CN107167950A - Display base plate and preparation method thereof, display device - Google Patents

Abstract

The invention discloses a kind of display base plate and preparation method thereof, display device, belong to display field.The display base plate includes viewing area and frame glue setting area, the frame glue setting area is located at outside the viewing area, the edge of the side of the frame glue setting area away from the viewing area is provided with current limliting group battle array, the current limliting group battle array includes at least two and holds glue groove, and described at least two hold glue groove arranges along the direction away from the viewing area.In the multiple appearance glue grooves arranged from inside to outside by making the frame glue of outside slime flux flow into successively; current limliting group battle array in the present invention can limit or stop the slime flux of frame glue laterally; the structure of more lateral is protected not covered by frame glue; therefore; the present invention can reduce the influence that the slime flux of frame glue is caused to subsequent technique, contribute to the lifting of yield.

Description

Display substrate, manufacturing method thereof, and display device

technical field

The invention relates to the display field, in particular to a display substrate, a manufacturing method thereof, and a display device.

Background technique

Thin Film Transistor-Liquid Crystal Display (TFT-LCD) has become a mainstream product in the display field after several decades of development. Generally, in mobile display products, borders are defined from the display area to the edge of the display screen. The existence of the border will reduce the visual effect of the entire display screen, especially the larger the border area, the worse the visual effect. Therefore, narrow bezel or even bezel-less visual effects have become the mainstream trend of high-quality displays.

In the display panel formed by dividing the display panel motherboard along the cutting line, the sealant surrounding the display area generally needs to be as far away from the cutting line as possible, so as to reserve enough allowable space for the overflow of the sealant. However, with the gradual narrowing of the TFT-LCD panel frame, the distance between the edge of the frame glue and the cutting line is getting closer and closer, and it is easy to cause various serious problems in the subsequent process due to the overflow of the frame glue, such as overflow The final frame glue covers the alignment mark, making the subsequent alignment process difficult; and if the overflowed frame glue crosses the cutting line or sticks to the adjacent frame glue, which seriously affects the subsequent cutting process, it is easy to Poor breaking, liquid crystal leakage and other defects occur, resulting in the dilemma of high scrap rate.

Contents of the invention

The invention provides an organic electroluminescence device, a manufacturing method thereof, and a light-emitting device, which can reduce the impact of frame glue overflow on subsequent processes.

In a first aspect, the present invention provides a display substrate, the display substrate includes a display area and a frame glue setting area, and the frame glue setting area is located outside the display area,

A current-limiting array is provided at the edge of the frame glue setting area away from the display area, and the current-limiting array includes at least two glue-accommodating grooves, and the at least two glue-accommodating grooves are along the The orientation of the display area is aligned.

In a possible implementation manner, the sealant setting area includes at least one corner area, and a side of each corner area away from the display area is provided with one current limiting array.

In a possible implementation manner, in any of the current limiting arrays provided on one side of the corner area, the edge line of the glue-containing groove closest to the corner area is tangent to the edge line of the corner area or partially overlapped.

In a possible implementation manner, the display substrate includes a surface medium layer for contacting sealant, and the glue-receiving grooves are all disposed in the surface medium layer.

In a possible implementation manner, a cutting line is provided on the display substrate, and the current limiting arrays are all arranged on a side of the cutting line close to the display area.

In a possible implementation manner, the at least two glue-receiving grooves included in the current limiting array are both parallel to the edge of the sealant setting area on a side away from the display area.

In a possible implementation manner, the glue-receiving groove is straight or curved in a direction away from the display area.

In a possible implementation manner, among the at least two glue-holding grooves included in the current-limiting array, the volume of the glue-holding grooves decreases sequentially along the direction that the sealant setting area is away from the display area .

In the second aspect, the present invention also provides a method for manufacturing any one of the above-mentioned display substrates, including:

A surface medium layer for contacting the frame glue is formed, and the glue-receiving grooves are all arranged in the surface medium layer.

In a third aspect, the present invention further provides a display device, the display device comprising any one of the above display substrates.

