CN106947906A - A kind of electronic package material and preparation method thereof - Google Patents

Abstract

The invention discloses a kind of electronic package material, it is characterised in that includes the raw material of following parts by weight：50 100 parts of Si 50%Al, 20 30 parts of alundum (Al2O3), 1 10 parts of aluminium nitride, 40 70 parts of silicon-carbide particle, 38 parts of graphene oxide, 15 parts of glass fibre.The electronic package material density of the present invention is relatively low, and thermal conductivity is higher, and linear expansion coefficient is controllable, raw material is easy to get, be easy to welded encapsulation and preparation method is simple, has a good application prospect.

Description

A kind of electronic packaging material and preparation method thereof

technical field

The invention relates to the technical field of packaging materials, in particular to an electronic packaging material and a preparation method thereof.

Background technique

The electronic package is the shell for installing the integrated circuit chip for external use, which plays the role of placing, fixing and sealing, protecting the integrated circuit chip, and enhancing the ability to adapt to the environment. Packaging materials play a pivotal role in the thermal performance and even reliability of electronic devices and circuits. Now, the electrical packaging material industry has become an important branch of the semiconductor industry, and it has been widely involved in various disciplines such as chemistry, electricity, thermodynamics, machinery and process equipment.

As a reinforcement of metal matrix composites, SiC particles have the advantages of high modulus, high hardness, low thermal expansion, high thermal conductivity, wide range of sources and low cost. Al alloy has the advantages of low density, high thermal conductivity (170-220W/m·K), low price and easy thermal processing. Combining the above factors, and considering that the electronic packaging material must have a very low coefficient of thermal expansion (CTE) that matches the substrate, high thermal conductivity, high stiffness, low density, and low cost, the two are combined. After the particle-reinforced aluminum matrix composite material, the material has the advantages of both Al and SiC, and almost represents all the performance requirements of the ideal packaging material, which makes the SiC/Al composite material the most attractive metal matrix composite material for electronic packaging. , the most widely used composite material. Graphene is the strongest material in the world, with good thermal conductivity and high-speed electron mobility at room temperature. At the same time, its unique structure makes it have special properties such as perfect quantum Hall effect, unique quantum tunnel effect, and bipolar electric field effect. Therefore, due to the excellent thermal conductivity of graphene, the electronic packaging material composed of graphene and Al/SiC not only maintains their respective performance advantages, but also greatly improves the thermal conductivity of the material, and has advantages in manufacturing process and welding performance. Significantly improved, it is expected to become a new generation of electronic packaging materials.

The riveting point on the integrated circuit chip is also the contact point, which is welded to the pin of the package shell. The existing SiC/Al composite electronic packaging material is mainly manufactured by the infiltration method. Its thermal conductivity, manufacturing process and welding There are problems in performance, especially it is difficult to use the existing package welding in our country for welding, which limits the application of this type of material in related fields.

Contents of the invention

Aiming at the defects of the prior art, the object of the present invention is to provide an electronic packaging material and a preparation method thereof, which has low density, high thermal conductivity, controllable coefficient of linear expansion, easy-to-obtain raw materials, easy packaging and welding and The preparation method is simple and has good application prospects.

The present invention solves technical problem and adopts following technical scheme:

The invention provides an electronic packaging material, comprising the following raw materials in parts by weight:

Si-50%Al 50-100 parts, aluminum oxide 20-30 parts, aluminum nitride 1-10 parts, silicon carbide particles 40-70 parts, graphene oxide 3-8 parts, glass fiber 1-5 parts.

Preferably, the battery material includes the following raw materials in parts by weight:

Si-50%Al 70-90 parts, aluminum oxide 20-25 parts, aluminum nitride 1-5 parts, silicon carbide particles 50-60 parts, graphene oxide 4-7 parts, glass fiber 2-3 parts.

