CN106967961A - A method for removing deposited film on inner wall of CVD reaction chamber - Google Patents
A method for removing deposited film on inner wall of CVD reaction chamber Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
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Abstract
Description
技术领域technical field
本发明涉及沉积膜清洗技术领域,特别涉及一种去除CVD反应腔体内壁沉积膜的方法。The invention relates to the technical field of deposited film cleaning, in particular to a method for removing deposited films on the inner wall of a CVD reaction chamber.
背景技术Background technique
CVD(Chemical vapor deposition,化学气相沉积)是反应物质在气态条件下发生电离或分解,在衬底表面上或者附近反应并在其上生成固态物质沉积,进而制得固体材料的工艺技术。微波等离子体CVD是利用微波激发等离子体实现化学气相沉积的一种工艺,具有产量大、质量高、成本低的优点。其原理是,利用微波在反应器中发生共振,形成强的电磁场中心区域,使该反应器中的气体电离,形成等离子体,然后在衬底表面上形成固态物质沉积。CVD (Chemical vapor deposition, chemical vapor deposition) is a process technology in which reactant substances are ionized or decomposed under gaseous conditions, react on or near the surface of the substrate, and deposit solid substances on it, thereby producing solid materials. Microwave plasma CVD is a process that utilizes microwave-excited plasma to realize chemical vapor deposition, which has the advantages of large output, high quality and low cost. The principle is that microwaves are used to resonate in the reactor to form a central area of strong electromagnetic field, ionize the gas in the reactor to form plasma, and then form solid material deposition on the surface of the substrate.
使用微波等离子体CVD在沉积各种半导体薄膜和绝缘薄膜时,使用的化学气相沉积腔体的内表面或者腔体内的反应器的表面上会形成一层沉积薄膜,该沉积薄膜是生长过程中不希望得到的副产物。例如,在生长金刚石的微波等离子体CVD腔体的内表面会形成一层类金刚石薄膜(DLC,Diamond Like Carbon),该薄膜不仅影响腔体对微波的反射效果,还会因为该薄膜在金刚石生长过程中的脱落而引起等离子体中发生电火花,这可能引起金刚石样品表面出现杂质,也可能使金刚石薄膜出现不需要的掺杂;在MOCVD(Metal OrganicChemical Vapor Deposition,金属有机化合物化学气相沉淀)设备中,在生长样品的上方,腔体或者反应器的内表面会形成Ⅲ-V族薄膜或者其它沉积,该薄膜或沉积不但会影响反应气体的流向,还会因这些堆积物的脱落影响样品的表面状态和薄膜生长;其它的CVD中也有这样的现象。When using microwave plasma CVD to deposit various semiconductor films and insulating films, a layer of deposited film will be formed on the inner surface of the chemical vapor deposition chamber or the surface of the reactor in the chamber, which is not grown during the growth process. desired by-products. For example, a layer of diamond-like carbon film (DLC, Diamond Like Carbon) will be formed on the inner surface of the microwave plasma CVD cavity for diamond growth, which not only affects the microwave reflection effect of the cavity, but also because the film grows in diamond The shedding during the process causes electric sparks in the plasma, which may cause impurities on the surface of the diamond sample, and may also cause unwanted doping of the diamond film; in MOCVD (Metal Organic Chemical Vapor Deposition, metal organic compound chemical vapor deposition) equipment In the process, above the growth sample, the inner surface of the chamber or reactor will form III-V film or other deposits. Surface state and film growth; also in other CVD.