From the above technical solution, it can be known that the flow-limiting array in the present invention can limit or block the overflow of the frame glue to the outside by making the frame glue overflowing outwards sequentially flow into a plurality of glue-containing grooves arranged from the inside to the outside, and protect more The outer structure is not covered by the sealant, therefore, the present invention can reduce the impact of the overflow of the sealant on the subsequent process, and contribute to the improvement of the yield rate.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a three-dimensional structural schematic diagram of a frame glue part of a display device in an embodiment of the present invention;

FIG. 2 is a schematic top view of a display substrate in an embodiment of the present invention;

Fig. 3 is a three-dimensional structural schematic diagram of a current-limiting array in an embodiment of the present invention;

Fig. 4 is a schematic diagram of the overflow principle of a current-limiting array in an embodiment of the present invention;

Fig. 5 is a schematic top view of a motherboard of a display panel in an embodiment of the present invention;

Fig. 6 is a top view structural diagram of a current limiting array in an embodiment of the present invention;

Fig. 7 is a schematic diagram of a three-dimensional structure of a current-limiting array in an embodiment of the present invention;

Fig. 8 is a schematic top view of a current-limiting array in an embodiment of the present invention;

Fig. 9 is a schematic perspective view of a current limiting array in an embodiment of the present invention.

detailed description

In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

FIG. 1 is a schematic three-dimensional structure diagram of a sealant part of a display device in an embodiment of the present invention. Referring to FIG. 1, the display device includes a display substrate 11 and a sealant 12 disposed on the display substrate 11; in order to make the graphics clear and clear, other parts of the display device and some structural details of the display substrate 11 and the sealant 12 are not shown in FIG. 1 shown in . It should be noted that the above-mentioned display device can be any product or component with a display function such as a display panel, a mobile phone, a tablet computer, a TV, a monitor, a notebook computer, a digital photo frame, or a navigator; the above-mentioned display substrate can be, for example, an array substrate , color film substrate, touch panel and other board structures or intermediate products; the above-mentioned sealant is the structure that mainly plays a sealing role in the display device, and in some implementation methods, it will be formed on the display substrate by curing after coating. Frame glue.

FIG. 2 is a schematic top view structure diagram of a display substrate in an embodiment of the present invention, specifically showing the top view structure of the display substrate 11 shown in FIG. 1 . 1 and 2, the display substrate 11 includes a display area A1 and a sealant setting area A2, wherein the display area A1 can be, for example, an active display area (Acitive Area, AA), and the sealant setting area A2 refers to the display The area on the substrate used to set the sealant, such as the coating area when coating the sealant forming material. Figure 1 shows the shape of the frame glue 12 by taking the actual setting area of the frame glue 12 completely overlapping with the frame glue setting area A2 as an example. It should be understood that the actual setting area and shape of the frame glue 12 may vary depending on the material, process and frame Glue overflow and other reasons do not completely correspond to the frame glue setting area A2. As shown in FIG. 1 and FIG. 2 , the sealant setting area A2 on the display substrate 11 is located outside the display area A1 .

Referring to FIG. 1 and FIG. 2 , the display substrate 11 is further provided with a current-limiting array 21 , and the current-limiting array 21 is arranged at the edge of the frame glue setting area A2 away from the display area A1 . Specifically, the frame glue setting area A2, which is roughly a rectangular frame, includes corner areas located at the four corners of the rectangle, and each corner area is provided with a current limiting array 21 on the side away from the display area A1. .