Preferably, the battery material includes the following raw materials in parts by weight:

80 parts of Si-50%Al, 23 parts of aluminum oxide, 3 parts of aluminum nitride, 55 parts of silicon carbide particles, 5 parts of graphene oxide, and 2.5 parts of glass fiber.

The present invention also provides a kind of preparation method of electronic packaging material, comprises the following steps:

Step 1, mixing graphene oxide and ethanol according to the volume ratio of 1:15, and dispersing evenly with ultrasound;

Step 2, add the graphene oxide ethanol solution prepared in step 1, Si-50%Al, aluminum oxide, aluminum nitride, silicon carbide particles, graphene oxide, and glass fiber into the V-type mixing equipment for wet mixing , the mixing time is 5-13 hours, and the stirring speed is 15-30 rpm;

Step 3, drying the mixed powder obtained above, pouring it into a V-type mixing equipment for dry mixing after drying, mixing for 5-13 hours, and rotating speed 15-30 rpm;

Step 4: Use 2mm thick LF21 aluminum alloy to prepare a Φ240mm×210mm sheath, and put the mixed powder into the sheath. It is required that the weight of the assembled powder should be controlled at 15kg-17kg, and the powder tap density should be greater than 1.8g/cm ³ ;

Step five, put the sheathed powder into a ring sintering machine for physical sintering, the sintering pressure is 95MPa-290MPa, the temperature is 420°C-480°C, and the time is 1-2.5 hours.

Preferably, the mixing time of the second step is 9 hours, and the stirring speed is 20 revolutions per minute.

Preferably, the mixing time of the third step is 7 hours, and the stirring speed is 20 revolutions per minute.

Preferably, the weight of the powder in the fourth step is 16 kilograms.

Preferably, the sintering pressure in the fifth step is 210 MPa, the temperature is 450° C., and the time is 1.5 hours.

Compared with the prior art, the present invention has the following beneficial effects:

(1) The electronic packaging material of the present invention uses Si-50%Al as the base composite material, and uses aluminum oxide, aluminum nitride, silicon carbide particles, 3-8 parts of graphene oxide, and glass fibers as reinforcements.

(2) Si-50%Al has good thermal conductivity, electrical conductivity, high resistance to harsh environments, impact resistance, fatigue resistance and fracture performance; aluminum oxide, aluminum nitride, silicon carbide particles, graphene oxide 3-8 parts, glass fiber as a reinforcement has high thermal conductivity, low expansion coefficient, low density, low cost, and good compatibility with matrix materials.

(3) The powder metallurgy method is adopted, and the material design is strong, and products with different linear expansion coefficients can be prepared according to needs.

(4) The electronic packaging material of the present invention not only has a high thermal conductivity, but also has low cost, is easy to weld, has a wide application range, simple operation process, is conducive to production control, and is easy to industrialized production, so it has a good application prospect.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with specific embodiments. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Example 1.

The electronic packaging material of the present embodiment includes the following raw materials in parts by weight:

50 parts of Si-50%Al, 20 parts of aluminum oxide, 1 part of aluminum nitride, 40 parts of silicon carbide particles, 3 parts of graphene oxide, and 1 part of glass fiber.

The preparation method of the electronic packaging material of this embodiment comprises the following steps:

Step 1, mixing graphene oxide and ethanol according to the volume ratio of 1:15, and dispersing evenly with ultrasound;

Step 2, add the graphene oxide ethanol solution prepared in step 1, Si-50%Al, aluminum oxide, aluminum nitride, silicon carbide particles, graphene oxide, and glass fiber into the V-type mixing equipment for wet mixing , the mixing time is 5 hours, and the stirring speed is 15 rpm;

Step 3, drying the mixed powder obtained above, pouring it into a V-type mixing equipment for dry mixing after drying, mixing for 5 hours, and rotating speed 15 rpm;

Step 4, use 2mm thick LF21 aluminum alloy to prepare Φ240mm×210mm wrapper, put the mixed powder into the wrapper, it is required that the weight of the assembled powder should be controlled at 15 kg, and the tap density of the powder should be greater than 1.8g/cm ³ ;

Step five, put the packaged powder into a ring-type sintering machine for physical sintering, the sintering pressure is 95MPa, the temperature is 420°C, and the time is 1 hour.