在研究上述问题的过程中,发明人发现,现有技术中清洗薄膜的方法大致分为两种,一种是利用机械方法进行腔体清理,另一种是利用化学腐蚀的方法进行腔体清理,虽然后者可以获得一定的清洗效果,但对于金属制的腔体和反应器或者不可移动式的腔体和反应器难以达到清洗效果,然而使用机械方法进行清洗又会刮伤腔体和反应器,同样难以达到清洗效果。In the process of studying the above problems, the inventor found that the methods for cleaning the film in the prior art are roughly divided into two types, one is to use mechanical methods to clean the cavity, and the other is to use chemical corrosion to clean the cavity , although the latter can obtain a certain cleaning effect, it is difficult to achieve the cleaning effect for metal chambers and reactors or non-movable chambers and reactors. However, cleaning with mechanical methods will scratch the chamber and reactor. device, it is also difficult to achieve the cleaning effect.
发明内容Contents of the invention
本发明所要解决的技术问题在于针对上述现有技术的不足,提供一种方便高效、且能有效避免清洗时将CVD反应腔体内壁刮伤的去除CVD反应腔体内壁沉积膜的方法。The technical problem to be solved by the present invention is to provide a method for removing the deposited film on the inner wall of the CVD reaction chamber which is convenient and efficient and can effectively avoid scratching the inner wall of the CVD reaction chamber during cleaning.
为解决上述技术问题,本发明采用的技术方案是,一种去除CVD反应腔体内壁沉积膜的方法,使用高温高压蒸汽冲击浸润该CVD反应腔体内壁沉积膜,并且蒸汽温度导致沉积膜和腔体产生热失配应力,导致沉积膜的脱落。In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is a method for removing the deposited film on the inner wall of the CVD reaction chamber, using high-temperature and high-pressure steam to impinge and infiltrate the deposited film on the inner wall of the CVD reaction chamber, and the temperature of the steam causes the deposited film and the chamber to The body produces thermal mismatch stress, which leads to the peeling off of the deposited film.
进一步地,将罩体罩覆于CVD反应腔体上,喷头穿过罩体伸入在CVD反应腔体内,喷头连接有高压蒸汽发生器,通过喷头向CVD反应腔体内壁喷洒高压蒸汽或者热水,使沉积膜脱落。Further, the cover is covered on the CVD reaction chamber, the nozzle is extended into the CVD reaction chamber through the cover, the nozzle is connected with a high-pressure steam generator, and high-pressure steam or hot water is sprayed to the inner wall of the CVD reaction chamber through the nozzle , so that the deposited film falls off.
进一步地,上下左右调整喷头的位置,调整高压蒸汽或者热水喷洒的方位,清洗过程中沉积膜脱落随蒸汽凝成的废液经连接在罩体上的排水管道排出。Further, the position of the nozzle is adjusted up, down, left, and right, and the direction of high-pressure steam or hot water spraying is adjusted. During the cleaning process, the deposited film falls off and the waste liquid condensed with the steam is discharged through the drainage pipe connected to the cover body.
进一步地,该喷头通过管道与高压蒸汽发生器相连接,且管道的出口端与喷头之间通过弯度可调节金属接头可拆卸连接。Further, the spray head is connected to the high-pressure steam generator through a pipe, and the outlet end of the pipe is detachably connected to the spray head through a bend-adjustable metal joint.
本发明公开了上述一种去除CVD反应腔体内壁沉积膜的方法中使用的装置,一种去除CVD反应腔体内壁沉积膜的装置,该装置包括喷头,喷头用于伸入CVD反应腔体中,并朝向其内壁喷洒高压蒸汽或者热水;还包括高温高压蒸汽发生器,高温高压蒸汽发生器与喷头通过管道连接,且管道的出口端与喷头通过弯度可调节金属接头可拆卸连接,以使喷头方向可调节;管道上设置有调节流量控制器;还包括罩体,罩体用于覆盖于CVD反应腔体的开口,罩体上开设有开孔,该开孔用于喷头穿入。The invention discloses a device used in the method for removing the deposited film on the inner wall of the CVD reaction chamber, a device for removing the deposited film on the inner wall of the CVD reaction chamber, the device includes a nozzle, and the nozzle is used to extend into the CVD reaction chamber , and spray high-pressure steam or hot water toward its inner wall; it also includes a high-temperature and high-pressure steam generator. The direction of the nozzle can be adjusted; the pipeline is provided with an adjustable flow controller; it also includes a cover, which is used to cover the opening of the CVD reaction chamber, and has an opening on the cover, which is used for the nozzle to penetrate.