FIG. 3 is a schematic diagram of a three-dimensional structure of a current-limiting array in an embodiment of the present invention, specifically showing the enlarged three-dimensional structure of the current-limiting array 21 marked by the dotted circle in FIG. 1 . Referring to FIG. 1 to FIG. 3 , the current limiting array 21 includes three glue-receiving grooves arranged along a direction away from the display area A1 . For the convenience of description, according to the order of arrangement along the direction away from the display area A1, the three glue-holding grooves are respectively called the first glue-holding groove G1, the second glue-holding groove G2 and the third glue-holding groove G3 . Referring to Fig. 1 to Fig. 3, the three glue-containing grooves of the current-limiting array 21 are all straight and have the same groove depth, but the cross-sectional area on the horizontal plane decreases successively along the direction away from the display area A1. Small, so the volume also decreases sequentially along the direction away from the display area A1; moreover, the edge line of the first glue-holding groove G1 closest to the corner area is tangent to the edge line of the frame glue setting area A2, the first glue-holding groove G1 The groove G1 , the second glue-holding groove G2 and the third glue-holding groove G3 are arranged in parallel along a direction away from the display area A1 .

FIG. 4 is a schematic diagram of the overflow principle of a current limiting array in an embodiment of the present invention, specifically showing the longitudinal section at the current limiting array 21 when the frame glue 12 overflows in the structure shown in FIG. 1 . As shown in FIG. 4, the display substrate 11 includes a lower substrate 11a and a surface dielectric layer 11b located on the lower substrate 11a (the lower substrate 11a and the surface dielectric layer 11b may each contain one or more than one layer structure), the above-mentioned current limiting group The first glue-holding groove G1 , the second glue-holding groove G2 and the third glue-holding groove G3 included in the array 21 are all disposed in the surface dielectric layer 11 b, and the sealant 12 is disposed on the surface dielectric layer 11 b. As shown in Figure 4, when the frame glue 12 set in the frame glue setting area A2 overflows in a direction away from the display area A1, it will first flow into the first glue-holding groove G1 until the entire first glue-holding groove is filled. Only then will the groove G1 continue to overflow outwards. During this process, the first glue-receiving groove G1 plays a role of containing the overflowing frame glue 12 and limiting its overflowing range within the groove. After the first glue-holding groove G1 is filled, the frame glue 12 that continues to overflow around will flow into the second glue-holding groove G2, and will not continue to overflow around until the entire second glue-holding groove G2 is filled. . During this process, the second glue-receiving groove G2 plays a role of containing the overflowing frame glue 12 and limiting its overflowing range within the groove. After the second glue-holding groove G2 is filled, the frame glue 12 that continues to overflow around will flow into the third glue-holding groove G3, and will not continue to overflow around until the entire third glue-holding groove G3 is filled. . During this process, the third glue-receiving groove G3 serves to accommodate the overflowing frame glue 12 and limit its overflowing range within the groove.

It can be seen that the recessed glue-accommodating space provided by the current-limiting array can limit the overflow range of the frame glue by accommodating the overflowing frame glue, thereby reducing the impact of the overflow of the frame glue on the surrounding area of the current-limiting array, especially the surrounding area of the current-limiting array. Adverse effects of structures on the side away from the frame glue setting area (such as alignment marks, conductor spacers, etc.). It can be understood that, compared with the method of using a retaining wall to limit the overflow of the frame glue, the embodiment of the present invention hardly causes the overflowed frame glue to overflow to other directions after being blocked, but is stably restricted in the glue-holding groove , thus achieving a better effect of limiting frame glue overflow. Of course, the current-limiting array in the embodiment of the present invention can also be arranged in cooperation with the retaining wall, so as to achieve the desired effect of limiting the overflow of the frame glue. Therefore, by making the frame glue overflowing outwards sequentially flow into a plurality of glue-containing grooves arranged from the inside to the outside, the current-limiting array in the embodiment of the present invention can limit or block the overflow of the frame glue to the outside, protecting the more outer parts. The structure is not covered by the frame glue, which can reduce the impact of the overflow of the frame glue on the subsequent process, and contribute to the improvement of the yield rate.

It can be understood that the structures shown in Fig. 1 to Fig. 4 are only examples for making the purpose, technical solutions and advantages of the present invention clearer, and the possible implementation manners of the present invention are not limited thereto. In the following, possible modifications of the above structure will be described with examples.