Example 2.

The electronic packaging material of the present embodiment includes the following raw materials in parts by weight:

90 parts of Si-50%Al, 25 parts of aluminum oxide, 5 parts of aluminum nitride, 60 parts of silicon carbide particles, 7 parts of graphene oxide, and 3 parts of glass fiber.

The preparation method of the electronic packaging material of this embodiment comprises the following steps:

Step 1, mixing graphene oxide and ethanol according to the volume ratio of 1:15, and dispersing evenly with ultrasound;

Step 2, add the graphene oxide ethanol solution prepared in step 1, Si-50%Al, aluminum oxide, aluminum nitride, silicon carbide particles, graphene oxide, and glass fiber into the V-type mixing equipment for wet mixing , the mixing time is 13 hours, and the stirring speed is 30 rpm;

Step 3, drying the mixed powder obtained above, pouring it into a V-type mixing equipment for dry mixing after drying, mixing for 13 hours, and rotating speed 30 rpm;

Step 4, use 2mm thick LF21 aluminum alloy to prepare a Φ240mm×210mm sheath, put the mixed powder into the sheath, the weight of the assembled powder is required to be controlled at 17 kg, and the tap density of the powder is greater than 1.8g/cm ³ ;

Step five, put the packaged powder into a ring-type sintering machine for physical sintering, the sintering pressure is 290MPa, the temperature is 480°C, and the time is 2.5 hours.

Example 3.

The electronic packaging material of the present embodiment includes the following raw materials in parts by weight:

80 parts of Si-50%Al, 23 parts of aluminum oxide, 3 parts of aluminum nitride, 55 parts of silicon carbide particles, 5 parts of graphene oxide, and 2.5 parts of glass fiber.

The preparation method of the electronic packaging material of this embodiment comprises the following steps:

Step 1, mixing graphene oxide and ethanol according to the volume ratio of 1:15, and dispersing evenly with ultrasound;

Step 2, add the graphene oxide ethanol solution prepared in step 1, Si-50%Al, aluminum oxide, aluminum nitride, silicon carbide particles, graphene oxide, and glass fiber into the V-type mixing equipment for wet mixing , the mixing time is 9 hours, and the stirring speed is 20 rpm;

Step 3, drying the mixed powder obtained above, pouring it into a V-type mixing equipment for dry mixing after drying, mixing for 7 hours, and rotating speed 20 rpm;

Step 4, use 2mm thick LF21 aluminum alloy to prepare Φ240mm×210mm sheath, put the mixed powder into the sheath, it is required that the weight of the assembled powder should be controlled at 16 kg, and the tap density of the powder should be greater than 1.8g/cm ³ ;

Step five, put the packaged powder into a ring-type sintering machine for physical sintering, the sintering pressure is 210MPa, the temperature is 450°C, and the time is 1.5 hours.

Example 4.

The electronic packaging material of the present embodiment includes the following raw materials in parts by weight:

90 parts of Si-50%Al, 28 parts of aluminum oxide, 3 parts of aluminum nitride, 45 parts of silicon carbide particles, 7 parts of graphene oxide, and 4 parts of glass fiber.

The preparation method of the electronic packaging material of this embodiment comprises the following steps:

Step 1, mixing graphene oxide and ethanol according to the volume ratio of 1:15, and dispersing evenly with ultrasound;

Step 2, add the graphene oxide ethanol solution prepared in step 1, Si-50%Al, aluminum oxide, aluminum nitride, silicon carbide particles, graphene oxide, and glass fiber into the V-type mixing equipment for wet mixing , the mixing time is 11 hours, and the stirring speed is 28 rpm;

Step 3, drying the mixed powder obtained above, pouring it into a V-type mixing equipment for dry mixing after drying, mixing for 7 hours, and rotating speed 19 rpm;

Step 4, use 2mm thick LF21 aluminum alloy to prepare a Φ240mm×210mm sheath, put the mixed powder into the sheath, the weight of the assembled powder is required to be controlled at 15.5kg, and the powder tap density is greater than 1.8g/cm ³ ;

Step five, put the packaged powder into a ring-type sintering machine for physical sintering, the sintering pressure is 260MPa, the temperature is 470°C, and the time is 1.5 hours.