进一步地,该罩体上设置有一排水管道。Further, a drainage pipe is arranged on the cover.
进一步地,该高温高压蒸汽发生器上开设有进水孔,进水孔处还安装有过滤阀。Further, the high-temperature and high-pressure steam generator is provided with a water inlet, and a filter valve is installed at the water inlet.
本发明一种去除CVD反应腔体内壁沉积膜的方法具有如下优点:A method for removing deposited film on the inner wall of a CVD reaction chamber of the present invention has the following advantages:
1.利用高温高压蒸汽冲击浸润沉积膜,蒸汽温度导致沉积膜和腔体产生热失配应力,导致沉积膜的脱落,不会刮伤CVD反应腔体内壁。1. Use high-temperature and high-pressure steam to impinge and infiltrate the deposited film. The steam temperature will cause thermal mismatch stress between the deposited film and the cavity, resulting in the detachment of the deposited film, without scratching the inner wall of the CVD reaction chamber.
2.清洗过程中沉积膜脱落随蒸汽凝成的废液经排水管道排出,保证工作连续进行。2. During the cleaning process, the deposited film falls off and the waste liquid condensed with steam is discharged through the drainage pipe to ensure continuous work.
3.喷头可旋转,方便清洗腔体,不会产生死角。3. The nozzle can be rotated, which is convenient for cleaning the cavity and will not cause dead ends.
4.清洗过程中,水压可调节,根据腔体内沉积膜的具体情况调节水压的大小。4. During the cleaning process, the water pressure can be adjusted, and the water pressure can be adjusted according to the specific conditions of the deposited film in the chamber.
附图说明Description of drawings
图1为本发明中去除CVD反应腔体内壁沉积膜的装置的示意图。FIG. 1 is a schematic diagram of a device for removing deposited films on the inner wall of a CVD reaction chamber in the present invention.
其中:1.高温高压蒸汽发生器;2.调节流量控制器;3.管道;4.橡胶套;5.罩体;6.CVD反应腔体;7.喷头;8.排水管道;9.进水孔;10过滤网。Among them: 1. High temperature and high pressure steam generator; 2. Regulating flow controller; 3. Pipeline; 4. Rubber sleeve; 5. Cover body; 6. CVD reaction chamber; 7. Nozzle; 8. Drainage pipe; 9. water hole; 10 filter screens.
具体实施方式detailed description
一种去除CVD反应腔体内壁沉积膜的方法,使用高温高压蒸汽冲击浸润该CVD反应腔体内壁沉积膜,并且蒸汽温度导致沉积膜和腔体产生热失配应力,导致沉积膜的脱落。将罩体5罩覆于CVD反应腔体6上,喷头7穿过罩体5伸入CVD反应腔体6内,喷头7连接有高压蒸汽发生器1,通过喷头7向CVD反应腔体6内壁喷洒高压蒸汽或者热水,使沉积膜脱落。上下左右调整喷头7的位置,调整高压蒸汽或者热水喷洒的方位,清洗过程中沉积膜脱落随蒸汽凝成的废液经连接在罩体5上的排水管道8排出。喷头7通过管道3与高压蒸汽发生器1相连接,且管道3的出口端与喷头7之间通过弯度可调节金属接头可拆卸连接。A method for removing a deposited film on the inner wall of a CVD reaction chamber, using high-temperature and high-pressure steam to impinge and infiltrate the deposited film on the inner wall of the CVD reaction chamber, and the temperature of the steam causes thermal mismatch stress between the deposited film and the chamber, resulting in the detachment of the deposited film. The cover body 5 is covered on the CVD reaction chamber 6, the nozzle 7 extends into the CVD reaction chamber 6 through the cover body 5, the nozzle 7 is connected with the high-pressure steam generator 1, and the nozzle 7 is sprayed to the inner wall of the CVD reaction chamber 6 Spray high-pressure steam or hot water to make the deposited film fall off. Adjust the position of the nozzle 7 up and down, left and right, and adjust the direction of high-pressure steam or hot water spraying. During the cleaning process, the deposited film falls off and the waste liquid condensed with the steam is discharged through the drain pipe 8 connected to the cover body 5 . The spray head 7 is connected to the high-pressure steam generator 1 through the pipe 3, and the outlet end of the pipe 3 and the spray head 7 are detachably connected through a bend-adjustable metal joint.