As an example in which the display substrate is specifically an intermediate product, the display substrate is specifically a display panel mother board that can obtain at least two display panels after cutting. FIG. 5 is a schematic top view of a motherboard of a display panel in an embodiment of the present invention. Referring to FIG. 5 , the display substrate 11 in this example includes display panel areas A0 arranged in a 3×3 array, and each display panel area A0 is provided with its own display area A1 and sealant setting area A2, as well as its own current limiting Formation 21. In each display panel area A0, the frame glue setting area A2 is located outside the display area A1, and the edge of the frame glue setting area A2 away from the display area A1 is provided with a current limiting array 21, and the current limiting array 21 includes at least two There are four glue-holding grooves (only two are taken as an example in FIG. 5 ), and at least two glue-holding grooves are arranged along a direction away from the display area A1. Cutting lines are provided between adjacent display panel areas A0, and the display substrate 11 can be divided into nine display panels by cutting along the cutting lines. In each display panel area A0 , the current-limiting array 21 is arranged on a side of the cutting line close to the display area A1 . Certainly, for the motherboard with plate-like structure other than the display panel, its implementation is also similar, which will not be repeated here. In addition, because frame glue overflow is a problem faced by all kinds of display substrates, and can be restricted by setting current limiting arrays in the above-mentioned way, so for factors such as the size, shape, display type, etc. of the display substrate, this Inventions are not limited.

As an example of the formation method of the above-mentioned current-limiting array, in any one of the above-mentioned manufacturing methods of the display substrate, it may include the step of forming a surface medium layer for contacting the sealant, and the above-mentioned glue-receiving grooves are all arranged on the surface medium layer. layer, as shown in Figure 4. In a possible implementation, this step specifically includes: depositing a layer of dielectric material on the lower substrate 11a (the material can be, for example, silicon oxide, silicon nitride, resin material, etc., and the process used can be, for example, chemical Vapor deposition, physical vapor deposition, etc.); deposit a layer of photoresist on the dielectric material layer; use a mask to expose the area where the adhesive groove is set or the area outside it, so that the area outside the area where the adhesive groove is set The photoresist is cured; the uncured photoresist is removed by development, so that the dielectric material layer in the area where the adhesive-containing groove is set is exposed; the exposed dielectric material layer is etched to form the above-mentioned adhesive-containing groove; Strip the photoresist. Of course, when the method of manufacturing the display substrate originally includes the patterning process of the dielectric material layer, the above-mentioned glue-receiving grooves can be fabricated simultaneously during the patterning process by changing the pattern of the mask plate. In yet another possible implementation manner, the lower substrate may also be etched during the above etching process, so that the glue-receiving groove penetrates the surface dielectric layer and is partially located in the lower substrate. In yet another possible implementation manner, the above-mentioned glue-accommodating grooves are directly formed on the substrate of the display substrate (the surface of the substrate is in direct contact with the sealant). In yet another possible implementation, the process of etching to form the glue-receiving groove can sequentially etch the dielectric material layers at different positions through a half-tone mask (Half Tone Mask, HTM), so that different Adhesive groove for groove depth. It can be understood that when the glue-holding grooves of the current limiting matrix all have the same groove depth, the etching process can be simplified; but in order to obtain the required volume of the glue-holding grooves, the same current limiting matrix can also be made There are different groove depths between the glue grooves. In addition, the groove depth of the glue-holding groove can also be set to change with the position, such as setting the bottom of any one or more of the above-mentioned glue-holding grooves so that the depth of the groove extends from the middle to both sides along the extending direction of the glue-holding groove Tapered shape. Of course, the internal shape of the glue-holding grooves and the relationship between them may not be limited to the above forms.