The electronic packaging material of the present invention adopts the powder metallurgy method, the material design is strong, and products with different linear expansion coefficients can be prepared according to the needs. The packaging material base material of the present invention has high resistance to harsh environments, impact resistance, fatigue resistance and Fracture performance; the added reinforcement has high thermal conductivity, low expansion coefficient, low density, low cost, and good compatibility with the base material. Therefore, the product not only has high thermal conductivity, but also has low cost, is easy to weld, has wide application range, simple operation process, is beneficial to production control, is easy to industrialize production, and has good application prospects.

It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only contains an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (8)

1. a kind of electronic package material, it is characterised in that include the raw material of following parts by weight：50-100 parts of Si-50%Al, three oxygen Change 20-30 parts of two aluminium, 1-10 parts of aluminium nitride, 40-70 parts of silicon-carbide particle, 3-8 parts of graphene oxide, 1-5 parts of glass fibre.

2. electronic package material according to claim 1, it is characterised in that the battery material includes following parts by weight Raw material：70-90 parts of Si-50%Al, 20-25 parts of alundum (Al2O3), 1-5 parts of aluminium nitride, 50-60 parts of silicon-carbide particle, oxidation stone Black alkene 4-7 parts, 2-3 parts of glass fibre.

3. electronic package material according to claim 1, it is characterised in that the battery material includes following parts by weight Raw material：80 parts of Si-50%Al, 23 parts of alundum (Al2O3), 3 parts of aluminium nitride, 55 parts of silicon-carbide particle, 5 parts of graphene oxide, glass 2.5 parts of fiber.

4. the preparation method of the electronic package material according to claim 1 or 2 or 3, it is characterised in that including following step Suddenly：

Step one, by graphene oxide and ethanol according to volume ratio 1:15 mixing, and be uniformly dispersed with ultrasound；

Step 2, graphene oxide ethanol solution prepared by step one, Si-50%Al, alundum (Al2O3), aluminium nitride, carborundum Particle, graphene oxide, glass fibre add and wet-mixing are carried out in V-type mixing equipment, incorporation time 5-13 hours, stirring speed 15-30 revs/min of degree；

Step 3, the mixed-powder of above-mentioned acquisition is dried, and is poured into after drying and dry mixed is carried out in V-type mixing equipment, Incorporation time 5-13 hours, 15-30 rpms of rotating speed；

Step 4, Φ 240mm × 210mm jackets are prepared using 2mm thickness LF21 aluminium alloys, and the powder mixed is loaded into jacket In, it is desirable to general assembly powder Weight control is at 15 kilograms~17 kilograms, and powder tap density is reached more than 1 .8g/cm³；

Step 5, is put into progress physics sintering in circular travelling sintering machine, the pressure of sintering is 95MPa- by the powder for installing jacket 290MPa, temperature is 420 DEG C -480 DEG C, and the time is 1-2.5 hours.

5. the preparation method of electronic package material according to claim 4, it is characterised in that the step 2 incorporation time For 9 hours, mixing speed was 20 rpms.

6. the preparation method of electronic package material according to claim 4, it is characterised in that the step 3 incorporation time For 7 hours, mixing speed was 20 rpms.

7. the preparation method of electronic package material according to claim 4, it is characterised in that the step 4 general assembly powder weight Measure as 16 kilograms.

8. the preparation method of the electronic package material according to claim asks 4, it is characterised in that the step 5 sintering pressure Power is 210 MPa, and 450 DEG C of temperature, the time is 1.5 hours.