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CN107162426A - A kind of glass capsulation material, sealing material paste and preparation method thereof - Google Patents

A kind of glass capsulation material, sealing material paste and preparation method thereof Download PDF

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Publication number
CN107162426A
CN107162426A CN201710474589.2A CN201710474589A CN107162426A CN 107162426 A CN107162426 A CN 107162426A CN 201710474589 A CN201710474589 A CN 201710474589A CN 107162426 A CN107162426 A CN 107162426A
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CN
China
Prior art keywords
glass capsulation
capsulation material
parts
paste
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710474589.2A
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Chinese (zh)
Inventor
徐成功
张瑜
叶燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Karuizhi Optoelectronics Technology Co Ltd
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Suzhou Karuizhi Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Suzhou Karuizhi Optoelectronics Technology Co Ltd filed Critical Suzhou Karuizhi Optoelectronics Technology Co Ltd
Priority to CN201710474589.2A priority Critical patent/CN107162426A/en
Publication of CN107162426A publication Critical patent/CN107162426A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

The invention discloses a kind of glass capsulation material, sealing material paste and preparation method thereof.Wherein, glass capsulation material, includes the raw material of following mass fraction:Bi2O35 10 parts, SiO28 15 parts, TiO236 parts, 46 parts of silane coupler, 12 parts of CaO, 68 parts of bentonite, Fe2O358 parts, 9 15 parts of ZnO, MnO246 parts.Using the raw material of specific proportioning, using the interaction between each raw material, collaboration comes into force, and makes the glass capsulation material not easy to foaming, airtight effect when for sealing good.

