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 10-15min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), epoxy resin A is scattered in water or organic solvent, adds MOF, curing agent, mixes 10-20min, system
It is standby to obtain the heat-dissipating resin composition for LED substrate.
It is further preferred that metallo-organic compound MOF is MOF-74, MOF-5, such as Mn-MOF-74, Co-MOF-74,
Zn-MOF-5、Ni-MOF-5。
It is further preferred that the containing ratio of metallo-organic compound MOF is 20-50 mass %, preferably 25-40 mass, more
It is preferred that 30 mass %.
It is further preferred that the containing ratio of the epoxy resin is 45 to 70wt%.
It is further preferred that the curing agent is 4,4- diaminodiphenylmethane (methylene dianiline), containing ratio for 5 to
10wt%.
It is further preferred that R, R for being connected with N ' straight chained alkyl of C1-C8 is each stood alone as, such as the straight chain of C2, C4, C6
Alkyl.
Composition according to the present invention can further add various conventional additives, for example, selected from dispersant, leveling agent,
At least one of dispersion stabilizer, pH adjusting agent, antiprecipitant, surfactant, wetting agent and thickener additive.
Use for the heat-dissipating resin composition of the present invention, is coated on pending surface, and 120-140 DEG C solid
Change 10-30min, obtain required thickness such as 10-50 μm.
The heat-dissipating resin composition of the present invention, the resin of contained specific structure is that a kind of high molecular is orderly, deep
The polymer network of molecule cross-link is spent, monomer there is corresponding mesomorphic structure, have liquid crystal liquid crystal property, while saved after curing
Its liquid crystal liquid crystal property.In the present invention, MOF materials are introduced into the resin for making to be used in the present invention after solidification process, further shape
Into orderly higher order structure.The presence of this structure, dramatically improves the free path of phonon so that it has relatively high
Thermal conductivity.
Beneficial effect
According to the present invention, it is possible to provide have the thermal diffusivity resin group for being capable of providing the radiator structure with excellent heat dissipation performance
Compound.By using the heat-dissipating resin composition, the heat for making to produce from the light emitting diode is in LED head lamp week
Effect eradiation is with, without setting the machinery radiating structure of such as fan, so as to suppress the increase of temperature, and because
This, the LED head lamp can have the improved service life.
Embodiment
The present invention is described below in more detail to contribute to the understanding of the present invention.
It should be appreciated that the term or word that use in the specification and in the claims are not construed as having
The implication limited in dictionary, and be interpreted as on the basis of following principle having and its implication one in the context of the present invention
The implication of cause：The concept of term can be limited suitably by inventor for the best illustration to the present invention.
Embodiment 1
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.2, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C2 alkyl, C4 straight chains
Alkyl, reacts 2min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 10min, be cooled to room temperature, first
It is dried in vacuo after benzene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 60 mass % is dispersed in water, and adds Mn-MOF-74,10 matter of 30 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Embodiment 2
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.2, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C3 straight chained alkyls, C6
Straight chained alkyl, reacts 3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 13min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 70 mass % is dispersed in water, and adds Co-MOF-74,10 matter of 20 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Embodiment 3
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.1, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C4 straight chained alkyls, C6
Straight chained alkyl, reacts 3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 15min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 60 mass % is dispersed in water, and adds Zn-MOF-5,10 matter of 30 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Embodiment 4
A kind of preparation method of heat-dissipating resin composition for LED substrate, including：
Step 1) prepares epoxy resin A,
Step 1.1) prepares the epoxide B of formula (II) structure,
4- xenols are dissolved in excessive epoxychloropropane, add potassium hydroxide, 4- xenols and hydroxide
The molar ratio of potassium is 1.1, when 100 DEG C of reactions 4 are small, unreacted epoxychloropropane is evaporated under reduced pressure, by the product of vacuum distillation
It is washed with distilled water, is dried to obtain epoxide A；
Step 1.2), epoxide B, R-N (H)-R ' is mixed, R, R being connected with N ' is respectively C8 straight chained alkyls, C6
Straight chained alkyl, reacts 3min at 110 DEG C, adds epoxy resin CYD-128, be uniformly mixed, react 15min, be cooled to room
Temperature, is dried in vacuo after toluene extraction, obtains epoxy resin A；
Step 2), the epoxy resin A of 60 mass % is dispersed in water, and adds Ni-MOF-5,10 matter of 30 mass %
The curing agent 4 of % is measured, 4- diaminodiphenylmethane, mixes 10min, the thermal diffusivity resin combination for LED substrate is prepared
Thing.
Comparative example 1
Mn-MOF-74 is not added with being different only in that for embodiment 1.
Embodiment 5
The heat-dissipating resin composition of embodiment 1-4, comparative example 1 are applied on LED housings, 130 DEG C of curing 20min, obtain
To 40 μm of products of thickness, accelerated aging test is carried out under the conditions of 80 DEG C and 300W ultraviolet light irradiations, test result is as follows
Table 1：
1 degradation result of table
| Ageing-resistant time h | Thermal conductivity factor W/ (m DEG C) | |
| Embodiment 1 | 6000 | 320 |
| Embodiment 2 | 5980 | 305 |
| Embodiment 3 | 6210 | 300 |
| Embodiment 4 | 6080 | 290 |
| Comparative example 1 | 4000 | 220 |
As it can be seen that in the present invention, MOF materials are introduced into the resin for making to be used in the present invention after solidification process, into one
Step forms orderly higher order structure.The presence of this structure, dramatically improves the free path of phonon so that it is with phase
To high thermal conductivity.
The preferred embodiment for the present invention is the foregoing described, so it is not limited to the present invention.Those skilled in the art couple
Embodiment disclosed herein can carry out improvement and the change without departing from scope and spirit.
Claims (1)
1. a kind of heat-dissipating resin composition for LED substrate, including epoxy resin A, the metal with formula (I) structure are organic
Compound MOF and curing agent,
Wherein, R, R being connected with N ' each stands alone as the alkyl of C1-C8, and following structures in compound A come from epoxy resin
CYD-128
The containing ratio of the epoxy resin is 45 to 60wt%；
The curing agent is 4,4- diaminodiphenylmethane (methylene dianiline), and containing ratio is 5 to 10wt%；
N is 3,5,10,15；
The containing ratio of the metallo-organic compound MOF is 20-30wt%.
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| KR102867474B1 (en) * | 2024-01-29 | 2025-10-14 | (주)씨앤비텍 | Epoxy resin adhesive including metal_organic frameworks and the method therof |
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