本发明公开了上述一种去除CVD反应腔体内壁沉积膜的方法中使用的装置,一种去除CVD反应腔体内壁沉积膜的装置,如图1所示,该装置包括喷头7,喷头7用于伸入CVD反应腔体6中,并朝向其内壁喷洒高压蒸汽或者热水;还包括高温高压蒸汽发生器1,高温高压蒸汽发生器1与喷头7通过管道3连接,且管道3的出口端与喷头7通过弯度可调节金属接头可拆卸连接,以使喷头7方向可调节;管道3上设置有调节流量控制器2;还包括罩体5,罩体5用于覆盖于CVD反应腔体6的开口,罩体5上开设有开孔,该开孔用于喷头7穿入。罩体5上设置有一排水管道8。高温高压蒸汽发生器1上开设有进水孔9,进水孔9处还安装有过滤阀10。The invention discloses a device used in the method for removing the deposited film on the inner wall of the CVD reaction chamber, a device for removing the deposited film on the inner wall of the CVD reaction chamber. It extends into the CVD reaction chamber 6 and sprays high-pressure steam or hot water toward its inner wall; it also includes a high-temperature and high-pressure steam generator 1, which is connected to the nozzle 7 through a pipeline 3, and the outlet end of the pipeline 3 It is detachably connected with the nozzle 7 through a bend-adjustable metal joint, so that the direction of the nozzle 7 can be adjusted; the pipeline 3 is provided with an adjustable flow controller 2; it also includes a cover 5, which is used to cover the CVD reaction chamber 6 The opening of the cover body 5 is provided with an opening, and the opening is used for the nozzle 7 to penetrate. A drain pipe 8 is arranged on the cover body 5 . A water inlet 9 is opened on the high temperature and high pressure steam generator 1, and a filter valve 10 is also installed at the water inlet 9.
其能够进行清洗的原理是,需要消除的沉积膜与反应腔体的膨胀系数不同,在使用高温高压蒸汽进行冲击时,沉积膜会脱离反应腔体内壁。该一种去除CVD反应腔体内壁沉积膜的方法,可以方便高效的清洗金属制的腔体或者可移动式的腔体,而且能有效避免清洗时将腔体内壁刮伤。采用一般的水做水源,通过设置在进水孔9处的过滤阀10滤去水中的杂质,保证了水源的清洁度。The principle that it can be cleaned is that the expansion coefficient of the deposited film to be eliminated is different from that of the reaction chamber, and when high-temperature and high-pressure steam is used for impact, the deposited film will break away from the inner wall of the reaction chamber. The method for removing the deposited film on the inner wall of the CVD reaction chamber can conveniently and efficiently clean the metal cavity or the movable cavity, and can effectively avoid scratching the inner wall of the cavity during cleaning. Common water is used as the water source, and impurities in the water are filtered through the filter valve 10 arranged at the water inlet 9, thereby ensuring the cleanliness of the water source.
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| CN111560599A (en) * | 2019-12-27 | 2020-08-21 | 长沙新材料产业研究院有限公司 | Process method for removing MPCVD (multi-layer chemical vapor deposition) cavity inner wall film |
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| CN114540794A (en) | 2022-05-27 |
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