Description

A kind of glass capsulation material, sealing material paste and preparation method thereof
Technical field
The invention belongs to packaging of photoelectric device technical field, and in particular to a kind of glass capsulation material, sealing material paste and its Preparation method.
Background technology
Display of organic electroluminescence OLED (Organic Light-Emitting Diode) is put down as a kind of new Plate shows, because it has actively luminous, high brightness, high-resolution, wide viewing angle, fast-response speed, low energy consumption and can be flexible The features such as change, it is expected to be widely applied in Medical Devices and optoelectronic display device.
There is the organic layer material for steam and oxygen extremely sensitivity in current OLED, this causes OLED to show The life-span of device substantially reduces.In order to solve this problem, various materials are mainly used in the prior art by the organic of OLED Layer material is isolated from the outside, and improves its sealing property.Wherein conventional encapsulating method is:In nitrogen atmosphere, shown in OLED The sealing area filling glass material of the upper and lower base plate of panel, then utilizes laser beam movement heated frit fusing.After fusing Frit forms closed encapsulation connection between upper and lower base plate.
Frits all at present mostly uses inorganic oxide and filler, when using process, is scattered in organic In solvent, then on silk screen brush to the upper and lower base plate of OLED display panel.Because of point of inorganic oxide and filler in organic solvent Dissipate property poor, it is easy to foaming in uneven components, fusion process in frit when causing to seal, influence sealing effectiveness.
The content of the invention
Therefore, to be solved by this invention is existing glass capsulation material poor defect of easy to foaming, airtight effect in sealing, It is the good glass capsulation material of stability, close and then it is low to provide a kind of good not easy to foaming, airtight effect, softening point and thermal coefficient of expansion Envelope material paste and preparation method thereof.
In order to solve the above technical problems, the technical solution adopted by the present invention is as follows:
Glass capsulation material provided by the present invention, includes the raw material of following mass fraction:
Further, the raw material of following mass fraction is included:
Further, 7-8 parts of beta-eucryptite and/or β-spodumene is included.
Further, 2-3 parts of vanadic anhydride is included.
Further, 1-2 parts of diboron trioxide is included.
In addition, the present invention also provides a kind of glass capsulation material paste, include the raw material of following mass fraction:
55-78 parts of glass capsulation material any one of claim 1-5
6-8 parts of polymeric adhesive
20-25 parts of organic solvent.
Further, the high polymer binder is carboxymethyl cellulose and/or acrylic resin.
Further, the organic solvent be terpineol, dibutyl phthalate or triglyme at least It is a kind of.
In addition, present invention also offers the preparation method of above-mentioned glass capsulation material paste, comprising the following steps:
1) the glass capsulation material and polymeric adhesive are ground for the first time, obtains abrasive;
2) abrasive is scattered in the organic solvent, and regrind, obtain the glass capsulation material Paste.
Further, the particle diameter of the abrasive is less than 2 μm.
Compared with prior art, the present invention has the advantages that:
The glass capsulation material that the embodiment of the present invention is provided, using the raw material of specific proportioning, using mutual between each raw material Effect, collaboration comes into force, and makes the glass capsulation material not easy to foaming, airtight effect when for sealing good.It is even especially with silane Join agent and bentonite, first improve the dispersion effect of other raw materials in organic solvent, improve the uniform of each feed distribution Property, enhance sealing effectiveness;Second bubble can be prevented to produce when melting sealing, while can also fill bubble, improves sealing Effect.After tested, the sealing effectiveness of the glass capsulation material can reach that vapour quantity is not more than 10-7g/m2/ day, amount of oxygen is not more than 10-4cm3/m2/ day.
Embodiment
In order to which the object, technical solutions and advantages of the present invention are better described, below in conjunction with specific embodiment to this hair It is bright to be described further.The present invention can be embodied in many different forms, and should not be construed as limited to set forth herein Embodiment.Opposite there is provided these embodiments so that the disclosure will be thorough and complete, and the design of the present invention will be filled Divide and convey to those skilled in the art, the present invention will only be defined by the appended claims.
Embodiment 1
A kind of glass capsulation material paste is present embodiments provided, by 8g Bi2O3, 11g SiO2, 5g TiO2, 5g KH550,1.5g CaO, 7g bentonite, 7g Fe2O3, 12g ZnO, 5g MnO2, 7g carboxymethyl cellulose and 22g Terpineol is constituted;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-carboxymethyl cellulose, obtain particle diameter less than 2 μm abrasive;
2) abrasive is scattered in organic solvent-terpineol, and regrind, obtain the glass capsulation Expect paste.
Embodiment 2
A kind of glass capsulation material paste is present embodiments provided, by 5g Bi2O3, 15g SiO2, 3g TiO2, 6g KH550,1g CaO, 8g bentonite, 5g Fe2O3, 15g ZnO, 4g MnO2, 8g acrylic resin and 20g it is three sweet Diethylene glycol dimethyl ether is constituted;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-acrylic resin, obtain particle diameter less than 2 μm Abrasive;
2) abrasive is scattered in organic solvent-triglyme, and regrind, obtain the glass Glass sealing material paste.
Embodiment 3
A kind of glass capsulation material paste is present embodiments provided, by 10g Bi2O3, 8g SiO2, 6g TiO2, 4g KH550,2g CaO, 6g bentonite, 8g Fe2O3, 9g ZnO, 6g MnO2, 6g acrylic resin and 25g it is three sweet Diethylene glycol dimethyl ether is constituted;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-acrylic resin, obtain particle diameter less than 2 μm Abrasive;
2) abrasive is scattered in organic solvent-triglyme, and regrind, obtain the glass Glass sealing material paste.
Embodiment 4
A kind of glass capsulation material paste is present embodiments provided, by 8g Bi2O3, 11g SiO2, 5g TiO2, 5g KH550,1.5g CaO, 7g bentonite, 7g Fe2O3, 12g ZnO, 5g MnO2, 7.5g beta-eucryptite, the five of 2.5g V 2 O, 1.5g diboron trioxide, 7g carboxymethyl cellulose and 22g terpineol composition;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-carboxymethyl cellulose, obtain particle diameter less than 2 μm abrasive;
2) abrasive is scattered in organic solvent-terpineol, and regrind, obtain the glass capsulation Expect paste.
Embodiment 5
A kind of glass capsulation material paste is present embodiments provided, by 8g Bi2O3, 11g SiO2, 5g TiO2, 5g KH550,1.5g CaO, 7g bentonite, 7g Fe2O3, 12g ZnO, 5g MnO2, 8g β-spodumene, 2g five oxidations Two vanadium, 2g diboron trioxide, 7g carboxymethyl cellulose and 25g dibutyl phthalate composition;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-carboxymethyl cellulose, obtain particle diameter less than 2 μm abrasive;
2) abrasive is scattered in organic solvent-terpineol, and regrind, obtain the glass capsulation Expect paste.
Comparative example 1
This comparative example provides a kind of glass capsulation material paste, by 8g Bi2O3, 11g SiO2, 5g TiO2, 1.5g CaO, 7g bentonite, 7g Fe2O3, 12g ZnO, 5g MnO2, 7g carboxymethyl cellulose and 22g terpineol composition;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-carboxymethyl cellulose, obtain particle diameter less than 2 μm abrasive;
2) abrasive is scattered in organic solvent-terpineol, and regrind, obtain the glass capsulation Expect paste.
Comparative example 2
This comparative example provides a kind of glass capsulation material paste, by 8g Bi2O3, 11g SiO2, 5g TiO2, 5g KH550,1.5g CaO, 7g Fe2O3, 12g ZnO, 5g MnO2, 7g carboxymethyl cellulose and 22g terpineol composition;
The preparation method of above-mentioned glass capsulation material paste, comprises the following steps:
1) ground for the first time by glass capsulation material and with polymeric adhesive-carboxymethyl cellulose, obtain particle diameter less than 2 μm abrasive;
2) abrasive is scattered in organic solvent-terpineol, and regrind, obtain the glass capsulation Expect paste.
Test example 1
Glass capsulation material paste made from the various embodiments described above and comparative example is used for sealed OLED display, OLED shows Show what device was made up of upper substrate, infrabasal plate, position to be sealed and OLED sedimentaries.Specific sealing step is as follows:With silk screen by glass Brush at glass sealing material paste brush to the corresponding position to be sealed of upper substrate.Pre-sintered processing is carried out below softening point temperature.It is first Frit first is heated into 130 DEG C of insulations makes the moisture evaporation in glass capsulation material paste for 5 minutes, is then heated to macromolecule and glues Agent burning point insulation 10 minutes is connect, polymeric adhesive is removed completely.The finally heated softening point to glass capsulation material paste with Upper insulation 10 minutes, pre-sintered good glass capsulation material paste is placed on laser package workbench and is sintered.What is used swashs Light device is semiconductor laser, and the wavelength for sending 6.5 watts is 810 nanometers of continuous laser, with the rate melt glass of 5 mm/seconds Glass sealing material paste, two substrates are merged, air locking is made.
The air-tightness of above-mentioned air locking is detected using Varian947 helium leak checks instrument, detection 100 is above-mentioned close every time Device is sealed, corresponding testing result is as shown in table 1 below and 2:
The air-tightness number up to standard of the air locking of table 1
Number
Embodiment 1 100
Embodiment 2 100
Embodiment 3 100
Embodiment 4 100
Embodiment 5 100
Comparative example 1 50
Comparative example 2 38
The air-tightness of the air locking of table 2
Vapour quantity g/m2/ day Amount of oxygen cm3/m2/ day
Embodiment 1 10-7 10-4
Embodiment 2 10-7 10-4
Embodiment 3 10-7 10-4
Embodiment 4 10-7 10-4
Embodiment 5 10-7 10-4
Comparative example 1 10-5 10-2
Comparative example 2 10-4 10-1
It was found from table 1 and 2:Using the raw material of specific proportioning, using the interaction between each raw material, collaboration comes into force, and makes this Glass capsulation material not easy to foaming, airtight effect when for sealing is good.