As examples of optional shapes of the glue-holding grooves in the above-mentioned current-limiting array, FIG. 6 and FIG. 7 are respectively a top view and a three-dimensional structure diagram of the current-limiting array with the glue-holding grooves being arc-shaped. It can be seen that the glue-holding grooves shown in Figure 6 and Figure 7 are all curved arcs away from the display area, and the edge line of the glue-holding groove closest to the corner area is in line with the edge line of the corner area cut. As another example, FIG. 8 and FIG. 9 are respectively a schematic top view and a three-dimensional structural view of a current-limiting array in which the glue-receiving groove is another arc shape. It can be seen that the glue-holding grooves shown in Figures 8 and 9 are all curved arcs away from the display area, and the edge line of the glue-holding groove closest to the corner area near the corner area is in line with the The edge lines of the corner area coincide. After comparison, it can be seen that the shape of the groove shown in Figure 6 and Figure 7 is closer to the curved shape of the corner area than the shape of the groove shown in Figure 1 to Figure 4, so it can be more conducive to the sealing of the sealant. When overflowing, the original curved shape is maintained, and the layout space outside the current-limiting array can be saved. Compared with the groove shape shown in Figure 6 and Figure 7, the shape of the groove shown in Figure 8 and Figure 9 is closer to the curved shape of the corner area, so it is more conducive to maintaining the original bending when the sealant overflows shape, and can further save the layout space outside the current-limiting array. Certainly, the optional shape of the glue-accommodating groove in the above-mentioned current-limiting array may not be limited thereto.

In the examples of the optional shapes of the above three kinds of glue-receiving grooves, each current-limiting array includes three parallel-arranged glue-receiving grooves as an example, but in other possible implementations, it is shown that each Each current limiting array can contain any required number of glue-containing grooves, and can be different from each other, so as to adapt to different application requirements, which is not limited in the present invention.

In the above three optional shape examples of the glue-holding grooves, the volume of the glue-holding grooves of each current-limiting array decreases sequentially along the direction in which the frame glue setting area is away from the display area. Under the same effect, the layout space occupied by the current-limiting array is smaller, which is conducive to the narrowing of the frame. Of course, the volume relationship between the glue-holding grooves can also be set according to actual application requirements, for example, the volumes are all the same or decrease first and then increase along the direction of the display area, so as to achieve the desired effect of limiting the overflow of the frame glue.

In the above three optional shape examples of the glue-receiving grooves, the glue-receiving grooves included in the current limiting array shown in FIG. 8 and FIG. 9 are all parallel to the edge of the frame glue setting area on the side away from the display area. Compared with the non-parallel implementation, this arrangement is more conducive to maintaining the original curved shape when the frame glue overflows, and can save the layout space outside the current-limiting array. In one example, the positions of the centers of the arcs of the adhesive grooves in the current limiting arrays shown in FIGS. 6 and 7 can be further away from or closer to the center of the display area in order to form circles that are not parallel to each other. arc to achieve the desired effect of limiting frame glue overflow.

In the above three optional shape examples of the glue-holding groove, there is a gap between the edge line of the glue-holding groove closest to the corner area and the edge line of the corner area in the current limiting array shown in Figure 8 and Figure 9 Partial overlap of overlapping sections, and the edge line and corner of the glue-containing groove closest to the corner area in the current-limiting array shown in Figures 1 to 4 and the current-limiting array shown in Figure 6 and Figure 7 There is a tangent relationship between the edge lines of the zone. After comparison, it can be seen that the overflow of the frame glue in the tangent setting mode starts from the tangent point and gradually spreads to both sides, while the overflow of the frame glue in the partially overlapping setting mode flows into the container at the edge line like a waterfall. Glue groove, obviously the former is more conducive to controlling the shape of the overflow of the frame glue than the latter. Of course, it is also possible to set an interval between the edge line of the glue-receiving groove closest to the corner area in the current-limiting array and the edge line of the corner area, such as placing any of the above-mentioned current-limiting arrays in a horizontal direction away from the display area The predetermined distance is translated so that there is a certain degree of buffer between the frame glue overflowing from the beginning and flowing into the glue-containing groove. Of course, the relationship between the edge line of the glue-receiving groove closest to the sealant setting area in the current limiting array and the edge line of the sealant setting area away from the display area may not be limited to the above forms.

In the above three examples of the optional shape of the glue-receiving groove, the current-limiting arrays are all set on the side of the corner area of the sealant setting area away from the display area, so that the corners where the sealant overflow is least controllable can be controlled The area carries the restriction on sealant overflow. In addition, according to the different requirements for limiting the overflow of the frame glue, current limiting arrays can be arranged at other outer edges of the frame glue setting area. For example, for the case where alignment marks are set outside the frame glue setting area of the display substrate, a current limiting array can be set at the edge of the frame glue setting area closest to the alignment mark, so as to prevent the frame glue from overflowing to the alignment mark to cover the registration mark. For another example, at least two rings of ring-shaped glue-receiving grooves may also be provided along the outer edge of the sealant setting area to limit overflow of the sealant at various positions. In addition, in order to achieve the function of limiting the overflow of the frame glue, the current-limiting array does not need to be strictly located outside the area where the frame glue is set. Direction translation, so that the outer edge of the frame glue setting area falls into the glue groove closest to the frame glue setting area in the current limiting array, and at this time the current limiting array is actually still set in the frame glue setting area away from the display area edge on one side. Of course, the number and location of the current-limiting arrays may not be limited to the above-mentioned several forms.

It should be noted that, within a possible range, the above-mentioned deformation methods in various aspects can also be combined to obtain display substrates and display devices that are suitable for different application requirements related to frame glue overflow, and the present invention does not do this limit.

Based on the same inventive concept, another embodiment of the present invention provides a method for manufacturing any one of the above-mentioned display substrates. in the surface medium layer. The example of this step in the manufacturing method has been described in detail above, and other steps can be adaptively set according to the structure to be manufactured, and will not be repeated here. Because the method of the embodiment of the present invention can manufacture the above-mentioned display substrate, it can reduce the impact of the overflow of the sealant on the subsequent process, and contribute to the improvement of the yield rate.

Based on the same inventive concept, another embodiment of the present invention provides a display device, which includes any one of the above-mentioned display substrates. The specific example of the display device has been described in detail above, and other components that can be included can be set according to actual needs, and will not be repeated here. It should be noted that the above-mentioned display device may be any product or component with a display function such as a display panel, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, and the like. Since the display device according to the embodiment of the present invention includes the above-mentioned display substrate, it can reduce the impact of sealant overflow on the subsequent process, and contribute to the improvement of the yield rate.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention Inside.

Claims (10)

1. A display substrate, the display substrate comprising a display area and a frame glue setting area, the frame glue setting area is located outside the display area, characterized in that, A current-limiting array is provided at the edge of the frame glue setting area away from the display area, and the current-limiting array includes at least two glue-accommodating grooves, and the at least two glue-accommodating grooves are along the The orientation of the display area is aligned. 2. The display substrate according to claim 1, wherein the sealant setting area includes at least one corner area, and one side of each corner area away from the display area is provided with one of the current limiting formation. 3. The display substrate according to claim 2, characterized in that, in the current-limiting array provided on one side of any of the corner areas, the edge line of the glue-receiving groove closest to the corner area is in line with the corner. The edge lines of the zone are tangent or partially coincident. 4 . The display substrate according to claim 1 , wherein the display substrate comprises a surface dielectric layer for contacting sealant, and the glue-receiving grooves are all arranged in the surface dielectric layer. 5 . The display substrate according to claim 1 , wherein a cutting line is provided on the display substrate, and the current limiting arrays are arranged on a side of the cutting line close to the display area. 6. The display substrate according to claim 1, wherein at least two glue-receiving grooves included in the current-limiting array are parallel to the edge of the frame glue setting area on the side away from the display area . 7. The display substrate according to any one of claims 1 to 6, wherein the glue-receiving groove is in the shape of a straight bar or an arc curved away from the display area. 8. The display substrate according to any one of claims 1 to 6, characterized in that, among the at least two glue-holding grooves included in the current limiting array, the volume of the glue-holding grooves is along the frame The direction in which the glue setting area is away from the display area decreases successively. 9. A method for manufacturing a display substrate according to any one of claims 1 to 8, characterized in that it comprises: A surface medium layer for contacting the frame glue is formed, and the glue-receiving grooves are all arranged in the surface medium layer. 10. A display device, comprising the display substrate according to any one of claims 1-8.