Claims (10)

1. a kind of glass capsulation material, includes the raw material of following mass fraction:
2. glass capsulation material according to claim 1, it is characterised in that:Include the raw material of following mass fraction:
3. glass capsulation material according to claim 1 or 2, it is characterised in that:Also include 7-8 parts beta-eucryptite and/or β-spodumene.
4. the glass capsulation material according to any one of claim 1-3, it is characterised in that:Also include 2-3 parts of five oxidations Two vanadium.
5. the glass capsulation material according to any one of claim 1-4, it is characterised in that:Also include 1-2 parts of three oxidations Two boron.
6. a kind of glass capsulation material paste, it is characterised in that include the raw material of following mass fraction:
55-78 parts of glass capsulation material any one of claim 1-5
6-8 parts of polymeric adhesive
20-25 parts of organic solvent.
7. glass capsulation material paste according to claim 6, it is characterised in that the high polymer binder is that carboxymethyl is fine Dimension element and/or acrylic resin.
8. the glass capsulation material paste according to claim 6 or 7, it is characterised in that the organic solvent is terpineol, neighbour At least one of dibatyl phithalate or triglyme.
9. the preparation method of the glass capsulation material paste any one of claim 6-8, comprises the following steps:
1) the glass capsulation material and polymeric adhesive are ground for the first time, obtains abrasive;
2) abrasive is scattered in the organic solvent, and regrind, obtain the glass capsulation material paste.
10. preparation method according to claim 9, it is characterised in that the particle diameter of the abrasive is less than 2 μm.
CN201710474589.2A 2017-06-21 2017-06-21 A kind of glass capsulation material, sealing material paste and preparation method thereof Pending CN107162426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710474589.2A CN107162426A (en) 2017-06-21 2017-06-21 A kind of glass capsulation material, sealing material paste and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710474589.2A CN107162426A (en) 2017-06-21 2017-06-21 A kind of glass capsulation material, sealing material paste and preparation method thereof

Publications (1)

Publication Number Publication Date
CN107162426A true CN107162426A (en) 2017-09-15

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Country Status (1)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103178214A (en) * 2011-12-22 2013-06-26 上海大学 Method and device for encapsulating photoelectric device
CN103906718A (en) * 2011-11-02 2014-07-02 费罗公司 Microwave sealing of inorganic substrates using low melting glass systems
CN103922596A (en) * 2013-12-31 2014-07-16 上海天马有机发光显示技术有限公司 Frit composition, frit paste composition, electrical element sealing method and electrical element
CN104628252A (en) * 2013-11-08 2015-05-20 谢再锋 Rare earth doped lead-free frit and electrical component sealing method utilizing the same
CN105906199A (en) * 2015-02-19 2016-08-31 中央硝子株式会社 Bi2O3-TeO2-SiO2-WO3 series glass

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103906718A (en) * 2011-11-02 2014-07-02 费罗公司 Microwave sealing of inorganic substrates using low melting glass systems
CN103178214A (en) * 2011-12-22 2013-06-26 上海大学 Method and device for encapsulating photoelectric device
CN104628252A (en) * 2013-11-08 2015-05-20 谢再锋 Rare earth doped lead-free frit and electrical component sealing method utilizing the same
CN103922596A (en) * 2013-12-31 2014-07-16 上海天马有机发光显示技术有限公司 Frit composition, frit paste composition, electrical element sealing method and electrical element
CN105906199A (en) * 2015-02-19 2016-08-31 中央硝子株式会社 Bi2O3-TeO2-SiO2-WO3 series glass

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Application publication date: 20170915